Semiconductor die bonder and pusher mechanism

Abstract

This utility model belongs to the field of electrical component technology, specifically relating to a device suitable for handling semiconductors or solid-state devices during manufacturing or processing, and particularly to a semiconductor solder sheet dispensing device. This semiconductor solder sheet dispensing device stacks solder sheets using a hopper. A feeding notch is provided at the bottom of the hopper, allowing a pushing mechanism to sequentially push the solder sheets out. Furthermore, the dimensional matching between the transition plate and the suction plate in the pushing mechanism achieves precise single-sheet dispensing, avoiding the technical problem of grasping errors caused by negative pressure adsorption of solder sheets.

Description

Technical Field

[0001] This utility model belongs to the field of electrical component technology, specifically relating to a device specifically suitable for handling semiconductor or solid-state devices during manufacturing or processing, and particularly to a semiconductor solder sheet dispensing device. Background Technology

[0002] In IGBT production lines, the loading, unloading, and assembly of semiconductor products often require transfer devices. For example, in semiconductor solder sheet sorting devices, negative pressure adsorption is used to pick up stacked solder sheets one by one. However, since the thickness of the solder sheets is generally less than 300μm, the negative pressure adsorption method often causes the solder sheets to stick together, resulting in two solder sheets being picked up at once. At the same time, the transfer device assists the detection equipment in detecting the picked solder sheets. When two solder sheets are picked up at the same time, the detection calibration error will occur, which will cause both solder sheets to be scrapped, resulting in product waste.

[0003] There is an urgent need to provide a semiconductor solder sheet feeding device to solve the technical problem of grasping errors caused by negative pressure adsorption of solder sheets in related technologies.

[0004] It should be noted that the information disclosed in this background section is only for understanding the background technology of the present application concept, and therefore, the above description is not considered to constitute prior art information. Utility Model Content

[0005] This disclosure provides at least one semiconductor wafer sorting device, including: a sorting table and a hopper disposed on the sorting table; The bottom of the hopper has a discharge notch; and The material pushing mechanism is slidably mounted on the material distribution table, and its front end is equipped with a suction plate that matches the outer contour of the welding sheet; wherein... The feeding mechanism is configured to push the suction plate repeatedly along the bottom of the hopper to push the stacked welding sheets in the hopper out one by one from the feeding notch.

[0006] In one optional implementation, a pusher guide frame is provided on the material distribution platform; wherein The width between the two frames of the pusher guide is matched with the width of the suction plate.

[0007] In one optional implementation, the pushing mechanism includes: a pushing cylinder; The movable end of the pusher cylinder is connected to the suction plate via a transition plate; and The pusher cylinder is configured to push the suction plate to translate along the pusher guide frame.

[0008] In one optional embodiment, the height of the transition plate is higher than the height of the suction plate; wherein The surface of the transition plate fits into the material discharge notch of the hopper; The height difference between the surface of the transition plate and the surface of the suction plate is equal to the thickness of the welding sheet.

[0009] In one alternative implementation, the feeding mechanism further includes a vacuum generator; The suction plate has several negative pressure suction holes on its surface; and The vacuum generator is connected to the suction plate via a pipeline.

[0010] In one alternative implementation, a pressure plate is also provided inside the hopper.

[0011] In one alternative implementation, the pushing mechanism further includes: a rodless cylinder; The movable end of the rodless cylinder is respectively provided with a pusher cylinder mounting position and a hopper mounting position; wherein The rodless cylinder is configured to pull the pusher cylinder and the hopper together.

[0012] This disclosure also provides at least one pushing mechanism, including: a pushing cylinder and a suction plate disposed at the bottom of the hopper; The pusher cylinder and the suction plate are connected by a transition plate; and The height of the transition plate is higher than the height of the suction plate; whereby... The surface of the transition plate fits into the material discharge notch of the hopper; The height difference between the surface of the transition plate and the surface of the suction plate is equal to the thickness of the welding sheet.

