An optical fiber subassembly automatic assembly apparatus

Abstract

This utility model discloses an automatic assembly equipment for fiber optic base assemblies, including a machine frame with a material flipping mechanism on the frame. A base feeding mechanism and a top cover feeding mechanism are located on the first side of the material flipping mechanism, and a material conveying mechanism, a spring feeding mechanism, and a chip feeding mechanism are located on the second side of the material flipping mechanism. This automatic assembly equipment for fiber optic base assemblies integrates base feeding, top cover assembly, material flipping and conveying, spring assembly, and chip assembly processes onto the same machine frame through a highly integrated and compact layout. These processes are systematically connected around the material flipping and conveying mechanisms, significantly shortening the material flow path between modules and reducing intermediate transfer links. This effectively shortens the production cycle time of individual products, achieving continuous and efficient automated production. Simultaneously, it ensures that the assembly position of each base and the installation posture of the springs and chips are highly consistent, significantly improving the product yield.

Description

Technical Field

[0001] This utility model relates to the field of automation equipment technology, specifically to an automatic assembly equipment for fiber optic base components. Background Technology

[0002] Fiber optic base assemblies are a core component of optical communication devices, widely used in fiber optic connectors, optical modules, fiber optic sensors, and various optical transmission equipment. The assembly quality of fiber optic base assemblies directly affects the coupling efficiency and transmission stability of optical signals. With the rapid development of optical communication networks towards higher speeds and higher densities, the production demand for fiber optic base assemblies has increased dramatically, placing higher requirements on assembly efficiency, precision, and consistency.

[0003] The current assembly of the aforementioned fiber optic base components mainly employs two technical methods: one is manual assembly, which requires high precision in positioning the fiber optic chip, the installation direction of the spring clips, and the fastening force of the top cover. Manual operation is not only labor-intensive and inefficient, but also prone to poor product consistency and high scrap rate due to differences in the skill level and condition of different operators, making it difficult to meet the needs of large-scale production; the other is automated equipment assembly, which often adopts a decentralized layout for assembling fiber optic base components. The integration of the equipment is not high, and the modules are connected by long conveyor lines or transfer mechanisms, resulting in an excessively long flow path for the entire assembly line and reducing the production cycle time, thus limiting the overall efficiency of the equipment.

[0004] In view of this, there is an urgent need to design a new type of automated assembly equipment for fiber optic base components to solve the technical defects of existing fiber optic base component assembly. Utility Model Content

[0005] To address the aforementioned problems, this utility model provides an automatic assembly device for fiber optic base assemblies, including a machine frame. The machine frame is equipped with a material flipping mechanism. A first side of the material flipping mechanism includes a base feeding mechanism and a top cover feeding mechanism. A second side of the material flipping mechanism includes a material conveying mechanism, a spring feeding mechanism, and a chip feeding mechanism. The material flipping mechanism includes a flipping bracket, a flipping power source connected to the flipping bracket, a flipping component driven by the flipping power source, a feeding guide groove located beside the flipping bracket, a pushing power source located beside the flipping bracket, and a feeding guide groove driven by the pushing power source. The pusher is driven by a power source, and the flipper has a material flipping position. The material flipping position is driven by the flipping power source to reciprocate between the pusher and the feed guide groove. The base loading mechanism is used to push the base into the feed guide groove. The top cover loading mechanism is used to assemble the top cover onto the base. The material flipping mechanism is used to transfer the base from the feed guide groove to the material conveying mechanism. The material conveying mechanism is used to sequentially convey the base. The spring piece loading mechanism is used to assemble the spring piece onto the base. The chip loading mechanism is used to assemble the chip onto the base.

[0006] The present invention is further configured such that the base feeding mechanism includes a base vibrating plate, a base feeding track connected to the base vibrating plate, a base screening power source located at the discharge end of the base feeding track, a base screening component driven by the base screening power source, a base top material power source located beside the base feeding track, and a base top material component driven by the base top material power source. The base screening component has a base feeding position, and the base feeding position moves back and forth between the base feeding track and the base top material component with the base screening component. The base top material component is used to push the base in the base feeding position into the feeding guide groove.

