Intelligent robot manufacturing part polishing device

Abstract

This utility model relates to the technical field of parts grinding devices, and discloses a parts grinding device for intelligent robot manufacturing. It achieves rapid replacement of the chip collection box by setting up a slot, chip collection box, and rocker arm. When the chip collection box needs to be replaced, the instep or side of the foot is used to kick the pin, causing it to slide away from the rocker arm and releasing the position restriction on the side plate insertion hole. Then, the side plate is stepped on, causing the rocker arm to rotate around the pivot, making the surface of the rocker arm inclined. A hydraulic damper is used to slowly release force when the side plate is stepped on, controlling the rotation speed of the rocker arm and preventing excessive inertia from causing the chip collection box to fall instantly. After the rocker arm rotates to a certain angle, the chip collection box begins to slide down due to gravity, sliding out of the box along the inclined surface of the rocker arm. Then, the chip collection box is pulled out by a hook-locking device, completing the removal process and achieving the effect of rapid chip collection box replacement.

Description

Technical Field

[0001] This utility model relates to the technical field of parts grinding devices, and in particular to parts grinding devices for intelligent robot manufacturing. Background Technology

[0002] Intelligent robots are mechanical devices that integrate multiple advanced technologies. They possess perception, decision-making, and execution capabilities, and can imitate or perform human behaviors and tasks. They are products that highly combine physical and intellectual labor, creating artificial machines that can "think." In the construction of robots, parts need to undergo processes such as grinding and polishing during production to facilitate the connection and installation between parts. Grinding devices are needed when grinding parts.

[0003] In the existing technology, traditional grinding devices have a chip collection function to collect the waste chips generated by the workpiece and the grinding media during grinding. However, the chip collection box of the grinding device has certain shortcomings. When disassembling and replacing the chip collection box, the chip collection box plus the waste chips is quite heavy. Generally, the chip collection box is installed inside the box, which is inconvenient to pull out or move out. Furthermore, due to the seal between the box and the chip collection box, it is even more inconvenient to replace the chip collection box. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a parts grinding device for intelligent robot manufacturing, which has the advantages of quick replacement of the chip collection box and sliding seal of the baffle, thus solving the problems mentioned in the background technology.

[0005] This utility model provides the following technical solution: a parts grinding device for intelligent robot manufacturing, comprising a housing, with transverse sliding grooves on both sides of the housing, and clamping devices symmetrically and slidably installed inside the transverse sliding grooves; a waste chip outlet is opened in the middle of the top surface of the housing; a box groove is opened on one side of the housing, and the waste chip outlet is connected to the box groove; a rocker arm is rotatably installed inside the box groove, and a chip collection box is placed on the top of the rocker arm; a reset groove is opened on the bottom wall of the box groove, and a reset device is installed inside the reset groove; shrinkage grooves are opened on the upper sides of both walls of the box groove, and sealing devices are slidably installed inside the shrinkage grooves; and a pin is slidably installed on one side of the housing at the opening of the box groove.

[0006] With the above structural design, the rocker arm and the chip collection box work together to achieve quick disassembly and replacement of the chip collection box. By stepping on the rocker arm, the rocker arm rotates. After the rocker arm rotates, the chip collection box slides out of the box due to gravity along the inclined surface of the rocker arm. A reset device is added to achieve a buffering effect.

[0007] Preferably, the bottom of the rocker is provided with a horizontal column above the shrink groove, and the two sides of the rocker are provided with rotating columns. The rocker is rotatably installed inside the box groove through the rotating columns. One side of the end of the rocker is provided with a side plate, and the side of the side plate away from the rocker is provided with an insertion hole. The shape and size of the insertion hole are adapted to the end of the pin.

[0008] With the above structural design, when not in use, the sliding pin is inserted into the side plate socket to limit the rocker and prevent it from being stepped on.

[0009] Preferably, the reset device includes a crossbar, a hydraulic buffer, and a tension spring. The crossbar is fixedly installed inside the reset groove. The crossbar and the cross post are positioned correspondingly. A hydraulic buffer is movably connected between the crossbar and the cross post. The two ends of the hydraulic buffer are respectively rotatably sleeved on the outer rings of the crossbar and the cross post. Tension springs are symmetrically and movably connected between the crossbar and the cross post, and are located on both sides of the hydraulic buffer.

[0010] With the above structural design, the slow release of force when stepping on the side plate controls the rotation speed of the rocker, preventing the chip collection box from slipping instantly due to excessive rotational inertia. The tension spring allows the rocker to rebound quickly after being stepped on.

[0011] Preferably, the sealing device includes a high baffle and a low baffle, which are linearly arrayed and uniformly slidably installed inside the shrinkage groove, and the thickness of the high baffle and the low baffle is equal to the thickness of the chip collection box.

