A semiconductor ceramic substrate thickness detection device

Abstract

This invention provides a semiconductor ceramic substrate thickness detection device, including a first frame and a transverse moving assembly disposed on the first frame. The first frame includes a worktable, on which a horizontal flipping assembly, a thickness detection assembly, and a material storage assembly are sequentially disposed. The transverse moving assembly includes a transverse moving guide rail disposed along the length of the first frame and a suction cup structure slidably connected to the transverse moving guide rail. The horizontal flipping assembly includes a rotating disk rotatably disposed on the worktable and several supporting structures disposed on the rotating disk. The thickness detection assembly includes a detection platform and a thickness detection structure disposed opposite each other in the vertical direction, with a first gap between them for the suction cup structure to pass through. The horizontal flipping assembly can temporarily store the incoming semiconductor ceramic substrate to adjust the speed difference between the thickness detection assembly and the incoming material speed, providing a buffer between the incoming material process and the thickness detection process of the ceramic substrate, ensuring that the thickness detection device can operate continuously and stably.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor ceramic substrate production, and in particular to a semiconductor ceramic substrate thickness detection device. Background Technology

[0002] During the production of semiconductor ceramic substrates, inconsistencies in the thickness of green blanks can occur due to factors such as raw materials, production equipment, and processing techniques. This leads to waste of raw materials and affects the yield of finished products. Therefore, it is necessary to measure the thickness of the green substrate during the production process.

[0003] Patent document CN217940980U discloses an automatic thickness measurement and sorting device for chip ceramic substrate green blanks, belonging to the technical field of ceramic substrate production. It includes a feeding component, a laser thickness measurement component, and a green blank thickness sorting component. The laser thickness measurement component is disposed between the feeding component and the green blank thickness sorting component. The laser thickness measurement component includes a horizontally moving stage and a laser thickness measurement group arranged along the green blank thickness direction. In this embodiment, the green blank to be measured is first transferred to the measurement position of the laser thickness measurement component using the feeding component. Then, the laser device is used to measure the green blank thickness. The green blanks are sorted and stored based on the measured thickness, thereby effectively rejecting green blanks that do not meet production requirements, facilitating the continuation of subsequent production. Furthermore, this device can effectively realize the automatic measurement of green blank thickness.

[0004] The problem with the above technical solution is that the detection speed of the thickness measuring component and the incoming speed of the ceramic substrate are inconsistent. Furthermore, the detection time for good and defective products also differs, which may further widen the speed difference, potentially requiring machine shutdown and technical intervention to ensure the production line's normal operation. Typically, increasing the number of thickness measuring components is used to mitigate the speed difference, but since the speed difference remains constant, this method only extends the manual intervention cycle and does not completely solve the problem.

[0005] Therefore, there is an urgent need for an automated ceramic substrate thickness detection device that requires no downtime or technical personnel intervention. Utility Model Content

[0006] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a semiconductor ceramic substrate thickness detection device to solve the problem in the prior art that the device stops and waits due to the inconsistency between the speed of the thickness detection component and the material feeding speed, which affects the production efficiency.

[0007] To achieve the above and other related objectives, this utility model provides the following technical solution: A semiconductor ceramic substrate thickness detection device includes: a first frame, the first frame including a worktable; a transverse moving assembly disposed on the first frame and spanning both sides of the length direction of the first frame, including a transverse moving guide rail disposed along the length direction of the first frame and a suction cup structure slidably connected to the transverse moving guide rail; a horizontal flipping assembly disposed on the worktable, including a rotating disk rotatably disposed on the worktable and a plurality of supporting structures disposed on the rotating disk; the horizontal flipping assembly includes at least two sets of supporting structures; the supporting structure includes a base plate and a plurality of side plates disposed perpendicular to the base plate, the base plate and the side plates surrounding each other to form a first receiving cavity with a first opening; the first receiving cavity is used to receive a ceramic sheet module, the ceramic sheet module being formed by arranging and stacking a plurality of ceramic substrates along the height direction of the side plates; and a thickness detection assembly disposed downstream of the horizontal flipping assembly along the feeding direction of the ceramic substrate, including a detection platform and a thickness detection structure disposed opposite each other in the vertical direction, and a first gap at least partially accommodating the suction cup structure is provided between the two.

