Cooking utensils

Abstract

This application provides a cooking appliance including a base, a coil, and a first fan assembly. The base has a receiving cavity, and the coil is disposed within the receiving cavity. A magnetic sensing component is disposed on the side of the coil facing away from the base. The first fan assembly is disposed within the receiving cavity, located below the coil. Along the axial direction of the coil, the projection of the first fan assembly is within the projection range of the coil. A first air inlet is provided on the base, positioned directly opposite the first fan assembly. The cooking appliance provided by this application can avoid or reduce the melting of the coil, thereby improving the reliability of the cooking appliance.

Description

Technical Field

[0001] This application relates to the field of cooking utensil technology, and more particularly to a cooking utensil. Background Technology

[0002] An induction cooker is a common cooking appliance with advantages such as high heating efficiency, fast heating speed, and safe use. However, its disadvantage is that it can only heat cookware made of ferromagnetic materials and cannot heat ceramic pots, earthenware pots, etc.

[0003] In related technologies, the fusion plate technology is generally used to enable induction cookers to be compatible with all types of cookware. Specifically, a magnetic induction plate is set above the coil. For cookware made of non-ferromagnetic materials that cannot be electromagnetically heated, the coil can generate a magnetic field to heat the magnetic induction plate, and then the magnetic induction plate generates infrared rays to heat the non-ferromagnetic cookware upwards.

[0004] However, due to the high temperature of the magnetic sensing sheet, the existing heat dissipation structure cannot meet the heat dissipation requirements, and the coil is prone to melting, which in turn can affect the reliability of cooking utensils. Utility Model Content

[0005] Based on this, this application provides a cooking appliance that can avoid or reduce the melting of the coil, thereby improving the reliability of the cooking appliance.

[0006] This application provides a cooking appliance, including:

[0007] A base, wherein a receiving cavity is provided on the base;

[0008] A coil disk is disposed within the receiving cavity, and a magnetic sensing component is disposed on the side of the coil disk facing away from the base;

[0009] The first fan assembly is disposed within the receiving cavity and is located below the coil disk along the axial direction of the coil disk. The projection of the first fan assembly is located within the projection range of the coil disk. A first air inlet is provided on the base, and the position of the first air inlet is directly opposite the first fan assembly.

[0010] The cooking appliance provided in this application embodiment has a receiving cavity on the base, in which the coil and the first fan assembly are both disposed, with the first fan assembly located below the coil. In addition, along the axial direction of the coil, the projection of the first fan assembly is located within the projection range of the coil. The base is also provided with a first air inlet, which is positioned directly opposite the first fan assembly. In this way, after the first fan assembly takes in air through the first air inlet, the cold air delivered by the first fan assembly is blown entirely towards the coil along the axial direction of the coil. The cold air directly dissipates heat from the location of the coil, which can better cool the coil and prevent or reduce the melting of the coil, thereby improving the reliability of the cooking appliance.

[0011] In one possible implementation, the receiving cavity is provided with a first receiving groove with an upper opening, at least a portion of the first fan assembly is disposed in the first receiving groove, and the first air inlet is disposed at the bottom of the first receiving groove.

[0012] With this configuration, after the first fan assembly takes in air through the first air inlet on the bottom of the first receiving groove, the cold air delivered by the first fan assembly can be blown onto the coil through the opening at the upper end of the first receiving groove, thereby achieving cooling and heat dissipation of the coil.

[0013] In one possible implementation, a first windbreak rib is also provided inside the receiving cavity. The first windbreak rib is located on the outer periphery of the first receiving groove. One end of the first windbreak rib is connected to the base, and the other end of the first windbreak rib extends toward the coil.

[0014] With this configuration, the end of the first wind deflector that is away from the base extends toward the coil disk. When the first fan assembly supplies air to the coil disk along the axial direction of the coil disk, the first wind deflector located on the outer periphery of the first receiving groove can concentrate the airflow, which helps the air supplied by the first fan assembly to be blown toward the coil disk.

[0015] In one possible implementation, it further includes: a motherboard; the motherboard is disposed within the receiving cavity, and the first windbreak rib has an opening on the side near the motherboard.