[0012] Preferably, both the high and low baffles have vertical sliding grooves inside, and the sealing device has baffles installed in a linear array on the inner wall of the shrinkage groove. The high and low baffles are slidably installed on the outer ring of the baffles through the vertical sliding grooves.

[0013] With the above structural design, the slow release of force when stepping on the side plate controls the rotation speed of the rocker, preventing the chip collection box from slipping instantly due to excessive rotational inertia. The tension spring allows the rocker to rebound quickly after being stepped on.

[0014] This utility model has the following advantages:

[0015] 1. This intelligent robot manufacturing parts grinding device enables rapid replacement of the chip collection box by setting up a slot, chip collection box, and rocker. When the chip collection box needs to be replaced, first kick the pin with the back or side of your foot to slide the pin away from the rocker and release the position restriction of the side plate insertion hole. Then step on the side plate to make the rocker rotate around the pivot column, so that the surface of the rocker is inclined. The hydraulic buffer is set to release the force slowly when the side plate is stepped on, so that the rotation speed of the rocker is controlled and the chip collection box is prevented from falling instantly due to excessive inertia. After the rocker rotates to a certain angle, the chip collection box begins to slide down due to gravity and slides out of the box along the inclined surface of the rocker. Then, the chip collection box is pulled by the hook locking device to complete the removal, which achieves the effect of rapid replacement of the chip collection box.

[0016] 2. This intelligent robot-manufacturing parts grinding device uses a sealing device, high baffle, and low baffle to isolate debris and prevent it from falling into the chip collection box. The downward sliding of the high baffle and low baffle is influenced by gravity, so they naturally sit on the top of the side of the chip collection box, guiding the debris. When the rocker rotates, the chip collection box, which sits on the surface of the rocker, rotates synchronously. The two sides of the chip collection box simultaneously push the high baffle and low baffle upward, so that the high baffle and low baffle slide upward through the vertical sliding groove on the outer ring of the stop head, without affecting the sliding out of the chip collection box, thus effectively isolating the debris. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0018] Figure 2 This is a first-view schematic diagram of the internal structure of the box of this utility model;

[0019] Figure 3 This is a schematic diagram showing the connection between the reset device and the rocker structure of this utility model;

[0020] Figure 4 This is a second-view schematic diagram of the internal structure of the box of this utility model;

[0021] Figure 5 This is a schematic diagram of the sealing device structure of this utility model.

[0022] In the diagram: 1. Housing; 11. Horizontal slide groove; 12. Waste chip outlet; 13. Chip box groove; 14. Reset groove; 15. Shrink groove; 16. Pin; 2. Clamping device; 3. Rocker; 31. Rotating column; 32. Side plate; 4. Chip collection box; 5. Reset device; 51. Crossbar; 52. Hydraulic buffer; 53. Tension spring; 6. Sealing device; 61. High stop bar; 62. Low stop bar; 63. Vertical slide groove; 64. Stop head. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figures 1-5 A grinding device for parts manufacturing for intelligent robots includes a housing 1. Horizontal sliding grooves 11 are provided on both sides of the housing 1. Clamping devices 2 are symmetrically slidably installed inside the horizontal sliding grooves 11. A waste chip inlet 12 is provided in the center of the top surface of the housing 1. A box groove 13 is provided on one side of the housing 1. The waste chip inlet 12 is connected to the box groove 13. A rocker 3 is rotatably installed inside the box groove 13. A chip collection box 4 is placed inside the box groove 13 at the top of the rocker 3. A reset groove 14 is provided on the bottom wall of the box groove 13. A reset device 5 is installed inside the reset groove 14. Shrinkage grooves 15 are provided on the upper sides of both walls of the box groove 13. A sealing device 6 is slidably installed inside the shrinkage groove 15. A pin 16 is slidably installed on one side of the housing 1 at the opening of the box groove 13.

[0025] In practical applications, this device achieves the effect of quick disassembly and replacement of the chip collection box 4 by setting up the cooperation between the rocker plate 3 and the chip collection box 4. By stepping on the rocker plate 3, the rocker plate 3 is rotated. After the rocker plate 3 rotates, the chip collection box 4 slides out of the box 1 through the inclined surface of the rocker plate 3 due to gravity. Furthermore, the addition of a reset device 5 achieves a buffering effect.

[0026] By setting up the interaction between the reset device 5, the sealing device 6, and the chip collection box 4, the sealing effect of the chip collection box 4 when collecting waste chips is optimized. The sealing device 6 is vertically positioned and fits against the side and top of the chip collection box 4, preventing small debris from leaking into the surface of the rocker 3 or the inside of the groove 13, thus achieving complete collection. The reset device 5 ensures that the chip collection box 4 is in a vertical plane during operation, ensuring that the rocker 3 can quickly rebound after being stepped on.