[0007] The present invention is further configured such that the upper cover feeding mechanism includes an upper cover vibrating plate, an upper cover feeding track connected to the upper cover vibrating plate, an upper cover screening power source located at the discharge end of the upper cover feeding track, an upper cover screening component driven by the upper cover screening power source, an upper cover top material power source located beside the upper cover screening component, and an upper cover top material component driven by the upper cover top material power source. The upper cover screening component is provided with an upper cover feeding position. The upper cover feeding position moves back and forth between the upper cover feeding track and the upper cover top material component with the upper cover screening component. The upper cover top material component is used to assemble the upper cover in the upper cover feeding position onto the base in the feeding guide groove.

[0008] The present invention is further configured such that the material conveying mechanism includes a transfer bracket, a transfer power source located beside the transfer bracket, a transfer plate driven by the transfer power source, and a one-way shifting component connected to the transfer plate. The transfer bracket has a transfer channel, and a transfer slot is provided below the transfer channel. The one-way shifting component is located in the transfer slot, and the transfer channel is directly opposite the pusher.

[0009] The present invention is further provided with a discharge slide at the discharge end of the transfer channel.

[0010] The present invention is further configured such that the spring feeding mechanism includes a spring vibratory plate, a spring feeding track connected to the spring vibratory plate, a spring blocking power source located at the discharge end of the spring feeding track, a spring blocking component driven by the spring blocking power source, a spring lifting power source located beside the transfer channel, and a spring lifting component driven by the spring lifting power source. The spring lifting component faces the transfer channel and is used to assemble the spring at the discharge end of the spring feeding track onto the base inside the transfer channel. The spring blocking component is movably connected between the transfer channel and the spring lifting component.

[0011] The present invention is further configured such that the chip feeding mechanism includes a chip vibratory feeder, a chip feeding track connected to the chip vibratory feeder, a chip stopper located at the discharge end of the chip feeding track, a chip stopper power source connected to the chip stopper, a chip stopper column driven by the chip stopper power source, a chip transfer assembly located beside the chip stopper, a chip top-loading power source located on the transfer bracket, and a chip top-loading component driven by the chip top-loading power source. The chip stopper is provided with a chip feeding channel connected to the chip feeding track, the chip stopper column is positioned directly opposite the chip feeding channel, the chip transfer assembly is used to transfer the chip to below the chip top-loading component, and the chip top-loading component is used to assemble the chip onto a base within the transfer channel.

[0012] The present invention is further configured such that the chip transfer assembly includes a chip transfer bracket, a first chip longitudinal movement force source connected to the chip transfer bracket, a first chip longitudinal transfer plate driven by the first chip longitudinal movement force source, a chip transverse movement force source connected to the first chip longitudinal transfer plate, a chip transverse transfer plate driven by the chip transverse movement force source, a second chip longitudinal movement force source connected to the chip transverse transfer plate, and a second chip longitudinal transfer plate driven by the second chip longitudinal movement force source. The second chip longitudinal transfer plate is provided with a chip transfer groove, and the chip stop is provided with a chip guide groove facing the transfer channel. The chip transfer groove reciprocates between the chip loading channel and the chip guide groove with the second chip longitudinal transfer plate.

[0013] The present invention is further configured such that the flipping angle of the flipping component is 90°.

[0014] The present invention is further configured such that the spring feeding mechanism and the chip feeding mechanism are respectively arranged on both sides of the material conveying mechanism.

[0015] The working principle of the automatic assembly equipment for fiber optic base components in this technical solution is as follows: When the equipment is started, the base feeding mechanism pushes the base into the feeding guide groove, and the top cover feeding mechanism assembles the base into the base in the feeding guide groove. After the base with the top cover assembled enters the material flipping position on the flipping component, the flipping power source drives the flipping component to rotate. The material flipping position rotates to the position of the pushing component, and the pushing power source drives the pushing component to move, pushing the base in the material flipping position onto the material conveying mechanism. The material conveying mechanism gradually moves the base through the spring piece feeding mechanism and the chip feeding mechanism in sequence. The spring piece feeding mechanism assembles the spring pieces onto the base, and the chip feeding mechanism assembles the chips onto the base. Finally, the material is unloaded to complete the automatic assembly of the fiber optic base components.