[0013] In one alternative implementation, the feeding mechanism further includes a vacuum generator; The suction plate has several negative pressure suction holes on its surface; and The vacuum generator is connected to the suction plate via a pipeline.

[0014] In one alternative implementation, the pushing mechanism further includes: a rodless cylinder; The movable end of the rodless cylinder is respectively provided with a pusher cylinder mounting position and a hopper mounting position; wherein The rodless cylinder is configured to pull the pusher cylinder and the hopper together.

[0015] The beneficial effects of this utility model are that the semiconductor solder sheet dispensing device stacks solder sheets through a set hopper, and pushes out the solder sheets one by one through a pushing mechanism by opening a feeding notch at the bottom of the hopper. Furthermore, the transition plate and the suction plate in the pushing mechanism are matched in size to achieve precise single-sheet pushing, thus avoiding the technical problem of grasping errors caused by negative pressure adsorption of solder sheets.

[0016] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0017] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0018] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 A three-dimensional structural schematic diagram of the semiconductor wafer feeding device provided in an embodiment of this disclosure is shown; Figure 2 A three-dimensional structural schematic diagram of the feeding mechanism provided in an embodiment of this disclosure is shown; Figure 3 It shows Figure 2 A magnified structural diagram of point A in the middle.

[0020] In the picture: 1. Material distribution platform; 10. Material pusher frame; 2. Material bin; 20. Pressure plate; 21. Material discharge notch; 3. Material pusher mechanism; 30. Rodless cylinder; 31. Material pusher cylinder; 32. Suction plate; 320. Negative pressure suction hole; 33. Transition plate; 34. Vacuum generator. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0022] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the figures, the thickness of parts may be exaggerated or reduced for the purpose of effectively depicting the technical content.

[0023] The following detailed description, with reference to the accompanying drawings, describes some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0024] See Figure 1 , Figure 1 A semiconductor solder sheet feeding device is shown, including: a feeding platform 1 and a hopper 2 disposed on the feeding platform 1; the bottom of the hopper 2 is provided with a feeding notch 21; and a pushing mechanism 3, which is slidably disposed on the feeding platform 1, and the front end of the pushing mechanism 3 is provided with a suction plate 32 adapted to the outer contour of the solder sheet; wherein the pushing mechanism 3 is configured to push the suction plate 32 to move repeatedly along the bottom of the hopper 2 to push the stacked solder sheets in the hopper 2 out one by one from the feeding notch 21.

[0025] In some embodiments, the welding sheets are stacked by the provided hopper 2, and the welding sheets are pushed out sequentially by the pusher mechanism 3 by opening a feeding notch 21 at the bottom of the hopper 2.

[0026] See Figure 3 In some embodiments, a pusher frame 10 is provided on the dispensing platform 1; wherein the width between the two frames of the pusher frame 10 is adapted to the width of the suction plate 32. The pusher frame 10 limits the suction plate 32, thereby precisely controlling the pushing path. Furthermore, the height of the pusher frame 10 is higher than the height of the suction plate 32, so that the sidewall of the welding sheet placed on the suction plate 32 is also supported, thereby ensuring the estimated ejection of the welding sheet.

[0027] Specifically, the pushing mechanism 3 includes: a pushing cylinder 31; the movable end of the pushing cylinder 31 is connected to the suction plate 32 through a transition plate 33; and the pushing cylinder 31 is configured to push the suction plate 32 to translate within the pushing guide frame 10.

[0028] In some embodiments, the height of the transition plate 33 is higher than the height of the suction plate 32; wherein the surface of the transition plate 33 is in contact with the discharge notch 21 of the hopper 2; the height difference between the surface of the transition plate 33 and the surface of the suction plate 32 is equal to the thickness of the welding sheet.

