Electrical component plating apparatus
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-20
- Publication Date
- 2026-08-11
AI Technical Summary
[0004]针对现有技术的不足,本实用新型提供了一种电子元件电镀装置,解决了现有的用于安装电子元件的吊具在电镀槽中的深度不方便调节的问题
[0016]通过电镀槽体、滑轨、滑板、连接杆、悬挂架、挡板、弹性件和锁紧件等的配合使用,将电子元件安装在悬挂架上,随后在滑板中向下按压连接杆带动悬挂架以及电子元件浸入到电镀槽体的溶液中,进行电镀,随后使用锁紧件固定连接杆在滑板中的位置,通过在连接杆上加工多个卡槽,便于调节悬挂架上的电子元件在电解槽中的深度,在弹性件的作用下,连接杆带动悬挂架以及电子元件移出液面,便于对电子元件进行取放。
Smart Images

Figure CN224620094U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electroplating equipment technology, specifically to an electroplating equipment for electronic components. Background Technology
[0002] Electroplating is a process that uses the principle of electrolysis to deposit a layer of other metals or alloys on the surface of a base metal. Specifically, electroplating involves using the workpiece to be plated as the cathode, the metal to be plated as the anode, and applying a direct current power supply between the two electrodes, causing metal ions in the solution to be reduced on the cathode to form a metal coating.
[0003] In the production of electronic components, an electroplating layer needs to be added to the surface of the components to improve the wear resistance of the surface. However, during electroplating, the depth of the hanger used to install the electronic components in the electroplating tank is inconvenient to adjust, and the hanger needs to be manually removed and placed, which is not convenient. Therefore, we propose an electroplating device for electronic components. Utility Model Content
[0004] To address the shortcomings of existing technologies, this utility model provides an electronic component electroplating device that solves the problem that the depth of existing hanging devices for installing electronic components in the electroplating tank is inconvenient to adjust.
[0005] To achieve the above objectives, the present invention provides the following technical solution: an electronic component electroplating apparatus, comprising an electroplating tank, wherein an mounting assembly is provided on the electroplating tank, and the mounting assembly is used to adjust the position of the electronic component in the electroplating tank;
[0006] The mounting components include slide rails, slide plates, connecting rods, suspension brackets, baffles, elastic elements, and locking elements;
[0007] The slide rail and the electroplating tank are fixedly connected, the slide plate and the slide rail are slidably connected, the connecting rod is inserted into the through groove of the slide plate, the suspension bracket is fixedly connected to the bottom end of the connecting rod, the suspension bracket is used to suspend electronic components, and the position of the suspension bracket and the electronic components in the electroplating tank is adjusted by moving the suspension bracket in the slide plate, the baffle is fixedly connected to the top end of the connecting rod, the elastic element is sleeved and connected to the connecting rod, the elastic element is located between the baffle and the slide plate, and the locking element is used to fix the position of the connecting rod in the slide plate.
[0008] Preferably, a connecting shaft is fixedly connected to the suspension frame, and both ends of the connecting shaft are rotatably connected to a stirring paddle via bearings.
[0009] Preferably, the locking element includes a fixing plate, a screw, and a handwheel;
[0010] The top of the fixing plate is fixedly connected to the sliding plate, the screw is threadedly connected to the internal thread hole of the fixing plate, one end of the screw is connected to the groove of the connecting rod, and the other end of the screw is fixedly connected to a handwheel.
[0011] Preferably, a drive assembly is installed on the electroplating tank, the drive assembly being used to drive the suspension frame to stir the solution in the electroplating tank;
[0012] The drive assembly includes a mounting base, a drive shaft, a slide, and a motor;
[0013] The mounting base and the electroplating tank are fixedly connected. The drive shaft is rotatably connected to the mounting base through a bearing. The slide is threadedly connected to the drive shaft. The bottom end of the slide and the slide plate are fixedly connected. The output end of the motor is connected to the drive shaft through a coupling.
[0014] Preferably, a drain pipe is fixedly connected to the electroplating tank, and a control valve is installed inside the drain pipe.
[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: This electronic component electroplating apparatus has the following advantages over traditional technology:
[0016] By using a combination of electroplating tank, slide rail, slide plate, connecting rod, suspension frame, baffle, elastic element, and locking element, electronic components are installed on the suspension frame. Then, the connecting rod is pressed down in the slide plate to immerse the suspension frame and electronic components into the solution in the electroplating tank for electroplating. The locking element is then used to fix the position of the connecting rod in the slide plate. Multiple slots are machined on the connecting rod to facilitate adjustment of the depth of the electronic components on the suspension frame in the electrolytic tank. Under the action of the elastic element, the connecting rod moves the suspension frame and electronic components out of the liquid surface, making it easy to pick up and put down the electronic components. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of this utility model;
[0018] Figure 2 for Figure 1 Schematic diagram of the connection structure of the middle slide rail, slide plate and connecting rod;
[0019] Figure 3 for Figure 1 Schematic diagram of the connection structure of the connecting rod, suspension frame and elastic element;
[0020] Figure 4 for Figure 1 A schematic diagram of the connection structure of the fixing plate, screw, and handwheel in the diagram;
[0021] Figure 5 for Figure 1A schematic diagram of the connection structure of the mounting base, drive shaft and slide.