[0016] Compared with the prior art, the technical solution provided by this utility model has the following advantages: This technical solution's automated assembly equipment for fiber optic base components integrates base loading, top cover assembly, material flipping and conveying, spring assembly, and chip assembly into a single machine frame through a highly integrated and compact layout. These processes are systematically connected around the material flipping and conveying mechanisms, significantly shortening the material flow path between modules and reducing intermediate transfer links. This effectively shortens the production cycle time for individual products, achieving continuous and efficient automated production. Simultaneously, the use of mechanical positioning and automated assembly eliminates quality fluctuations caused by differences in operator skill and skill level, ensuring high consistency in the assembly position of each base and the installation posture of springs and chips, thus significantly improving product yield. Attached Figure Description

[0017] Figure 1 This is a perspective view of an automatic assembly device for fiber optic base components according to an embodiment of this utility model.

[0018] Figure 2 This is a top view of the automatic assembly equipment for the fiber optic base assembly according to an embodiment of this utility model.

[0019] Figure 3 This is a perspective view of the material flipping mechanism, the base feeding mechanism, and the top cover feeding mechanism of this utility model embodiment.

[0020] Figure 4 This is a perspective view of the base feeding mechanism in an embodiment of this utility model.

[0021] Figure 5This is a perspective view of the upper cover feeding mechanism in an embodiment of this utility model.

[0022] Figure 6 This is a cross-sectional view of the upper cover feeding mechanism in an embodiment of this utility model.

[0023] Figure 7 This is a perspective view of the material flipping mechanism, material conveying mechanism, spring feeding mechanism, and chip feeding mechanism of this utility model embodiment.

[0024] Figure 8 This is a perspective view of the material flipping mechanism and the material conveying mechanism according to an embodiment of the present utility model.

[0025] Figure 9 This is a cross-sectional view of the material flipping mechanism and the material conveying mechanism according to an embodiment of the present utility model.

[0026] Figure 10 This is a perspective view of the spring feeding mechanism according to an embodiment of the present utility model.

[0027] Figure 11 This is a cross-sectional view of the spring feeding mechanism according to an embodiment of the present utility model.

[0028] Figure 12 This is a perspective view of the chip feeding mechanism according to an embodiment of the present utility model.

[0029] Figure 13 This is a cross-sectional view of the chip feeding mechanism according to an embodiment of the present invention.

[0030] Figure 14 for Figure 13 Enlarged schematic diagram of part A in the middle.

[0031] Figure 15 This is a perspective view of the fiber optic base assembly according to an embodiment of the present invention.

[0032] Explanation of reference numerals in the attached drawings: 1. Equipment frame; 2. Material tilting mechanism; 21. Tilting support; 22. Tilting power source; 23. Tilting component; 231. Material tilting position; 24. Feed guide chute; 25. Pushing power source; 26. Pushing component; 3. Base loading mechanism; 31. Base vibratory feeder; 32. Base feeding track; 33. Base screening power source; 34. Base screening component; 341. Base loading position; 35. Base top loading power source; 36. Base top loading component; 4. Top cover loading mechanism; 41. Top cover vibratory feeder; 42. Top cover feeding track; 43. Top cover screening power source; 44. Top cover screening component; 441. Top cover loading position; 45. Top cover top loading power source; 46. Top cover top loading component; 5. Material conveying mechanism; 51. Transfer support; 511. Transfer channel; 512. Transfer slot; 52. Transfer power source; 53. 54. Transfer plate; 55. One-way shifting assembly; 6. Discharge slide; 7. Spring feeding mechanism; 8. Spring vibratory feeder; 9. Spring feeding track; 10. Spring blocking power source; 11. Spring blocking component; 12. Spring lifting power source; 13. Spring lifting component; 24. Chip feeding mechanism; 15. Chip vibratory feeder; 16. Chip feeding track; 17. Chip blocking seat; 18. Chip feeding channel; 19. Chip guide groove; 10. Chip blocking power source; 10. Chip blocking column; 11. Chip lifting power source; 12. Chip lifting component; 13. Chip transfer bracket; 14. First chip longitudinal movement power source; 15. First chip longitudinal movement plate; 16. Chip transverse movement power source; 17. Chip transverse movement plate; 18. Second chip longitudinal movement power source; 19. Second chip longitudinal movement plate; 10. Chip transfer groove. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0034] Combined with appendix Figure 15 This is a perspective view of the fiber optic base assembly to be assembled by the automatic assembly equipment in this embodiment. The fiber optic base assembly 8 includes a base 81, a top cover 82, a spring 83, and a chip 84. The top cover 82, the spring 83, and the chip 84 are all connected to the base 81.

