A multi-slit laser cutting device

Abstract

This utility model discloses a multi-slice laser cutting device, belonging to the field of solar cell processing technology. It includes a support assembly, a laser cutting assembly, and a material conveying assembly. By utilizing the corresponding arrangement of multiple sets of grooving laser units, thermal cracking laser units, and cooling units within the laser assembly, multi-slice cutting of materials can be achieved. Furthermore, through optimized design of the placement of each unit, the cutting points of adjacent cutting lines are spaced apart in the first direction, thereby avoiding the influence of thermal stress during multi-slice cutting and achieving high-quality material cutting. The multi-slice laser cutting device of this utility model has a compact structure, is easy to control, and can achieve multi-slice laser cutting of materials while avoiding the influence of thermal stress during adjacent laser cutting. This ensures the accuracy and quality of multi-slice cutting of materials (especially silicon wafers), improves the efficiency of multi-slice cutting, and reduces the manufacturing cost of solar cells.

Description

Technical Field

[0001] This utility model belongs to the field of solar cell processing technology, specifically relating to a multi-segment laser cutting device. Background Technology

[0002] In the fabrication of solar cells, the slicing and cutting of silicon wafers is often indispensable. With changing market demands, the requirements for silicon wafer specifications and dimensions are becoming increasingly diverse, placing higher demands on silicon wafer slicing technology. Therefore, the research and application of multi-slice silicon wafer technology is becoming increasingly important.

[0003] Currently, the main method for silicon wafer slicing is two-piece slicing, which uses a set of lasers for splitting. If three-piece or four-piece slicing is desired, the two-piece silicon wafers need to be cut again by the same equipment. Due to changes in silicon wafer size, increased production speed, and the growing demand for multi-piece solar cells, traditional slicing methods are no longer sufficient to meet customer needs and have shown significant limitations. Utility Model Content

[0004] In view of one or more of the above-mentioned defects or improvement needs of the prior art, the present invention provides a multi-slice laser cutting device that can meet the multi-slice cutting needs of silicon wafers and ensure the cutting accuracy of each slice of the silicon wafer.

[0005] To achieve the above objectives, this utility model provides a multi-slice laser cutting device, which includes:

[0006] Support components;

[0007] A material transfer assembly; the material transfer assembly includes at least one platform movable back and forth in a first direction, the platform being used to carry the material to be sliced;

[0008] A laser cutting assembly; the laser cutting assembly is mounted on a support assembly and includes at least three slotting laser units, a thermal cracking laser unit corresponding to each slotting laser unit, and a cooling unit corresponding to each thermal cracking laser unit.

[0009] Each of the grooving laser units can focus on the material carried by the stage. The distance between the focus points of two adjacent grooving lasers in the second direction is equal to the distance between two adjacent cutting lines on the material, and the focus points of two adjacent grooving lasers are spaced apart by a certain distance in the first direction. Each of the thermal cracking laser units can focus on the material carried by the stage, and the focus point of each thermal cracking laser unit coincides with the focus point of the corresponding grooving laser unit. The working area of ​​each of the cooling units is located on one side of the first direction of the corresponding laser focus point, and is used to cool the cut material.

[0010] The first direction is the material feeding direction, and the second direction in the same plane is perpendicular to the first direction.

[0011] As a further improvement of this utility model, at least two slotted laser units are spaced apart in the second direction, and at least one slotted laser unit is spaced apart from the two adjacent slotted laser units in the first direction.

[0012] As a further improvement of this utility model, the grooving laser unit, the hot-splitting laser unit, and the cooling unit are all arranged in three spaced-apart configurations; and

[0013] In each of the various units, two units located on both sides are spaced apart in the second direction, and a unit located in the middle is spaced apart from the two units on both sides in the first direction.

[0014] As a further improvement of this utility model, the distance between the focal points of two adjacent slotted lasers in the first direction is 15~25mm.

[0015] As a further improvement of this utility model, the support assembly includes a base fixed on the equipment frame and a support plate connected to the base;

[0016] The support plate is provided with a first sliding component that can be reciprocated in a second direction, and a second sliding component that can be reciprocated vertically is provided on the first sliding component; and

[0017] The grooving laser unit, the thermal cracking laser unit, and the cooling unit are respectively mounted on the second sliding assembly via connectors, and can be moved horizontally and vertically under the drive of the two sliding assemblies.

