A die-bonded LED chip

Abstract

This invention discloses a die-bonded LED chip, comprising a base, a thermally conductive layer, and a lens. The top of the base is covered with a thermally conductive layer, and the lens is fixedly connected to the top of the thermally conductive layer. The advantages of this invention are: compared to traditional planar structures, the wavy surface provides a larger heat dissipation surface area within the same volume, thus more efficiently absorbing and dissipating the heat generated by the chip. Due to the aforementioned efficient heat dissipation structure and increased heat dissipation area, the heat generated by the chip can be quickly dissipated, significantly reducing the junction temperature of the LED chip. The reduced junction temperature effectively reduces the risk of performance degradation and damage to the chip due to high temperatures, improving the stability and reliability of the LED chip. Under normal operating conditions, a lower junction temperature slows down the aging rate of the chip, reduces light decay, and allows the LED chip to maintain high luminous efficiency and performance for a longer period, reducing the frequency and cost of replacing the LED chip.

Description

Technical Field

[0001] This utility model relates to the field of LED lamp bead technology, and in particular to a die-bonded LED lamp bead. Background Technology

[0002] LED (Light Emitting Diode) chips are widely used in lighting, display backlighting, and many other fields due to their high luminous efficacy, long lifespan, energy efficiency, and environmental friendliness. In the structure of an LED chip, the chip is its light-emitting core, but it generates a significant amount of heat when powered on. If this heat cannot be dissipated effectively and promptly, the chip junction temperature will rise, leading to a series of problems such as luminous efficacy degradation (light decay), color temperature drift, decreased reliability, and even a significantly shortened lifespan. Therefore, heat dissipation performance is one of the key factors determining the performance and lifespan of LED chips.

[0003] In existing die-attach surface-mount LED chip designs, heat dissipation primarily relies on the die-attach material (such as conductive silver paste) beneath the chip to conduct heat to the support or base, and then dissipate it to the external environment. For example, a common structure includes a base, a reflector cup mounted on the base, a chip die-attached within the reflector cup, and a lens integrated with the base to encapsulate the chip. To improve heat dissipation, some designs use metal materials or introduce specialized thermal pads or thermal grease in the base. However, these traditional structures have significant shortcomings: firstly, their heat dissipation path is relatively simple, with heat mainly conducted vertically downwards, resulting in weak lateral and upward heat dissipation capabilities; secondly, the lens typically only serves for light transmission and protection, hardly participating in active heat dissipation, leading to a bottleneck in heat dissipation efficiency. Therefore, a die-attach surface-mount LED chip is proposed to address these issues. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to propose a die-bonded LED bead to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.

[0006] To achieve the above objectives, one embodiment of the present invention provides a die-bonded LED chip, including a base, a thermally conductive layer, and a lens. The top of the base is covered with a thermally conductive layer, and the lens is fixedly connected to the top of the thermally conductive layer. An anode and a cathode are connected to the base, and a reflector cup is fixedly connected to the top of the cathode; The reflector cup is conical, with its tip pointing downwards; A chip is fixedly connected to the inner side of the reflector cup, and the chip is connected to the top of the anode by a gold wire. The inner wall of the lens is partially covered with an inner layer, and the bottom of the inner layer is in contact with a heat-conducting layer. The outer wall of the lens is partially covered with an outer layer, the bottom of which contacts a heat-conducting layer, and the outer surfaces of the inner and outer layers are wavy.

[0007] Preferably, in any of the above solutions, the base is made of plastic, and the heat-conducting layer is specifically a silicone layer.

[0008] Using the above technical solution: When the die-bonded LED chip is working, current is input through the anode and cathode, causing the chip to emit light. During operation, the chip generates heat. This heat is first absorbed by the inner layer, which partially covers the inner wall of the lens. The bottom of the inner layer contacts the heat-conducting layer, allowing for rapid heat transfer. Simultaneously, the outer layer, which partially covers the outer wall of the lens, also contacts the heat-conducting layer at its bottom, working in conjunction with the inner layer to make the lens an effective heat dissipation path. The heat generated by the chip is not only conducted downwards through the heat-conducting layer but also dissipated laterally through the outer layer. Furthermore, the wavy outer surfaces of the inner and outer layers significantly increase the heat absorption and dissipation area, enabling more efficient absorption and dissipation of heat generated by the chip, significantly reducing the junction temperature of the LED chip, and thus extending its lifespan.

