Automatic tin paste adding device and tin paste printing machine

Abstract

An automatic solder paste dispensing device is disclosed, comprising: a mounting bracket configured to be horizontally slidably mounted on a solder paste printer; a solder paste container holder mounted on the mounting bracket and configured to hold a solder paste container containing solder paste; a pressing mechanism configured to press the solder paste container; a lifting mechanism connected to the mounting bracket and configured to drive the pressing mechanism to move up and down to press the solder paste container; a solder paste channel located within the solder paste container holder and fluidly communicating with the outlet of the solder paste container so that solder paste in the solder paste container flows out through the solder paste channel when the pressing mechanism presses the solder paste container; and a controller configured to control the movement of the lifting mechanism and the sliding of the mounting bracket on the solder paste printer to drip solder paste onto the desired location for solder paste replenishment on the circuit board during the printing process, according to a preset setting.

Description

Technical Field

[0001] This disclosure relates to the field of circuit board printing technology, and more specifically, to an automatic solder paste dispensing device and a solder paste printer including the automatic solder paste dispensing device. Background Technology

[0002] Solder paste is a new type of soldering material that emerged with Surface Mount Technology (SMT). It is mainly used for soldering electronic components such as resistors, capacitors, and ICs on the surface of printed circuit boards (PCBs). In existing technology, the PCB is first conveyed to the printing area and fixed. Then, a stencil is tightly attached to the PCB, with the holes in the stencil corresponding to the pads on the PCB where solder paste needs to be printed. Next, a squeegee scrapes solder paste from the solder paste storage area across the stencil surface. Under the pressure of the squeegee, the solder paste is squeezed through the holes in the stencil onto the corresponding pads on the PCB. Afterward, the stencil is separated from the PCB, and the PCB with printed solder paste is conveyed to the next process via a conveyor device, thus completing one solder paste printing process. However, in existing technology, solder paste can only be added when printing stops, which reduces work efficiency. In addition, because the size and distribution of electronic components on the PCB surface are not uniform, the amount of solder paste required for the entire surface of the circuit board is inconsistent, which may lead to poor soldering quality in some areas of the circuit board due to insufficient solder paste. In addition, during the production of printed circuit boards, the solder paste container used to hold solder paste may become too tightly fitted to the solder paste dispensing equipment due to sealing design and pressure fitting, making it difficult to remove. Utility Model Content

[0003] One object of this disclosure is to address at least one aspect of the aforementioned problems and deficiencies existing in the prior art.

[0004] According to one aspect of this disclosure, an automatic solder paste dispensing device is provided, the device comprising: a mounting bracket configured to be horizontally slidably mounted on a solder paste printer; a solder paste container holder mounted on the mounting bracket and configured to hold a solder paste container containing solder paste; a pressing mechanism configured to press the solder paste container; a lifting mechanism connected to the mounting bracket and configured to drive the pressing mechanism to move up and down to press the solder paste container; a solder paste channel located within the solder paste container holder and fluidly communicating with an outlet of the solder paste container to allow solder paste in the container to flow out through the solder paste channel when the pressing mechanism presses the container; and a controller configured to control the movement of the lifting mechanism and the sliding of the mounting bracket on the solder paste printer to drip solder paste onto a desired location for solder paste replenishment on the circuit board during printing, according to a preset procedure.

[0005] According to an exemplary embodiment of the present disclosure, the automatic solder paste dispensing device further includes a solder paste height detector disposed on the solder paste printer, the solder paste height detector being configured to detect the height of the solder paste on the stencil.

[0006] According to an exemplary embodiment of the present disclosure, the controller is configured to control the automatic solder paste dispensing device to dispense solder paste onto the stencil based on the height of the solder paste on the stencil detected by the solder paste height detector.

[0007] According to an exemplary embodiment of the present disclosure, the controller is configured to dispense solder paste onto the stencil when the circuit board printing is completed and transported downstream and the next circuit board to be printed is entering the printing area.

[0008] According to an exemplary embodiment of the present disclosure, the controller is configured to control the automatic solder paste dispensing device to dispense solder paste onto the stencil according to a preset setting.

