A heat-dissipating LED chip light source
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-07
- Publication Date
- 2026-08-11
AI Technical Summary
[0003]传统的贴片LED光源安装时,直接将PCB板安装在灯具的内部,当LED运行时,自身会产生热量,热量在灯具的内部堆积,导致灯具温度升高,对灯具的使用寿命造成影响,基于此,提出一种散热型LED贴片光源,用于对光源灯具进行散热
1、该一种散热型LED贴片光源,通过设置内支撑架、卡座、上固定框和散射灯罩,其共同组合成光源外形结构,内支撑架上开设有八个卡槽,进而便于为PCB板和导热板提供安装位置,每个导热板的一侧均安装有多个散热片,同时散射灯罩的底端开设有多个通风孔,卡座的外壁开设有多个出风槽,进而八个PCB板上的贴片LED灯珠通电运行,向外部发射光线,同时自身的温度传导至导热板和散热片上,该光源内部的温度升高,空气受到加热并向上流动,利用烟筒效应,空气从多个通风孔向上流动,并从多个出风槽进行流通,从而便于对PCB板和导热板进行散热降温,保证该光源稳定运行,并有效解决现有技术中所存在的问题。
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Figure CN224622829U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED chip light source technology, and in particular to a heat dissipation type LED chip light source. Background Technology
[0002] Surface mount LEDs, also known as SMD LEDs, are semiconductor light-emitting devices made by soldering LED chips onto a PCB substrate and encapsulating them in epoxy resin. They are characterized by their small size and light weight, and can be efficiently mounted on circuit boards using surface mount technology (SMT). They are simple lighting fixtures. Their light-emitting principle involves passing an electric current through a compound semiconductor; through the combination of electrons and holes, excess energy is released as light, achieving the effect of emitting light.
[0003] Traditionally, when installing surface-mount LED light sources, the PCB board is directly installed inside the lamp. When the LED is running, it generates heat, which accumulates inside the lamp, causing the lamp temperature to rise and affecting the lamp's lifespan. Based on this, a heat-dissipating surface-mount LED light source is proposed to dissipate heat from the light source and lamp. Utility Model Content
[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a heat-dissipating LED patch light source, which effectively solves the deficiencies of the prior art.
[0005] To achieve the above objectives, one embodiment of the present invention provides a heat-dissipating LED patch light source, including an inner support frame and a card holder. Eight card slots are provided at the edge of the inner support frame, and each of the eight slots has a PCB board with patch LED beads and a heat-conducting plate slidably installed inside. Each of the eight heat-conducting plates has multiple heat sinks installed on the side near the axis of the inner support frame. A diffuser lamp cover is fixedly connected to the outer wall of the inner support frame. The diffuser lamp cover has multiple ventilation holes on its bottom surface near the multiple heat sinks. An upper fixing frame is fixedly connected to the top of the inner support frame. Multiple buckles are installed in the middle of the top surface of the upper fixing frame. An annular clip that engages with the multiple buckles is installed at the bottom of the inner wall of the card holder. Multiple air outlet slots are opened at the top of the outer wall of the card holder.
[0006] Preferably, in any of the above embodiments, the bottom of the inner support frame is octagonal in shape, and a hollow frame is provided in the middle of the inner support frame. Two mounting tubes are installed on the side of the hollow frame near each heat-conducting plate and on the side of each heat-conducting plate. A spring is installed between the two mounting tubes at the collinear positions. In this embodiment, the inner support frame, the upper fixing frame, and the hollow frame are all made of engineering plastic. The hollow frame adopts a hollow design, which facilitates its installation together with the PCB board and the heat-conducting plate into the interior of the inner support frame. The spring facilitates the application of pressure to the heat-conducting plate. The heat-conducting plate is made of metal, which will deform when heated. The spring facilitates the pushing of the middle of the heat-conducting plate, reducing the gap between the heat-conducting plate and the PVB board, and achieving efficient heat conduction through the heat-conducting layer.
[0007] Preferably, in any of the above embodiments, multiple surface-mount LEDs are mounted on the PCB board by soldering. A thermally conductive layer is provided between the PCB board and the heat-conducting plate. In this embodiment, the PCB board is made of aluminum substrate, and an insulating layer and a circuit layer are sequentially provided on the side away from the heat-conducting plate. The surface-mount LEDs are soldered to the circuit layer. The thermally conductive layer is made of thermally conductive silicone grease, which facilitates filling the gap between the PCB board and the heat-conducting plate, allowing heat to be conducted in the direction of the heat-conducting plate, reducing the temperature of the PCB board, and ensuring stable operation of the light source.