[0009] Preferably, of any of the above embodiments, the lens is made of epoxy resin, and the upper part of the lens is bowl-shaped.

[0010] Preferably, in any of the above embodiments, the anode is located on one side of the cathode, and the chip is bonded using conductive silver paste.

[0011] Preferably, the inner and outer layers are composite layers of a thick electroplated copper layer and an anti-sulfurization transparent coating, and the inner and outer layers are located only on the lower surface of the lens.

[0012] The core design of this LED chip is as follows: By partially creating an inner layer on the inner wall of the lens and partially creating an outer layer on the outer wall, with the bottom of both the inner and outer layers contacting a heat-conducting layer, the lens becomes an effective heat dissipation path. The heat generated by the chip is not only conducted downwards but also dissipated laterally, significantly improving heat dissipation efficiency. The outer surfaces of the inner and outer layers are wavy, a special shape that significantly increases the heat absorption and dissipation area. Compared to traditional planar structures, the wavy surface provides a larger heat dissipation surface area within the same volume, thus more efficiently absorbing and dissipating the heat generated by the chip.

[0013] Thanks to the aforementioned efficient heat dissipation structure and increased heat dissipation area, the heat generated by the chip can be quickly dissipated, significantly reducing the junction temperature of the LED chip. Lower junction temperature effectively reduces the risk of performance degradation and damage caused by high temperatures, improving the stability and reliability of the LED chip. Lower junction temperature directly extends the lifespan of the LED chip. Under normal operating conditions, a lower junction temperature slows down chip aging, reduces light decay, and allows the LED chip to maintain high luminous efficiency and performance for a longer period, reducing the frequency and cost of replacing the LED chip.

[0014] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows: This die-bonded LED chip features an inner layer partially formed on the inner wall of the lens and an outer layer partially formed on the outer wall, with the bottom of both layers contacting a heat-conducting layer. This design makes the lens an effective heat dissipation path. The heat generated by the chip is not only conducted downwards but also dissipated laterally, significantly improving heat dissipation efficiency. The outer surfaces of the inner and outer layers are wavy, a unique shape that significantly increases the heat absorption and dissipation area. Compared to traditional planar structures, the wavy surface provides a larger heat dissipation surface area within the same volume, thus more efficiently absorbing and dissipating the heat generated by the chip.

[0015] Thanks to the aforementioned efficient heat dissipation structure and increased heat dissipation area, the heat generated by the chip can be quickly dissipated, significantly reducing the junction temperature of the LED chip. Lower junction temperature effectively reduces the risk of performance degradation and damage caused by high temperatures, improving the stability and reliability of the LED chip. Lower junction temperature directly extends the lifespan of the LED chip. Under normal operating conditions, a lower junction temperature slows down chip aging, reduces light decay, and allows the LED chip to maintain high luminous efficiency and performance for a longer period, reducing the frequency and cost of replacing the LED chip.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a first-view structural schematic diagram of the present invention; Figure 2 This is a structural schematic diagram of the present invention from a second perspective; Figure 3 This is a schematic diagram of a partial internal structure of the present invention.