[0009] According to an exemplary embodiment of the present disclosure, the pressing mechanism includes a pressure plate for pressing the solder paste can, connecting plates located on opposite sides of the solder paste can, and a protrusion extending from the lower edge of the connecting plates toward the bottom of the solder paste can, such that when the controller controls the lifting mechanism to move the pressing mechanism upward, the pressing mechanism can move the solder paste can to cause the seal between the outlet of the solder paste can and the solder paste can holder to fail.

[0010] According to an exemplary embodiment of the present disclosure, the automatic solder paste dispensing device further includes a sensor for detecting whether the solder paste can is empty. The sensor is connected to the controller so that when the sensor detects that the solder paste can is empty, the controller controls the lifting mechanism to drive the pressing mechanism upward, thereby causing the seal between the outlet of the solder paste can and the solder paste can holder to fail.

[0011] According to an exemplary embodiment of the present disclosure, the lifting mechanism includes a lead screw, a nut that cooperates with the lead screw, and a drive device for driving the lead screw to rotate. The drive device is connected to the controller, and the nut is connected to the pressing mechanism.

[0012] According to an exemplary embodiment of the present disclosure, the mounting bracket has a U-shaped structure, the U-shaped structure includes a top plate, a base, and a vertical plate connected to the top plate and the base, and the nut is installed inside the U-shaped structure.

[0013] According to an exemplary embodiment of the present disclosure, the lifting mechanism further includes at least one guide rod connected to the top plate and extending in a vertical direction, the at least one guide rod being configured to guide the nut member to move in a vertical direction.

[0014] According to another aspect of this disclosure, a solder paste printer is also provided, the solder paste printer including the automatic solder paste dispensing device according to an exemplary embodiment of this disclosure.

[0015] The automatic solder paste dispensing device and solder paste printer described in the exemplary embodiments provided herein can dispense solder paste onto the desired location on the circuit board during the printing process, according to a customer's pre-set parameters, thereby ensuring soldering quality and improving work efficiency. Furthermore, when the solder paste height sensor detects that the solder paste height is less than a pre-set value, the automatic solder paste dispensing device can dispense solder paste onto the stencil while the circuit board is being transported downstream after printing and the next circuit board to be printed is entering the printing area. This allows for routine solder paste addition without interrupting the printing process, further improving work efficiency. Additionally, the automatic solder paste dispensing device can use a lifting mechanism to drive a pressing mechanism upwards, causing the seal between the solder paste can outlet and the solder paste can holder to break, facilitating subsequent replacement of the solder paste can. Attached Figure Description

[0016] The above and other aspects, features, and advantages of various embodiments of the present disclosure will become clearer from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0017] Figure 1 This is a schematic diagram illustrating the structure of a solder paste printer equipped with an automatic solder paste dispensing device according to an exemplary embodiment of the present disclosure;

[0018] Figure 2 It is shown Figure 1 The diagram shows the structure of the automatic solder paste dispensing device.

[0019] Figure 3 It is shown Figure 2 The diagram shows another angle of the automatic solder paste dispensing device.

[0020] Figure 4 It is shown Figure 2 The diagram shows another angle of the automatic solder paste dispensing device.

[0021] Figure 5 It is shown Figure 2 The diagram shows another angle of the automatic solder paste dispensing device. Detailed Implementation

[0022] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. In this specification, identical or similar components are indicated by identical or similar reference numerals. The following description of various embodiments of this disclosure with reference to the accompanying drawings is intended to illustrate the overall concept of this disclosure and should not be construed as a limitation thereof.

[0023] Furthermore, in the following detailed description, numerous specific details are set forth for ease of explanation to provide a thorough understanding of embodiments of the present disclosure. However, it will be apparent that one or more embodiments may be practiced without these specific details. In other instances, well-known structures and apparatuses are illustrated to simplify the figures.

[0024] In the following detailed description, directional terms such as "front," "rear," "upper," "lower," "left," "right," "upper part," "lower part," "inner," and "outer" are defined according to the accompanying drawings, but the shape and position of the parts are not limited by these terms and can be adjusted according to the actual application.