[0008] To achieve the above technical solution, the horizontal flipping assembly includes at least two sets of support structures. When one set of support structures is removing the ceramic substrate, the other set of support structures can be used to support a new ceramic substrate without affecting each other. Furthermore, the state switching between multiple sets of support structures can be achieved by rotating the rotating disk. Through the design of the horizontal flipping assembly, the speed difference between the ceramic substrate feeding speed and the ceramic substrate thickness detection speed is greatly adjusted, enabling the thickness detection device to operate smoothly.

[0009] Furthermore, the side plate is provided with a pair of tidying structures arranged diagonally to each other at one end near the first opening; the tidying structure includes a fixing block installed on the outer periphery of the top of the side plate and a tapping plate installed on the fixing block that moves back and forth along the direction of the tidying structure.

[0010] To achieve the above technical solution, after the ceramic substrate is placed into the first receiving cavity through the first opening, the sides of the ceramic substrate are tapped and tidied by a tapping plate to facilitate the subsequent removal of the ceramic substrate from the first receiving cavity.

[0011] Furthermore, a lifting drive unit is provided below the base plate, the output end of the lifting drive unit penetrates through the base plate and is at least partially accommodated in the first accommodating cavity; the output end of the lifting drive unit is provided with a support plate arranged parallel to the base plate.

[0012] To achieve the above technical solution, the support plate is used to receive the ceramic sheet module and drive the ceramic sheet module to move back and forth in the vertical direction, so that the suction cup structure can be taken out from the first receiving cavity or put into the ceramic substrate.

[0013] Furthermore, the horizontal flipping assembly includes a fixed plate mounted below the rotary disk, a rotary drive unit mounted on the fixed plate, and a rotary shaft connected at both ends to the rotary disk and the fixed plate respectively; the fixed plate is fixed to the worktable by a connecting rod; the rotary shaft and the rotary drive unit are connected by a belt drive.

[0014] To achieve the above technical solution, a rotating disk is driven by a rotating drive unit, thereby causing the supporting structure to rotate and enabling the supporting structure to switch between different working states.

[0015] Furthermore, the thickness detection platform includes a first support rod perpendicular to the worktable and a detection plate horizontally positioned above the worktable via the first support rod; the thickness detection component is located above the detection plate.

[0016] To achieve the above technical solution, the thickness detection component, in conjunction with a suction cup structure, is used to detect whether the thickness of the ceramic substrate meets the standard.

[0017] Furthermore, the thickness detection structure includes a second support rod perpendicular to the worktable and a mounting plate horizontally mounted to the detection plate via the second support rod; a plurality of pressure cylinders and thickness detectors are provided on the side of the mounting plate away from the detection plate at intervals.

[0018] To achieve the above technical solution, the thickness detector is designed to penetrate the mounting plate and face the detection platform, in order to detect the ceramic substrate placed on the detection platform by the suction cup structure.

[0019] Furthermore, the output end of the pressure cylinder is connected to a pressure plate, which abuts against the ceramic substrate; the pressure plate is provided with a clearance hole for the detection probe of the thickness detector to pass through.

[0020] To achieve the above technical solution, the design of the pressure plate is used to press the ceramic substrate towards the detection platform, keeping the ceramic substrate flat so that the detection probe can better detect its thickness. The design of the clearance hole is to avoid interference between the pressure plate and the detection probe.

[0021] Furthermore, it also includes a storage component located downstream of the thickness detection component along the ceramic substrate feeding direction; the storage component includes a plurality of storage trays spaced apart from each other along the length of the worktable, the storage trays being used to hold the ceramic substrates after the detection is completed.

[0022] To achieve the above technical solution, the storage tray is located downstream of the thickness detection component to hold the qualified ceramic substrates, waiting for them to enter the next process.

[0023] As described above, the semiconductor ceramic substrate thickness detection device of this utility model has the following beneficial effects: 1. In this utility model, the design of the horizontal flipping component adjusts the speed difference between the ceramic substrate feeding speed and the thickness detection component, providing a buffer between the two and ensuring the stable operation of the equipment.

[0024] 2. In this utility model, by designing a lifting drive unit and a tapping component on the bearing structure, the ceramic substrate can be adjusted in the vertical and horizontal directions, ensuring the neatness of the ceramic substrate in the bearing tray and facilitating the placement and removal of the ceramic substrate. Attached Figure Description

[0025] Figure 1 The diagram shown is a structural schematic of a semiconductor ceramic substrate thickness detection device according to this utility model.

[0026] Figure 2 The diagram shown is a structural schematic of the transverse component in this utility model.

[0027] Figure 3 The diagram shown is a structural schematic of the horizontal flipping component in this utility model.

