A low-temperature texturing tank device

Abstract

This utility model discloses a low-temperature texturing tank device, including an outer tank, an inner tank, and a circulating temperature control mechanism. The inner tank is fixedly installed inside the outer tank, and a reflux chamber is formed between the outer tank and the inner tank. A flow equalization plate assembly is fixedly installed inside the inner tank, and a texturing operation chamber is formed inside the flow equalization plate assembly. Both the inner tank and the reflux chamber are filled with texturing liquid. The circulating temperature control mechanism includes a circulating pump. The inlet pipe of the circulating pump is connected to the inner tank, and the outlet pipe of the circulating pump is connected to the outer tank. This utility model adopts an inner and outer tank design, and meets the low-temperature control requirements of the texturing liquid by circulating the texturing liquid between the inner and outer tanks. The flow equalization plate assembly of this utility model can provide a stable texturing liquid flow environment for silicon wafer products, and can well meet the production requirements of inverted pyramid textured surfaces.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer texturing technology, and more specifically, to a low-temperature texturing tank device. Background Technology

[0002] Crystalline silicon solar cells currently dominate the photovoltaic industry. Surface texturing of silicon wafers, also known as "surface texturing," is the first process in manufacturing crystalline silicon cells and a core step in cell manufacturing. An inverted pyramid-shaped pit structure is considered ideal for texturing because sunlight undergoes three reflections on an inverted pyramid textured surface, absorbing one more reflection than on a regular pyramid textured surface, reducing the reflectivity to around 4-6% (compared to approximately 10% for a regular pyramid textured surface), thus improving cell efficiency. While producing a regular pyramid textured surface requires a high-temperature environment, producing an inverted pyramid textured surface requires a low-temperature environment. Companies need to design and modify their existing texturing tank equipment to meet the requirements for producing inverted pyramid textured surfaces, hence this case study. Utility Model Content

[0003] The purpose of this invention is to address the needs of the prior art and provide a low-temperature texturing tank device. This invention adopts an inner and outer tank design, and meets the low-temperature control requirements of the texturing liquid by circulating the texturing liquid between the inner and outer tanks. The flow equalization plate combination of this invention can provide a stable texturing liquid flow environment for silicon wafer products, and can well meet the production requirements of inverted pyramid textured surfaces.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A low-temperature texturing tank device includes an outer tank, an inner tank, and a circulating temperature control mechanism. The inner tank is fixedly installed inside the outer tank, and a reflux chamber is formed between the outer tank and the inner tank. A flow equalization plate assembly is fixedly installed inside the inner tank, and a texturing operation chamber is formed inside the flow equalization plate assembly. Both the inner tank and the reflux chamber are filled with texturing liquid. The circulating temperature control mechanism includes a circulating pump. The inlet pipe of the circulating pump is connected to the inner tank, and the outlet pipe of the circulating pump is connected to the outer tank.

[0006] Furthermore, the highest point of the sidewall of the outer groove is higher than the highest point of the sidewall of the inner groove.

[0007] Furthermore, the flow equalization plate assembly includes two side flow equalization plates and one bottom flow equalization plate. The two side flow equalization plates are symmetrically and vertically installed inside the inner tank, and the bottom flow equalization plate is installed horizontally. The two side flow equalization plates are respectively connected to the left and right sides of the bottom flow equalization plate.

[0008] Furthermore, a gap space is formed between the side flow equalizer and the inner wall of the inner tank, which is set as a buffer chamber. A gap space is formed between the bottom flow equalizer and the bottom wall of the inner tank, which is set as a displacement fluid chamber. The surfaces of the side flow equalizer and the bottom flow equalizer are covered with a number of guide holes. The buffer chamber and the texturing operation chamber are connected only through the side flow equalizer, and the displacement fluid chamber and the texturing operation chamber are connected only through the bottom flow equalizer.

[0009] Furthermore, the highest point of the side flow equalizer is higher than the highest point of the side wall of the inner tank.