[0029] Specifically, since the height of the transition plate 33 is higher than that of the suction plate 32, a storage recess is formed by the connection between the two. When the transition plate 33 slides, its top surface is pressed against the discharge notch 21 of the hopper 2, so that the welding sheet cannot fall at this time. When the transition plate 33 is removed, the suction plate 32 moves to the bottom of the hopper 2, and the stacked welding sheet will fall into the storage recess and then be pushed out.

[0030] The specific working process is as follows: The pusher cylinder 31 pushes the transition plate 33 and the suction plate 32 to move left and right together. Initially, the transition plate 33 is located below the hopper 2. At this time, the material discharge gap 21 of the hopper 2 is blocked. Then, the pusher cylinder 31 pulls the transition plate 33 and the suction plate 32 to move one position to the left. At this time, the suction plate 32 is facing the material discharge gap 21, causing the welding piece to fall. Then, the pusher cylinder 31 pushes the transition plate 33 and the suction plate 32 to move one position to the right, causing the falling welding piece to be pushed out. The transition plate 33 then blocks the material discharge gap 21 again. This process is repeated to complete the single-piece ejection of the welding piece.

[0031] See Figure 1 In some embodiments, the pushing mechanism 3 further includes: a vacuum generator 34; a plurality of negative pressure suction holes 320 are provided on the surface of the suction plate 32; and the vacuum generator 34 is connected to the suction plate 32 via a pipeline. By cooperating with the vacuum generator 34 through the negative pressure suction holes 320, the suction plate 32 can stably pick up a single piece of welding sheet. Even if the welding sheet undergoes slight deformation, it can still be pushed stably to avoid jamming.

[0032] In some embodiments, a pressure plate 20 is also provided inside the hopper 2. The pressure plate 20 uses its own weight to press down on the solder pieces, thereby ensuring that all solder pieces can be ejected.

[0033] In some embodiments, the pushing mechanism 3 further includes a rodless cylinder 30; the movable end of the rodless cylinder 30 is respectively provided with a pushing cylinder 31 mounting position and a hopper 2 mounting position; wherein the rodless cylinder 30 is configured to pull the pushing cylinder 31 and the hopper 2 together. The rodless cylinder 30 enables the overall handling of the equipment, facilitating subsequent workstation changes and maintenance.

[0034] See Figure 2 On the other hand, some embodiments also provide a pushing mechanism 3, including: a pushing cylinder 31 and a suction plate 32 disposed at the bottom of the hopper 2; the pushing cylinder 31 and the suction plate 32 are connected by a transition plate 33; and the height of the plate surface of the transition plate 33 is higher than the height of the plate surface of the suction plate 32; wherein the plate surface of the transition plate 33 is in contact with the material discharge notch 21 of the hopper 2; the height difference between the plate surface of the transition plate 33 and the plate surface of the suction plate 32 is equal to the thickness of the welding sheet.

[0035] In some embodiments, the feeding mechanism 3 further includes: a vacuum generator 34; a plurality of negative pressure suction holes 320 are provided on the surface of the suction plate 32; and the vacuum generator 34 is connected to the suction plate 32 through a pipeline.

[0036] In some embodiments, the pushing mechanism 3 further includes: a rodless cylinder 30; the movable end of the rodless cylinder 30 is respectively provided with a pushing cylinder 31 mounting position and a hopper 2 mounting position; wherein the rodless cylinder 30 is configured to pull the pushing cylinder 31 and the hopper 2 to move together.

[0037] In summary, this semiconductor solder sheet dispensing device stacks solder sheets using a hopper 2. By opening a feeding notch 21 at the bottom of the hopper 2, the solder sheets are pushed out sequentially by a pushing mechanism 3. Furthermore, the transition plate 33 in the pushing mechanism 3 is sized to match the suction plate 32, thereby achieving precise single-sheet feeding and avoiding the technical problem of grasping errors caused by negative pressure adsorption of solder sheets.

[0038] In this document, when it is said that the first component is located on the second component, this can mean that the first component can be directly formed on the second component, or that the third component can be inserted between the first component and the second component.

