A defrosting system and a refrigerator

Abstract

This utility model provides a defrosting system and a refrigerator, relating to the field of refrigeration equipment technology. The defrosting system includes a compartment, a blower, and a thermoelectric cooler. An air supply channel is formed within the compartment, and an evaporator is located within the air supply channel. The blower is positioned within the air supply channel. The thermoelectric cooler is located within the air supply channel and is positioned upstream of the evaporator in the air supply direction. This defrosting system, by placing the thermoelectric cooler within the air supply channel and positioning it upstream of the evaporator in the air supply direction, allows the cold end of the thermoelectric cooler to actively frost, reducing moisture in the air supply channel and making it difficult for the evaporator to frost due to lack of moisture. Furthermore, the thermoelectric cooler can reverse the direction of current to interchange the cold and hot ends, eliminating its own frost through heating. This results in high defrosting efficiency, low energy consumption, and minimal temperature fluctuations in the compartment.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration equipment technology, and in particular to a defrosting system and a refrigerator. Background Technology

[0002] Currently, as a commonly used household appliance, the defrosting function of refrigerators is one of the important factors affecting their performance and energy efficiency. Traditional refrigerator defrosting methods mainly include natural defrosting and electric defrosting. Natural defrosting involves stopping the compressor or lowering the evaporator temperature, allowing the frost layer to gradually melt. While this method has lower energy consumption, its defrosting efficiency is low, and it can easily cause the compartment temperature to rise again, affecting the user experience. Electric defrosting, on the other hand, uses heating elements on the evaporator surface to melt the frost layer. Although this method improves defrosting efficiency, it has higher energy consumption, and the defrosting process can significantly affect the internal temperature stability of the refrigerator.

[0003] However, neither natural defrosting nor electric defrosting can guarantee both low energy consumption and minimal temperature fluctuations in the room while ensuring defrosting efficiency.

[0004] In view of this, a new technical solution is needed to solve the above-mentioned technical problems. Utility Model Content

[0005] To address the challenge of simultaneously ensuring defrosting efficiency while reducing energy consumption and minimizing temperature fluctuations in the compartments, this invention aims to provide a defrosting system and refrigerator that achieves high defrosting efficiency, low energy consumption, and minimal temperature fluctuations in the compartments.

[0006] To achieve the above objectives, the present invention employs the following technical means:

[0007] A first aspect of this utility model provides a defrosting system, comprising:

[0008] A compartment, in which an air supply duct is formed, and an evaporator is installed in the air supply duct;

[0009] An air supply fan is installed within the air supply duct;

[0010] A semiconductor cooling chip is disposed within the air supply channel and is located upstream of the evaporator in the air supply direction of the air supply channel.

[0011] Optionally, the room is further provided with a partition, which divides the air supply channel into a first channel and a second channel. The thermoelectric cooler is located in the first channel, and the evaporator is located in the second channel. The thermoelectric cooler and the evaporator are spaced apart.

[0012] Optionally, the partition is provided with an opening and a damper for opening or closing the opening; the opening connects the first channel and the second channel, and when the damper is open, the first channel and the second channel are connected; when the damper is closed, the first channel and the second channel are isolated from each other.

[0013] Optionally, it also includes a control module and a second defrost temperature sensor, wherein the control module is electrically connected to the second defrost temperature sensor, the air supply fan and the damper respectively; the second defrost temperature sensor is disposed near the semiconductor cooling chip.

[0014] Optionally, it also includes a defrosting fan, a defrosting mode air inlet, and a defrosting mode air outlet. The defrosting fan is located in the first channel. The defrosting mode air inlet and the defrosting mode air outlet are located at opposite ends of the defrosting fan. Both the defrosting mode air inlet and the defrosting mode air outlet are used to connect with the outside. The defrosting fan is used to drive air to circulate between the compartment and the outside. The semiconductor cooling chip is located on the air supply path of the defrosting fan.

[0015] Optionally, it also includes an electric heater, with the air supply fan located at one end of the evaporator and the electric heater located at the opposite end of the evaporator.