[0016] With this configuration, the air delivered by the first fan assembly can be blown onto the motherboard through the opening on the first baffle rib, thereby cooling the motherboard. In other words, the first air delivery assembly can simultaneously cool both the coil and the motherboard.

[0017] In one possible implementation, it further includes: a second fan assembly; the second fan assembly is disposed within the receiving cavity;

[0018] The cavity is provided with a second receiving groove with an upper opening. At least part of the second fan assembly is disposed in the second receiving groove. The bottom of the second receiving groove is provided with a second air inlet. The side wall of the second receiving groove is provided with a first air outlet, which faces the motherboard.

[0019] With this configuration, after the second fan assembly takes in air through the second air inlet on the bottom of the second accommodating slot, the cold air delivered by the second fan assembly can be blown onto the motherboard through the first air outlet on the side wall of the second accommodating slot, thereby achieving cooling and heat dissipation of the motherboard.

[0020] In one possible implementation, it further includes: a windshield cover, which covers the opening of the second receiving groove so that the second fan assembly is located within the space formed by the windshield cover and the second receiving groove.

[0021] With this configuration, the wind deflector can prevent the air delivered by the second fan assembly from flowing out of the second receiving slot through the opening at the top of the second receiving slot. This helps the cool air delivered by the second fan assembly to be blown onto the motherboard through the first air outlet, thereby achieving a better heat dissipation effect on the motherboard.

[0022] In one possible implementation, the first fan assembly is an axial flow fan.

[0023] An axial flow fan refers to a fan that operates in an axial flow manner, where the airflow is in the same direction as the fan blade axis, meaning the airflow is parallel to the fan axis. By setting the first fan assembly as an axial flow fan, it can be ensured that all the air delivered by the first fan assembly is blown axially towards the coil.

[0024] In one possible implementation, the coil disk includes a disk frame and a coil wound on the disk frame, the coil including an inner coil and an outer coil wound coaxially, the upper surface of the outer coil being higher than the upper surface of the inner coil;

[0025] The magnetic sensing component is located above the inner coil and is located radially inside the outer coil;

[0026] The tray frame is provided with air passage holes, which pass through the tray frame along the axial direction of the coil.

[0027] With this configuration, the magnetic sensing component is positioned above the inner coil, which generates an alternating magnetic field below the magnetic sensing component. The magnetic sensing component is positioned radially inside the outer coil, which generates an alternating magnetic field on the outer periphery of the magnetic sensing component. The magnetic fields of the inner and outer coils work together on the magnetic sensing component, resulting in more uniform heat generation in all parts of the magnetic sensing component. This improves the working efficiency of the magnetic sensing component and prevents deformation due to uneven temperature.

[0028] In addition, by providing air passage holes that run through the coil coil along the axial direction of the coil coil on the coil coil, the air delivered by the first fan assembly blows towards the coil coil and passes through the air passage holes on the coil coil, which can more evenly cool and dissipate heat on the coil coil and the coil wound on the coil coil.

[0029] In one possible implementation, it further includes: a heat insulation element disposed between the coil disk and the magnetic sensing component;

[0030] In the axial direction of the coil, there is a gap between the heat insulation member and at least a portion of the coil frame, and the gap communicates with the air passage.

[0031] In this way, the air delivered by the first fan assembly passes through the air passage and the gap in sequence. Since the gap is located between the heat insulation component and at least part of the coil frame, it can better cool and dissipate heat on the heat insulation component, the coil frame and the coil, thereby improving the heat dissipation efficiency of the coil coil.

[0032] In one possible implementation, the ratio of the projected area of ​​the gap to the projected area of ​​the magnetic sensing component along the axial direction of the coil disk is a, where a ≥ 0.8.

[0033] Since the magnetic sensing component directly transfers heat to the heat insulation component below it, the high-temperature area on the heat insulation component is the area directly below the magnetic sensing component. Along the axial direction of the coil, the ratio of the projected area of ​​the gap between the heat insulation component and the coil frame to the projected area of ​​the magnetic sensing component is greater than or equal to 0.8, which can significantly reduce the temperature on the coil frame and the coil.