[0018] As a further improvement of this utility model, the connecting parts of at least two units are adjustable connecting parts, which are used to adjust the horizontal position and / or vertical height and / or tilt angle of the corresponding units.

[0019] As a further improvement of this utility model, a connecting bracket is provided on the second sliding component; the slotting laser unit is mounted on the connecting bracket via a connector; and

[0020] A connector for mounting the cooling unit is located below the connecting bracket and includes a rotating bracket, a position connecting plate, and a position adjusting member. The position connecting plate is fixedly connected to the connecting bracket, and the position adjusting member is connected to the position connecting plate and includes a first-direction translation unit, a second-direction translation unit, and a vertical lifting unit arranged in combination. The cooling unit is mounted on the rotating bracket, and the rotating bracket is hinged to the position adjusting member.

[0021] As a further improvement of this utility model, the material conveying assembly includes a support frame extending along a first direction; drive rails extending along the first direction are respectively provided on both sides of the support frame in a second direction, and lifting units are assembled on the two drive rails; each lifting unit is equipped with a platform, and each platform can be vertically lifted and lowered under the drive of the lifting unit, and can be reciprocated in the first direction under the drive of the drive rail.

[0022] As a further improvement of this utility model, the platform is a negative pressure platform, which is used to provide a negative pressure of -15kPa to -35kPa and adsorb the material on the platform.

[0023] As a further improvement of this utility model, the negative pressure platform includes a plurality of bearing units arranged at intervals, at least some of the bearing units are provided with adsorption holes, and the distance between at least some of the bearing units is adjustable.

[0024] As a further improvement of this utility model, a visual imaging component is also included; the visual imaging component is disposed at the end of the material conveying component used for picking up materials, and is used to photograph and detect the materials that have been picked up on the platform.

[0025] As a further improvement of this utility model, it also includes a material correction mechanism; the material correction mechanism is disposed on one side of the material conveying component and is used to correct and adjust the material to be cut on the platform after it has been photographed and detected.

[0026] As a further improvement of this utility model, it also includes a laser displacement module; the support component is mounted on the laser displacement module, so that the laser cutting component can be displaced in a first direction and / or a second direction under the drive of the laser displacement module.

[0027] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0028] In summary, the beneficial effects of the above-described technical solutions conceived by this utility model compared with the prior art include:

[0029] The multi-slice laser cutting device of this invention includes a support assembly, a laser cutting assembly, and a material conveying assembly. By utilizing the corresponding arrangement of multiple grooving laser units, thermal cracking laser units, and cooling units within the laser assembly, multi-slice cutting of materials can be achieved. Furthermore, through optimized design of the placement of each unit, the cutting points of adjacent cutting lines are spaced apart in a first direction (material movement direction / cutting line extension direction), thereby avoiding the influence of thermal stress during multi-slice cutting and achieving high-quality material cutting. The multi-slice laser cutting device of this invention has a compact structure, is easy to control, and can achieve multi-slice laser cutting of materials while avoiding the influence of thermal stress during adjacent laser cutting, ensuring the accuracy and quality of multi-slice cutting of materials (especially silicon wafers) and improving the efficiency of multi-slice cutting. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the overall structure of the multi-slice laser cutting device in this embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of the combined assembly of the support component and the laser cutting component in an embodiment of this utility model;

[0033] Figure 3 , Figure 4 These are schematic diagrams from different perspectives of the laser cutting assembly in this embodiment of the present invention, showing the arrangement of each unit.

[0034] Figure 5 This is a schematic diagram of the material transfer component of the multi-slice laser cutting device in this embodiment of the present invention;

[0035] Figure 6 This is a schematic diagram of the negative pressure platform of the material transfer component in this utility model embodiment;

[0036] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically:

[0037] 100. Support assembly; 200. Laser cutting assembly; 300. Material transfer assembly;

[0038] 101. Base; 102. Support plate; 103. First sliding assembly; 104. Second sliding assembly; 105. Connecting bracket; 106. First connector; 107. Second connector; 108. Rotating bracket; 109. Position connecting plate; 110. Position adjusting component;

[0039] 201. Grooving laser unit; 202. Thermal cracking laser unit; 203. Cooling unit;

[0040] 301. Support frame; 302. Drive track; 303. Negative pressure platform; 304. Lifting unit. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model. Furthermore, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.