[0008] Preferably, in any of the above solutions, the outer diameter of the diffuser lampshade is the same as the outer diameter of the bottom of the card holder, and the top of the diffuser lampshade is fixedly connected to the bottom of the card holder by adhesive. This solution facilitates a smooth transition between the contact position of the card holder and the diffuser lampshade. During installation, adhesive is applied to the bottom of the card holder, and then the diffuser lampshade is pushed upward so that the end of the diffuser lampshade contacts the bottom of the card holder. After the adhesive cures, the two are fixedly connected. The diffuser lampshade facilitates the scattering of light to the surroundings, making the overall lighting more uniform.
[0009] Preferably, in any of the above solutions, the upper fixing frame adopts a hollow structure, and the edge of the upper fixing frame is fixedly connected to the top of the inner support frame by laser welding. In this solution, the hollow structure of the upper fixing frame can reduce the amount of material used while ensuring mechanical strength, and facilitates the later use of laser welding to fix it to the top of the inner support frame. Multiple buckles located at the top of the upper fixing frame are engaged with the annular locking strip, thereby facilitating the stable connection between the card seat and the inner support frame, while confining the drive circuit board inside the card seat.
[0010] Preferably, in any of the above solutions, a drive circuit board is provided between the top of the multiple buckles and the inner wall of the card holder. The multiple PCBs are electrically connected to the drive circuit board through wires. In this solution, the E27 metal screw on the card holder is electrically connected to the drive circuit board through two wires to achieve circuit connection. At the same time, the drive circuit board converts AC power into DC power to provide driving voltage for the multiple PCBs, so that the multiple surface-mount LED beads are powered on and emit light. The multiple surface-mount LED beads are installed in series on the output port of the drive circuit board.
[0011] This utility model has the following advantages: 1. This heat-dissipating LED patch light source, by setting an inner support frame, a mounting bracket, an upper fixing frame, and a diffuser lamp cover, together form the light source's external structure. The inner support frame has eight slots to facilitate the installation of PCB boards and heat-conducting plates. Each heat-conducting plate has multiple heat sinks installed on one side. At the same time, the bottom of the diffuser lamp cover has multiple ventilation holes, and the outer wall of the mounting bracket has multiple air outlet slots. When the patch LEDs on the eight PCB boards are powered on, they emit light to the outside. Simultaneously, their own heat is conducted to the heat-conducting plates and heat sinks, increasing the internal temperature of the light source. The air is heated and flows upward. Utilizing the chimney effect, the air flows upward through the multiple ventilation holes and circulates through the multiple air outlet slots, thereby facilitating heat dissipation and cooling of the PCB boards and heat-conducting plates, ensuring stable operation of the light source, and effectively solving the problems existing in the prior art.
[0012] 2. This heat dissipation type LED patch light source, by setting an upper fixed frame, is fixedly connected to the top of the inner support frame. At the same time, multiple buckles on the top surface of the upper fixed frame are engaged with the annular clips on the inner wall of the card holder, thereby facilitating the stable connection of the card holder to the inner support frame through the upper fixed frame. By setting a hollow frame, two springs are respectively set between it and each heat conduction plate, which facilitates the pushing of the middle part of the heat conduction plate, so that the side of the heat conduction plate is stably attached to the side of the PCB board, avoiding deformation of the heat conduction plate due to temperature rise. Attached Figure Description
[0013] Figure 1 This is a first-view structural diagram of the entire utility model; Figure 2 This is a cross-sectional view of the overall structure of this utility model; Figure 3 This is a second-view structural diagram of the entire utility model; Figure 4 This is a schematic diagram of the exploded structure of this utility model; Figure 5 This is a schematic diagram of the card holder structure of this utility model; Figure 6This is a schematic diagram of the internal support frame structure of this utility model; Figure 7 This is a schematic diagram of the heat-conducting plate structure of this utility model; Figure 8 This is an exploded structural diagram of the heat-conducting plate and hollow frame of this utility model.
[0014] In the diagram: 1-Card holder, 2-Air outlet slot, 3-Diffuse lamp cover, 4-Upper fixing frame, 5-Drive circuit board, 6-Ring clip, 7-Heat conduction plate, 8-PCB board, 9-Spring, 10-Hollow frame, 11-Inner support frame, 12-Snap fastener, 13-Ventilation hole, 14-Heat sink, 15-Card slot, 16-Mounting tube. Detailed Implementation
[0015] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited to the following description.
[0016] like Figures 1 to 8 As shown, a heat-dissipating LED patch light source includes an inner support frame 11 and a mounting bracket 1. The top of the mounting bracket 1 is equipped with an E27 metal screw for easy threaded connection with an external lamp holder and establishment of a circuit connection. Eight slots 15 are provided on the edge of the inner support frame 11, and each of the eight slots has a PCB board 8 with patch LED beads and a heat-conducting plate 7 slidably installed inside. Multiple heat sinks 14 are installed on the side of the eight heat-conducting plates 7 near the axis of the inner support frame 11.