[0034] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the cooking appliances provided by this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific embodiments. Attached Figure Description

[0035] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 This is a schematic cross-sectional view of the cooking equipment provided in the embodiments of this application;

[0037] Figure 2This is a schematic diagram of the disassembled structure of the cooking equipment provided in the embodiments of this application;

[0038] Figure 3 A three-dimensional structural diagram of the cooking device provided in the embodiments of this application;

[0039] Figure 4 This is another perspective structural diagram of the cooking apparatus provided in the embodiments of this application;

[0040] Figure 5 This is a top view of the cooking equipment provided in an embodiment of this application;

[0041] Figure 6 This is a partial cross-sectional structural diagram of a cooking device provided in an embodiment of this application;

[0042] Figure 7 This is a schematic diagram of another partial cross-sectional structure of the cooking device provided in an embodiment of this application.

[0043] Explanation of reference numerals in the attached figures:

[0044] 100 - Cooking utensils;

[0045] 110-coil reel;

[0046] 1101 - Coil slot;

[0047] 111-Disc rack;

[0048] 1111 - Air vent;

[0049] 112 - Coil;

[0050] 1121 - Inner coil;

[0051] 1122 - Outer coil;

[0052] 113 - Magnetic strip;

[0053] 120 - Housing;

[0054] 1201 - Base;

[0055] 1202 - Control Panel Components;

[0056] 1203 - Top Cover;

[0057] 121 - Receiving cavity;

[0058] 1211 - First receiving slot;

[0059] 1212 - First air duct;

[0060] 1213 - First air inlet;

[0061] 122 - First windbreak rib;

[0062] 1221 - Opening;

[0063] 123 - Second receiving slot;

[0064] 1231 - Second air inlet;

[0065] 1232 - First air outlet;

[0066] 130 - Magnetic sensing component;

[0067] 140 - First wind turbine assembly;

[0068] 141-Air Supply Department;

[0069] 142 - Air guide section;

[0070] 150 - Thermal insulation;

[0071] 151 - Insulation groove;

[0072] 152-Gap;

[0073] 160 - Motherboard;

[0074] 170 - Second fan assembly;

[0075] 180-Windshield;

[0076] S1 - Area of ​​the second air duct;

[0077] S2 - Area of ​​the magnetic sensing component. Detailed Implementation

[0078] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0079] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0080] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0081] The terms "first," "second," and "third" (if any) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.

[0082] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or display that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or display.

[0083] An induction cooker is a very common and frequently used cooking appliance. It has the advantages of high heating efficiency, fast heating speed, and safe use of electric heating. However, its disadvantage is that it can only heat cookware made of ferromagnetic materials and cannot heat ceramic pots, earthenware pots, etc.

[0084] Currently, a fusion plate is generally used to enable induction cookers to be compatible with all types of cookware, greatly reducing costs. This integrated design eliminates the need for disassembly and allows for simultaneous electromagnetic and infrared heating of the cookware. However, when using a fusion plate, the magnetic induction plate receives a magnetic field and generates a large amount of heat, which is then used to heat the upper microcrystalline plate and the cookware in the form of infrared rays. The temperature on the magnetic induction plate can reach approximately 800℃.

[0085] In related technologies, heat insulation components are generally used to insulate the magnetic sensing sheet. The presence of heat insulation components can play a certain role in heat insulation and protect the winding and support below. However, the heat insulation effect of the heat insulation components is still limited. In addition, the winding itself will also generate heat, and there is still a risk that the support and winding will be heated and melted by high temperature. This makes the coil easy to melt, which can easily affect the reliability of the cooking appliance.

[0086] In view of the above problems, this application provides a cooking appliance including a base, a coil, and a first fan assembly. The base has a receiving cavity, and the coil is disposed within the receiving cavity. A magnetic sensing component is disposed on the side of the coil away from the base. The first fan assembly is disposed within the receiving cavity, located below the coil, and its projection along the axial direction of the coil is within the projection range of the coil. A first air inlet is provided on the base, positioned directly opposite the first fan assembly. The cooking appliance provided by this application can avoid or reduce the melting of the coil, thereby improving the reliability of the cooking appliance.

[0087] The specific implementation of the cooking device provided in the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0088] The cooking appliance provided in this application embodiment can be an induction cooker or an induction stove, and this application embodiment does not limit it to this.