[0042] In the description of this utility model, it should be understood that, unless otherwise explicitly specified and limited, the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0043] Furthermore, unless otherwise expressly defined, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.

[0044] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0045] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0046] Below, for reference Figures 1-6 This invention describes a multi-slice laser cutting device according to a preferred embodiment of the present invention.

[0047] In a preferred embodiment of this utility model, the multi-slice laser cutting device is designed to cut a whole piece of material into multiple slices.

[0048] More specifically, in the preferred embodiment, the material to be slicing is silicon wafer from the solar cell manufacturing process. Of course, while meeting the cutting requirements, the multi-slice laser cutting device in the preferred embodiment can also be used for cutting other materials, which will not be elaborated upon here.

[0049] Meanwhile, the “multi-slice” involved in the preferred embodiment is different from the conventional two-slice cutting. It refers to the situation where a whole piece of material is cut into no less than three slices, such as four or five slices.

[0050] like Figure 1 As shown, the multi-slice laser cutting device in the preferred embodiment includes a support component 100, a laser cutting component 200, and a material conveying component 300.

[0051] The support component 100 is provided to support the laser cutting component 200.

[0052] As a feasible example, the support assembly 100 in the preferred embodiment includes a base 101 and a support plate 102. The base 101 is preferably a marble base, which is preferably fixedly connected to the equipment frame to reliably support the support plate 102 on which the laser cutting assembly 200 is mounted. Meanwhile, in the preferred embodiment, the support plate 102 is fixedly mounted on the base 101 to fix the laser cutting assembly 200 and to facilitate position adjustment of the laser cutting assembly 200.

[0053] Furthermore, in the preferred embodiment, the laser cutting component 200 is used to laser cut materials, efficiently achieving multi-slice operations. Specifically, in the preferred embodiment, the laser cutting component 200 is disposed on the support component 100, and includes at least two grooving laser units 201, a thermal cracking laser unit 202 corresponding to each grooving laser unit 201, and a cooling unit 203 corresponding to each thermal cracking laser unit 202. The grooving laser unit 201 is used to emit laser light and perform grooving operations on the surface of the material. Each grooving laser unit 201 can focus on the surface of the material, and the focusing positions of two adjacent grooving laser units 201 on the material surface correspond to two adjacent cutting lines on the material.

[0054] Meanwhile, as a special setting in the preferred embodiment, the focal points of two adjacent grooving lasers on the material surface are spaced a certain distance apart in a first direction; wherein, the first direction is the feeding direction of the material during the slicing process. The reason for this setting is that when performing multi-slice cutting, if the effective distance between two adjacent laser beams is too close, the material slices will be subjected to greater thermal stress, resulting in a certain positional deviation between the cutting path and the theoretical cutting path. The existence of this deviation will lead to poor accuracy of the sliced ​​material obtained after slicing.

[0055] By spacing the focus points of two adjacent grooving lasers on the material surface along a first direction, the grooving lasers corresponding to two adjacent cutting lines on the material surface will act sequentially during material conveying and cutting. Thus, while one grooving laser is performing grooving, the other grooving laser is not operating on one side of its second direction (a horizontal direction perpendicular to the first direction), thereby avoiding the thermal stress influence between adjacent grooving lasers. When the material further moves along the first direction to the focus point of the adjacent grooving laser, only the already cut and cooled slit line exists in the second direction of that adjacent grooving laser, effectively avoiding the thermal stress influence between adjacent lasers.

[0056] More specifically, in the preferred embodiment, the thermal cracking laser unit 202, the cooling unit 203, and the grooving laser unit 201 are arranged in a one-to-one correspondence, and the focus point of the thermal cracking laser unit 202 coincides with the focus point of the corresponding grooving laser unit 201. That is to say, the focus points of two adjacent thermal cracking lasers on the material surface are spaced apart by a certain distance in the first direction, and this distance is equal to the distance between the focus points of two adjacent grooving lasers in the first direction. By utilizing the overlapping effect of the grooving laser and the thermal cracking laser on the material surface, the material is cut.

[0057] Accordingly, the working area of ​​the cooling unit 203 is located on one side of the first direction corresponding to the laser focus point, specifically on the side of the material conveying forward direction, so as to cool the cut material.