[0017] The inner support frame 11 is fixedly connected to the outer wall of a diffused light cover 3. The diffused light cover 3 has multiple ventilation holes 13 on the bottom surface near the multiple heat sinks 14. The top of the inner support frame 11 is fixedly connected to an upper fixed frame 4. Multiple buckles 12 are installed in the middle of the top surface of the upper fixed frame 4. The bottom of the inner wall of the card seat 1 is equipped with an annular clip 6 that engages with the multiple buckles 12. The top of the card seat 1 near the E27 metal screw hole has multiple air outlet slots 2. The multiple air outlet slots 2 are arranged in a circular array around the axis of the card seat 1.
[0018] A gap is left between the inner wall of the diffused lamp cover 3 and each PCB board 8 to allow air to flow from bottom to top and dissipate heat from the PCB board 8.
[0019] The bottom of the inner support frame 11 is octagonal in shape. A hollow frame 10 is provided in the middle of the inner support frame 11. Two mounting tubes 16 are installed on the side of the hollow frame 10 near each heat-conducting plate 7 and on the side of each heat-conducting plate 7. A spring 9 is installed between the two mounting tubes 16 at the collinear position. As an optional technical solution of this utility model, the inner support frame 11, the upper fixing frame 4 and the hollow frame 10 are all made of engineering plastic. The hollow frame 10 adopts a hollow design, which facilitates its installation together with the PCB board 8 and the heat-conducting plate 7 into the interior of the inner support frame 11. The spring 9 facilitates the pressure on the heat-conducting plate 7. The heat-conducting plate 7 is made of metal and will deform when heated. The spring 9 facilitates the pushing of the middle of the heat-conducting plate 7, reducing the gap between the heat-conducting plate 7 and the PVB board 8, and achieving efficient heat conduction through the heat-conducting layer.
[0020] Multiple surface-mount LED beads are mounted on the PCB board 8 by soldering. A heat-conducting layer is provided between the PCB board 8 and the heat-conducting plate 7. As an optional technical solution of this utility model, the PCB board 8 is made of aluminum substrate, and an insulating layer and a circuit layer are arranged sequentially on the side away from the heat-conducting plate 7. The surface-mount LEDs are soldered to the circuit layer. The heat-conducting layer is made of thermal grease, which can easily fill the gap between the PCB board 8 and the heat-conducting plate 7, so that heat can be conducted in the direction of the heat-conducting plate 7, reducing the temperature of the PCB board 8 and making the light source operate stably.
[0021] The outer diameter of the diffused light cover 3 is the same as the outer diameter of the bottom end of the card holder 1. The top end of the diffused light cover 3 is fixedly connected to the bottom end of the card holder 1 by adhesive. As an optional technical solution of this utility model, this facilitates a smooth transition between the contact position of the card holder 1 and the diffused light cover 3. During installation, the adhesive is applied to the bottom end of the card holder 1, and then the diffused light cover 3 is pushed upward so that the end of the diffused light cover 3 contacts the bottom end of the card holder 1. After the adhesive cures, the two are fixedly connected. The diffused light cover 3 facilitates the scattering of light to the surroundings, making the overall lighting more uniform.
[0022] The upper fixing frame 4 adopts a hollow structure. The edge of the upper fixing frame 4 is fixedly connected to the top of the inner support frame 11 by laser welding. As an optional technical solution of this utility model, the hollow structure of the upper fixing frame 4 can reduce the amount of material used while ensuring mechanical strength, and facilitates the later use of laser welding to fix it to the top of the inner support frame 11. Multiple buckles 12 located at the top of the upper fixing frame 4 are engaged with the annular clip 6, thereby facilitating the stable connection between the card seat 1 and the inner support frame 11, while confining the drive circuit board 5 inside the card seat 1.
[0023] A drive circuit board 5 is provided between the top of multiple clips 12 and the inner wall of the card holder 1. Multiple PCB boards 8 are electrically connected to the drive circuit board 5 through wires. As an optional technical solution of this utility model, the E27 metal screw on the card holder 1 is electrically connected to the drive circuit board 5 through two wires to realize circuit connection. At the same time, the drive circuit board 5 converts AC power into DC power to provide driving voltage for multiple PCB boards 8, so that multiple surface-mount LED beads are powered on and emit light. Multiple surface-mount LED beads are installed in series on the output port of the drive circuit board 5.