[0035] Combined with appendix Figure 1 To be continued Figure 14The utility model technical solution is an automatic assembly equipment for fiber optic base components, including a machine frame 1. The machine frame 1 is equipped with a material flipping mechanism 2. The first side of the material flipping mechanism 2 is equipped with a base feeding mechanism 3 and a top cover feeding mechanism 4. The second side of the material flipping mechanism 2 is equipped with a material conveying mechanism 5, a spring feeding mechanism 6, and a chip feeding mechanism 7. The material flipping mechanism 2 includes a flipping bracket 21, a flipping power source 22 connected to the flipping bracket 21, a flipping component 23 driven by the flipping power source 22, a feeding guide groove 24 located beside the flipping bracket 21, a pushing power source 25 located beside the flipping bracket 21, and a component driven by the pushing power source 25. The pusher 26 and the flipper 23 are provided with a material flipping position 231. The material flipping position 231 is driven by the flipping power source 22 to move back and forth between the pusher 26 and the feed guide 24. The base loading mechanism 3 is used to push the base into the feed guide 24. The top cover loading mechanism 4 is used to assemble the top cover onto the base in the feed guide 24. The material flipping mechanism 2 is used to transfer the base from the feed guide 24 to the material conveying mechanism 5. The material conveying mechanism 5 is used to convey the base sequentially. The spring piece loading mechanism 6 is used to assemble the spring piece onto the base. The chip loading mechanism 7 is used to assemble the chip onto the base.

[0036] The working principle of the automatic assembly equipment for fiber optic base components in this embodiment is as follows: When the equipment is started, the base feeding mechanism 3 pushes the base into the feeding guide groove 24, and the top cover feeding mechanism 4 assembles the base into the base in the feeding guide groove 24. After the base with the top cover assembled enters the material flipping position 231 on the flipping component 23, the flipping power source 22 drives the flipping component 23 to rotate, and the material flipping position 231 rotates to the position of the pushing component 26. The pushing power source 25 drives the pushing component 26 to move, pushing the base in the material flipping position 231 onto the material conveying mechanism 5. The material conveying mechanism 5 gradually moves the base through the spring piece feeding mechanism 6 and the chip feeding mechanism 7 in sequence. The spring piece feeding mechanism 6 assembles the spring pieces onto the base, and the chip feeding mechanism 7 assembles the chips onto the base. Finally, the material is unloaded to complete the automatic assembly of the fiber optic base components.

[0037] In this embodiment, the base feeding mechanism 3 and the top cover feeding mechanism 4 complete the assembly of the base and the top cover on the first side of the material flipping mechanism 2 (specifically, within the feeding guide groove 24); after the top cover is assembled, the base enters the material flipping position 231 of the flipping member 23 along the feeding guide groove 24; the flipping power source 22 drives the flipping member 23 to rotate, so that the material flipping position 231 faces the pushing member 26; the pushing power source 25 drives the pushing member 26 to move, pushing the base in the material flipping position 231 to the material conveying mechanism 5; the spring feeding mechanism 6 and the chip feeding mechanism 7 complete the assembly of the spring and the chip on the second side of the material flipping mechanism 2.

[0038] This embodiment of the automatic assembly equipment for fiber optic base components integrates base feeding, top cover assembly, material flipping and conveying, spring assembly, and chip assembly into a single machine frame through a highly integrated and compact layout. These processes are systematically connected around the material flipping mechanism 2 and the material conveying mechanism 5, significantly shortening the material flow path between modules and reducing intermediate transfer links. This effectively shortens the production cycle of a single product and achieves continuous and efficient automated production. At the same time, the use of mechanical positioning and automated assembly eliminates quality fluctuations caused by differences in operator proficiency and condition, ensuring that the assembly position of each base and the installation posture of the springs and chips are highly consistent, greatly improving the product yield.