[0022] In the diagram: 1. Electroplating tank; 11. Drain pipe; 12. Control valve; 2. Mounting assembly; 21. Slide rail; 22. Slide plate; 23. Connecting rod; 24. Suspension frame; 241. Connecting shaft; 242. Agitator; 25. Baffle; 26. Elastic element; 27. Locking element; 271. Fixing plate; 272. Screw; 273. Handwheel; 3. Drive assembly; 31. Mounting base; 32. Drive shaft; 33. Slide block; 34. Motor. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] The existing hanging fixtures used for installing electronic components have the problem of inconvenient depth adjustment in electroplating tanks.
[0025] In view of this, the present invention provides an electronic component electroplating device. Through the coordinated use of an electroplating tank, a slide rail, a slide plate, a connecting rod, a suspension frame, a baffle, an elastic element, and a locking element, the electronic component is installed on the suspension frame. Then, the connecting rod is pressed down in the slide plate to immerse the suspension frame and the electronic component into the solution in the electroplating tank for electroplating. Subsequently, the locking element is used to fix the position of the connecting rod in the slide plate. By processing multiple slots on the connecting rod, the depth of the electronic component on the suspension frame in the electrolytic tank can be easily adjusted.
[0026] Depend on Figure 1 , Figure 2 and Figure 3An electronic component electroplating apparatus includes an electroplating tank 1, on which an mounting assembly 2 is provided. The mounting assembly 2 is used to adjust the position of the electronic component in the electroplating tank 1. The mounting assembly 2 includes a slide rail 21, a slide plate 22, a connecting rod 23, a suspension bracket 24, a baffle 25, an elastic element 26, and a locking element 27. The slide rail 21 is fixedly connected to the electroplating tank 1, and the slide plate 22 is slidably connected to the slide rail 21. The connecting rod 23 is inserted into the through groove of the slide plate 22. The suspension bracket 24 is fixedly connected to the bottom end of the connecting rod 23 and is used to suspend the electronic component. By moving the suspension bracket 24 in the slide plate 22, the position of the suspension bracket 24 and the electronic component in the electroplating tank 1 can be adjusted. The baffle 25 is fixedly connected to the top end of the connecting rod 23. The elastic element 26 is sleeved and connected to the connecting rod 23. The elastic element 26 is located between the baffle 25 and the slide plate 22. The locking element 27 is used to fix the position of the connecting rod 23 in the slide plate 22.
[0027] In the specific implementation process, it is worth noting that the slide plate 22 is machined with grooves that are compatible with the slide rail 21, the outer wall of the connecting rod 23 is evenly distributed with slots, the suspension frame 24 is used to suspend electronic components, the baffle 25 is designed to prevent the elastic element 26 and the connecting rod 23 from separating, the elastic element 26 adopts a compression spring to facilitate the upward movement of the connecting rod 23 in the slide plate 22, by moving the connecting rod 23 in the slide plate 22, the connecting rod 23 drives the suspension frame 24 and the electronic components to move out of the liquid surface, which facilitates the picking and placing of electronic components;
[0028] Furthermore, a connecting shaft 241 is fixedly connected to the suspension frame 24, and both ends of the connecting shaft 241 are rotatably connected to the stirring paddle 242 via bearings;
[0029] In the specific implementation process, it is worth noting that stirring paddles 242 are provided at both ends of the connecting shaft 241. The stirring paddles 242 are used to stir the solution in the electroplating tank 1.
[0030] Specifically, the electronic components are mounted on the suspension bracket 24, and then the connecting rod 23 is pressed down in the slide plate 22. The connecting rod 23 drives the suspension bracket 24 and the electronic components to be immersed in the solution of the electroplating tank 1. Then, the locking member 27 is used to fix the position of the connecting rod 23 in the slide plate 22. The slide plate 22 is moved on the outer wall of the slide rail 21. The slide plate 22 drives the suspension bracket 24 to move in the electroplating tank 1. At the same time, the connecting shaft 241 drives the stirring paddle 242 to stir the solution.
[0031] Depend on Figure 1 , Figure 4 and Figure 5It can be seen that the locking component 27 includes a fixing plate 271, a screw 272 and a handwheel 273. The top end of the fixing plate 271 is fixedly connected to the slide plate 22. The screw 272 is threadedly connected to the internal thread hole of the fixing plate 271. One end of the screw 272 is connected to the groove of the connecting rod 23. The other end of the screw 272 is fixedly connected to the handwheel 273.