[0027] Please see Figures 1-3The bottom of the rocker 3 is located above the shrinkage groove 15 and has a horizontal column. The rocker 3 has rotating columns 31 on both sides. The rocker 3 is rotatably installed inside the box groove 13 through the rotating columns 31. The end of the rocker 3 has a side plate 32. The side of the side plate 32 away from the rocker 3 has an insertion hole. The shape and size of the insertion hole are adapted to the end of the pin 16. When not in use, the sliding pin 16 is inserted into the insertion hole of the side plate 32 to achieve the limiting effect of the rocker 3, so that the rocker 3 cannot be stepped on. When the chip collection box 4 needs to be replaced, the pin 16 is kicked with one side of the foot to make the pin 16 slide and release the position restriction of the side plate 32. At this time, the side plate 32 is stepped on, so that the rocker 3 rotates around the rotating column 31 as the axis center, so that the top surface of the rocker 3 is in a ramp state.

[0028] Please see Figures 1-3 The reset device 5 includes a crossbar 51, a hydraulic buffer 52, and a tension spring 53. The crossbar 51 is fixedly installed inside the reset groove 14. The crossbar 51 is positioned corresponding to the crossbar column. The hydraulic buffer 52 is movably connected between the crossbar 51 and the crossbar column. The two ends of the hydraulic buffer 52 are respectively rotatably sleeved on the outer ring of the crossbar 51 and the crossbar column. The tension spring 53 is symmetrically and movably connected between the crossbar 51 and the crossbar column, and is located on both sides of the hydraulic buffer 52. The two ends of the tension spring 53 are respectively hooked on the outer ring of the crossbar 51 and the crossbar column to achieve position fixation.

[0029] The reset device 5, by setting a hydraulic buffer 52 and a tension spring 53, achieves slow release of force when the foot steps on the side plate 32, so that the rotation speed of the rocker 3 can be controlled, and the excessive rotational inertia of the rocker 3 can prevent the chip collection box 4 from slipping down instantly. The tension spring 53 enables the rocker 3 to rebound quickly after being stepped on. Through the tension of the tension spring 53, the rocker 3 can be pressed tightly against the bottom wall of the box groove 13, ensuring that the chip collection box 4 is flat after being placed.

[0030] Please see Figures 1-5 The sealing device 6 includes a high baffle 61 and a low baffle 62. The high baffle 61 and the low baffle 62 are linearly arrayed and uniformly slidably installed inside the shrinkage groove 15. The thickness of the high baffle 61 and the low baffle 62 is equal to the thickness of the chip collection box 4. The bottom of the high baffle 61 and the low baffle 62 presses against the top of the side of the chip collection box 4. Vertical sliding grooves 63 are opened inside the high baffle 61 and the low baffle 62. The sealing device 6 is located on the inner wall of the shrinkage groove 15 and the baffle head 64 is linearly arrayed and uniformly installed. The high baffle 61 and the low baffle 62 are slidably installed on the outer ring of the baffle head 64 through the vertical sliding grooves 63.

[0031] The high baffle 61 and the low baffle 62 are closely arranged and will not shift left or right when sliding. The downward sliding of the high baffle 61 and the low baffle 62 is affected by gravity, and they naturally sit on the top side of the chip collection box 4, which guides the chips and prevents the chips from falling into the box groove 13. When the chip collection box 4 slides down at an angle, the high baffle 61 and the low baffle 62 are pushed upward by the side, so that the high baffle 61 and the low baffle 62 are located on the outer ring of the baffle head 64 and slide upward without affecting the sliding out of the chip collection box 4. After being moved, the high baffle 61 and the low baffle 62 can naturally hang down and return to their positions.

[0032] Working principle: During use, the workpiece is placed between the clamping devices 2. The position of the clamping devices 2 is controlled to clamp the workpiece. The clamping process is usually driven by hydraulic, cylinder, motor and other devices, which are not shown in this figure. After clamping, grinding is performed. The debris generated during grinding falls into the waste chip inlet 12 and slides down into the chip collection box 4 for collection. Since the outer wall of the chip collection box 4 is in contact with the inner wall of the box groove 13, and the high baffle 61 and low baffle 62 hang down naturally by gravity and sit on the top of the side of the chip collection box 4, the waste chips slide evenly and naturally into the chip collection box 4 from the inner wall of the box groove 13 and the surface of the high baffle 61 and low baffle 62. The waste chips will not fall into the box groove 13 or onto the surface of the rocker plate 3. The chip collection box 4 is replaced when the workpiece is finished grinding or when the waste chips stored in the chip collection box 4 reach a certain amount.

