A high-strength polished stainless steel tube for semiconductors

Abstract

This utility model relates to the field of stainless steel pipe technology, and more particularly to a high-strength polished stainless steel pipe for semiconductors. The technical solution includes a protective outer pipe and a stainless steel inner pipe. The protective outer pipe is attached to the outer surface of the stainless steel inner pipe. The inner wall of the protective outer pipe is provided with a plurality of reinforcing ribs arranged in a ring array at equal intervals, and a foamed adhesive layer is provided between each adjacent reinforcing rib. This utility model can protect the stainless steel pipe for semiconductors, preventing dents when subjected to external impacts, ensuring the normal transport of fluids inside the pipe, and also providing heat insulation and sound insulation for the stainless steel pipe.

Description

Technical Field

[0001] This utility model relates to the field of stainless steel pipe technology, specifically to a high-strength polished stainless steel pipe for semiconductors. Background Technology

[0002] Polished stainless steel tubing for semiconductors is a special type of tubing developed specifically for the semiconductor manufacturing industry. Made from high-quality stainless steel raw materials, it undergoes high-precision cold drawing, welding, and special heat treatment processes. The inner wall is polished using electrochemical or mechanical polishing techniques to achieve extremely high surface finish (roughness Ra≤0.2μm), effectively reducing particle adsorption and fluid resistance. Simultaneously, this tubing possesses high purity and excellent corrosion resistance, capable of withstanding the high temperatures, high pressures, and highly corrosive chemical media in semiconductor manufacturing processes. It ensures the contamination-free transport of ultrapure water, specialty gases, and chemicals, serving as a core component of vacuum systems and high-purity material transport systems in critical process equipment such as photolithography, etching, and coating. This provides reliable assurance for the high-precision, high-yield production of semiconductor products.

[0003] Currently, polished stainless steel tubes for semiconductors are prone to dents when subjected to external impacts, which can lead to deformation of the internal flow channel cross-section, resulting in increased fluid resistance, uneven flow, and even localized turbulence. This is especially problematic when conveying semiconductor process media such as ultrapure water and specialty gases, as it can cause unstable material transport or pressure fluctuations. Furthermore, the damaged metal lattice structure at the dented area can lead to stress concentration and potentially induce microcracks, reducing the tube's strength and corrosion resistance. In high-pressure or corrosive environments, this increases the risk of leakage. Therefore, we propose a high-strength polished stainless steel tube for semiconductors. Utility Model Content

[0004] The purpose of this invention is to provide a high-strength polished stainless steel tube for semiconductors. This tube protects the stainless steel tube from dents caused by external impacts, ensuring normal fluid transport within the pipe. It also provides insulation and soundproofing. This invention solves the problem that current polished stainless steel tubes for semiconductors are prone to denting when subjected to impacts, leading to deformation of the internal flow channel cross-section, increased fluid resistance, uneven flow, and even localized turbulence. This is particularly problematic when transporting semiconductor process media such as ultrapure water and special gases, easily causing unstable material transport or pressure fluctuations. Furthermore, the dented area damages the metal lattice structure, and stress concentration may induce microcracks, reducing the tube's strength and corrosion resistance, and increasing the risk of leakage in high-pressure or corrosive environments.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-strength polished stainless steel tube for semiconductors, comprising a protective outer tube and a stainless steel inner tube, wherein the protective outer tube is connected to the outer surface of the stainless steel inner tube, and the inner wall of the protective outer tube is provided with a plurality of reinforcing ribs arranged in a ring array at equal intervals, and a foaming adhesive layer is provided between two adjacent reinforcing ribs.

[0006] Preferably, the outer surface of the stainless steel inner tube is provided with a plurality of raised strips arranged in a ring array at equal intervals, and each of the raised strips is located between two adjacent reinforcing ribs. The raised strips can enhance the strength of the stainless steel inner tube itself to improve its bending resistance. At the same time, the raised strips are inserted into the foam layer and play a limiting role in the foam layer.

[0007] Preferably, the outer surface of the protective outer tube is provided with a buffer adhesive layer, which can play a buffering role when the protective outer tube is subjected to external impact, effectively preventing damage to the protective outer tube.

[0008] Preferably, the outer surface of the buffer layer is provided with a wear-resistant coating. The wear-resistant coating can improve the wear resistance of the buffer layer surface, effectively prevent wear on the surface of the buffer layer, and also isolate the buffer layer from the air, effectively delaying the aging of the buffer layer.