[0039] In this embodiment, as shown in the appendix Figure 3 and attached Figure 4 As shown, the base feeding mechanism 3 includes a base vibrating plate 31, a base feeding track 32 connected to the base vibrating plate 31, a base screening power source 33 located at the discharge end of the base feeding track 32, a base screening component 34 driven by the base screening power source 33, a base top material power source 35 located beside the base feeding track 32, and a base top material component 36 driven by the base top material power source 35. The base screening component 34 has a base feeding position 341. The base feeding position 341 moves back and forth between the base feeding track 32 and the base top material component 36 with the base screening component 34. The base top material component 36 is used to push the base in the base feeding position 341 into the feeding guide groove 24.

[0040] In this embodiment, as shown in the appendix Figure 3 Appendix Figure 5 and attached Figure 6As shown, the upper cover feeding mechanism 4 includes an upper cover vibrating plate 41, an upper cover feeding track 42 connected to the upper cover vibrating plate 41, an upper cover screening power source 43 located at the discharge end of the upper cover feeding track 42, an upper cover screening component 44 driven by the upper cover screening power source 43, an upper cover top material power source 45 located beside the upper cover screening component 44, and an upper cover top material component 46 driven by the upper cover top material power source 45. The upper cover screening component 44 is provided with an upper cover feeding position 441. The upper cover feeding position 441 moves back and forth between the upper cover feeding track 42 and the upper cover top material component 46 with the upper cover screening component 44. The upper cover top material component 46 is used to assemble the upper cover in the upper cover feeding position 441 onto the base in the feeding guide groove 24.

[0041] In this embodiment, as shown in the appendix Figure 7 To be continued Figure 9 As shown, the material conveying mechanism 5 includes a transfer bracket 51, a transfer power source 52 located beside the transfer bracket 51, a transfer plate 53 driven by the transfer power source 52, and a one-way shifting component 54 connected to the transfer plate 53. The transfer bracket 51 has a transfer channel 511, and a transfer slot 512 is provided below the transfer channel 511. The one-way shifting component 54 is located in the transfer slot 512. The transfer channel 511 is directly opposite the pusher 26. The transfer channel 511 is used for the movement of the base on the transfer bracket 51. The one-way shifting component 54 can adopt a shifting block structure with one-way swing, which is a conventional structure of automated equipment and will not be described in detail.

[0042] In this embodiment, as shown in the appendix Figure 7 To be continued Figure 8 As shown, the discharge end of the transfer channel 511 is provided with a discharge slide 55, which is used to unload the assembled optical fiber base assembly.

[0043] In this embodiment, as shown in the appendix Figure 10 and attached Figure 11 As shown, the spring feeding mechanism 6 includes a spring vibrating plate 61, a spring feeding track 62 connected to the spring vibrating plate 61, a spring blocking power source 63 located at the discharge end of the spring feeding track 62, a spring blocking component 64 driven by the spring blocking power source 63, a spring lifting power source 65 located beside the transfer channel 511, and a spring lifting component 66 driven by the spring lifting power source 65. The spring lifting component 66 faces the transfer channel 511 and is used to assemble the springs at the discharge end of the spring feeding track 62 onto the base inside the transfer channel 511. The spring blocking component 64 is movably connected between the transfer channel 511 and the spring lifting component 66.

[0044] In this embodiment, as shown in the appendix Figure 7 and appendix Figure 12 To be continued Figure 14 As shown, the chip loading mechanism 7 includes a chip vibratory feeder 71, a chip feeding track 72 connected to the chip vibratory feeder 71, a chip stopper 73 located at the discharge end of the chip feeding track 72, a chip stopper power source 74 connected to the chip stopper 73, a chip stopper column 75 driven by the chip stopper power source 74, a chip transfer assembly located beside the chip stopper 73, a chip top-loading power source 76 located on the transfer bracket 51, and a chip top-loading component 77 driven by the chip top-loading power source 76. The chip stopper 73 is provided with a chip loading channel 731 communicating with the chip feeding track 72. The chip stopper column 75 is positioned directly opposite the chip loading channel 731. The chip transfer assembly is used to transfer the chip to the area below the chip top-loading component 77. The chip top-loading component 77 is used to assemble the chip onto the base within the transfer channel 511.