[0039] In this document, when an element or layer is referred to as “located,” “joined to,” “connected to,” “attached to,” or “coupled to” another element or layer, it may be directly located, joined, connected, attached to, or coupled to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” “directly attached to,” or “directly coupled to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items.

[0040] In the description of the embodiments of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0041] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0042] Spatially relative terms, such as “inside,” “outside,” “below,” “below,” “down,” “above,” “up,” etc., may be used herein to describe the relationship between one element or feature illustrated in the figures and another element or feature. In addition to the orientations depicted in the figures, spatially relative terms may be intended to cover different orientations of the apparatus in use or operation.

[0043] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A semiconductor solder sheet feeding device, characterized in that, include: The material distribution platform (1) and the hopper (2) set on the material distribution platform (1); The bottom of the hopper (2) is provided with a discharge notch (21); and A feeding mechanism (3) is slidably mounted on a dispensing table (1), and the front end of the feeding mechanism (3) is provided with a suction plate (32) that matches the outer contour of the welding sheet; wherein The pushing mechanism (3) is configured to push the suction plate (32) along the bottom of the bin (2) repeatedly to push the stacked welding sheets in the bin (2) out one by one from the feeding notch (21).

2. The semiconductor wafer feeding device as described in claim 1, characterized in that, The material distribution table (1) is equipped with a material pusher frame (10); wherein The width between the two frames of the pusher guide frame (10) is adapted to the width of the suction plate (32).

3. The semiconductor wafer feeding device as described in claim 2, characterized in that, The pushing mechanism (3) includes: a pushing cylinder (31); The movable end of the pusher cylinder (31) is connected to the suction plate (32) via a transition plate (33); and The pusher cylinder (31) is configured to push the suction plate (32) to translate within the pusher guide frame (10).

4. The semiconductor wafer feeding device as described in claim 3, characterized in that, The height of the transition plate (33) is higher than the height of the suction plate (32); wherein The surface of the transition plate (33) is in contact with the material discharge notch (21) of the hopper (2); The height difference between the surface of the transition plate (33) and the surface of the suction plate (32) is equal to the thickness of the welding sheet.

5. The semiconductor wafer feeding device as described in claim 4, characterized in that, The feeding mechanism (3) also includes: a vacuum generator (34); The suction plate (32) has several negative pressure suction holes (320) on its surface; and The vacuum generator (34) is connected to the suction plate (32) through a pipeline.

6. The semiconductor wafer feeding device as described in claim 1, characterized in that, The hopper (2) is also equipped with a pressure plate (20).

7. The semiconductor wafer feeding device as described in claim 1, characterized in that, The pushing mechanism (3) also includes: a rodless cylinder (30); The movable end of the rodless cylinder (30) is respectively provided with a pusher cylinder (31) mounting position and a hopper (2) mounting position; wherein The rodless cylinder (30) is configured to pull the pusher cylinder (31) and the hopper (2) together.

8. A feeding mechanism (3), characterized in that, include: The push cylinder (31) and suction plate (32) are set at the bottom of the hopper (2); The pushing cylinder (31) and the suction plate (32) are connected by a transition plate (33); and The height of the transition plate (33) is higher than the height of the suction plate (32); wherein The surface of the transition plate (33) is in contact with the material discharge notch (21) of the hopper (2); The height difference between the surface of the transition plate (33) and the surface of the suction plate (32) is equal to the thickness of the welding sheet.

9. The feeding mechanism (3) as described in claim 8, characterized in that, Also includes: Vacuum generator (34); The suction plate (32) has several negative pressure suction holes (320) on its surface; and The vacuum generator (34) is connected to the suction plate (32) through a pipeline.

10. The feeding mechanism (3) as described in claim 9, characterized in that, Also includes: rodless cylinder (30); The movable end of the rodless cylinder (30) is respectively provided with a pusher cylinder (31) mounting position and a hopper (2) mounting position; wherein The rodless cylinder (30) is configured to pull the pusher cylinder (31) and the hopper (2) together.

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