[0009] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0010] 1. This utility model, by setting up a stainless steel inner tube, a protective outer tube, reinforcing ribs, and a foam layer, achieves the function of protecting the stainless steel tube for semiconductors, preventing it from denting when subjected to external impacts, ensuring the normal transport of fluid inside the pipe, and also providing heat insulation and sound insulation for the stainless steel tube. Before the stainless steel inner tube is subjected to external impact, the external impact will first act on the protective outer tube. At the same time, the reinforcing ribs improve the structural strength of the protective outer tube, which can effectively prevent the impact from acting on the stainless steel inner tube and causing it to dent. The foam layer can also provide sound insulation and heat insulation for the stainless steel inner tube.

[0011] 2. By setting the raised strip, this utility model can enhance the strength of the stainless steel inner tube itself, thereby improving its bending resistance. At the same time, the raised strip is inserted into the foam layer, which plays a limiting role in the foam layer.

[0012] 3. By setting a buffer adhesive layer, this utility model can play a buffering role when the outer tube is subjected to external impact, effectively preventing damage to the outer tube. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0014] Figure 2This is a partial three-dimensional structural diagram of the stainless steel inner tube of this utility model;

[0015] Figure 3 This is a schematic diagram of a partial three-dimensional structure of the outer protective tube of this utility model.

[0016] Reference numerals: 1. Buffer layer; 2. Protective outer tube; 3. Foam layer; 4. Stainless steel inner tube; 5. Raised strip; 6. Reinforcing rib; 7. Wear-resistant coating. Detailed Implementation

[0017] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0018] Example 1

[0019] like Figures 1-3 As shown, this utility model proposes a high-strength polished stainless steel tube for semiconductors, comprising a protective outer tube 2 and a stainless steel inner tube 4. The inner wall of the stainless steel inner tube 4 is polished to achieve extremely high smoothness through electrochemical or mechanical polishing technology, which can effectively reduce particle adsorption and fluid resistance. The protective outer tube 2 is attached to the outer surface of the stainless steel inner tube 4. The inner wall of the protective outer tube 2 is provided with a number of reinforcing ribs 6 arranged in a ring array at equal intervals. A foam layer 3 is provided between each two adjacent reinforcing ribs 6. The outer surface of the stainless steel inner tube 4 is provided with a number of protruding strips 5 arranged in a ring array at equal intervals, and each protruding strip 5 is located between two adjacent reinforcing ribs 6. The protruding strips 5 can enhance the strength of the stainless steel inner tube 4 itself to improve its bending resistance. At the same time, the protruding strips 5 are inserted into the foam layer 3, which plays a limiting role in the foam layer 3.

[0020] In use, before the stainless steel inner tube 4 is subjected to external impact, the external impact will first act on the protective outer tube 2. At the same time, the reinforcing ribs 6 improve the structural strength of the protective outer tube 2, which can effectively prevent the impact from acting on the stainless steel inner tube 4 and causing it to dent. This will not cause deformation of the internal flow channel cross section of the pipe, ensuring stable material transmission when conveying semiconductor process media such as ultrapure water and special gases. In addition, the foam layer 3 can play a role in sound insulation and heat preservation for the stainless steel inner tube 4.

[0021] Example 2

[0022] like Figure 1 and Figure 3 As shown, the present invention proposes a high-strength polished stainless steel tube for semiconductors. Compared with Embodiment 1, this embodiment further includes a buffer adhesive layer 1 on the outer surface of the outer tube 2, and a wear-resistant coating 7 on the outer surface of the buffer adhesive layer 1. The wear-resistant coating 7 can improve the wear resistance of the surface of the buffer adhesive layer 1, effectively avoid wear on the surface of the buffer adhesive layer 1, and also isolate the buffer adhesive layer 1 from the air, effectively delaying the aging of the buffer adhesive layer 1.

[0023] In this embodiment, the buffer adhesive layer 1 can buffer the outer tube 2 when it is subjected to external impact, effectively preventing damage to the outer tube 2.

[0024] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A high-strength polished stainless steel tube for semiconductors, comprising a protective outer tube (2) and a stainless steel inner tube (4), characterized in that: The outer protective tube (2) is connected to the outer surface of the stainless steel inner tube (4). The inner wall of the outer protective tube (2) is provided with a number of reinforcing ribs (6) arranged in a ring array at equal intervals. A foaming layer (3) is provided between two adjacent reinforcing ribs (6).

2. The high-strength polished stainless steel tube for semiconductors according to claim 1, characterized in that: The outer surface of the stainless steel inner tube (4) is provided with a number of raised strips (5) arranged in a ring array at equal intervals, and each of the raised strips (5) is located between two adjacent reinforcing ribs (6).

3. The high-strength polished stainless steel tube for semiconductors according to claim 1, characterized in that: The outer surface of the protective outer tube (2) is provided with a buffer adhesive layer (1).

4. A high-strength polished stainless steel tube for semiconductors according to claim 3, characterized in that: The outer surface of the buffer adhesive layer (1) is provided with a wear-resistant coating (7).

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