[0058] Furthermore, in the preferred embodiment, the material transfer component 300 includes a platform for carrying the material to be sliced. The platform can reciprocate along a first direction under the drive of the drive component, thereby completing the processes of picking up the unsliced ​​material, moving it under the laser cutting component 200 to complete the slicing and cutting, and unloading the material after slicing and cutting.

[0059] More specifically, to achieve accurate alignment of the various groups of grooving laser units 201, hot-splitting laser units 202, and cooling units 203, the support plate 102 in the preferred embodiment is provided with a first sliding assembly 103 and a second sliding assembly 104. The first sliding assembly 103 is configured to reciprocate in a second direction to adjust the position of the laser cutting assembly 200 in that direction. Simultaneously, the second sliding assembly 104 is also provided on the first sliding assembly 103; this second sliding assembly 104 is a vertical displacement assembly capable of vertical reciprocating adjustment. Correspondingly, each unit of the laser cutting assembly 200 is assembled onto the second sliding assembly 104 via connecting members, thereby enabling vertical and horizontal position adjustments of each unit of the laser cutting assembly 200 through the movement of the two sliding assemblies.

[0060] As a feasible example, in the preferred embodiment, the two sliding components are preferably a combination of a slider and a slide rail, that is, a slide rail extending in the corresponding direction is provided, and a reciprocating slider is matched on the slide rail. Of course, it can be understood that, corresponding to the displacement control of the slider on the slide rail, either a manual adjustment structure (e.g., a screw structure for the slider) or an electric adjustment mechanism (e.g., a cylinder, with the output end of the cylinder connected to the slider, and the position adjustment of the slider completed by the extension and retraction of the cylinder output end) can be provided, and this can be preferably designed according to needs. Furthermore, in actual installation, the positions of the slider and the slide rail can be interchanged. For example, for the first sliding component 103, the component on the support plate 102 can be either a slide rail or a slider, as long as the slider can be slidably assembled with the slide rail. Similarly, the setting mechanism of the second sliding component 104 is similar and will not be elaborated here.

[0061] Obviously, in actual setup, the functions of the first sliding component 103 and the second sliding component 104 can be interchanged. That is, the first sliding component 103 set on the support plate 102 is a sliding component that can be vertically raised and lowered, while the second sliding component 104 set on the first sliding component 103 can slide back and forth along the second direction.

[0062] It should be noted that the aforementioned sliding component is set up using conventional methods in the prior art, and the setting form is not limited to the aforementioned combination of slide rail and slider. The sliding drive form can also be optimized according to needs, which will not be elaborated here.

[0063] More preferably, in order to achieve flexible adjustment and corresponding installation of each laser unit and cooling unit 203, each unit in the preferred embodiment is assembled and connected to the second sliding assembly 104 by adjustable connectors. By adjusting each adjustable connector, the corresponding adjustment of the position of each unit on the material surface can be realized, and the interval between units of the same type can be adjusted accordingly, thereby adjusting the spacing between two adjacent laser cutting lines to adapt to the slicing requirements of materials of different sizes.

[0064] As a feasible example, in a preferred embodiment, the thermal cracking laser unit 202 is connected to the sliding plate of the second sliding assembly 104 via a first connector 106. The sliding plate is assembled with a sliding track disposed on the first sliding assembly 103. The first connector 106 includes a sliding block and a rotating clamping block. The sliding block slides along a horizontal slide rail on the second sliding assembly 104, which extends in a second direction. A horizontal adjustment mechanism is provided corresponding to the sliding block. This horizontal adjustment mechanism is preferably a screw assembly, which includes a bracket with a threaded hole and an adjusting screw. The bracket is fixed to the sliding plate of the second sliding assembly 104. One end of the adjusting screw passes through the threaded hole and is rotatably connected to the sliding block. By adjusting the rotation of the adjusting screw, the sliding block can be pushed and pulled horizontally, thereby adjusting the position of a single thermal cracking laser unit 202 in the second direction. In addition, the rotating clamp is used to hold the thermal cracking laser unit 202 to fix it, and one side of the rotating clamp is hinged to the sliding block, so that the setting angle of the thermal cracking laser unit 202 can be adjusted accordingly by rotating the rotating clamp.