[0016] Optionally, it also includes a first defrost temperature sensor, and the control module is electrically connected to the defrost fan, the electric heater, and the first defrost temperature sensor respectively; the first defrost temperature sensor is located near the evaporator.

[0017] Optionally, the two ends of the semiconductor cooling chip are a hot electrode and a cold electrode, respectively, and the hot electrode and the cold electrode can switch between each other following the direction of the current.

[0018] Optionally, the input end of the air supply duct is a return air inlet, the output end of the air supply duct is an air supply outlet, and the air supply fan is used to drive the air in the room to circulate between the return air inlet and the air supply outlet.

[0019] A second aspect of this utility model provides a refrigerator, comprising: any of the defrosting systems described above.

[0020] Compared with the prior art, this utility model brings the following technical effects:

[0021] This invention discloses a defrosting system that utilizes a thermoelectric cooler installed within an air supply duct, positioned upstream of the evaporator in the air supply direction. The cold end of the thermoelectric cooler actively frosts, reducing moisture in the air supply duct and preventing frost formation on the evaporator due to lack of moisture. Furthermore, the thermoelectric cooler can reverse the direction of current to interchange the cold and hot ends, eliminating frost through heating. This results in high defrosting efficiency, low energy consumption, and minimal temperature fluctuations in the compartment. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 The following are schematic diagrams illustrating the structure of a defrosting system according to some embodiments of the present invention;

[0024] Figure 2 The diagram shows the working principle of the defrosting system in normal cooling mode according to some embodiments of the present invention;

[0025] Figure 3 The diagram illustrates the working principle of the defrosting mode of the defrosting system according to some embodiments of the present invention.

[0026] Explanation of key component symbols:

[0027] 10-Compartment; 11-Partition; 12-Damper; 20-Air supply duct; 21-First duct; 211-Air outlet; 212-Defrost mode air inlet; 213-Defrost mode exhaust outlet; 22-Second duct; 221-Return air outlet; 30-Evaporator; 31-First defrost temperature sensor; 40-Air supply fan; 50-Semiconductor cooling chip; 51-Second defrost temperature sensor; 61-Defrost fan; 62-Electric heater. Detailed Implementation

[0028] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0029] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other. The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0030] Please see Figures 1-3 In a first aspect, this utility model provides a defrosting system, including a chamber 10, a blower 40, an evaporator 30, and a semiconductor refrigeration chip 50.

[0031] An air supply duct 20 is formed in the compartment 10, and an evaporator 30 is installed in the air supply duct 20; a blower is located in the air supply duct 20; a semiconductor cooling chip 50 is installed in the air supply duct 20 and is located upstream of the evaporator 30 in the air supply direction of the air supply duct 20.

[0032] This invention discloses a defrosting system that utilizes a thermoelectric cooler 50 installed within the air supply duct 20, positioned upstream of the evaporator 30 in the air supply direction. The cold end of the thermoelectric cooler 50 actively frosts, reducing moisture in the air supply duct 20 and preventing frost formation on the evaporator 30 due to lack of moisture. Furthermore, the thermoelectric cooler 50 can reverse the direction of current to interchange its cold and hot ends, eliminating frost through heating. This results in high defrosting efficiency, low energy consumption, and minimal temperature fluctuations in the compartment 10.

[0033] In principle, the semiconductor cooling chip 50 of this invention reduces the moisture in the air supply channel 20 to prevent frost from forming on the evaporator 30, rather than using thermal contact or thermal radiation to defrost the fins of the evaporator 30 as in related technologies.

[0034] The input end of the air supply duct 20 is the return air inlet 221, and the output end of the air supply duct 20 is the air supply outlet 211. The air supply fan 40 drives the air in the chamber 10 to circulate between the air supply outlet 211 and the return air inlet 221. Specifically, the air in the chamber 10 leaves through the air supply outlet 211 and then returns to the chamber 10 through the return air inlet 221. Within the chamber 10, the air supply direction of the air supply fan 40 is from the return air inlet 221 to the air supply outlet 211 (e.g., ...). Figure 2 (As indicated by the middle arrow). The thermoelectric cooler 50 is positioned near the return air inlet 221, and the evaporator 30 is positioned near the supply air inlet 211. In this way, the thermoelectric cooler 50 is located within the supply air channel 20 and upstream of the evaporator 30 in the air supply direction of the supply air channel 20.