[0028] Figure 4 The diagram shown is a structural schematic of the load-bearing structure in the horizontal flipping component of this utility model.

[0029] Figure 5 The diagram shown is a schematic representation of the internal structure of the thickness detection component in this invention.

[0030] Figure 6 The image shown is a top view of the thickness detection structure in this invention.

[0031] The components include: 1. First frame; 11. Workbench; 2. Horizontal movement assembly; 21. Horizontal movement guide rail; 22. Suction cup structure; 3. Horizontal flipping assembly; 31. Rotary disk; 32. Bearing structure; 321. Base plate; 322. Side plate; 323. First opening; 324. First receiving cavity; 325. Arranging structure; 3251. Fixing block; 3252. Beating plate; 326. Lifting drive unit; 327. Support plate; 33. Fixing plate; 34. Rotation drive unit; 35. Rotation shaft; 36. Connection. 4. Rod; 4. Thickness detection component; 41. Detection platform; 411. First support rod; 412. Detection plate; 42. Thickness detection structure; 421. Second support rod; 422. Mounting plate; 423. Pressing cylinder; 424. Thickness detector; 4241. Detection probe; 425. Pressing plate; 4251. Clearance hole; 43. First gap; 5. Material storage component; 51. Material storage tray; 100. Ceramic sheet module; 101. Ceramic substrate; 1000. A semiconductor ceramic substrate thickness detection device. Detailed Implementation

[0032] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0033] Please see Figure 1-6 It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this invention, should still fall within the scope of the disclosed technical content. Furthermore, the terms "upper," "lower," "left," "right," "middle," and "one" used in this specification are merely for clarity and not intended to limit the scope of this invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0034] Please see Figures 1 to 6 This utility model provides a semiconductor ceramic substrate thickness detection device 1000, including a first frame 1 and a transverse moving component 2 disposed on the first frame 1 and spanning both sides of the first frame 1 along its length. The first frame 1 includes a worktable 11, on which a horizontal flipping component 3 and a thickness detection component 4 are sequentially arranged along the material feeding direction.

[0035] Specifically, the transverse component 2 includes a transverse guide rail 21 arranged along the length of the first frame 1 and a plurality of suction cup structures 22 slidably connected to the transverse guide rail 21; the horizontal flipping component 3 is located upstream of the thickness detection component 4, and includes a rotating disk 31 rotatably arranged on the worktable 11 and a plurality of bearing structures 32 arranged on the rotating disk 31; the thickness detection component 4 is vertically installed in the middle of the worktable 11, and includes a detection platform 41 and a thickness detection structure 42 arranged opposite to each other in the vertical direction, and a first gap 43 is provided between the two.

[0036] The suction cup structure 22 is at least partially able to extend into the first gap 43 to place the ceramic substrate 101 into the thickness detection component 4 or to remove the ceramic substrate 101 from the thickness detection component 4.

[0037] Furthermore, the horizontal flipping assembly 3 includes at least two sets of support structures 32. The support structure 23 includes a base plate 321 and a plurality of side plates 322 disposed perpendicular to the base plate 321. The base plate 321 and the side plates 322 are arranged to form a first receiving cavity 324 with a first opening 323. The first receiving cavity 324 is used to receive the ceramic sheet module 100, which is formed by arranging and stacking a plurality of ceramic substrates 101 along the height direction of the side plates 322.

[0038] The suction cup structure 22 takes the ceramic substrate 101 conveyed from the incoming direction and places it into the first receiving cavity 324 through the first opening 323, and stacks the ceramic substrate 101 along the height direction. When the thickness detection component 4 is waiting for an undetected ceramic substrate 101, the suction cup structure 22 takes the ceramic substrate 101 out of the first receiving cavity 324 through the first opening 323 and puts it into the thickness detection component 4.

[0039] The horizontal flipping assembly 3 includes at least two sets of support structures 32. When one set of support structures 32 is removed from the ceramic substrate 101, the other set of support structures 32 can be used to support a new ceramic substrate 101 without affecting each other. Furthermore, the state switching between multiple sets of support structures 32 can be achieved by rotating the rotating disk 31. Through the design of the horizontal flipping assembly 3, the speed difference between the ceramic substrate 101 feeding speed and the ceramic substrate 101 thickness detection speed is greatly adjusted, enabling the thickness detection device to operate smoothly.

[0040] It should be noted that this application does not limit the number of the supporting structure 32 in the horizontal flipping component 3 and the number of the thickness detection component 4. The number of the two should be adjusted according to the specific production process so that the whole equipment can operate stably.

