Laser processing pads and laser processing devices

Abstract

This utility model belongs to the technical field of laser processing pads, and discloses a laser processing pad and a laser processing device. The laser processing pad includes multiple layers of metal pads, which are stacked sequentially to form the entire pad, with adjacent layers bonded together. The entire pad can be detachably installed on a laser worktable and used to support the bottom of the workpiece. The multiple layers of metal pads can be peeled off sequentially from bottom to top, with the topmost metal pad serving as the new working pad for each laser operation. This laser processing pad is easy to install and requires no cleaning.

Description

Technical Field

[0001] This utility model relates to the field of laser processing pad technology, and in particular to a laser processing pad and laser processing device. Background Technology

[0002] CO2 laser processing utilizes carbon dioxide gas as the working medium to generate laser light for cutting, engraving, marking, and welding of non-metallic and some metallic materials. During actual processing, the substrate or other workpiece is placed on a pad on the processing table to protect it and prevent damage to the table surface. Currently, the pads used in CO2 laser processing in the industry are mostly made of copper or aluminum. However, these pads require cleaning and brushing after each use to remove surface impurities. This causes the pads to become thin and uneven after a few uses, necessitating replacement and incurring high costs. Furthermore, a layer of adhesive residue adheres to the entire surface of the pad, requiring removal from the processing table for cleaning and brushing, which impacts work efficiency.

[0003] Therefore, there is an urgent need to propose a laser processing pad and a laser processing device to solve the above problems. Utility Model Content

[0004] The first objective of this invention is to provide a laser processing pad that is easy to install and requires no cleaning.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A laser processing pad, comprising multiple layers of metal pads, wherein the multiple layers of metal pads are stacked sequentially to form a whole pad, and adjacent layers of metal pads are bonded together; the whole pad can be detachably installed on a laser worktable for placing under the workpiece; in the whole pad, the multiple layers of metal pads can be peeled off sequentially from bottom to top, with the topmost metal pad serving as the working pad for a new laser operation.

[0007] As an optional technical solution for laser processing pads, the thickness of each layer of the metal pad is h, and 0.05mm≤h≤0.09mm.

[0008] As an optional technical solution for a backing plate used in laser processing, the number of layers of the metal backing plate is n, and 50≤n≤200.

[0009] As an optional technical solution for a backing plate used in laser processing, the metal backing plate is made of copper.

[0010] As an optional technical solution for a backing plate used in laser processing, the metal backing plate is made of aluminum.

[0011] As an optional technical solution for laser processing pads, the two adjacent metal pads are bonded together by an organic connecting coating and a coupling agent.

[0012] As an optional technical solution for a laser processing pad, the laser processing pad also includes a fixing plate. In the entire pad, the metal pad at the bottom layer is bonded to the fixing plate, and the fixing plate is detachably connected to the laser worktable.

[0013] As an optional technical solution for a laser processing pad, the outer periphery of the fixing plate in the entire pad has a bent edge, and the surface of the laser worktable is fitted inside the bent edge.

[0014] As an optional technical solution for a pad used in laser engraving, the bent edge extends along the outer circumference of the fixed plate and is arranged in a closed loop.

[0015] The second objective of this invention is to provide a laser engraving device with high laser processing efficiency.

[0016] To achieve this objective, the present invention adopts the following technical solution:

[0017] The laser engraving device includes a laser engraving machine and the aforementioned laser engraving processing pad. The laser engraving machine is equipped with a laser engraving worktable, on which the workpiece can be processed. The pad is detachably mounted on the laser engraving worktable.

[0018] The beneficial effects of this utility model are:

[0019] The laser processing pad provided by this utility model includes multiple layers of metal pads, which are stacked sequentially to form the entire pad. Adjacent layers of metal pads are bonded together. The entire pad can be detachably installed on the laser worktable and placed under the workpiece. This facilitates laser processing of the workpiece and protects the surface of the laser worktable. Furthermore, the pad is formed by bonding multiple layers of metal pads, which can be peeled off sequentially from bottom to top. Each time, the topmost metal pad serves as the working pad for a new laser operation. After each laser processing operation, the used top layer of metal pad can be removed until the last layer is used up, avoiding the need to clean the entire pad. Moreover, for multiple laser processing operations, the entire pad only needs to be installed on the laser worktable once, saving time and improving work efficiency. Attached Figure Description

[0020] Figure 1This is a schematic diagram of the overall structure of the pad (multi-layer metal pad bonding) provided in this embodiment of the utility model;

[0021] Figure 2 This is an assembly drawing of the laser processing pad and laser worktable provided in this embodiment of the utility model.

