A carrier plate film opening mechanism

Abstract

This utility model discloses a carrier plate film-opening mechanism, including a support and a clamping and moving mechanism mounted on the support. It also includes an ultrasonic film-opening mechanism mounted on the support, comprising an upper ultrasonic transmitter and a lower ultrasonic transmitter mounted on the support. The upper ultrasonic transmitter emits ultrasonic waves downwards, and the lower ultrasonic transmitter emits ultrasonic waves upwards. Advantages: Using ultrasonic waves to vibrate and separate the pressure-holding copper foils at both ends of the carrier plate avoids damage to the surface of the substrate copper foil during separation, and also prevents damage to the surface pressure-holding copper foil from affecting subsequent peeling.

Description

Technical Field

[0001] This utility model relates to the field of film-opening equipment, specifically a carrier plate film-opening mechanism. Background Technology

[0002] IC substrates are required in integrated circuit packaging processes. The raw materials for IC substrates include copper foil substrates. Pressure-holding copper foil is placed on the upper and lower surfaces of the copper foil substrate. This pressure-holding copper foil must be peeled off from the copper foil substrate before IC substrate fabrication can proceed. Traditional peeling methods use grinding or adhesive peeling mechanisms to separate the pressure-holding copper foil. Grinding mechanisms grind or cut the edges of the pressure-holding copper foil, causing the edges to warp and form a suspended portion at the edge of the copper foil substrate. Grippers or vacuum suction cups are then used to pick up this suspended portion, or a peeling blade is inserted between the film and the substrate to create initial separation. This method easily damages the copper foil substrate, is costly, and can damage the copper foil surface. Adhesive peeling mechanisms use adhesive rollers to press the pressure-holding copper foil surface, using the adhesive force of the glue to peel the pressure-holding copper foil off the substrate copper foil. However, this method easily leaves glue residue on the copper foil substrate, affecting subsequent processing.

[0003] Therefore, it is necessary to provide a carrier plate film opening mechanism. Summary of the Invention

[0004] The present invention provides a carrier plate film-opening mechanism, which effectively solves the problem of damage to the surface of copper foil substrate caused by the existing film-tearing mechanism.

[0005] The technical solution adopted in this utility model is:

[0006] A carrier plate film-opening mechanism includes a support and a clamping and moving mechanism disposed on the support. It also includes an ultrasonic film-opening mechanism disposed on the support, the ultrasonic film-opening mechanism comprising an upper ultrasonic transmitter and a lower ultrasonic transmitter disposed on the support, the upper ultrasonic transmitter emitting ultrasonic waves downwards and the lower ultrasonic transmitter emitting ultrasonic waves upwards.

[0007] Furthermore, the clamping and moving mechanism clamps the product and moves it; the sound wave emission port of the upper ultrasonic transmitter contacts the upper end surface of the product, causing the upper end surface of the product to vibrate; the sound wave emission port of the lower ultrasonic transmitter contacts the lower end surface of the product, causing the lower end surface of the product to vibrate.

[0008] Furthermore, the clamping and moving mechanism includes a multi-axis robotic arm and a clamping assembly mounted on the robotic arm. The clamping assembly is used to clamp the product from the upper and lower ends, and the multi-axis robotic arm is used to drive the clamping assembly to move the product so that the product contacts the ultrasonic film-opening mechanism at different positions.

[0009] Furthermore, the clamping assembly includes a connecting frame mounted on the multi-axis robotic arm, an upper clamping member and a lower clamping member symmetrically mounted on the connecting frame, and the upper clamping member includes a cylinder mounted on the connecting frame and a pressure plate mounted on the cylinder output end.

[0010] Furthermore, the upper clamping member contacts the product from the upper end face, and the lower clamping member contacts the product from the lower end face.

[0011] Furthermore, the width of the pressure plate is equal to that of the product.

[0012] Furthermore, the upper and lower ultrasonic transmitters are symmetrically arranged on the support.

[0013] The beneficial effects of the utility model are as follows: the use of ultrasonic waves to vibrate and separate the pressure-holding copper foils on both ends of the carrier board can avoid damage to the surface of the substrate copper foil during the separation process, and also avoid damage to the surface pressure-holding copper foil, which would affect subsequent peeling. Attached Figure Description

[0014] Figure 1 This is an overall schematic diagram of the carrier plate opening mechanism provided in the embodiments of this application.