[0032] In the specific implementation process, it is worth noting that the fixing plate 271 is machined with an internal thread hole, the screw 272 can move laterally in the fixing plate 271, and the handwheel 273 is set to facilitate the rotation of the screw 272.
[0033] Furthermore, a drive assembly 3 is installed on the electroplating tank 1. The drive assembly 3 is used to drive the suspension frame 24 to stir the solution in the electroplating tank 1. The drive assembly 3 includes a mounting base 31, a drive shaft 32, a slide 33 and a motor 34. The mounting base 31 is fixedly connected to the electroplating tank 1. The drive shaft 32 is rotatably connected to the mounting base 31 through a bearing. The slide 33 is threadedly connected to the drive shaft 32. The slide 33 is fixedly connected to the bottom end of the slide plate 22. The output end of the motor 34 is connected to the drive shaft 32 through a coupling.
[0034] In the specific implementation process, it is worth noting that the mounting base 31 is machined into a U-shape, the outer wall of the drive shaft 32 is machined with threads, the drive shaft 32 rotates in the mounting base 31 through the bearing, and the motor 34 provides power for the rotation of the drive shaft 32.
[0035] Furthermore, a drain pipe 11 is fixedly connected to the electroplating tank 1, and a control valve 12 is installed inside the drain pipe 11.
[0036] In the specific implementation process, it is worth noting that the drain pipe 11 is used to export the solution in the electroplating tank 1, and the control valve 12 is used to control the opening and closing of the drain pipe 11.
[0037] Specifically, based on the above embodiment, after connecting the bottom ends of the slide block 33 and the slide plate 22, when it is necessary to move the slide plate 22 on the slide rail 21, the motor 34 is started. The motor 34 drives the transmission shaft 32 to rotate in the mounting base 31. As the transmission shaft 32 rotates, it drives the slide block 33 to move, and then the slide block 33 drives the slide plate 22 to move. Through the transmission between the transmission shaft 32 and the slide block 33, power is provided for the suspension frame 24 to stir the solution in the electroplating tank 1.
[0038] In the description of this utility model, it should be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "side", "top", "inner", "front", "center", "both ends", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0039] In this utility model, unless otherwise explicitly specified and limited, the terms "installation", "setting", "connection", "fixing", "screw connection", etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An electroplating apparatus for electronic components, comprising an electroplating tank (1), characterized in that: The electroplating tank (1) is provided with a mounting assembly (2), which is used to adjust the position of electronic components in the electroplating tank (1); The mounting assembly (2) includes a slide rail (21), a slide plate (22), a connecting rod (23), a suspension bracket (24), a baffle (25), an elastic element (26), and a locking element (27); The slide rail (21) and the electroplating tank (1) are fixedly connected. The slide plate (22) and the slide rail (21) are slidably connected. The connecting rod (23) is inserted into the through groove of the slide plate (22). The suspension bracket (24) is fixedly connected to the bottom end of the connecting rod (23). The suspension bracket (24) is used to suspend electronic components. By moving the suspension bracket (24) in the slide plate (22), the position of the suspension bracket (24) and the electronic components in the electroplating tank (1) can be adjusted. The baffle (25) is fixedly connected to the top end of the connecting rod (23). The elastic element (26) is sleeved and connected to the connecting rod (23). The elastic element (26) is located between the baffle (25) and the slide plate (22). The locking element (27) is used to fix the position of the connecting rod (23) in the slide plate (22).
2. The electronic component electroplating apparatus according to claim 1, characterized in that: A connecting shaft (241) is fixedly connected in the suspension frame (24), and both ends of the connecting shaft (241) are rotatably connected to a stirring paddle (242) through bearings.
3. The electronic component electroplating apparatus according to claim 1, characterized in that: The locking component (27) includes a fixing plate (271), a screw (272), and a handwheel (273); The top of the fixing plate (271) is fixedly connected to the sliding plate (22), the screw (272) is threadedly connected to the internal thread hole of the fixing plate (271), one end of the screw (272) is connected to the groove of the connecting rod (23), and the other end of the screw (272) is fixedly connected to a handwheel (273).
4. The electronic component electroplating apparatus according to claim 1, characterized in that: A drive assembly (3) is installed on the electroplating tank (1), and the drive assembly (3) is used to drive the suspension frame (24) to stir the solution in the electroplating tank (1); The drive assembly (3) includes a mounting base (31), a drive shaft (32), a slide (33), and a motor (34); The mounting base (31) and the electroplating tank (1) are fixedly connected. The drive shaft (32) is rotatably connected to the mounting base (31) through a bearing. The slide (33) is threadedly connected to the drive shaft (32). The slide (33) and the bottom end of the slide plate (22) are fixedly connected. The output end of the motor (34) is connected to the drive shaft (32) through a coupling.
5. The electronic component electroplating apparatus according to claim 1, characterized in that: A drain pipe (11) is fixedly connected to the electroplating tank (1), and a control valve (12) is installed inside the drain pipe (11).