[0041] Please continue reading. Figure 4 The side plate 322 has a pair of arrangement structures 325 arranged diagonally to each other at one end near the first opening 323.

[0042] The tidying structure 325 includes a fixing block 3251 installed on the top outer periphery of the side plate 322 and a patting plate 3252 installed on the fixing block 3251 that moves back and forth along the direction set by the tidying structure 325.

[0043] In a preferred embodiment, the tidying structure 325 is mounted on a pair of diagonally opposite side plates 322, and the shape of the tapping plate 3252 corresponds to the shape of the ceramic substrate 101. When the ceramic substrate 101 is placed into the first receiving cavity 324 through the first opening 323, the tapping plate 3252 taps and tidies the sides of the ceramic substrate 101, making it easier to remove the ceramic substrate 101 from the first receiving cavity 324 later.

[0044] Please continue reading. Figure 4 A lifting drive unit 326 is provided below the base plate 321. The output end of the lifting drive unit 326 passes through the first plate and is at least partially accommodated in the first accommodating cavity 324.

[0045] The output end of the lifting drive unit 326 is provided with a support plate 327 that is parallel to the base plate 321. The support plate 327 is used to support the ceramic tile module 100 and drive the ceramic tile module 100 to move back and forth in the vertical direction, so that the suction cup structure 22 can be taken out from the first receiving cavity 324 or put into the ceramic substrate 101.

[0046] Please continue reading. Figure 4 The horizontal flipping assembly 3 includes a fixed plate 33 installed below the rotating disk 31, a rotation drive unit 34 installed on the fixed plate 33, and a rotating shaft 35 whose two ends are respectively connected to the fixed plate 33 of the rotating disk 31.

[0047] The fixed plate 33 is fixed to the worktable 11 by the connecting rod 36; the rotating shaft 35 is connected to the rotating drive unit 34 by belt drive.

[0048] In this embodiment, the horizontal flipping component 3 is designed to be recessed relative to the worktable 11, which saves space in the height direction of the horizontal flipping component 3, ensures that it maintains a roughly uniform height with the downstream components, and facilitates the setting of the transverse movement structure.

[0049] Please continue reading. Figure 5 The thickness detection platform 41 includes a first support rod 411 set vertically on the worktable 11 and a detection plate 412 set horizontally above the worktable 11 via the first support rod 411. The thickness detection component 4 is set above the detection plate 412.

[0050] Specifically, the thickness detection structure 42 includes a second support rod 421 set on the vertical worktable 11 and a mounting plate 422 set horizontally with the detection plate 412 via the second support rod 421. The mounting plate 422 has a number of spaced-apart pressing cylinders 423 and thickness detectors 424 on the side away from the detection plate 412.

[0051] Furthermore, the output end of the pressing cylinder 423 is connected to a pressing plate 425, which abuts against the ceramic substrate 101. The pressing plate 425 has a clearance hole 4251 for the detection probe 4241 of the thickness detector 424 to pass through. The pressing plate 425 presses the ceramic substrate 101 towards the detection platform 41, keeping the ceramic substrate 101 flat, so that the detection probe 4241 can more accurately detect the thickness of the ceramic substrate 101. The clearance hole 4251 is designed to prevent the detection probe 4241 from being damaged due to interference between the pressing plate 423 and the detection probe 4241.

[0052] In a preferred embodiment, the thickness detector 424 is an ultrasonic thickness gauge.

[0053] In addition, this application also includes a material storage component 5 located downstream of the thickness detection component 4 along the material feeding direction of the ceramic substrate 101. The material storage component 5 includes a plurality of material storage trays 51 arranged at intervals along the length direction of the worktable 11. The material storage trays 51 are used to carry the ceramic substrate 101 after the inspection is completed, waiting to enter the next process.

[0054] The implementation principle of the semiconductor ceramic substrate thickness detection device 1000 in this utility model is as follows: The horizontal flipping component 3 is rotatably mounted on the worktable 11, and the incoming ceramic substrate 101 plate is supported by the bearing structure 32 provided on its rotating disk 31. The bearing structure 32 is provided with a support plate 327 that can move in the vertical direction to adjust the height of the ceramic sheet module 100 in the first receiving cavity 324, so as to facilitate the suction cup structure 22 to put into or take out the ceramic substrate 101 from the bearing structure 32. Then, the suction cup structure 22 places the ceramic substrate 101 along the first gap 43 on the detection platform 41 in the thickness detection component 4. Then, the pressing cylinder 423 drives the pressing plate 425 to abut against the ceramic substrate 101, and the detection probe 4241 detects the thickness of the ceramic substrate 101. After the detection is completed, the suction cup structure 22 puts the ceramic substrate 101 into the storage component 5. The ceramic substrate 101 that fails the thickness test is removed by the robotic arm or technicians.