[0033] When the chip collection box 4 needs to be replaced, first kick the pin 16 with the back or side of your foot to slide the pin 16 away from the rocker arm 3, thus releasing the position restriction on the insertion hole of the side plate 32. Then, step on the side plate 32 to make the rocker arm 3 rotate around the pivot 31, so that the surface of the rocker arm 3 is inclined. Due to the hydraulic damper 52, when the side plate 32 is stepped on, the hydraulic damper 52 slowly releases force, controlling the rotation speed of the rocker arm 3 and preventing excessive inertia from causing the chip collection box 4 to fall instantly. As the rocker arm 3 rotates, the chip collection box 4, which is located on the surface of the rocker arm 3, rotates synchronously. The two sides of the chip collection box 4 will push the high baffle 61 and the low baffle 62 upwards simultaneously. After the high baffle 61 and the low baffle 62 are subjected to force, they slide upwards through the vertical sliding groove 63 on the outer ring of the stop head 64. After the rocker arm 3 rotates to a certain angle, the chip collection box 4 begins to slide down due to gravity and slides out of the box 1 along the inclined surface of the rocker arm 3. Then, the chip collection box 4 is pulled by the hook lock device to complete the removal.

[0034] After the chip collection box 4 slides out, stop stepping on the side plate 32, so that the rocker 3 returns to the flat state through the elastic contraction of the hydraulic buffer 52 and the tension spring 53. At this time, the high baffle 61 and the low baffle 62 naturally droop due to gravity, and their bottoms are level. Replace the chip collection box 4 and reinsert it into the box groove 13 through the opening of the box groove 13 and the surface of the rocker 3, and make the top of the side of the chip collection box 4 fit with the bottom of the high baffle 61 and the low baffle 62 to prevent chip spillage.

Claims

1. A parts grinding device for intelligent robot manufacturing, comprising a housing (1), characterized in that: The box body (1) has horizontal sliding grooves (11) on both sides. A clamping device (2) is symmetrically slidably installed inside the horizontal sliding grooves (11). A waste chip opening (12) is opened in the middle of the top surface of the box body (1). A box groove (13) is opened on one side of the box body (1). The waste chip opening (12) is connected to the box groove (13). A rocker (3) is rotatably installed inside the box groove (13). A chip collection box (4) is placed inside the box groove (13) at the top of the rocker (3). A reset groove (14) is opened on the bottom wall of the box groove (13). A reset device (5) is installed inside the reset groove (14). A shrinkage groove (15) is opened on the upper side of both walls of the box groove (13). A sealing device (6) is slidably installed inside the shrinkage groove (15). A pin (16) is slidably installed on one side of the box body (1) at the opening of the box groove (13).

2. The parts grinding device for intelligent robot manufacturing according to claim 1, characterized in that: The bottom of the rocker (3) is provided with a horizontal column above the shrinkage groove (15). The rocker (3) is provided with rotating columns (31) on both sides. The rocker (3) is rotatably installed inside the box groove (13) through the rotating columns (31). The end of the rocker (3) is provided with a side plate (32). The side plate (32) away from the rocker (3) has an insertion hole. The insertion hole is compatible with the shape and size of the end of the pin (16).

3. The parts grinding device for intelligent robot manufacturing according to claim 2, characterized in that: The reset device (5) includes a crossbar (51), a hydraulic buffer (52), and a tension spring (53). The crossbar (51) is fixedly installed inside the reset groove (14). The crossbar (51) is positioned opposite to the horizontal column. A hydraulic buffer (52) is movably connected between the crossbar (51) and the horizontal column. The two ends of the hydraulic buffer (52) are respectively rotatably sleeved on the outer ring of the crossbar (51) and the horizontal column. A tension spring (53) is symmetrically and movably connected between the crossbar (51) and the horizontal column, and is located on both sides of the hydraulic buffer (52).

4. The parts grinding device for intelligent robot manufacturing according to claim 3, characterized in that: The sealing device (6) includes a high baffle (61) and a low baffle (62). The high baffle (61) and the low baffle (62) are linearly arrayed and uniformly slidably installed inside the shrinkage groove (15). The thickness of the high baffle (61) and the low baffle (62) is equal to the thickness of the chip collection box (4).

5. The parts grinding device for intelligent robot manufacturing according to claim 4, characterized in that: The high baffle (61) and the low baffle (62) are both provided with vertical sliding grooves (63). The sealing device (6) is located on the inner wall of the shrinkage groove (15) and the baffles (64) are uniformly installed in a linear array. The high baffle (61) and the low baffle (62) are slidably installed on the outer ring of the baffles (64) through the vertical sliding grooves (63).

Images