[0065] As another example, the vertical lifting function of the second sliding assembly 104 can be transferred to each of the first connecting members 106. In this case, the second sliding assembly 104 only includes a mounting plate mounted on the first sliding assembly 103, and the thermal cracking laser unit 202 is mounted on this mounting plate through the first connecting members 106. In this case, in addition to the aforementioned sliding block and rotating clamping block, the first connecting member 106 is also configured as follows:

[0066] The sliding block is configured as a combination of a vertical slide rail and a vertical slider. One side of the vertical slide rail is connected to the slider on the horizontal slide rail, and one side of the rotating clamp is hinged to the vertical slider. A vertical adjustment mechanism, such as a screw mechanism, is provided corresponding to the vertical slide rail to adjust the vertical position of the vertical slider on the vertical slide rail. This configuration allows the first connecting member 106 to independently adjust the vertical height, second-direction displacement, and laser irradiation angle of a single thermal cracking laser unit 202, thereby ensuring the flexibility of thermal cracking laser adjustment. Of course, when the laser cutting assembly 200 has overall displacement adjustment in the second direction, the first sliding assembly 103 can be controlled accordingly to complete the adjustment.

[0067] Furthermore, in order to achieve the corresponding arrangement of the two laser units in space, it is preferable to provide a connecting bracket 105 on the second sliding assembly 104 (sliding plate), and to install the slotting laser unit 201 on the connecting bracket 105 through the second connector 107, so that the slotting laser unit 201 and the hot cracking laser unit 202 are spaced apart in the first direction.

[0068] In actual setup, the second connector 107 in the preferred embodiment can also be configured as an adjustable connector, similar to the first connector 106 described above, to achieve vertical height adjustment, second-direction displacement adjustment, and laser angle adjustment of the slotting laser unit 201. Of course, to simplify the connector structure, it can also be configured as an adjustable connector with only partial adjustment functions, such as a connector with only vertical adjustment function. That is, the clamping parts of each slotting laser unit 201 are connected to the connecting bracket 105 via a vertical adjustment unit, thereby achieving vertical adjustment of the slotting laser unit 201 relative to the connecting bracket 105, thus changing the size of the laser spot and completing the focusing operation of the slotting laser. Correspondingly, after setting the laser spot of the slotting laser, the position of the first connector 106 can be adjusted to achieve overlapping focusing of the thermal cracking laser and the slotting laser, which is equivalent to adjusting the alignment of the thermal cracking laser and the slotting laser based on the focal point of the slotting laser.

[0069] It is understandable that, in actual setup, the functions of the first connector 106 and the second connector 107 can be interchanged. That is, the hot cracking laser is first focused by adjusting the vertical position of the hot cracking laser unit 202, and then the hot cracking laser and the grooving laser are aligned by adjusting the spatial position of the second connector 107.

[0070] In addition, such as Figure 3 As shown in the preferred embodiment, the installation of the cooling unit 203 is preferably provided with a third connecting member consisting of a rotating bracket 108, a position connecting plate 109, and a position adjusting member 110. The position connecting plate 109 is connected to the second sliding assembly 104 and is further preferably located at the bottom of the connecting bracket 105. Meanwhile, the position adjusting member 110 is located at the bottom of the position connecting plate 109 and is a spatial adjustment module, including a combined vertical lifting unit, a first-direction translation unit, and a second-direction translation unit. The rotating bracket 108 and the position adjusting member 110 are hinged together. By adjusting the translation of the position adjusting member 110 in each direction and adjusting the rotation angle of the rotating bracket 108, the position of the cooling unit 203's working area can be accurately adjusted, ensuring that the cooling unit 203 always acts on the side of the grooving laser / thermal cracking laser cutting position along the positive direction of the first direction (the direction of the material conveying assembly 300's displacement). This ensures that the material can be rapidly cooled after being cut by the two lasers.

[0071] For example, in the preferred embodiment, the cooling unit 203 is a nozzle that can spray water mist. The positions of the multiple nozzles correspond to the positions of the grooving laser unit 201 and the thermal cracking laser unit 202. That is, two adjacent nozzles are spaced apart in the second direction and are spaced a certain distance apart in the first direction.

[0072] In actual setup, at least two types of unit connectors are adjustable connectors, which are used to adjust the horizontal position and / or vertical height and / or tilt angle of the corresponding unit (in the second direction).