[0024] This heat-dissipating LED chip light source requires the following steps to use: 1) During installation, stack multiple heat-conducting pads 7 with the PCB board 8, and insert the bottom end slightly into the slot 15; 2) Install the springs 9 sequentially inside the adjacent mounting tubes 16, then push the hollow frame 10 and the heat-conducting plate 7 and the PCB board 8 downwards in sync, and push them to the bottom of the slot 15. 3) Fix the top of the upper fixed frame 4 to the top of the inner support frame 11, and electrically connect the PCB board 8, the top metal part of the card holder 1 and the drive circuit board 5 through wires. At the same time, insert the circuit board 5 into the inside of the card holder 1. 4) Press the card holder 1 toward the inner support frame 11 so that the multiple buckles 12 engage with the annular card strip 6 simultaneously; 5) Apply adhesive to the bottom edge of the card holder 1, and finally install the diffused light cover 3, so that the top of the diffused light cover 3 is fixedly connected to the card holder 1 by adhesive.
[0025] In summary, when used by the user, the inner support frame 11, the card holder 1, the upper fixing frame 4, and the diffused lamp cover 3 are combined to form the shape structure of the light source. The inner support frame 11 has eight slots 15, which facilitates the installation of the PCB board 8 and the heat conduction plate 7. Each heat conduction plate 7 has multiple heat sinks 14 installed on one side. At the same time, the bottom of the diffused lamp cover 3 has multiple ventilation holes 13, and the outer wall of the card holder 1 has multiple air outlet slots 2. When the surface-mount LED beads on the eight PCB boards 8 are powered on, they emit light to the outside. At the same time, their own heat is conducted to the heat conduction plate 7 and the heat sinks 14, and the temperature inside the light source rises. The air is heated and flows upward. Utilizing the chimney effect, the air rises from the multiple ventilation holes 13. The airflow is facilitated through multiple air outlets 2, thereby enabling heat dissipation and cooling of the PCB board 8 and heat-conducting plate 7, ensuring stable operation of the light source, and effectively solving the problems existing in the prior art. Furthermore, an upper fixing frame 4 is set and fixedly connected to the top of the inner support frame 11. At the same time, multiple buckles 12 on the top surface of the upper fixing frame 4 are engaged with the annular clips 6 on the inner wall of the card holder 1, thereby facilitating a stable connection between the card holder 1 and the inner support frame 11 through the upper fixing frame 4. By setting a hollow frame 10, two springs 9 are respectively set between it and each heat-conducting plate 7, which facilitates pushing the middle part of the heat-conducting plate 7, so that the side of the heat-conducting plate 7 is stably attached to the side of the PCB board 8, avoiding deformation of the heat-conducting plate 7 due to temperature rise.
[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A heat-dissipating LED chip light source, characterized in that: It includes an inner support frame (11) and a card holder (1). Eight card slots (15) are provided at the edge of the inner support frame (11), and PCB boards (8) with surface-mount LED beads and heat conduction plates (7) are slidably installed inside the eight slots. Multiple heat sinks (14) are installed on the side of the eight heat conduction plates (7) near the axis of the inner support frame (11). The inner support frame (11) is fixedly connected to the outer wall of a diffused lamp cover (3). The diffused lamp cover (3) has multiple ventilation holes (13) on the bottom surface near the multiple heat sinks (14). The top of the inner support frame (11) is fixedly connected to an upper fixed frame (4). Multiple buckles (12) are installed in the middle of the top surface of the upper fixed frame (4). The bottom of the inner wall of the card seat (1) is equipped with an annular clip (6) that engages with the multiple buckles (12). The top of the outer wall of the card seat (1) has multiple air outlet slots (2).
2. The heat-dissipating LED patch light source according to claim 1, characterized in that: The bottom of the inner support frame (11) is octagonal in shape. A hollow frame (10) is provided in the middle of the inner support frame (11). Two mounting tubes (16) are installed on the side of the hollow frame (10) near each heat-conducting plate (7) and on the side of each heat-conducting plate (7). A spring (9) is installed between the two mounting tubes (16) at the collinear position.
3. The heat-dissipating LED patch light source according to claim 2, characterized in that: Multiple surface-mount LED beads are mounted on the PCB board (8) by soldering, and a heat-conducting layer is provided between the PCB board (8) and the heat-conducting plate (7).
4. The heat-dissipating LED patch light source according to claim 3, characterized in that: The outer diameter of the diffuser lamp cover (3) is the same as the outer diameter of the bottom end of the card holder (1), and the top end of the diffuser lamp cover (3) is fixedly connected to the bottom end of the card holder (1) by adhesive.
5. A heat-dissipating LED patch light source according to claim 4, characterized in that: The upper fixing frame (4) adopts a hollow structure, and the edge of the upper fixing frame (4) is fixedly connected to the top of the inner support frame (11) by laser welding.
6. A heat-dissipating LED patch light source according to claim 5, characterized in that: A drive circuit board (5) is provided between the top of the multiple buckles (12) and the inner wall of the card holder (1), and multiple PCB boards (8) are electrically connected to the drive circuit board (5) through wires.