[0089] Reference Figures 1 to 5 As shown, this application provides a cooking appliance 100, which may include a base 1201, a coil 110, and a magnetic sensing component 130. In this application embodiment, the magnetic sensing component 130 may be disposed on the coil 110. Specifically, in this application embodiment, the base 1201 may have a receiving cavity 121, the coil 110 may be disposed in the receiving cavity 121, and the magnetic sensing component 130 may be disposed on the side of the coil 110 away from the base 1201.

[0090] In some embodiments, the magnetic sensing component 130 may include at least three magnetic sensing sheets (not shown in the figure), which may be arranged at circumferential intervals along the coil disk 110.

[0091] In this embodiment of the application, the cooking appliance 100 may further include a first fan assembly 140. The first fan assembly 140 may be disposed in the receiving cavity 121 and may be located below the coil 110. Along the axial direction of the coil 110, the projection of the first fan assembly 140 is located within the projection range of the coil 110. A first air inlet 1213 is provided on the base 1201, and the position of the first air inlet 1213 is directly opposite the first fan assembly 140.

[0092] By providing a receiving cavity 121 on the base 1201, both the coil and the first fan assembly are disposed within the receiving cavity, with the first fan assembly located below the coil. Furthermore, along the axial direction of the coil, the projection of the first fan assembly is within the projection range of the coil. The base is also provided with a first air inlet, which is positioned directly opposite the first fan assembly. Thus, after the first fan assembly receives air through the first air inlet, the cold air delivered by the first fan assembly 140 is blown entirely towards the coil 110 along the axial direction of the coil. The cold air directly dissipates heat from the location of the coil 110, which can better cool the coil 110 and thus prevent or reduce the melting of the coil 110, thereby improving the reliability of the cooking appliance 100.

[0093] It should be noted that in some embodiments, the first fan assembly 140 can be an axial flow fan. An axial flow fan refers to a fan that operates in an axial manner, where the airflow generated is in the same direction as the axis of the fan blades, that is, the airflow flows parallel to the fan axis. By setting the first fan assembly 140 as an axial flow fan, it can be ensured that the air delivered by the first fan assembly 140 is blown entirely towards the coil disk 110 in the axial direction.

[0094] Alternatively, in some other embodiments, the first fan assembly 140 may also be a centrifugal fan.

[0095] In addition, in this embodiment, the first fan assembly 140 can be located directly below the coil disk 110, so that the first fan assembly 140 can dissipate heat for the coil disk 110 more efficiently, improve the heat dissipation effect, and prevent the coil 112 and the disk frame 111 from melting due to heat.

[0096] It is understood that, in the embodiments of this application, the cooking appliance 100 may also include a panel (not shown in the figure), the base 1201 and the panel are connected to form a whole as the housing 120 of the cooking appliance 100, and a receiving cavity 121 is defined in the housing 120, and the coil 110, the magnetic sensing component 130 and the first fan component 140 can be housed in the receiving cavity 121.

[0097] Additionally, see Figures 2 to 4 As shown, the housing 120 of the cooking appliance 100 may also include a top cover 1203, which is connected to the base 1201 to form a receiving cavity 121. The top of the top cover 1203 is provided with an opening, and a panel may be disposed on the top cover 1203 and cover the opening.

[0098] Additionally, in some embodiments, a control panel 1202 may be included (see...). Figure 2 As shown), the control panel 1202 can be located below the top cover 1202. The control panel 1202 is a module for users to input control commands.

[0099] The housing 120 integrates the coil 110, the magnetic sensing component 130, and the first fan assembly 140, allowing the cookware to contact the control panel and thus be placed on the cooking appliance 100 for heating. The coil 110 and the magnetic sensing component 130 convert electrical energy into heat energy, thereby heating the cookware and the food inside. In this way, the coil 110 and the magnetic sensing component 130 can serve as a heating source for the cooking appliance 100.