[0015] The following are labeled in the diagram: 1. Support; 2. Clamping and moving mechanism; 3. Upper ultrasonic transmitter; 4. Lower ultrasonic transmitter; 21. Multi-axis robotic arm; 22. Connecting frame; 23. Upper clamping component; 24. Lower clamping component; 100. Copper foil substrate; 200. Upper pressure-holding copper foil; 300. Lower pressure-holding copper foil; 231. Cylinder; 232. Pressure plate. Detailed Implementation

[0016] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0017] like Figure 1 As shown, the improved embodiment of this application is a carrier plate film opening mechanism, the structure of which includes a support 1, a clamping and moving mechanism 2 disposed on the support 1, and an ultrasonic film opening mechanism disposed on the support 1. The ultrasonic film opening mechanism includes an upper ultrasonic transmitter 3 disposed on the support 1 and a lower ultrasonic transmitter 4 disposed on the support 1. The upper ultrasonic transmitter 3 emits ultrasonic waves downward and the lower ultrasonic transmitter 4 emits ultrasonic waves upward.

[0018] In actual use, the product is clamped by the clamping and moving mechanism 2, and then moved to the lower end of the upper ultrasonic transmitter 3, so that the edge of the upper surface of the product contacts the sound wave emission port of the upper ultrasonic transmitter 3. The upper ultrasonic transmitter 3 is then activated to emit ultrasonic waves to the upper surface of the product, causing the corresponding part of the product to vibrate due to the energy impact of the ultrasonic waves. This causes the upper pressure-holding copper foil 200 to separate from the copper foil substrate 100 in that part. Then, the clamping and moving mechanism 2 moves the product at a constant speed, so that the entire edge of the upper surface of the product is impacted and vibrated by the ultrasonic waves emitted by the upper ultrasonic transmitter 3. This vibration causes the upper pressure-holding copper foil 200 on the edge surface of the product to separate from the substrate copper foil. Once the upper pressure-holding copper foil 200 and the substrate copper foil have separated at the edge... The upper ultrasonic transmitter 3 is turned off, and the lower ultrasonic transmitter 4 is turned on. The clamping and moving mechanism 2 moves the product so that one end of the lower end face of the product contacts the sound wave emission port of the lower ultrasonic transmitter 4. The part of the lower end face of the product corresponding to the lower ultrasonic transmitter 4 vibrates due to the impact of ultrasonic energy, causing the lower pressure copper foil 300 of that part to separate from the base copper foil. Then, the clamping and moving mechanism 2 moves the product at a constant speed so that the entire edge of the lower end face of the product is impacted by the ultrasonic waves emitted by the upper ultrasonic transmitter 3 and vibrates. The vibration causes the upper pressure copper foil 200 on the edge surface of the product to separate from the base copper foil.

[0019] In the above design, ultrasonic waves are used to vibrate and separate the pressure-holding copper foils on both ends of the carrier board. This avoids damage to the surface of the substrate copper foil during the separation process and also prevents damage to the surface pressure-holding copper foil from affecting subsequent peeling.

[0020] Specifically: the clamping and moving mechanism 2 clamps and moves the product, the sound wave emission port of the upper ultrasonic transmitter 3 contacts the upper end surface of the product, causing the upper end surface of the product to vibrate, and the sound wave emission port of the lower ultrasonic transmitter 4 contacts the lower end surface of the product, causing the lower end surface of the product to vibrate.

[0021] Specifically: such as Figure 1 As shown, the clamping and moving mechanism 2 includes a multi-axis robotic arm 21 and a clamping assembly mounted on the robotic arm. The clamping assembly is used to clamp the product from the upper and lower ends. The multi-axis robotic arm 21 is used to drive the clamping assembly to move the product, so that the product contacts the ultrasonic film-opening mechanism at different positions.

[0022] In actual use, a section of the product is clamped by the clamping component, and then the multi-axis robotic arm 21 drives the clamping component to move, so that the product moves synchronously. The product is moved to the position corresponding to the upper ultrasonic transmitter 3 to separate the edge of the upper pressure copper foil 200 from the base copper foil. The product is moved to the position corresponding to the lower ultrasonic transmitter 4 to separate the edge of the lower pressure copper foil 300 from the base copper foil.