[0045] In this embodiment, as shown in the appendix Figure 12 To be continued Figure 14 As shown, the chip transfer assembly includes a chip transfer bracket 78, a first chip longitudinal movement force source 79 connected to the chip transfer bracket 78, a first chip longitudinal transfer plate 710 driven by the first chip longitudinal movement force source 79, a chip lateral movement force source 711 connected to the first chip longitudinal transfer plate 710, a chip lateral transfer plate 712 driven by the chip lateral movement force source 711, a second chip longitudinal movement force source 713 connected to the chip lateral transfer plate 712, and a second chip longitudinal transfer plate 714 driven by the second chip longitudinal movement force source 713. The second chip longitudinal transfer plate 714 has a chip transfer groove 7141, and the chip stop 73 has a chip guide groove 732 facing the transfer channel 511. The chip transfer groove 7141 moves back and forth between the chip loading channel 731 and the chip guide groove 732 with the second chip longitudinal transfer plate 714.

[0046] In this embodiment, the flipping angle of the flipping component 23 is 90°, that is, after the base is assembled with the top cover, it needs to be flipped 90° before the spring and chip are assembled.

[0047] In this embodiment, the spring feeding mechanism 6 and the chip feeding mechanism 7 are respectively arranged on both sides of the material conveying mechanism 5, which is more conducive to the high integration of the mechanism on the equipment.

[0048] In this embodiment, each feeding station is equipped with a probe to detect whether the material is in place in order to proceed to the next step of the operation.

[0049] In this embodiment, due to the high integration of various mechanisms, some overlap in the installation of the components is inevitable. The equipment adopts a modular design concept (base feeding mechanism 3, top cover feeding mechanism 4, material flipping mechanism 2, material conveying mechanism 5, spring feeding mechanism 6, chip feeding mechanism 7, etc.). The functional modules of each mechanism are relatively independent yet closely cooperate. This layout not only facilitates debugging and maintenance but also improves the overall operational stability of the equipment. The equipment realizes full automation from base feeding, top cover assembly, material transfer, to spring and chip assembly. Workers only need to be responsible for equipment monitoring and material replenishment, which greatly reduces labor intensity. At the same time, one automated production line can replace multiple manual workstations, effectively saving labor costs.

[0050] It should also be noted that, in this specification, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0051] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An automated assembly device for fiber optic base assemblies, comprising a machine frame, characterized in that, The equipment frame is equipped with a material flipping mechanism. The first side of the material flipping mechanism is equipped with a base feeding mechanism and a top cover feeding mechanism. The second side of the material flipping mechanism is equipped with a material conveying mechanism, a spring feeding mechanism, and a chip feeding mechanism. The material flipping mechanism includes a flipping bracket, a flipping power source connected to the flipping bracket, a flipping component driven by the flipping power source, a feeding guide groove located next to the flipping bracket, a pushing power source located next to the flipping bracket, and a pushing component driven by the pushing power source. The flipping component has a material flipping position, which is driven by the flipping power source to reciprocate between the pushing component and the feeding guide groove. The base feeding mechanism is used to push the base into the feeding guide groove, the top cover feeding mechanism is used to assemble the top cover onto the base, the material flipping mechanism is used to transfer the base from the feeding guide groove to the material conveying mechanism, the material conveying mechanism is used to sequentially convey the base, the spring feeding mechanism is used to assemble the spring onto the base, and the chip feeding mechanism is used to assemble the chip onto the base.