[0035] The cooling principle of the thermoelectric cooler 50 is as follows: the P-type and N-type semiconductors of the thermoelectric cooler 50 are connected by a metal conductor. Applying current creates a cold end and a hot end. The positions of the cold and hot ends can be adjusted by changing the direction of the current. In normal cooling mode, the thermoelectric cooler 50 actively frosts, consuming moisture in the air supply channel 20. In defrosting mode, the current direction of the thermoelectric cooler 50 is switched, the cold and hot ends of the semiconductor are interchanged, and the hot end heats the frost layer formed on the semiconductor.

[0036] In one specific embodiment, a partition 11 is provided in the compartment 10, which divides the air supply channel 20 into a first channel 21 and a second channel 22. The semiconductor cooling chip 50 is located in the first channel 21, and the evaporator 30 is located in the second channel 22. The semiconductor cooling chip 50 and the evaporator 30 are arranged at intervals.

[0037] By placing the thermoelectric cooler 50 and the evaporator 30 into the first channel 21 and the second channel 22 respectively, the thermoelectric cooler 50 and the evaporator 30 can be spaced apart from each other so that the thermoelectric cooler 50 and the evaporator 30 do not come into direct contact, thus preventing frost on the thermoelectric cooler 50 from affecting the operation of the evaporator 30.

[0038] Furthermore, the partition 11 is provided with an opening and a damper 12 for opening or closing the opening; when the damper 12 is open, the first channel 21 and the second channel 22 are connected; when the damper 12 is closed, the first channel 21 and the second channel 22 are set independently of each other.

[0039] The opening connects the first channel 21 and the second channel 22. The damper 12 controls the opening and closing of the opening. Specifically, the damper 12 is connected to a drive motor (not shown), which rotates the damper 12 to open or close the opening. However, the opening and closing of the opening is not limited to the damper 12 in this embodiment.

[0040] When the damper 12 is opened, the first channel 21 and the second channel 22 are connected. The supply air fan 40 drives the air to enter the first channel 21 through the return air inlet 221, then through the opening into the second channel 22, and finally out of the chamber 10 through the supply air inlet 211. Inside the first channel 21, the thermoelectric cooling chip 50 reduces the moisture in the supply air through active frosting. As a result, when the air reaches the second channel 22, the evaporator 30 in the second channel 22 has less frost due to insufficient moisture, or even no frost at all.

[0041] When the damper 12 is closed, the first channel 21 and the second channel 22 are set independently. That is, the first channel 21 and the second channel 22 are isolated from each other, and the semiconductor cooling chip 50 and the evaporator 30 are located on opposite sides of the damper 12.

[0042] Specifically, the partition 11 includes vertical and horizontal plates that are perpendicular to each other. The vertical plates are spaced apart from the side walls of the compartment 10 to form a first passage 21 with the side walls of the compartment 10. One end of the horizontal plate is connected to the vertical plate, and the other end is connected to the side wall of the compartment 10 to block the first passage 21. In this way, when the damper 12 is opened, air can only enter the first passage 21 from the return air inlet 221 and leave the first passage 21 through the opening.

[0043] In addition, the vertical panels, horizontal panels, and the side walls of the compartment 10 together form the second passageway 22.

[0044] In this embodiment, the compartment 10 is provided with partitions 11, which divide the compartment 10 into two first channels 21 and one second channel 22. The two first channels 21 are located on opposite sides of one second channel 22. Correspondingly, the compartment 10 is also provided with two return air vents 221 and two supply air vents 211. Each first channel 21 is equipped with one supply air vent 211. The second channel 22 is connected to both second supply air vents 211. Specifically, the two supply air vents 211 are arranged on the same axis and are located on the left and right sides of the compartment 10.