[0023] In the above design, the clamping and moving mechanism 2 is driven by the existing multi-axis robotic arm 21, which can be purchased directly without additional mechanical design, reducing design costs. At the same time, the multi-axis robotic arm 21 automatically drives the clamping components to move the product, ensuring that the product moves relatively in a stable motion after contacting the ultrasonic film opening mechanism, thus ensuring the accuracy and consistency of the entire edge film opening.

[0024] Specifically: such as Figure 1 As shown, the clamping assembly includes a connecting frame 22 mounted on a multi-axis robotic arm 21, an upper clamping member 23 and a lower clamping member 24 symmetrically mounted on the connecting frame 22. The upper clamping member 23 includes a cylinder 231 mounted on the connecting frame 22 and a pressure plate 232 mounted on the output end of the cylinder 231.

[0025] In actual use, the cylinder 231 drives the pressure plate 232 to contact and press against the end face of the product.

[0026] In the above design, the structural design of the clamping component can ensure effective clamping of the product end face.

[0027] Specifically: the upper clamping member 23 contacts the product from the upper end face, and the lower clamping member 24 contacts the product from the lower end face.

[0028] Specifically, the pressure plate 232 is equal to the width of the product.

[0029] In the above design, the pressure plate 232 can prevent the side of the product from warping after pressing it tightly against the product, thus preventing the film opening effect from being affected.

[0030] Specifically: such as Figure 1 As shown, the upper ultrasonic transmitter 3 and the lower ultrasonic transmitter 4 are symmetrically arranged on the bracket 1.

[0031] In the above design, the product needs to contact the upper ultrasonic transmitter 3 and the lower ultrasonic transmitter 4 respectively. Setting the upper ultrasonic transmitter 3 and the lower ultrasonic transmitter 4 symmetrically can improve the efficiency of the product moving from top to bottom to contact the lower ultrasonic transmitter 4.

[0032] In further detail, it should be understood that the above description is only a specific embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A carrier plate film opening mechanism, comprising a support (1) and a clamping and moving mechanism (2) disposed on the support (1), characterized in that: It also includes an ultrasonic film-opening mechanism mounted on the support (1), which includes an upper ultrasonic transmitter (3) mounted on the support (1) and a lower ultrasonic transmitter (4) mounted on the support (1). The upper ultrasonic transmitter (3) emits ultrasonic waves downwards, and the lower ultrasonic transmitter (4) emits ultrasonic waves upwards.

2. The carrier plate film opening mechanism according to claim 1, characterized in that: The clamping and moving mechanism (2) clamps and moves the product. The sound wave emission port of the upper ultrasonic transmitter (3) contacts the upper end surface of the product, causing the upper end surface of the product to vibrate. The sound wave emission port of the lower ultrasonic transmitter (4) contacts the lower end surface of the product, causing the lower end surface of the product to vibrate.

3. The carrier plate film opening mechanism according to claim 1, characterized in that: The clamping and moving mechanism (2) includes a multi-axis robotic arm (21) and a clamping assembly disposed on the multi-axis robotic arm (21). The clamping assembly is used to clamp the product from the upper and lower ends. The multi-axis robotic arm (21) is used to drive the clamping assembly to move the product so that the product contacts the ultrasonic film opening mechanism at different positions.

4. The carrier plate film opening mechanism according to claim 3, characterized in that: The clamping assembly includes a connecting frame (22) mounted on a multi-axis robotic arm (21), an upper clamping member (23) and a lower clamping member (24) mounted symmetrically on the connecting frame (22). The upper clamping member (23) includes a cylinder (231) mounted on the connecting frame (22) and a pressure plate (232) mounted on the output end of the cylinder (231).

5. The carrier plate film-opening mechanism according to claim 4, characterized in that: The upper clamping member (23) contacts the product from the upper end face of the product, and the lower clamping member (24) contacts the product from the lower end face of the product.

6. The carrier plate film-opening mechanism according to claim 5, characterized in that: The pressure plate (232) is equal to the width of the product.

7. The carrier plate film opening mechanism according to claim 1, characterized in that: The upper ultrasonic transmitter (3) and the lower ultrasonic transmitter (4) are symmetrically arranged on the bracket (1).

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