[0018] In the diagram: 1-base, 2-thermal conductive layer, 3-lens, 4-anode, 5-cathode, 6-reflector cup, 7-chip, 8-gold wire, 9-inner layer, 10-outer layer. Detailed Implementation

[0019] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0020] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0021] like Figure 1-3 As shown, this die-bonded LED chip includes a base 1, a thermally conductive layer 2, and a lens 3. The top of the base 1 is covered with a thermally conductive layer 2, and the lens 3 is fixedly connected to the top of the thermally conductive layer 2. An anode 4 and a cathode 5 are connected to the base 1, and a reflector cup 6 is fixedly connected to the top of the cathode 5; The reflector cup 6 is conical, with its tip pointing downwards; A chip 7 is fixedly connected to the inside of the reflector cup 6, and the chip 7 is connected to the top of the anode 4 by a gold wire 8. The inner wall of lens 3 is partially covered by an inner layer 9, and the bottom of the inner layer 9 contacts the heat-conducting layer 2; The outer wall of lens 3 is partially covered by an outer layer 10, the bottom of which contacts the heat-conducting layer 2, and the outer surfaces of the inner layer 9 and the outer layer 10 are wavy.

[0022] Example 1: The base 1 is made of plastic, and the heat-conducting layer 2 is specifically a silicone layer. The lens 3 is made of epoxy resin, and the upper part of the lens 3 is bowl-shaped. The anode 4 is located on one side of the cathode 5, and the chip 7 is bonded using conductive silver paste. The inner layer 9 and the outer layer 10 are specifically a composite layer of electroplated thick copper layer and anti-sulfurization transparent coating, and the inner layer 9 and the outer layer 10 are only located on the lower surface of the lens 3.

[0023] Example 2: When the LED chip of this die-bonded surface mount is working, current is input through the anode 4 and cathode 5, energizing the chip 7 to emit light. During operation, the chip 7 generates heat. This heat is first absorbed by the inner layer 9, which partially covers the inner wall of the lens 3. The bottom of the inner layer 9 contacts the heat-conducting layer 2, allowing for rapid transfer of the absorbed heat. Simultaneously, the outer layer 10, which partially covers the outer wall of the lens 3, also contacts the heat-conducting layer 2 at its bottom, working in conjunction with the inner layer 9 to make the lens 3 an effective heat dissipation path. The heat generated by the chip 7 is not only conducted downwards through the heat-conducting layer 2 but also dissipated laterally through the outer layer 10. Furthermore, the outer surfaces of the inner layer 9 and the outer layer 10 are wavy, which significantly increases the heat absorption and dissipation area, enabling more efficient absorption and dissipation of the heat generated by the chip 7, significantly reducing the junction temperature of the LED chip, and thus extending the lifespan of the LED chip.

[0024] The working principle of this utility model is as follows: The base 1 of this LED bead is made of plastic, which has advantages such as low cost and good insulation. The top of the base 1 is covered with a heat-conducting layer 2, which is specifically a silicone layer. Silicone has good thermal conductivity and flexibility, which allows it to fit tightly onto the base 1 and make good contact with the lens 3, so as to achieve effective heat conduction.

[0025] An anode 4 and a cathode 5 are mounted on the base 1, with the anode 4 located to one side of the cathode 5 for easy circuit connection and layout. A reflector cup 6 is fixedly connected to the top of the cathode 5. The reflector cup 6 is conical with its tip pointing downwards. This structure reflects and focuses the light emitted by the chip 7, improving light utilization. The chip 7 is fixedly connected to the inside of the reflector cup 6. The chip 7 is bonded using conductive silver paste, which has good conductivity and adhesion, ensuring a stable connection and electrical conduction between the chip 7 and the reflector cup 6. The chip 7 is connected to the top of the anode 4 via a gold wire 8, which has excellent conductivity and oxidation resistance, ensuring stable current transmission.

[0026] Lens 3 is made of epoxy resin, which has high transparency, good weather resistance, and chemical stability. The upper part of lens 3 is bowl-shaped, which helps to further shape and diffuse light. The inner wall of lens 3 is partially covered with an inner layer 9, and the outer wall is partially covered with an outer layer 10. The inner layer 9 and the outer layer 10 are specifically a composite layer of electroplated thick copper layer and anti-sulfurization transparent coating. This composite layer has good thermal conductivity and can prevent the effects of sulfidation on lens 3. The inner layer 9 and the outer layer 10 are only located on the lower surface of lens 3, and their bottoms are in contact with the heat-conducting layer 2. The outer surface of the inner layer 9 and the outer layer 10 is wavy, which greatly increases the surface area.