[0045] In one specific embodiment, the defrosting system further includes a control module (not shown) and a second defrosting temperature sensor 51. The control module is electrically connected to the second defrosting temperature sensor 51, the air supply fan 40, and the damper 12, respectively. The second defrosting temperature sensor 51 is located near the semiconductor cooling chip 50.

[0046] The second defrost temperature sensor 51 is used to acquire the temperature of the thermoelectric cooler 50. The control module is used to close the damper 12, return air vent 221, and supply air vent 211 when the real-time temperature acquired by the second defrost temperature sensor 51 is lower than the set value. The control module is also used to open the damper 12, return air vent 221, and supply air vent 211 when the real-time temperature acquired by the second defrost temperature sensor 51 is higher than the set value.

[0047] It should be noted that both the return air vent 221 and the supply air vent 211 are equipped with valves or doors. The valves and doors can open or close the return air vent 221 and the supply air vent 211 in response to the control commands of the control module. The use of valves or doors is a common technical means in this field and will not be described in detail here.

[0048] In one specific embodiment, the defrosting system further includes a defrosting fan 61, a defrosting mode air inlet 212, and a defrosting mode air outlet 213. The defrosting fan 61 is located in the first channel 21, and the defrosting mode air inlet 212 and the defrosting mode air outlet 213 are located at opposite ends of the defrosting fan 61, respectively. The semiconductor cooling chip 50 is disposed on the air supply path of the defrosting fan 61.

[0049] Both the defrost mode air inlet 212 and the defrost mode air outlet 213 are located on the bottom wall of the compartment 10. The defrost mode air inlet 212 is located below the defrost fan 61, and the defrost mode air outlet 213 is located above the defrost fan 61.

[0050] The defrosting fan 61 accelerates the defrosting speed of the thermoelectric cooler 50 and removes hot and humid air from the air duct to prevent it from entering the evaporator 30 and causing frost buildup after defrosting. The defrosting fan 61 directs airflow from the defrosting mode inlet 212 to the defrosting mode outlet 213. The thermoelectric cooler 50 is positioned between the defrosting mode inlet 212 and the defrosting mode outlet 213, meaning it is positioned in the direction of airflow to heat the air supplied by the defrosting fan 61.

[0051] Both the defrost mode air inlet 212 and the defrost mode air outlet 213 are connected to the outside. The defrost fan is used to drive the air to circulate between the chamber 10 and the outside. In this way, the hot and humid air in the defrost system can be discharged through gas exchange with the outside, thereby reducing the moisture in the defrost system.

[0052] In one specific embodiment, the defrosting system further includes an electric heater 62, with the air blower 40 and the electric heater 62 respectively located on opposite sides of the evaporator 30.

[0053] The electric heater 62 defrosts the evaporator 30 through its own thermal radiation. The electric heater 62 is positioned away from the blower 40 so that the heat generated by the electric heater 62 can be more concentrated, resulting in a more stable defrosting effect on the evaporator 30.

[0054] In one specific embodiment, the defrosting system further includes a first defrosting temperature sensor 31, and the control module is electrically connected to the defrosting fan 61, the first defrosting temperature sensor 31 and the electric heater 62 respectively; the first defrosting temperature sensor 31 is located near the evaporator 30.

[0055] The first defrost temperature sensor 31 is used to detect the temperature of the evaporator 30. Compared with the second defrost temperature sensor 51, the first defrost temperature sensor 31 is more accurate in detecting the frosting state of the evaporator 30. The first defrost temperature sensor 31 is fixedly installed on the bottom wall of the compartment 10.

[0056] When the temperature measured by the first defrost temperature sensor 31 is lower than the defrost start temperature, it indicates that the temperature of the evaporator 30 is low, and the frost on the surface of the semiconductor cooling chip 50 provides weak protection for the evaporator 30. At this time, the defrost system enters the enhanced defrost mode.

[0057] In enhanced defrosting mode, the control module closes damper 12, air supply vent 211, and return air vent 221. The control module also shuts off the supply fan 40, turns on the defrost fan 61, opens the exhaust vent, and opens the defrost mode air inlet. The control device also turns on the electric heater 62, which directly heats the evaporator 30.