[0010] Furthermore, a bubble-forming network is laid inside the displacement fluid chamber, and nitrogen gas is introduced into the bubble-forming network to form bubbles.

[0011] Furthermore, the circulating temperature control mechanism also includes a suction pipe and a return pipe. One end of the suction pipe is connected to the displacement fluid chamber, and the other end is connected to the inlet of the circulating pump. One end of the return pipe is connected to the outlet of the circulating pump, and the other end is connected to the return fluid chamber. The circulating pump is integrated with a cooler.

[0012] Furthermore, the liquid level in the reflux chamber is higher than the liquid level in the inner tank.

[0013] Furthermore, the temperature of the texturing liquid in the texturing operation chamber is controlled at 20±2℃.

[0014] The beneficial effects of this utility model are:

[0015] This invention employs an inner and outer tank design. The circulating flow of the texturing solution between the inner and outer tanks meets the low-temperature control requirements of the texturing solution. This invention has a flow equalization plate assembly installed in the inner tank. The silicon wafer is produced in the texturing operation chamber inside the flow equalization plate assembly. The flow equalization plate assembly can buffer and equalize the backflow of the low-temperature texturing solution, providing a stable texturing solution flow environment for the silicon wafer. This invention can well meet the production requirements of inverted pyramid textured surfaces. Attached Figure Description

[0016] Figure 1 This is a cross-sectional structural schematic diagram of a low-temperature texturing tank device in this embodiment.

[0017] Reference numerals: Outer tank 1, Inner tank 2, Return liquid chamber 3, Flow equalizer assembly 4, Side flow equalizer 41, Guide hole 411, Bottom flow equalizer 42, Buffer chamber 43, Displacement liquid chamber 44, Bubbling pipe network 45, Texturing operation chamber 5, Circulation temperature control mechanism 6, Circulation pump 61, Cooler 611, Suction pipe 62, Return pipe 63. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] like Figure 1 The illustrated low-temperature texturing tank device includes an outer tank 1, an inner tank 2, and a circulating temperature control mechanism 6. Figure 1 This is a cross-sectional view of a low-temperature texturing tank device. The texturing tank is generally rectangular in shape. An inner tank 2 is fixedly installed inside an outer tank 1. A reflux chamber 3 is formed between the outer tank 1 and the inner tank 2. A flow equalization plate assembly 4 is fixedly installed inside the inner tank 2. A texturing working chamber 5 is formed inside the flow equalization plate assembly 4. Both the inner tank 2 and the reflux chamber 3 are filled with texturing liquid. The silicon wafer product completes the inverted pyramid texture preparation in the texturing working chamber 5. The circulating temperature control mechanism 6 includes a circulating pump 61. The inlet pipe of the circulating pump 61 is connected to the inner tank 2, and the outlet pipe of the circulating pump 61 is connected to the outer tank 1. The circulating pump 61 forms a circulating flow of the texturing liquid. The texturing liquid in the inner tank 2 is circulated by the circulating pump 61. 1. The texturing liquid is drawn into the return liquid chamber 3 and naturally overflows into the inner tank 2. The circulation pump 61 of this utility model is integrated with a cooler 611 (the circulation pump 61 with integrated cooler 611 is a commercially available product and its structure is not described in the existing technology). The cooler 611 can cool down the texturing liquid drawn out of the inner tank 2, and then the cooled texturing liquid flows back into the inner tank 2, thereby maintaining the temperature of the working area of ​​the inner tank 2. The working area of ​​the inner tank 2 is also the texturing working chamber 5 area. The temperature of the texturing liquid in the texturing working chamber 5 is controlled at 20±2℃, thereby meeting the low-temperature environment required for silicon wafer products to complete the inverted pyramid texture preparation.