[0100] In this embodiment, the coil 110 is used to generate an alternating magnetic field when energized, so that the magnetic sensing component 130 senses the alternating magnetic field. When the magnetic sensing component 130 is placed in the alternating magnetic field, the magnetic lines of force pass through the magnetic sensing component 130, generating a large number of eddy currents on the magnetic sensing component 130, thereby causing the magnetic sensing component 130 to heat up on its own, and then heating the pot through the thermal radiation of the magnetic sensing component 130, thereby heating the food in the pot.

[0101] Alternatively, when the coil 110 is energized, it can generate an alternating magnetic field. Both the magnetic sensing component 130 and the cookware can sense the alternating magnetic field. When the magnetic sensing component 130 and the cookware are placed in the alternating magnetic field, the magnetic lines of force pass through the magnetic sensing component 130 and the cookware, generating a large number of eddy currents on the magnetic sensing component 130 and the cookware. This causes the magnetic sensing component 130 and the cookware to heat up on their own, and the heat from the magnetic sensing component 130 can be conducted to the cookware, thereby heating the food inside the cookware together.

[0102] In other words, when the cookware is non-magnetic, the alternating magnetic field generated when the coil 110 is energized can act on the magnetic sensing component 130, thereby heating the non-magnetic cookware through the magnetic sensing component 130. This is an infrared heating scheme. When the cookware is magnetic, the alternating magnetic field generated when the coil 110 is energized can act on the magnetic sensing component 130, thereby heating the magnetic cookware through the magnetic sensing component 130. At the same time, the alternating magnetic field generated when the coil 110 is energized can also directly act on the magnetic cookware, causing the magnetic cookware to generate heat on its own. This is a scheme combining electromagnetic heating and infrared heating, which can improve the working efficiency of the cooking appliance 100 when heating.

[0103] In this way, the cooking utensil 100 can break the limitation of the pot material, and both magnetic and non-magnetic pots can be used to cook with the cooking utensil 100 of this embodiment, thereby expanding the application range of the cooking utensil 100.

[0104] Reference Figures 2 to 4As shown in this embodiment, the receiving cavity 121 may be provided with a first receiving groove 1211 with an open upper end. At least a portion of the first fan assembly 140 may be disposed within the first receiving groove 1211, and the first air inlet 1213 may be disposed at the bottom of the first receiving groove 1211. In this way, after the first fan assembly 140 takes in air through the first air inlet 1213 at the bottom of the first receiving groove 1211, the cold air delivered by the first fan assembly 140 can be blown towards the coil 110 through the opening at the upper end of the first receiving groove 1211, thereby achieving cooling and heat dissipation of the coil 110.

[0105] It is understood that, in this embodiment of the application, a first baffle rib 122 may also be provided inside the receiving cavity 121. The first baffle rib 122 may be located on the outer periphery of the first receiving groove 1211. One end of the first baffle rib 122 is connected to the base 1201, and the other end of the first baffle rib 122 may extend toward the coil disk 110. In this way, the end of the first baffle rib 122 away from the base 1201 extends toward the coil disk 110. When the first fan assembly 140 blows air to the coil disk 110 along the axial direction of the coil disk 110, the first baffle rib 122 located on the outer periphery of the first receiving groove 1211 can play a role in concentrating the airflow, which helps to ensure that all the air delivered by the first fan assembly 140 is blown toward the coil disk 110.

[0106] In this embodiment, the cooking appliance 100 may further include a main board 160, wherein the main board 160 may be disposed within the receiving cavity 121, and the first baffle rib 122 may have an opening 1221 on the side near the main board 160. Thus, the air delivered by the first fan assembly 140 can be blown onto the main board 160 through the opening 1221 on the first baffle rib 122, thereby cooling the main board 160. In other words, the first air delivery assembly 140 can simultaneously cool both the coil 110 and the main board 160.

[0107] In one possible implementation, refer to Figures 2 to 5 As shown, the cooking device 100 may further include a second fan assembly 170, wherein the second fan assembly 170 may be disposed within the receiving cavity 121. The receiving cavity 121 may be provided with a second receiving groove 123 with an open upper end, at least a portion of the second fan assembly 170 is disposed within the second receiving groove 123, the bottom of the second receiving groove 123 is provided with a second air inlet 1231, and the side wall of the second receiving groove 123 is provided with a first air outlet 1232, which may face the main board 160.