2. The automatic assembly equipment for fiber optic base components according to claim 1, characterized in that, The base feeding mechanism includes a base vibrating plate, a base feeding track connected to the base vibrating plate, a base screening power source located at the discharge end of the base feeding track, a base screening component driven by the base screening power source, a base top material power source located beside the base feeding track, and a base top material component driven by the base top material power source. The base screening component has a base feeding position, and the base feeding position moves back and forth between the base feeding track and the base top material component with the base screening component. The base top material component is used to push the base in the base feeding position into the feeding guide groove.

3. The automatic assembly equipment for fiber optic base components according to claim 1, characterized in that, The upper cover feeding mechanism includes an upper cover vibrating plate, an upper cover feeding track connected to the upper cover vibrating plate, an upper cover screening power source located at the discharge end of the upper cover feeding track, an upper cover screening component driven by the upper cover screening power source, an upper cover top material power source located beside the upper cover screening component, and an upper cover top material component driven by the upper cover top material power source. The upper cover screening component is provided with an upper cover feeding position. The upper cover feeding position moves back and forth between the upper cover feeding track and the upper cover top material component with the upper cover screening component. The upper cover top material component is used to assemble the upper cover in the upper cover feeding position onto the base in the feeding guide groove.

4. The automatic assembly equipment for fiber optic base components according to claim 1, characterized in that, The material conveying mechanism includes a transfer bracket, a transfer power source located beside the transfer bracket, a transfer plate driven by the transfer power source, and a one-way shifting component connected to the transfer plate. The transfer bracket has a transfer channel, and a transfer slot is provided below the transfer channel. The one-way shifting component is located in the transfer slot, and the transfer channel is directly opposite the pusher.

5. The automatic assembly equipment for fiber optic base components according to claim 4, characterized in that, The discharge end of the transfer channel is equipped with a discharge chute.

6. The automatic assembly equipment for fiber optic base components according to claim 4, characterized in that, The spring feeding mechanism includes a spring vibratory plate, a spring feeding track connected to the spring vibratory plate, a spring blocking power source located at the discharge end of the spring feeding track, a spring blocking component driven by the spring blocking power source, a spring lifting power source located beside the transfer channel, and a spring lifting component driven by the spring lifting power source. The spring lifting component faces the transfer channel and is used to assemble the springs at the discharge end of the spring feeding track onto the base inside the transfer channel. The spring blocking component is movably connected between the transfer channel and the spring lifting component.

7. The automatic assembly equipment for fiber optic base components according to claim 4, characterized in that, The chip loading mechanism includes a chip vibratory feeder, a chip feeding track connected to the chip vibratory feeder, a chip stopper located at the discharge end of the chip feeding track, a chip stopping power source connected to the chip stopper, a chip stopping column driven by the chip stopping power source, a chip transfer assembly located beside the chip stopper, a chip top-loading power source located on the transfer bracket, and a chip top-loading component driven by the chip top-loading power source. The chip stopper is provided with a chip loading channel connected to the chip feeding track. The chip stopping column is positioned directly opposite the chip loading channel. The chip transfer assembly is used to transfer the chip to below the chip top-loading component. The chip top-loading component is used to assemble the chip onto a base within the transfer channel.

8. The automatic assembly equipment for fiber optic base components according to claim 7, characterized in that, The chip transfer assembly includes a chip transfer bracket, a first chip longitudinal movement force source connected to the chip transfer bracket, a first chip longitudinal transfer plate driven by the first chip longitudinal movement force source, a chip transverse movement force source connected to the first chip longitudinal transfer plate, a chip transverse transfer plate driven by the chip transverse movement force source, a second chip longitudinal movement force source connected to the chip transverse transfer plate, and a second chip longitudinal transfer plate driven by the second chip longitudinal movement force source. The second chip longitudinal transfer plate has a chip transfer groove, and the chip stop has a chip guide groove facing the transfer channel. The chip transfer groove moves back and forth between the chip loading channel and the chip guide groove with the second chip longitudinal transfer plate.

9. An automatic assembly device for fiber optic base assemblies according to any one of claims 1 to 8, characterized in that, The flipping angle of the flipping component is 90°.

10. An automatic assembly device for an optical fiber base assembly according to any one of claims 1 to 8, characterized in that, The spring feeding mechanism and the chip feeding mechanism are respectively arranged on both sides of the material conveying mechanism.

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