An adaptive semiconductor packaging die structure

Abstract

This utility model discloses an adaptively adjustable semiconductor packaging mold structure, including an upper mold and a lower mold. The lower mold consists of a lower mold body and an adaptively adjustable cavity. Multiple cavities are evenly spaced on the top surface of the lower mold body. A mounting groove is provided below each cavity on the lower mold body, and the mounting groove communicates with the cavity. The lower mold body of this utility model has an adaptively adjustable cavity within its cavity. The adaptively adjustable cavity consists of a central plate located at the center and sequentially nested, liftable first, second, and third lifting frames. By individually controlling the lifting of the first, second, and third lifting frames, the size of the cavity at the center for placing the chip's lead frame / substrate can be changed, thereby meeting the packaging requirements of semiconductors of different sizes to a certain extent.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging mold technology, specifically an adaptively adjustable semiconductor packaging mold structure. Background Technology

[0002] In semiconductor packaging, multiple chips are first placed on a lead frame or substrate and electrically connected as necessary. Then, encapsulating material is used to cover the chips and lead frame / substrate, so that the chips can be protected and fixed on the lead frame / substrate by the encapsulating material.

[0003] The basic procedure involves placing multiple pre-assembled leadframes / substrates with chips in a cavity within an upper and lower mold. Next, thermosetting encapsulating material is injected into the cavity, filling it completely and sealing the chips and leadframes / substrates. After the encapsulating material cools and cures, the encapsulation process is complete. Currently, the cavity size is typically designed based on the dimensions of the semiconductor to be encapsulated, and the cavity cannot be changed after processing. Therefore, encapsulating semiconductors of different sizes requires different types of molds, which is quite cumbersome. Utility Model Content

[0004] The purpose of this invention is to provide an adaptively adjustable semiconductor packaging mold structure to solve the problems in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an adaptively adjustable semiconductor packaging mold structure, comprising an upper mold and a lower mold, wherein the lower mold consists of a lower mold body and an adaptively adjustable cavity, wherein multiple cavities are equally spaced on the top surface of the lower mold body, and an mounting groove is provided below the cavity on the lower mold body, the mounting groove being connected to the cavity, and the adaptively adjustable cavity being installed inside the mounting groove, wherein the adaptively adjustable cavity consists of a center plate, a first lifting frame, a second lifting frame, a third lifting frame, a column, a first electric telescopic rod, a second electric telescopic rod, a third electric telescopic rod, and a base plate, wherein the column is vertically fixed at the center position of the top surface of the base plate, the center plate is fixed to the top of the column, the first lifting frame is sleeved on the side of the center plate and connected to the base plate through the first electric telescopic rod, the second lifting frame is sleeved on the side of the first lifting frame and connected to the base plate through the second electric telescopic rod, and the third lifting frame is sleeved on the side of the second lifting frame and connected to the base plate through the third electric telescopic rod.

[0006] Preferably, the bottom of the upper mold is provided with casting holes that correspond one-to-one with the cavity, and after the upper mold and the lower mold are combined, the casting holes are located on the center vertical line of the cavity, and the side of the upper mold is provided with a feed port.

[0007] Preferably, a controller is fixed on the side of the lower mold body. The controller is equipped with three knobs for controlling the first electric telescopic rod, the second electric telescopic rod, and the third electric telescopic rod, as well as a power supply wire.

[0008] Preferably, a positioning rod is vertically fixed at each of the four corners of the top surface of the lower mold body, and a positioning hole that cooperates with the positioning rod is provided at each of the four corners of the upper mold.

[0009] Compared with the prior art, the beneficial effects of this utility model are: the cavity of the lower mold body of this utility model is provided with an adaptive adjustment cavity. The adaptive adjustment cavity consists of a central plate located at the center position and a first lifting frame, a second lifting frame and a third lifting frame that are sequentially nested and can be raised and lowered. By controlling the raising and lowering of the first lifting frame, the second lifting frame and the third lifting frame separately, the size of the cavity for placing the lead frame / substrate of the chip located at the center position can be changed, thereby meeting the packaging requirements of semiconductors of different sizes to a certain extent.

[0010] The bottom of the upper mold is provided with pouring holes that correspond one-to-one with the cavity. After the upper mold and the lower mold are combined, the pouring holes are located on the vertical line of the center of the cavity. The side of the upper mold is provided with a feed port. This design ensures that no matter how the size of the cavity changes, the feed port will always be located on the vertical line of the center of the cavity. Attached Figure Description

[0011] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0012] Figure 1 This is a schematic diagram of the top structure of the lower mold of this utility model;

[0013] Figure 2 This is a schematic diagram of the bottom structure of the lower mold of this utility model;

[0014] Figure 3 This is a schematic diagram of the adaptive adjustable cavity of this utility model;

[0015] Figure 4 This is a schematic diagram of the bottom structure of the lower mold body of this utility model;

[0016] Figure 5 This is a schematic diagram of the combined structure of the upper and lower molds of this utility model;

[0017] Figure 6 This is a schematic diagram of the bottom structure of the upper mold of this utility model.