[0073] By setting the connectors of each unit in the laser cutting assembly 200 to the aforementioned adjustable connectors, the vertical height, second direction position, and laser irradiation / water mist spraying angle of the grooving laser unit 201, the hot cracking laser unit 202, and the cooling unit 203 can be adjusted as needed, thereby ensuring the alignment of the hot cracking laser and the grooving laser and controlling the size of the laser spot, ensuring the completion of the focus adjustment for laser processing and the alignment adjustment of the two lasers.

[0074] More specifically, in the preferred embodiment, the number of slotting laser units 201 is at least three. At least two slotting laser units 201 are spaced apart in the second direction, and at least one slotting laser unit 201 is spaced apart from two adjacent slotting laser units 201 in the first direction.

[0075] For example, in such Figure 1 In the preferred embodiment shown, the slotting laser unit 201, the hot cracking laser unit 202, and the cooling unit 203 are all three units arranged at intervals; and among the various units, the two units on both sides are arranged at intervals in the second direction, and the unit in the middle is arranged at intervals with the two units on both sides in the first direction.

[0076] More specifically, in the preferred embodiment, the distance between the focal points of two adjacent grooving lasers in the first direction is 15-25 mm; of course, the distance between the focal points of two adjacent grooving lasers in the second direction corresponds to the distance between the two cutting lines on the material, which will not be elaborated here.

[0077] like Figure 1 , Figure 5 As shown, in the preferred embodiment, the material transfer component 300 is disposed below the laser cutting component 200, including a support frame 301 extending along the first direction, and a drive rail 302 for the stage to reciprocate along the first direction is provided on the support frame 301. Then, through the reciprocating motion of the stage in the first direction, the material to be sliced ​​can be picked up and aligned for cutting, resulting in multiple pieces of material and completing the unloading.

[0078] In actual setup, the preferred embodiment uses a negative pressure platform 303, which is assembled with a drive rail 302 via a slider, and a drive mechanism, such as a linear drive motor, is provided corresponding to the slider to complete the reciprocating motion of the negative pressure platform 303 along the first direction.

[0079] More specifically, in the preferred embodiment, the negative pressure stage 303 is used to provide negative pressure, which preferably refers to the stage pressure being within the range of -15 kPa to -35 kPa. Compared to existing material adsorption methods, which combine strong and weak negative pressure adsorption to adsorb materials onto the stage, in the preferred embodiment, all parts of the material on the stage are adsorbed and fixed by negative pressure of -15 kPa to -35 kPa throughout the entire slicing process. This ensures the reliability of material adsorption and avoids bending and deformation of the material slice edges due to excessive negative pressure adsorption force, further improving the quality of material slicing.

[0080] To improve the cutting efficiency of the selected materials, in the preferred embodiment, the drive rails 302 on the support frame 301 are two separate tracks located on both sides of the support frame 301 in the second direction. Negative pressure platforms 303 are mounted on the two drive rails 302 via sliders and drive mechanisms. Simultaneously, to achieve accurate displacement of the two negative pressure platforms 303 in the first direction, the two negative pressure platforms 303 are respectively connected to the drive rails 302 via lifting units 304, allowing the two negative pressure platforms 303 to avoid misalignment during staggered movement in the first direction through the lifting control of the lifting units 304.

[0081] For example, when one of the negative pressure platforms 303 is carrying material and cutting it under the laser cutting assembly 200, another negative pressure platform 303 can be lowered below the bottom surface of the working negative pressure platform 303 and pass under the working negative pressure platform 303 to pick up another piece of material to be cut at one end of the support frame 301, thereby improving the efficiency of material cutting.

[0082] Further preferably, to adapt the negative pressure platform 303 to materials of different sizes, the negative pressure platform 303 in the preferred embodiment includes multiple bearing units arranged at planar intervals. At least some of the bearing units are provided with adsorption holes, and the distance between at least some of the bearing units is adjustable, for example, by connecting multiple adjusting rods in series. In this way, the bearing area of ​​the negative pressure platform 303 can be adjusted according to the size of the material to be sliced, thereby meeting the bearing requirements of materials of different sizes.

[0083] For example, in such Figure 6 In the preferred embodiment shown, the negative pressure stage 303 includes a plurality of bearing units extending along a first direction, the plurality of bearing units being spaced apart in a second direction, and the distance between at least some of the bearing units is adjustable.