[0025] Furthermore, the terminology used herein is for describing exemplary embodiments and is not intended to limit and / or constrain this disclosure. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the,” “the” are also intended to include the plural forms. In this disclosure, the terms “comprising,” “including,” “having,” and similar terms are used to enumerate features, quantities, steps, operations, elements, components, or combinations thereof, but do not exclude the presence or addition of one or more of said features, quantities, steps, operations, elements, components, or combinations thereof.

[0026] Although the terms “first,” “second,” etc., may be used herein to describe a variety of different elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and a second element may be referred to as a first element. The term “and / or” includes a combination of multiple related items or any one of multiple related items.

[0027] Figure 1 A schematic diagram of a solder paste printer equipped with an automatic solder paste dispensing device is shown, according to an exemplary embodiment of the present disclosure. Figures 2 to 5 Shown from different angles Figure 1 The diagram shows the structure of the automatic solder paste dispensing device. Figures 1 to 5 As shown, an automatic solder paste dispensing device 100 according to an exemplary embodiment of the present disclosure includes: a mounting bracket 10, a solder paste container holder 20, a pressing mechanism 30, a lifting mechanism 40, a solder paste container 50, a solder paste flow channel 60, and a controller. The mounting bracket 10 is configured to slide horizontally (i.e., along the X direction) on a solder paste printer 1000 to support the automatic solder paste dispensing device 100. Figure 1 In the illustrated embodiment, a horizontal slide rail 200 is provided on the solder paste printer 1000, and an automatic solder paste dispensing device 100 is horizontally slidably mounted on the slide rail 200 so as to be driven to slide on the solder paste printer 1000 by a horizontal actuator. A solder paste container holder 20 is mounted on the mounting bracket 10 and configured to hold a solder paste container 50 for containing solder paste. A pressing mechanism 30 is configured to press the solder paste container 50 so that the solder paste in the container 50 flows out through the solder paste channel 60 and is added to the printed circuit board (not shown). A lifting mechanism 40 is connected to the mounting bracket 10 and configured to drive the pressing mechanism 30 to move up and down to press the solder paste container 50. Solder paste flow channel 60 is located within solder paste can holder 20 and is fluidly connected to the outlet at the bottom of solder paste can 50 so that when the pressing mechanism 40 presses the solder paste can 50, solder paste in the can flows out through solder paste flow channel 60 and is added to the printed circuit board. The controller is configured to control the up-and-down movement of the lifting mechanism 40 and the horizontal sliding of the mounting bracket 10 on the solder paste printer 1000, to drip solder paste onto the desired solder paste replenishment location on the circuit board during printing, such as a location where more solder paste is needed.

[0028] During operation, the circuit board to be printed is first transported to the printing area and fixed by a conveying mechanism. Then, the printing head of the printer, driven by an actuator (e.g., a motor), descends to the surface of the stencil. The printing head and the stencil print on the stencil according to a stroke set based on the parameters of the circuit board. During the printing process, the automatic solder paste dispensing device 100 can drip solder paste onto the desired location on the circuit board according to customer settings. Specifically, for example, after the circuit board is in the printing area and before the printing head of the printer descends to the surface of the stencil, the automatic solder paste dispensing device 100 can be moved along the slide rail 200 of the solder paste printer 100 to a position corresponding to the desired location on the circuit board. During the printing process, the lifting mechanism 40 drives the pressing mechanism 30 downward to press the solder paste container 50, thereby squeezing out the solder paste in the container 50 to drip onto the desired location. Then, the lifting mechanism 40 drives the pressing mechanism 30 back to the upper starting position, thus completing the solder paste replenishment.

[0029] It should be noted that the locations where solder paste is expected to be added to the circuit board can include one or more locations along the X direction (e.g., a first location, a second location, etc.). When adding solder paste, for example, it can be added to the first location during the printing of the current circuit board and to the second location during the printing of another circuit board. Alternatively, it can be added to both the first and second locations during the printing of the current circuit board. In this case, after adding to the first location, the automatic solder paste adding device 100 can be moved by the controller to the location corresponding to the second location for further addition.