[0020] In this invention, the texturing liquid in the reflux chamber 3 overflows into the inner tank 2. Therefore, the highest point of the side wall of the outer tank 1 is set higher than the highest point of the side wall of the inner tank 2. As the level of the texturing liquid in the reflux chamber 3 rises (due to the replenishment of cooled texturing liquid), the texturing liquid in the reflux chamber 3 can overflow into the inner tank 2. Before texturing begins, the liquid level in the inner tank 2 is lower than the liquid level in the reflux chamber 3.

[0021] During the texturing process, the flow stability of the liquid around the product needs to be maintained. Therefore, this utility model designs a flow equalization plate assembly 4 structure, which includes two side flow equalization plates 41 and a bottom flow equalization plate 42. The two side flow equalization plates 41 are symmetrically and vertically installed inside the inner tank 2, and the bottom flow equalization plate 42 is installed horizontally. The left and right sides of the bottom flow equalization plate 42 are respectively connected to the two side flow equalization plates 41. A gap space is formed between the side flow equalization plates 41 and the inner wall of the inner tank 2. This gap space is set as a buffer chamber 43. A gap space is formed between the bottom flow equalization plate 42 and the bottom wall of the inner tank 2. This gap space is set as a displacement liquid chamber 44. The surfaces of the side flow equalization plates 41 and the bottom flow equalization plate 42 are covered with a number of guide holes 411. The buffer chamber 43 and the texturing working chamber 5 are connected only through the side flow equalization plates 41, and the displacement liquid chamber 44 and the texturing working chamber 5 are connected only through the bottom flow equalization plate 42. Figure 1 As indicated by the arrow, after the texturing liquid level in the reflux chamber 3 rises, it overflows into the inner tank 2, first entering the buffer chamber 43, and then entering the texturing working chamber 5 through the side flow equalizer 41. To ensure that the overflowing texturing liquid first enters the buffer chamber 43, this invention sets the highest point of the side flow equalizer 41 higher than the highest point of the side wall of the inner tank 2. The advantage of the overflowing texturing liquid entering the buffer chamber 43 first is that the liquid impact caused by the overflowing texturing liquid acts on the buffer chamber 43, but not on the texturing working chamber 5, so the position of the product is not affected. However, if the texturing liquid in the buffer chamber 43 wants to enter the texturing working chamber 5, it must pass through the guide holes 411 of the side flow equalizer 41. The densely arranged guide holes... The flow holes 411 serve both as a connector and to ensure uniform flow of the texturing solution, guaranteeing stable liquid flow within the texturing chamber 5. This invention incorporates a bubble network 45 within the displacement fluid chamber 44. Nitrogen gas is introduced into the bubble network 45 to create bubbles, creating a bubbling effect. Bubbling influences the silicon wafer product, promoting the reaction, improving the texture quality, and optimizing the reaction rate. Due to the obstruction of the bottom flow equalizer 42, the large flow disturbances caused by bubbling only exist within the displacement fluid chamber 44. The texturing solution maintains a stable flow even after passing through the guide holes 411 of the bottom flow equalizer 42. Bubbling also helps accelerate the flow of the texturing solution around the product, where the temperature rises fastest; accelerated flow ensures effective temperature control.

[0022] In this invention, the circulating temperature control mechanism 6 further includes a suction pipe 62 and a return pipe 63. One end of the suction pipe 62 is connected to the displacement liquid chamber 44, and the other end is connected to the inlet end of the circulating pump 61. One end of the return pipe 63 is connected to the outlet end of the circulating pump 61, and the other end is connected to the return liquid chamber 3. The return suction of the texturing liquid starts from the displacement liquid chamber 44, and after arriving at the circulating pump 61, it is cooled by the cooler 611 integrated in the circulating pump 61. Then, it is pumped to the return liquid chamber 3. After the liquid level in the return liquid chamber 3 rises, it overflows into the buffer chamber 43. The texturing liquid in the buffer chamber 43 is replenished back to the texturing working chamber 5 through the side flow equalization plate 41. This forms a circulating flow path for the texturing liquid. In this path, the low-temperature texturing liquid is continuously replenished back to the texturing working chamber 5 to ensure that the temperature of the texturing liquid in the texturing working chamber 5 is controlled at 20±2℃.