[0018] In the diagram: 1. Upper mold; 2. Lower mold; 3. Lower mold body; 4. Cavity; 5. Adaptive adjustable cavity; 6. Center plate; 7. First lifting frame; 8. Second lifting frame; 9. Third lifting frame; 10. Column; 11. Base plate; 12. First electric telescopic rod; 13. Second electric telescopic rod; 14. Third electric telescopic rod; 15. Mounting slot; 16. Positioning hole; 17. Casting hole; 18. Feed port. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0020] Please see Figure 1-6In this embodiment of the present invention, an adaptively adjustable semiconductor packaging mold structure includes an upper mold 1 and a lower mold 2. The lower mold 2 consists of a lower mold body 3 and an adaptively adjustable cavity 5. Multiple cavities 4 are evenly spaced on the top surface of the lower mold body 3. Below each cavity 4 is a mounting groove 15 formed on the lower mold body 3, which communicates with the cavity 4. The adaptively adjustable cavity 5 is installed inside the mounting groove 15. The adaptively adjustable cavity 5 consists of a center plate 6, a first lifting frame 7, a second lifting frame 8, a third lifting frame 9, a column 10, a first electric telescopic rod 12, a second electric telescopic rod 13, a third electric telescopic rod 14, and a base plate 11. The column 10 is vertically fixed at the center of the top surface of the base plate 11. The core plate 6 is fixed to the top of the column 10. The first lifting frame 7 is fitted on the side of the core plate 6 and is connected to the base plate 11 through the first electric telescopic rod 12. The second lifting frame 8 is fitted on the side of the first lifting frame 7 and is connected to the base plate 11 through the second electric telescopic rod 13. The third lifting frame 9 is fitted on the side of the second lifting frame 8 and is connected to the base plate 11 through the third electric telescopic rod 14. By controlling the lifting of the first lifting frame 7, the second lifting frame 8 and the third lifting frame 9 separately, the size of the cavity of the lead frame / substrate for placing the chip located in the center can be changed, thereby meeting the packaging requirements of semiconductors of different sizes to a certain extent.

[0021] The bottom of the upper mold 1 is provided with a pouring hole 17 corresponding to the cavity 4. After the upper mold 1 and the lower mold 2 are combined, the pouring hole 17 is located on the vertical line of the center of the cavity 4. The side of the upper mold 1 is provided with a feed port 18. The pouring hole 17 is located on the vertical line of the center of the cavity 4. The side of the upper mold 1 is provided with a feed port 18. This design ensures that no matter how the size of the cavity changes, the feed port 18 will always be located on the vertical line of the center of the cavity.

[0022] A controller is fixed on the side of the lower mold body 3. The controller is equipped with three knobs for controlling the first electric telescopic rod 12, the second electric telescopic rod 13, and the third electric telescopic rod 14, as well as wires for power supply.

[0023] A positioning rod is vertically fixed at each of the four corners of the top surface of the lower mold body 3, and a positioning hole 16 that cooperates with the positioning rod is provided at each of the four corners of the upper mold 1.

[0024] The working principle of this utility model is as follows: The cavity 4 of the lower mold body 3 of this utility model is provided with an adaptive adjustment cavity 5. The adaptive adjustment cavity 5 is composed of a central plate 6 located at the center position and a first lifting frame 7, a second lifting frame 8 and a third lifting frame 9 that are sequentially nested and can be raised and lowered. By controlling the raising and lowering of the first lifting frame 7, the second lifting frame 8 and the third lifting frame 9 separately, the size of the cavity for placing the lead frame / substrate of the chip located at the center position can be changed, thereby meeting the packaging requirements of semiconductors of different sizes within a certain range.

[0025] The bottom of the upper mold 1 is provided with a pouring hole 17 that corresponds one-to-one with the cavity 4. After the upper mold 1 and the lower mold 2 are combined, the pouring hole 17 is located on the center vertical line of the cavity 4. The side of the upper mold 1 is provided with a feed port 18. This design ensures that no matter how the size of the cavity changes, the feed port 18 will always be located on the center vertical line of the cavity.

[0026] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An adaptively adjustable semiconductor packaging mold structure, comprising an upper mold (1) and a lower mold (2), characterized in that: The lower mold (2) consists of a lower mold body (3) and an adaptive adjustable cavity (5). Multiple cavities (4) are evenly spaced on the top surface of the lower mold body (3). Below each cavity (4) is a mounting groove (15) on the lower mold body (3), which communicates with the cavity (4). The adaptive adjustable cavity (5) is installed inside the mounting groove (15). The adaptive adjustable cavity (5) consists of a center plate (6), a first lifting frame (7), a second lifting frame (8), a third lifting frame (9), a column (10), a first electric telescopic rod (12), a second electric telescopic rod (13), a third electric telescopic rod (14), and a base plate (6). 11) Composition, the column (10) is vertically fixed at the center of the top surface of the base plate (11), the center plate (6) is fixed to the top of the column (10), the first lifting frame (7) is sleeved on the side of the center plate (6), and the first lifting frame (7) is connected to the base plate (11) through the first electric telescopic rod (12), the second lifting frame (8) is sleeved on the side of the first lifting frame (7), and the second lifting frame (8) is connected to the base plate (11) through the second electric telescopic rod (13), the third lifting frame (9) is sleeved on the side of the second lifting frame (8), and the third lifting frame (9) is connected to the base plate (11) through the third electric telescopic rod (14).

2. The adaptively adjustable semiconductor packaging mold structure according to claim 1, characterized in that: The bottom of the upper mold (1) is provided with casting holes (17) that correspond one-to-one with the cavity (4). After the upper mold (1) and the lower mold (2) are combined, the casting holes (17) are located on the center vertical line of the cavity (4). The side of the upper mold (1) is provided with a feed port (18).

3. The adaptively adjustable semiconductor packaging mold structure according to claim 1, characterized in that: A controller is fixed on the side of the lower mold body (3). The controller is equipped with three knobs for controlling the first electric telescopic rod (12), the second electric telescopic rod (13), and the third electric telescopic rod (14), as well as wires for power supply.

4. The adaptively adjustable semiconductor packaging mold structure according to claim 1, characterized in that: A positioning rod is vertically fixed at each of the four corners of the top surface of the lower mold body (3), and a positioning hole (16) that cooperates with the positioning rod is provided at each of the four corners of the upper mold (1).

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