[0108] In this way, after the second fan assembly 170 takes in air through the second air inlet 1231 on the bottom of the second accommodating groove 123, the cold air delivered by the second fan assembly 170 can be blown to the motherboard 160 through the first air outlet 1232 on the side wall of the second accommodating groove 123, thereby achieving cooling and heat dissipation of the motherboard 160.

[0109] In addition, the first fan assembly 140 and the second fan assembly 170 work together to dissipate heat from the whole machine, which can improve the reliability of the safe operation of each component in the cooking appliance 100, and thus prevent the coil 110, especially the plate frame 111 and the coil 112 in the coil 110, from melting.

[0110] See Figure 2 As shown in this embodiment, the cooking appliance 100 may further include a wind deflector 180, wherein the wind deflector 180 may cover the opening of the second receiving groove 123, so that the second fan assembly 170 is located within the space formed by the wind deflector 180 and the second receiving groove 123. In this way, the wind deflector 180 can prevent the air delivered by the second fan assembly 170 from flowing out of the second receiving groove 123 through the opening at the upper end of the second receiving groove 123, thereby helping the cold air delivered by the second fan assembly 170 to be blown onto the motherboard 160 through the first air outlet 1232, thus better achieving the heat dissipation effect on the motherboard 160.

[0111] In the embodiments of this application, reference is made to Figure 2 As shown, the coil 110 may include a tray frame 111 and a coil 112, wherein the coil 112 may be wound around the tray frame 111. Moreover, in some embodiments, the coil 112 may be wound around the side of the tray frame 111 facing the cookware.

[0112] Specifically, the coil 112 may include an inner coil 1121 and an outer coil 1122 wound coaxially, and the upper surface of the outer coil 1122 may be higher than the upper surface of the inner coil 1121. The magnetic sensing component 130 may be disposed above the inner coil 1121, and the magnetic sensing component 130 may be disposed radially inside the outer coil 1122.

[0113] The magnetic sensing component 130 is disposed above the inner coil 1121. The inner coil 1121 can generate an alternating magnetic field below the magnetic sensing component 130. The magnetic sensing component 130 is disposed radially inside the outer coil 1122. The outer coil 1122 can generate an alternating magnetic field on the outer periphery of the magnetic sensing component 130. The magnetic fields of the inner coil 1121 and the outer coil 1122 act together on the magnetic sensing component 130, which can make the heat generation of the magnetic sensing component 130 more uniform, thereby improving the working efficiency of the magnetic sensing component 130 and preventing the magnetic sensing component from deforming due to uneven temperature.

[0114] Additionally, it is understood that in the embodiments of this application, the coil 110 may also include a plurality of magnetic strips 113, wherein the plurality of magnetic strips 113 may be disposed on the side of the tray 111 away from the pot.

[0115] In this way, the tray 111 can be used to carry the inner coil 1121, the outer coil 1122, and the magnetic strip 113. When the inner coil 1121 and the outer coil 1122 are energized, they can both generate alternating current, thereby generating an alternating magnetic field. The magnetic strip 113 can optimize the magnetic field, thereby enhancing the strength of the alternating magnetic field, thus improving the heating efficiency of the cooking appliance 100. Furthermore, the magnetic strip 113 can shield the magnetic field to prevent the coil tray 110 and the magnetic sensing component 130 from interfering with other magnetic appliances, thereby improving the electromagnetic compatibility of the cooking appliance 100.

[0116] It should be noted that, in this embodiment, the first receiving groove 1211 may also have a first air duct 1212 surrounding the first fan assembly 140. Specifically, the air delivered by the first fan assembly 140 can be blown towards the coil disk 110 through the first air duct 1212. By providing the first air duct 1212 in the first receiving groove 1211, the air delivered by the first fan assembly 140 can be blown towards the coil disk 110 through the first air duct 1212 surrounding the first fan assembly 140, making the cold air blown towards the coil disk 110 more uniform.