[0084] More preferably, a visual imaging component (not shown in the figure) is also provided for the material on the negative pressure stage 303, which is used to take visual pictures of the material fed onto the stage and determine the position of the material so as to provide a basis for the adjustment of the laser cutting component 200.

[0085] Correspondingly, a material correction mechanism (not shown in the figure) is also provided. It is located on one side of the material conveying component 300 and is used to correct the position of the material that has been picked up on the platform to ensure the accuracy of the position of the material conveyed to the laser cutting component 200.

[0086] Of course, in addition to setting up a material correction mechanism to correct the material position, in actual setup, the material correction and cutting can also be completed by controlling the displacement of the laser cutting component 200.

[0087] Specifically, if the material only has an overall displacement error in the second direction, the error can be compensated by controlling the laser cutting component 200 to move a distance equal to the error in the second direction before cutting. After compensation, the position of the laser cutting component 200 is fixed, and the material to be sliced ​​is driven by the material conveying component 300 and displaced in the first direction. (See diagram...) Figures 1-5 Taking a device with three sets of units performing four-slice cutting as an example, after the edge of the material reaches the focus of the grooving laser and the thermal cracking laser (the laser units on both sides of the second direction in the diagram), each laser unit on both sides of the second direction starts working and cuts the material along the predetermined cutting line. The corresponding cooling unit 203 also starts working thereafter to cool the cutting position. Simultaneously, as the material moves in the first direction, the edge of the material between the two cutting lines reaches the focus position of the middle laser unit. At this point, all three sets of laser units start working, forming three cutting lines. The cutting point in the middle is spaced a certain distance from the cutting points on both sides in the first direction, for example, 15~25mm.

[0088] In another scenario, if the material's position has a planar angular deviation, meaning the offset varies across different areas in the first direction, then in addition to using a material correction mechanism for adjustment, the offset can also be compensated for by the continuous displacement of the laser cutting assembly 200 during the cutting process. Similarly, as illustrated in the diagram (… Figures 1-5 Taking a device with three units performing four-slice cutting as an example, before cutting, the laser positions on both sides of the laser cutting assembly 200 are adjusted to correspond to the positions to be cut on the material. The material is controlled to move until the edge of the material reaches the focal point of the grooving laser and the thermal cracking laser (the laser units on both sides of the second direction in the diagram). After that, each laser unit located on both sides of the second direction starts working, cutting the material along the predetermined cutting line, and the corresponding cooling unit 203 also starts working to cool the cutting position. While the material moves along the first direction, the laser cutting assembly 200 is controlled to move synchronously and continuously along the second direction, and the movement of the laser cutting assembly 200 dynamically compensates for the deviation distance at each position of the material. As the material moves in the first direction, the laser unit located in the middle also works accordingly, and its working mode is similar to that described above, so it will not be repeated here.

[0089] In actual setup, the continuous correction motion of the laser cutting component 200 in the second direction can be achieved through the dynamic control of the first sliding component 103.

[0090] Alternatively, a laser displacement module may be provided for the support component 100. In this case, the base 101 of the support component 100 is mounted on the laser displacement module, and the laser cutting component 200 can be displaced in the second direction under the drive of the laser displacement module.

[0091] Of course, based on the configuration of the laser displacement module, it is also preferable to drive the laser cutting component 200 to move in the first direction. When the laser cutting component 200 can reciprocate in the first direction, the material can be sliced ​​without moving in the first direction. That is, the material remains stationary during the cutting process, and the laser cutting component completes the cutting through displacement. At this time, the laser displacement module is a combination structure of the first direction motion unit and the second direction motion unit, such as a collection of two sets of planar sliding components (slider-rail combination) arranged orthogonally.

[0092] The multi-slice laser cutting device of this invention has a compact structure and is easy to control. It can realize multi-slice laser cutting of materials and avoid the influence of thermal stress during adjacent laser cutting. It ensures the accuracy of multi-slice cutting of materials (especially silicon wafers), ensures the quality of material slicing, improves the efficiency of multi-slice cutting, and reduces the manufacturing cost of solar cells.