[0027] When the LED bead is connected to the circuit and powered on, current flows through the anode 4 and cathode 5 into the chip 7, causing the chip 7 to emit light. During the light-emitting process, the heat generated by the chip 7 is rapidly absorbed by the inner layer 9, which then transfers the heat to the heat-conducting layer 2. Simultaneously, the outer layer 10, through contact with the heat-conducting layer 2, works in conjunction with the inner layer 9 to dissipate heat to the sides. Due to the wavy structure on the surfaces of the inner layer 9 and the outer layer 10, the heat absorption and dissipation area is increased, allowing heat to dissipate more quickly and effectively reducing the junction temperature of the LED bead.

[0028] Compared with the prior art, the present invention has the following advantages: This die-bonded LED chip features an inner layer 9 partially formed on the inner wall of the lens 3 and an outer layer 10 partially formed on the outer wall. The bottoms of the inner layer 9 and the outer layer 10 contact the heat-conducting layer 2, making the lens 3 an effective heat dissipation path. The heat generated by the chip 7 is not only conducted downwards but also dissipated laterally, significantly improving heat dissipation efficiency. The outer surfaces of the inner layer 9 and the outer layer 10 are wavy, a special shape that significantly increases the heat absorption and dissipation area. Compared to traditional planar structures, the wavy surface provides a larger heat dissipation surface area within the same volume, thus more efficiently absorbing and dissipating the heat generated by the chip 7.

[0029] Thanks to the aforementioned efficient heat dissipation structure and increased heat dissipation area, the heat generated by chip 7 can be quickly dissipated, significantly reducing the junction temperature of the LED chip. This lower junction temperature effectively reduces the risk of performance degradation and damage to chip 7 due to high temperatures, improving the stability and reliability of the LED chip. The reduced junction temperature directly extends the lifespan of the LED chip. Under normal operating conditions, a lower junction temperature slows down the aging process of chip 7, reduces light decay, and allows the LED chip to maintain high luminous efficiency and performance for a longer period, reducing the frequency and cost of replacing the LED chip.

Claims

1. A die-bonded LED chip, characterized in that, It includes a base (1), a heat-conducting layer (2), and a lens (3). The top of the base (1) is covered with a heat-conducting layer (2), and the top of the heat-conducting layer (2) is fixedly connected to the lens (3). An anode (4) and a cathode (5) are connected to the base (1), and a reflector cup (6) is fixedly connected to the top of the cathode (5). The reflector cup (6) is conical, with the tip of the reflector cup (6) pointing downwards; A chip (7) is fixedly connected to the inner side of the reflector cup (6), and the chip (7) is connected to the top of the anode (4) by a gold wire (8); The inner wall of the lens (3) is partially covered with an inner layer (9), and the bottom of the inner layer (9) contacts the heat-conducting layer (2). The outer wall of the lens (3) is partially covered with an outer layer (10), the bottom of the outer layer (10) is in contact with the heat-conducting layer (2), and the outer surfaces of the inner layer (9) and the outer layer (10) are wavy.

2. The die-bonded LED chip as described in claim 1, characterized in that: The base (1) is made of plastic, and the heat-conducting layer (2) is specifically a silicone layer.

3. The die-bonded LED chip as described in claim 2, characterized in that: The lens (3) is made of epoxy resin, and the upper part of the lens (3) is bowl-shaped.

4. The die-bonded LED chip as described in claim 3, characterized in that: The anode (4) is located on one side of the cathode (5), and the chip (7) is bonded using conductive silver paste.

5. The die-bonded LED chip as described in claim 4, characterized in that: The inner layer (9) and outer layer (10) are specifically a composite layer of electroplated thick copper layer and anti-sulfurization transparent coating. The inner layer (9) and outer layer (10) are located only on the lower surface of the lens (3).

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