[0023] This invention employs a circulating cooling flow mode for the texturing liquid to achieve stable temperature control within the texturing chamber 5, maintaining it at a low temperature of 20±2℃. Furthermore, the invention utilizes the design and installation of an inner and outer tank assembly and a flow equalization plate combination 4 to ensure smooth liquid flow within the texturing chamber 5, providing a stable texturing liquid flow environment for silicon wafer products. This invention effectively meets the requirements for creating inverted pyramid textured surfaces.

[0024] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A low-temperature texturing tank device, characterized in that, The device includes an outer tank (1), an inner tank (2), and a circulating temperature control mechanism (6). The inner tank (2) is fixedly installed inside the outer tank (1). A reflux chamber (3) is formed between the outer tank (1) and the inner tank (2). A flow equalization plate assembly (4) is fixedly installed inside the inner tank (2). A texturing operation chamber (5) is formed inside the flow equalization plate assembly (4). Both the inner tank (2) and the reflux chamber (3) are filled with texturing liquid. The circulating temperature control mechanism (6) includes a circulating pump (61). The inlet pipe of the circulating pump (61) is connected to the inner tank (2), and the outlet pipe of the circulating pump (61) is connected to the outer tank (1).

2. The low-temperature texturing tank device according to claim 1, characterized in that, The height of the highest point of the side wall of the outer groove (1) is higher than the height of the highest point of the side wall of the inner groove (2).

3. The low-temperature texturing tank apparatus according to claim 1, characterized in that, The flow equalizer assembly (4) includes two side flow equalizers (41) and a bottom flow equalizer (42). The two side flow equalizers (41) are symmetrically and vertically installed inside the inner tank (2). The bottom flow equalizer (42) is installed horizontally. The two side flow equalizers (41) are connected to the left and right sides of the bottom flow equalizer (42).

4. The low-temperature texturing tank device according to claim 3, characterized in that, A gap space is formed between the side flow equalizer (41) and the inner wall of the inner tank (2), and this gap space is set as a buffer chamber (43). A gap space is formed between the bottom flow equalizer (42) and the bottom wall of the inner tank (2), and this gap space is set as a displacement fluid chamber (44). The side flow equalizer (41) and the bottom flow equalizer (42) are covered with a number of guide holes (411). The buffer chamber (43) and the texturing operation chamber (5) are connected only through the side flow equalizer (41), and the displacement fluid chamber (44) and the texturing operation chamber (5) are connected only through the bottom flow equalizer (42).

5. The low-temperature texturing tank apparatus according to claim 3, characterized in that, The highest point of the side flow equalizer (41) is higher than the highest point of the side wall of the inner tank (2).

6. The low-temperature texturing tank apparatus according to claim 4, characterized in that, The displacement fluid chamber (44) is lined with a bubble network (45), which forms bubbles by introducing nitrogen gas.

7. The low-temperature texturing tank apparatus according to claim 4, characterized in that, The circulating temperature control mechanism (6) also includes a suction pipe (62) and a return pipe (63). One end of the suction pipe (62) is connected to the displacement liquid chamber (44), and the other end is connected to the inlet end of the circulating pump (61). One end of the return pipe (63) is connected to the outlet end of the circulating pump (61), and the other end is connected to the return liquid chamber (3). The circulating pump (61) is integrated with a cooler (611).

8. The low-temperature texturing tank apparatus according to claim 1, characterized in that, The liquid level in the reflux chamber (3) is higher than the liquid level in the inner tank (2).

9. The low-temperature texturing tank apparatus according to claim 1, characterized in that, The temperature of the texturing liquid in the texturing operation chamber (5) is controlled at 20±2℃.

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