[0055] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A semiconductor ceramic substrate thickness detection device, characterized in that, include: The first frame (1) includes a workbench (11). The transverse component (2) is set on the first frame (1) and spans both sides of the length direction of the first frame (1), including a transverse guide rail (21) set along the length direction of the first frame (1) and a number of suction cup structures (22) that are slidably connected to the transverse guide rail (21). A horizontal flipping assembly (3) disposed on a workbench (11) includes a rotating disk (31) rotatably disposed on the workbench (11) and a plurality of supporting structures (32) disposed on the rotating disk (31); the horizontal flipping assembly (3) includes at least two sets of supporting structures (32); the supporting structure (32) includes a base plate (321) and a plurality of side plates (322) disposed vertically to the base plate (321), the base plate (321) and the side plates (322) are arranged to form a first receiving cavity (324) having a first opening (323); the first receiving cavity (324) is used to receive a ceramic sheet module (100), the ceramic sheet module (100) is formed by a plurality of ceramic substrates (101) arranged and stacked along the height direction of the side plates (322); The thickness detection component (4) located downstream of the horizontal flipping component (3) along the feeding direction of the ceramic substrate (101) includes a detection platform (41) and a thickness detection structure (42) arranged opposite to each other in the vertical direction, and a first gap (43) is provided between them to at least partially accommodate the suction cup structure (22).

2. The semiconductor ceramic substrate thickness detection device according to claim 1, characterized in that, The side plate (322) has a pair of tidying structures (325) arranged diagonally to each other at one end near the first opening (323); the tidying structure (325) includes a fixing block (3251) installed on the outer periphery of the top of the side plate (322) and a patting plate (3252) installed on the fixing block (3251) and moving back and forth along the direction of the tidying structure (325).

3. The semiconductor ceramic substrate thickness detection device according to claim 2, characterized in that, A lifting drive unit (326) is provided below the base plate (321). The output end of the lifting drive unit (326) passes through the base plate (321) and is at least partially accommodated in the first accommodating cavity (324). The output end of the lifting drive unit (326) is provided with a support plate (327) arranged parallel to the base plate (321).

4. The semiconductor ceramic substrate thickness detection device according to claim 3, characterized in that, The horizontal flipping assembly (3) includes a fixed plate (33) installed below the rotating disk (31), a rotary drive unit (34) installed on the fixed plate (33), and a rotating shaft (35) connected at both ends to the rotating disk (31) and the fixed plate (33) respectively; the fixed plate (33) is fixed to the worktable (11) by a connecting rod (36); the rotating shaft (35) and the rotary drive unit (34) are connected by belt drive.

5. The semiconductor ceramic substrate thickness detection device according to any one of claims 1-4, characterized in that, The thickness detection platform (41) includes a first support rod (411) perpendicular to the workbench (11) and a detection plate (412) horizontally arranged above the workbench (11) via the first support rod (411); the thickness detection component (4) is located above the detection plate (412).

6. The semiconductor ceramic substrate thickness detection device according to claim 5, characterized in that, The thickness detection structure (42) includes a second support rod (421) perpendicular to the worktable (11) and a mounting plate (422) horizontally arranged with the detection plate (412) via the second support rod (421); a number of pressure cylinders (423) and thickness detectors (424) are provided on the side of the mounting plate (422) away from the detection plate (412).

7. The semiconductor ceramic substrate thickness detection device according to claim 6, characterized in that, The output end of the pressure cylinder (423) is connected to a pressure plate (425), which abuts against the ceramic substrate (101); the pressure plate (425) is provided with a clearance hole (4251) for the detection probe (4241) of the thickness detector (424) to pass through.

8. The semiconductor ceramic substrate thickness detection device according to claim 1, characterized in that, It also includes a material storage component (5) located downstream of the thickness detection component (4) along the material feeding direction of the ceramic substrate (101); the material storage component (5) includes a plurality of material storage trays (51) spaced apart from each other along the length direction of the worktable (11), and the material storage trays (51) are used to carry the ceramic substrate (101) after the detection is completed.

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