[0093] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multi-slice laser cutting device, characterized in that, include: Support components; A material transfer assembly; the material transfer assembly includes at least one platform movable back and forth in a first direction, the platform being used to carry the material to be sliced; A laser cutting assembly; the laser cutting assembly is mounted on a support assembly and includes at least three slotting laser units, a thermal cracking laser unit corresponding to each slotting laser unit, and a cooling unit corresponding to each thermal cracking laser unit. Each of the grooving laser units can focus on the material carried by the stage. The distance between the focus points of two adjacent grooving lasers in the second direction is equal to the distance between two adjacent cutting lines on the material, and the focus points of two adjacent grooving lasers are spaced apart by a certain distance in the first direction. Each of the thermal cracking laser units can focus on the material carried by the stage, and the focus point of each thermal cracking laser unit coincides with the focus point of the corresponding grooving laser unit. The working area of ​​each of the cooling units is located on one side of the first direction of the corresponding laser focus point, and is used to cool the cut material. The first direction is the material feeding direction, and the second direction in the same plane is perpendicular to the first direction.

2. The multi-slice laser cutting device according to claim 1, characterized in that, At least two slotted laser units are spaced apart in the second direction, and at least one slotted laser unit is spaced apart from the two adjacent slotted laser units in the first direction.

3. The multi-slice laser cutting device according to claim 2, characterized in that, The grooving laser unit, the thermal cracking laser unit, and the cooling unit are all arranged in three spaced-apart configurations; and In each of the various units, two units located on both sides are spaced apart in the second direction, and a unit located in the middle is spaced apart from the two units on both sides in the first direction.

4. The multi-slice laser cutting apparatus according to any one of claims 1 to 3, characterized in that, The distance between the focal points of two adjacent slotted lasers in the first direction is 15~25mm.

5. The multi-slice laser cutting apparatus according to any one of claims 1 to 3, characterized in that, The support assembly includes a base fixed to the equipment frame and a support plate connected to the base; The support plate is provided with a first sliding component that can be reciprocated in a second direction, and a second sliding component that can be reciprocated vertically is provided on the first sliding component; and The grooving laser unit, the thermal cracking laser unit, and the cooling unit are respectively mounted on the second sliding assembly via connectors, and can be moved horizontally and vertically under the drive of the two sliding assemblies.

6. The multi-slice laser cutting device according to claim 5, characterized in that, At least two types of units have adjustable connectors, which are used to adjust the horizontal position and / or vertical height and / or tilt angle of the corresponding units.

7. The multi-slice laser cutting device according to claim 5, characterized in that, The second sliding assembly is provided with a connecting bracket; the slotting laser unit is mounted on the connecting bracket via a connector; and A connector for mounting the cooling unit is located below the connecting bracket and includes a rotating bracket, a position connecting plate, and a position adjusting member. The position connecting plate is fixedly connected to the connecting bracket, and the position adjusting member is connected to the position connecting plate and includes a first-direction translation unit, a second-direction translation unit, and a vertical lifting unit arranged in combination. The cooling unit is mounted on the rotating bracket, and the rotating bracket is hinged to the position adjusting member.

8. The multi-slice laser cutting device according to claim 1, characterized in that, The material conveying assembly includes a support frame extending along a first direction; drive rails extending along the first direction are respectively provided on both sides of the support frame in a second direction, and lifting units are assembled on the two drive rails; each lifting unit is equipped with a platform, and each platform can be vertically lifted and lowered under the drive of the lifting unit, and can be reciprocated in the first direction under the drive of the drive rails.

9. The multi-slice laser cutting apparatus according to claim 1 or 8, characterized in that, The platform is a negative pressure platform, used to provide a negative pressure of -15kPa to -35kPa and adsorb the material onto the platform.

10. The multi-slice laser cutting device according to claim 9, characterized in that, The negative pressure platform includes multiple bearing units arranged at intervals, at least some of the bearing units have adsorption holes, and the distance between at least some of the bearing units is adjustable.

11. The multi-slice laser cutting device according to claim 1, characterized in that, It also includes a visual imaging component; the visual imaging component is set at the end of the material conveying component used for picking up materials, and is used to take pictures and detect the materials that have been picked up on the platform.

12. The multi-slice laser cutting device according to claim 11, characterized in that, It also includes a material correction mechanism; the material correction mechanism is located on one side of the material conveying component and is used to correct and adjust the material to be cut on the platform after it has been photographed and detected.

13. The multi-slice laser cutting apparatus according to claim 1 or 11, characterized in that, It also includes a laser displacement module; the support component is mounted on the laser displacement module, and the laser cutting component can be displaced in a first direction and / or a second direction under the drive of the laser displacement module.

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