[0022] In the picture:

[0023] 100. Integral pad; 110. Metal gasket; 200. Fixing plate; 300. Bending edge. Detailed Implementation

[0024] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0025] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0026] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0027] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0028] This embodiment provides a laser processing pad that is easy to install and requires no cleaning.

[0029] Specifically, such as Figure 1 and Figure 2 As shown, the laser processing pad includes multiple layers of metal pads 110, which are stacked sequentially to form a pad assembly 100, and adjacent layers of metal pads 110 are bonded together. The pad assembly 100 can be detachably installed on the laser worktable and used to support the bottom of the workpiece. In the pad assembly 100, the multiple layers of metal pads 110 can be peeled off sequentially from bottom to top, with the topmost metal pad 110 serving as the working pad for a new laser operation.

[0030] Based on the above design, multiple layers of metal pads 110 are stacked sequentially to form a pad assembly 100, with adjacent layers of metal pads 110 bonded together. The pad assembly 100 can be detachably installed on the laser worktable and used to support the bottom of workpieces (such as substrates), facilitating laser processing of the workpieces and protecting the surface of the laser worktable. Furthermore, since the pad assembly 100 is formed by bonding multiple layers of metal pads 110, these pads can be peeled off sequentially from bottom to top. Each time, the topmost metal pad 110 serves as the working pad for a new laser operation. After each laser processing operation, the used top layer of metal pad 110 can be removed until the last layer is used up, avoiding the need to clean the pad assembly 100. Moreover, during multiple laser processing operations, the pad assembly 100 only needs to be installed on the laser worktable once, saving time and improving work efficiency.

[0031] It should be noted that each single-layer metal gasket 110 can fulfill the function of a backing plate for laser processing; after the used metal gasket 110 on the top layer is removed, the area previously used for bonding on the new top metal gasket 110 will not affect the use of the metal gasket 110.

[0032] It is also worth noting that since each metal gasket 110 can be peeled off from the entire gasket 100 like paper, the metal gasket 110 should be in sheet form.

[0033] Optionally, the thickness of each metal pad 110 is h, and 0.05mm≤h≤0.09mm. If h≤0.05mm, the thickness of each metal pad 110 is too thin, and the top metal pad 110 can be easily penetrated during laser processing, affecting the use of the top metal pad 110 in the next (or even the next) laser processing. That is, multiple layers of metal pads 110 may need to be torn off each time. Furthermore, when only the bottom layer of metal pad 110 remains in the entire pad plate 100, the metal pad 110 is too thin and cannot function as a pad, damaging the workpiece and the surface of the laser worktable. If h≥0.09mm, the thickness of each metal pad 110 is too thick, making it difficult to bond multiple layers of metal pads 110 together. Tearing them off after one use also easily leads to waste.

[0034] For example, the thickness of each metal gasket 110 can be 0.05mm, 0.08mm or 0.09mm, etc., and there is no specific limitation. It can be set as needed.

[0035] In this embodiment, the thickness of each metal pad 110 is 2 oz.

[0036] Optionally, the number of layers of the metal gasket 110 is n, and 50≤n≤200. If n≤50, the number of layers of the metal gasket 110 is too small, and it will be used up after a few times, requiring the replacement of the entire gasket plate 100, which delays processing time; if h≥200, the number of layers of the metal gasket 110 is too large, and the thickness of the entire gasket plate 100 is too thick, occupying a lot of space.

[0037] For example, the number of layers of the metal gasket 110 can be 50, 100, 150 or 200, etc., and there is no specific limitation here. It can be set as needed.

[0038] Optionally, the metal gasket 110 is made of copper. Copper has a high thermal conductivity, which can transfer heat away more quickly, thereby significantly reducing the temperature of the workpiece. Copper also has better strength and hardness, and good wear resistance.

[0039] Optionally, the metal gasket 110 is made of aluminum, which is lightweight, has good corrosion resistance, and is suitable for a wide range of applications.

[0040] Optionally, adjacent metal gaskets 110 are bonded together by an organic linking coating and a coupling agent. Using an "organic linking coating" in combination with a "coupling agent" is a highly efficient method in modern composite materials, coating technologies, and bonding processes. An organic linking coating typically refers to a thin layer of organic polymer with specific functional groups, pre-coated onto the surface of the substrate to be bonded, acting as a "molecular bridge" or "intermediate layer." One side of the coating is bonded to the substrate surface through strong chemical bonds or physical interactions, while the exposed functional groups on the other side (such as amino, epoxy, mercapto, vinyl, etc.) can chemically react with the subsequently applied coupling agent or adhesive / resin. The coupling agent more specifically refers to the silane coupling agent itself (or its solution), a chemical substance that enables the "coupling" function, while the "organic linking coating" is typically a thin film formed after the coupling agent cures on the substrate.