[0030] According to exemplary embodiments of this disclosure, such as Figure 1 As shown, the automatic solder paste dispensing device 100 also includes a solder paste height detector 80 disposed on the solder paste printer 1000. The solder paste height detector 80 is configured to detect the height of the solder paste on the stencil in order to determine whether solder paste needs to be dispensed onto the stencil (i.e., conventional solder paste dispensing) based on the detected height of the solder paste on the stencil.

[0031] According to an exemplary embodiment of this disclosure, the controller is configured to control the automatic solder paste dispensing device 100 to slide horizontally (i.e., along) the solder paste printer 100 according to the parameters of the circuit board, based on the height of the solder paste on the stencil detected by the solder paste height detector 80. Figure 1In the X direction, while sliding, the pressing mechanism 30 is controlled by the lifting mechanism 40 to press the solder paste container 50 downwards, thereby dispensing solder paste onto the stencil in the X direction (i.e., conventional solder paste addition). Specifically, for example, when the solder paste height detector 80 detects that the height of the solder paste on the stencil is less than a preset value, the controller can control the automatic solder paste dispensing device 100 to perform the solder paste dispensing operation onto the stencil. However, in some other embodiments of this disclosure, the controller may also be configured to control the automatic solder paste dispensing device 100 to dispense solder paste onto the stencil according to a preset setting, for example, performing a conventional solder paste addition after every y printed circuit boards.

[0032] In an exemplary embodiment of this disclosure, the controller is configured to dispense solder paste onto the stencil in the X direction when the circuit board printing is completed and transported downstream while the next circuit board to be printed is entering the printing area. This allows for routine solder paste addition without interrupting the printing process, thereby improving work efficiency and ensuring the quality of solder paste addition on the printed board. Specifically, after the current circuit board printing is completed, the printed circuit board is transported downstream, and the solder paste height on the stencil is detected by the solder paste height detector 80. If the detected solder paste height on the stencil is lower than a preset value, the controller moves to the starting position according to the size of the circuit board in the X direction. Then, the controller drives the pressing mechanism 30 to press down the solder paste container 50 via the lifting mechanism 40. While pressing, the controller controls the automatic solder paste dispensing device 100 to slide horizontally so that the solder paste in the solder paste container 50 is dispensed horizontally onto the circuit board. Then, the automatic solder paste dispensing device 100 returns to the stop position. When it is necessary to add solder paste to the desired location on the circuit board, the controller can drive the automatic solder paste adding device 100 to slide horizontally along the solder paste printer 1000 to the location corresponding to the desired location on the circuit board, so as to perform the solder paste addition operation during the printing process.

[0033] It should be noted that adding solder paste to the desired location on the circuit board and distributing it horizontally (i.e., regular solder paste addition) can be done intermittently. By rationally planning the timing or operation nodes of both, the soldering quality of the circuit board can be guaranteed. The specific interval method needs to be designed based on the circuit board characteristics and process requirements. For example, in continuous production scenarios with a relatively stable distribution frequency, an additional solder paste operation can be triggered after printing N circuit boards between two adjacent distribution operations (i.e., regular solder paste addition), where 2N, 3N, 4N, or m×N circuit boards are printed between adjacent distribution operations, and m is a natural number. For example, a regular solder paste addition operation can be performed approximately every 15 circuit boards printed. During the printing of these 15 circuit boards, an additional solder paste operation can be triggered after printing every 5 circuit boards. This avoids frequent additions and prevents insufficient solder paste from affecting soldering quality. In other embodiments of this application, a solder paste replenishment operation can be performed every L solder paste dispensing operations (i.e., conventional solder paste additions), where L is greater than or equal to 1. For example, a solder paste replenishment operation can be performed between every two conventional solder paste addition operations. This replenishment operation can be triggered between 2x conventional solder paste addition operations and 2x+1 conventional solder paste addition operations (where x is a natural number greater than or equal to 1). In other embodiments of this disclosure, another solder paste height detector can be provided, configured to detect the height of the solder paste at a position on the stencil corresponding to the desired solder paste replenishment position on the circuit board, so as to determine whether a solder paste replenishment operation needs to be performed based on the detected solder paste height on the stencil. Preferably, the other solder paste height detector is configured to be mounted on the solder paste printer 1000 in a horizontal (i.e., along the X direction) manner, so that its position can be adjusted according to different circuit board conditions so that it corresponds to the desired solder paste replenishment position on the circuit board.