[0117] like Figure 6 As shown in this embodiment, the tray frame 111 may also be provided with an air passage hole 1111, which can penetrate the tray frame 111 along the axial direction of the coil disk 110. By providing an air passage hole 1111 on the tray frame 111 that penetrates the tray frame 111 along the axial direction of the coil disk 110, the air delivered by the first fan assembly 140 is blown toward the coil disk 110 through the first air duct 1212 and then passes through the air passage hole 1111 on the tray frame 111, which can more evenly cool and dissipate heat from the tray frame 111 and the coil 112 wound on the tray frame 111.

[0118] For heat dissipation of the coil 110, the dual heat sources—heat transfer from the magnetic sensing component 130 to the heat insulation component 150 and the heat generated by the coil 112 itself—can cause excessive temperature rise in the coil holder 111 near the heat insulation component 150 and in the coil 112 itself. By separately setting the first fan component 140, taking the first fan component 140 as an axial fan as an example, cool air can be blown directly upwards along the axial direction. The coil holder 111 of the upper coil 110 has air vents 1111 that can directly receive the air from the axial fan and guide the airflow to the coil 112, thereby efficiently dissipating heat from the coil 110.

[0119] In this embodiment, the cooking appliance 100 may further include a heat insulation member 150, wherein the heat insulation member 150 may be disposed between the coil 110 and the magnetic sensing component 130. Moreover, in the axial direction of the coil 110, the heat insulation member 150 may have a gap 152 between itself and at least a portion of the tray 111, and the gap 152 may communicate with the air vent 1111.

[0120] In this way, the air delivered by the first fan assembly 140 passes through the air passage 1111 and the gap 152 in sequence. Since the gap 152 is located between the heat insulation component 150 and at least part of the tray 111, it can better cool and dissipate heat on the heat insulation component 150, the tray 111 and the coil 112, thereby improving the heat dissipation efficiency of the coil tray 110.

[0121] In some embodiments, the heat insulation member 150 may have a heat insulation groove 151 on the side facing away from the coil disk 110, and the magnetic sensing component 130 is disposed in the heat insulation groove 151.

[0122] In addition, the coil disk 110 may have a coil groove 1101 on the side opposite to the first receiving groove 1211, and the heat insulation member 150 may be disposed in the coil groove 1101.

[0123] It should be noted that, in this embodiment, the dimension of the gap 152 in the axial direction of the coil disk 110 can be 0.5mm-5mm. If the gap 152 is less than 0.5mm, the airflow will be too small to achieve a good heat dissipation effect; if the gap 152 is too large, the distance between the coil 112 and the magnetic sensing component 130 will be too large, resulting in a decrease in power.

[0124] For example, in the embodiments of this application, the dimension of the gap 152 in the axial direction of the coil disk 110 can be 0.5mm, 1mm, 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm or 5mm, etc. The embodiments of this application do not limit this, nor are they limited to the above examples.

[0125] It should be noted that the numerical values ​​and ranges involved in this application are approximate values. Due to the influence of the manufacturing process, there may be a certain range of errors, which can be considered negligible by those skilled in the art.

[0126] See Figure 7 As shown in this embodiment, along the axial direction of the coil disk 110, the ratio of the projected area of ​​the gap 152 to the projected area of ​​the magnetic sensing component 130 can be 'a', where 'a' can be greater than or equal to 0.8. That is, the projected area of ​​the second air duct on the magnetic sensing component 130 (i.e., the area S1 of the second air duct) can account for more than 80% of the area of ​​the magnetic sensing component 130 (i.e., the area S2 of the magnetic sensing component).

[0127] Since the magnetic sensing component 130 directly transfers heat to the heat insulation component 150 below it, the high-temperature area on the heat insulation component 150 is the area directly below the magnetic sensing component 130. The projection of the gap 152 between the heat insulation component 150, the tray 111, and the inner coil 1121 on the magnetic sensing component 130 covers more than 80% of the area of ​​the magnetic sensing sheet, which can significantly reduce the temperature on the coil 112. In addition, the cold air flowing through the tray 111 can also dissipate heat from the tray 111.

[0128] In this embodiment, the projected area of ​​the second air duct on the magnetic sensing component 130 can occupy 100% of the area of ​​the magnetic sensing component 130. In this way, the projected area of ​​the gap 152 between the heat insulation component 150, the tray 111, and the inner coil 1121 on the magnetic sensing component 130 completely covers the magnetic sensing component 130, which can dissipate heat from the coil tray 110 to a greater extent and reduce the temperature of the coil tray 110.