[0041] Optionally, the laser processing pad also includes a fixing plate 200. In the entire pad 100, the bottom metal pad 110 is bonded to the fixing plate 200. The fixing plate 200 is detachably connected to the laser worktable. Only the bottom metal pad 110 is connected to the fixing plate 200, and the fixing plate 200 can be detachably installed on the laser worktable. This allows the last layer of metal pads 110 to be removed and replaced without affecting the removal of other layers of metal pads 110.

[0042] Furthermore, the outer periphery of the fixing plate 200 is provided with a bent edge 300, and the table surface of the laser workbench is fitted inside the bent edge 300. That is, the fixing plate 200 is hooked onto the table surface of the laser workbench through the bent edge 300 at the bottom, which makes the installation simple and the connection firm.

[0043] In this embodiment, the bent edge 300 extends along the outer periphery of the fixed plate 200 and is arranged in a closed loop, which increases the contact area between the bent edge 300 and the surface of the laser worktable and improves the connection strength.

[0044] Of course, in some other embodiments, the bent edges 300 may be evenly spaced along the outer periphery of the fixing plate 200.

[0045] This embodiment also provides a laser engraving device with high laser processing efficiency.

[0046] Specifically, the laser device includes a laser machine and the aforementioned laser processing pad. The laser machine is equipped with a laser worktable, and the workpiece can be processed on the laser worktable. The pad is 100% detachable and installed on the laser worktable. Multiple layers of metal pads 110 are stacked sequentially to form a pad assembly 100, with adjacent layers of metal pads 110 bonded together. The pad assembly 100 can be detachably installed on the laser worktable and placed under the workpiece, facilitating laser processing and protecting the worktable surface. Furthermore, the pad assembly 100, formed by bonding multiple layers of metal pads 110, can be peeled off sequentially from bottom to top. Each time, the topmost metal pad 110 serves as the working pad for a new laser operation. After each laser processing operation, the used top layer of metal pad 110 can be removed until the last layer is used, avoiding the need to clean the pad assembly 100. Moreover, during multiple laser processing operations, the pad assembly 100 only needs to be installed on the laser worktable once, saving time and improving work efficiency.

[0047] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A pad for laser engraving, characterized in that, The laser processing pad includes multiple layers of metal pads (110), which are stacked sequentially to form a whole pad (100), and adjacent layers of metal pads (110) are bonded together. The whole pad (100) can be detachably installed on the laser worktable and used to support the bottom of the workpiece. In the whole pad (100), the multiple layers of metal pads (110) can be peeled off sequentially from bottom to top, and the topmost metal pad (110) each time serves as a new working pad for laser operation.

2. The laser processing pad according to claim 1, characterized in that, The thickness of each layer of the metal gasket (110) is h, and 0.05mm≤h≤0.09mm.

3. The laser processing pad according to claim 1, characterized in that, The number of layers of the metal gasket (110) is n, and 50≤n≤200.

4. The laser processing pad according to claim 1, characterized in that, The metal gasket (110) is made of copper.

5. The laser processing pad according to claim 1, characterized in that, The metal gasket (110) is made of aluminum.

6. The laser processing pad according to claim 1, characterized in that, The adjacent metal gaskets (110) are bonded together by an organic bonding coating and a coupling agent.

7. The laser processing pad according to claim 1, characterized in that, The laser processing pad also includes a fixing plate (200). In the entire pad (100), the bottom metal pad (110) is bonded to the fixing plate (200). The fixing plate (200) is detachably connected to the laser worktable.

8. The laser processing pad according to claim 7, characterized in that, The outer periphery of the fixing plate (200) is provided with a bent edge (300), and the table surface of the laser worktable is fitted inside the bent edge (300).

9. The laser processing pad according to claim 8, characterized in that, The bent edge (300) extends along the outer periphery of the fixed plate (200) and is arranged in a closed loop.

10. A laser engraving device, characterized in that, The invention includes a laser machine and a laser processing pad as described in any one of claims 1-9. The laser machine is equipped with a laser worktable, and the workpiece can be processed on the laser worktable. The pad as a whole (100) is detachably mounted on the laser worktable.

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