[0034] According to exemplary embodiments of this disclosure, such as Figures 2 to 5 As shown, the pressing mechanism 30 includes a pressure plate 31 located on top of the solder paste container 50 and configured to press the solder paste container 50, connecting plates 32 located on opposite sides of the solder paste container 50, and a protrusion 33 extending from the lower edge of the connecting plate 32 toward the bottom of the solder paste container 50. When the controller controls the lifting mechanism 40 to move the pressing mechanism 30 upward, the protrusion 33 can move the solder paste container 50 slightly upward, thereby causing the seal between the outlet of the solder paste container 50 and the solder paste container holder 20 to fail. This allows outside air to enter through the gap between the outlet of the solder paste container 50 and the solder paste container holder 20, facilitating the subsequent removal of the solder paste container 50 and replacement with a new one.

[0035] In an exemplary embodiment not shown in this disclosure, the automatic solder paste dispensing device 100 further includes a sensor for detecting whether the solder paste container 50 is empty. When the sensor detects that the solder paste container 50 is empty, the automatic solder paste dispensing device 100 can control the lifting mechanism 40 to move upward through the controller, thereby driving the pressing mechanism 30 to move upward, thereby causing the seal between the outlet of the solder paste container 50 and the solder paste container holder 20 to fail, so as to facilitate the subsequent replacement of a new solder paste container 50.

[0036] exist Figures 1 to 5 In the exemplary embodiment shown, the lifting mechanism 40 includes a lead screw 41, a nut 42 cooperating with the lead screw 41, and a drive device 43 for driving the lead screw 41 to rotate. The drive device 43 can be a motor, etc. The drive device 42 is connected to a controller, and the nut 42 is connected to the pressing mechanism 30. When the motor starts under the control of the controller, the motor outputs rotational power and drives the lead screw 41 to rotate synchronously through a coupling, thereby causing the nut 42 to move linearly along the lead screw axis, thus driving the pressing mechanism 30 to rise or fall. The direction of motor rotation determines the lifting direction. It should be noted that in some other embodiments of this disclosure, the lifting mechanism may also employ other structures, such as a push rod and a cylinder or hydraulic cylinder for moving the push rod up and down.

[0037] According to exemplary embodiments of this disclosure, such as Figures 2 to 5 As shown, the mounting bracket 10 is generally U-shaped, comprising a top plate, a base, and a vertical plate connected to the top plate and the base, with the nut located inside the U-shaped structure. The top plate of the mounting bracket 10 has a hole through which the lead screw 41 extends. It should be noted that the mounting bracket 10 can also employ other suitable structures.

[0038] According to exemplary embodiments of this disclosure, such as Figures 2 to 5 As shown, the lifting mechanism 40 also includes at least one guide rod 44 connected to the top plate 31 and extending in a vertical direction, the at least one guide rod 44 being configured to guide the nut 42 to move in a vertical direction.

[0039] According to another aspect of this disclosure, such as Figure 1 As shown, a solder paste printer 1000 is also provided, which includes the solder paste automatic dispensing device 100 as described above.

[0040] The automatic solder paste dispensing device and solder paste printer according to the above embodiments of this disclosure can, according to the customer's pre-set parameters, drip solder paste onto the desired location on the circuit board during the printing process, thereby improving work efficiency and ensuring soldering quality. Furthermore, when the solder paste height sensor detects that the solder paste height is less than a pre-set value, the automatic solder paste dispensing device can dispense solder paste onto the stencil in the X direction while the circuit board is being transported downstream after printing and the next circuit board to be printed is entering the printing area. This allows for solder paste addition without interrupting the printing process, thus improving work efficiency. Additionally, the automatic solder paste dispensing device can use a lifting mechanism to drive a pressing mechanism upwards, causing the seal between the solder paste can outlet and the solder paste can holder to break, thereby facilitating subsequent replacement of the solder paste can.