[0129] In this embodiment, the first fan assembly 140, combined with the first air duct 1212, the air vent 1111, and the gap 152, can greatly assist in the heat dissipation of the coil 110, thereby improving the stability of heat dissipation when cooling the cooking appliance 100.

[0130] It should be noted that, as Figure 5 As shown, in some embodiments, the first fan assembly 140 may include an air supply section 141 and an air guide section 142, wherein the air guide section 142 may be located at the outer edge of the air supply section 141 and extend toward the coil 110. In this way, the air guide section 142 can play the role of guiding and concentrating air, thereby better gathering and guiding the air supplied by the air supply section 141 to the coil 110.

[0131] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A cooking utensil (100), characterized in that, include: A base (1201) having a receiving cavity (121) thereon; A coil disk (110) is disposed in the receiving cavity (121), and a magnetic sensing component (130) is disposed on the side of the coil disk (110) away from the base (1201); The first fan assembly (140) is disposed in the receiving cavity (121) and is located below the coil disk (110). Along the axial direction of the coil disk (110), the projection of the first fan assembly (140) is located within the projection range of the coil disk (110). A first air inlet (1213) is provided on the base (1201), and the position of the first air inlet (1213) is directly opposite the first fan assembly (140).

2. The cooking utensil according to claim 1, characterized in that, The receiving cavity (121) is provided with a first receiving groove (1211) with an upper opening. At least a portion of the first fan assembly (140) is disposed in the first receiving groove (1211), and the first air inlet (1213) is disposed at the bottom of the first receiving groove (1211).

3. The cooking utensil according to claim 2, characterized in that, The cavity (121) is also provided with a first windbreak rib (122). The first windbreak rib (122) is located on the outer periphery of the first accommodating groove (1211). One end of the first windbreak rib (122) is connected to the base (1201), and the other end of the first windbreak rib (122) extends toward the coil disk (110).

4. The cooking utensil according to claim 3, characterized in that, It also includes: a motherboard (160); the motherboard (160) is disposed in the receiving cavity (121), and the first wind deflector (122) has an opening (1221) on the side near the motherboard (160).

5. The cooking utensil according to claim 4, characterized in that, Also includes: The second fan assembly (170) is disposed within the receiving cavity (121); The receiving cavity (121) is provided with a second receiving groove (123) with an upper opening. At least a portion of the second fan assembly (170) is disposed in the second receiving groove (123). The bottom of the second receiving groove (123) is provided with a second air inlet (1231). The side wall of the second receiving groove (123) is provided with a first air outlet (1232), which faces the main board (160).

6. The cooking utensil according to claim 5, characterized in that, Also includes: Windshield (180); The windshield (180) covers the opening of the second receiving groove (123) so that the second fan assembly (170) is located in the space formed by the windshield (180) and the second receiving groove (123).

7. The cooking utensil according to any one of claims 1-6, characterized in that, The first fan assembly (140) is an axial flow fan.

8. The cooking utensil according to any one of claims 1-6, characterized in that, The coil disk (110) includes a disk frame (111) and a coil (112) wound on the disk frame (111). The coil (112) includes an inner coil (1121) and an outer coil (1122) wound coaxially. The upper surface of the outer coil (1122) is higher than the upper surface of the inner coil (1121). The magnetic sensing component (130) is located above the inner coil (1121), and the magnetic sensing component (130) is located radially inside the outer coil (1122); The tray frame (111) is provided with an air passage (1111), which passes through the tray frame (111) along the axial direction of the coil disc (110).

9. The cooking utensil according to claim 8, characterized in that, Also includes: A heat insulation element (150) is disposed between the coil disk (110) and the magnetic sensing component (130); In the axial direction of the coil disc (110), there is a gap (152) between the heat insulation member (130) and at least a portion of the disc frame (111), and the gap (152) communicates with the air passage (1111).

10. The cooking utensil according to claim 9, characterized in that, Along the axial direction of the coil disk (110), the ratio of the projected area of ​​the gap (152) to the projected area of ​​the magnetic sensing component (130) is a, where a ≥ 0.8.

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