[0041] Although embodiments of the present disclosure have been shown and described, it will be understood by those skilled in the art that variations may be made to these embodiments without departing from the principles and spirit of the present disclosure, the scope of which is defined by the appended claims and their equivalents. Furthermore, it should be noted that, unless otherwise specified, the terms “comprising,” “including,” and “having” as used herein do not exclude other elements or steps. Additionally, any reference numerals in the claims should not be construed as limiting the scope of the present disclosure.

Claims

1. An automatic solder paste dispensing device, characterized in that, The automatic solder paste dispensing device includes: Mounting bracket, configured to be horizontally slidably mounted on a solder paste printer; Solder paste container holder, which is mounted on the mounting bracket and configured to hold a solder paste container containing solder paste; A pressing mechanism, configured to press the solder paste container; A lifting mechanism is connected to the mounting bracket and configured to drive the pressing mechanism to move up and down to press the solder paste container; Solder paste flow channel, the solder paste flow channel being located within the solder paste can holder and fluidly communicating with the outlet of the solder paste can, so that when the pressing mechanism presses the solder paste can, solder paste in the solder paste can flows out through the solder paste flow channel; and A controller configured to control the movement of the lifting mechanism and the sliding of the mounting bracket on the solder paste printer to drip solder paste onto the desired location for replenishing solder paste on the circuit board during the printing process, according to a preset setting.

2. The automatic solder paste dispensing device according to claim 1, characterized in that, The automatic solder paste dispensing device also includes a solder paste height detector disposed on the solder paste printer, the solder paste height detector being configured to detect the height of the solder paste on the stencil.

3. The automatic solder paste dispensing device according to claim 2, characterized in that, The controller is configured to control the automatic solder paste dispensing device to dispense solder paste onto the stencil based on the height of the solder paste on the stencil detected by the solder paste height detector.

4. The automatic solder paste dispensing device according to claim 1, characterized in that, The controller is configured to control the solder paste automatic dispensing device to dispense solder paste onto the stencil according to a preset setting.

5. The automatic solder paste dispensing device according to claim 3 or 4, characterized in that, The controller is configured to dispense solder paste onto the stencil when the circuit board printing is completed and transported downstream, and the next circuit board to be printed is entering the printing area.

6. The automatic solder paste dispensing device according to any one of claims 1 to 4, characterized in that, The pressing mechanism includes a pressure plate for pressing the solder paste can, connecting plates located on opposite sides of the solder paste can, and a protrusion extending from the lower edge of the connecting plates toward the bottom of the solder paste can, such that when the controller controls the lifting mechanism to move the pressing mechanism upward, the pressing mechanism can move the solder paste can to cause the seal between the outlet of the solder paste can and the solder paste can holder to fail.

7. The automatic solder paste dispensing device according to claim 6, characterized in that, The automatic solder paste dispensing device also includes a sensor for detecting whether the solder paste can is empty. The sensor is connected to the controller so that when the sensor detects that the solder paste can is empty, the controller controls the lifting mechanism to drive the pressing mechanism upward, thereby causing the seal between the outlet of the solder paste can and the solder paste can holder to fail.

8. The automatic solder paste dispensing device according to any one of claims 1 to 4, characterized in that, The lifting mechanism includes a lead screw, a nut that cooperates with the lead screw, and a drive device for driving the lead screw to rotate. The drive device is connected to the controller, and the nut is connected to the pressing mechanism.

9. The automatic solder paste dispensing device according to claim 8, characterized in that, The mounting bracket has a U-shaped structure, which includes a top plate, a base, and a vertical plate connected to the top plate and the base. The nut is installed inside the U-shaped structure.

10. The automatic solder paste dispensing device according to claim 9, characterized in that, The lifting mechanism further includes at least one guide rod connected to the top plate and extending in a vertical direction, the at least one guide rod being configured to guide the nut component to move in a vertical direction.

11. A solder paste printing machine, characterized in that, The solder paste printer includes an automatic solder paste dispensing device according to any one of claims 1 to 10.

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