[0058] When the temperature obtained by the first defrost temperature sensor 31 is higher than the defrost exit temperature, the defrost system exits the enhanced defrost mode.

[0059] Furthermore, the two ends of the semiconductor cooling chip 50 are a hot electrode and a cold electrode, respectively, with the cold electrode located within the air supply channel 20.

[0060] The two ends of the semiconductor cooling chip 50 are the hot electrode and the cold electrode, respectively, and the hot electrode and the cold electrode switch with each other following the direction of the current.

[0061] The ability of the thermoelectric cooler 50 to frost its cold electrode decreases as the frost layer increases. Therefore, after a certain degree of frost buildup, the cold electrode is actively switched to the hot electrode to defrost. In this way, the thermoelectric cooler 50 differs from a simple cooling device; defrosting can be performed simply by switching circuits, making operation simple and quick.

[0062] In essence, both the hot and cold electrodes of the thermoelectric cooler 50 can improve the defrosting efficiency of the evaporator 30. Defrosting at the hot electrode is to improve the working efficiency of the cold electrode, which indirectly improves the cooling efficiency of the thermoelectric cooler 50.

[0063] In this embodiment, there are two groups of thermoelectric coolers 50, each group comprising multiple thermoelectric coolers 50 arranged in a single row and spaced apart from each other. Both groups of thermoelectric coolers 50 are arranged within two first channels 21. The number of thermoelectric coolers 50 can be adaptively set according to actual usage requirements.

[0064] In summary, the defrosting system has four operating modes: normal cooling mode, shutdown mode, defrosting mode, and enhanced defrosting mode.

[0065] Please see Figure 2 When the thermoelectric cooler 50 is energized, the evaporator 30 starts, and the temperature setting of the thermoelectric cooler 50 is always lower than the inlet and outlet temperatures of the evaporator 30. The control module controls the damper 12 to open, and controls the air supply outlet 211 and return air outlet 221 to open, and controls the air supply fan 40 to start. Furthermore, the control module controls the defrost fan 61 to close, and controls the exhaust outlet and defrost mode air inlet to close. In normal cooling mode, the air supply fan 40 and evaporator 30 are responsible for reducing the temperature of compartment 10, while the thermoelectric cooler 50 assists in reducing the temperature of compartment 10 and actively frosts, reducing moisture in the air supply duct.

[0066] When the temperature of compartment 10 falls below the set value (for example, when the first defrost sensor detects that the temperature of compartment 10 is too low), the system enters shutdown mode. In shutdown mode, the evaporator 30 stops cooling, and the thermoelectric cooler 50 stops operating. When the temperature fluctuation of compartment 10 is detected to be higher than the set value, the system exits shutdown mode and enters cooling mode.

[0067] Please see Figure 3 When the compressor refrigeration system shuts down and the temperature detected by the second defrost temperature sensor 51 is lower than the defrost set temperature, the system enters defrost mode.

[0068] In defrost mode, the control module closes the damper 12, the air supply vent 211, and the return air vent 221, and also shuts down the air supply fan 40. The control module turns on the defrost fan 61, and opens the exhaust vent and the defrost mode air inlet. The defrost heating of the evaporator 30 is turned off. With the evaporator 30 in a normal off-state, the thermoelectric cooler 50 adjusts its current direction to switch to heating mode, heating the bottom of the frost layer on the thermoelectric cooler 50 for rapid defrosting. When the second defrost temperature sensor 51 detects that the temperature in compartment 10 has risen above a preset value, it automatically switches back to normal cooling mode.

[0069] When the first defrost temperature sensor 31 detects that the temperature is lower than the defrost set temperature, the system enters the enhanced defrost mode.

[0070] In the enhanced defrost mode, the control module closes the damper 12, the air supply vent 211, the return air vent 221, and the air supply fan 40. Simultaneously, the control module activates the defrost fan 61, the exhaust vent, the defrost mode air inlet, and the defrost electric heater on the evaporator 30. The semiconductor refrigeration system switches to heating mode. When the first defrost temperature sensor 31 detects a temperature higher than the defrost exit temperature, the enhanced defrost mode is exited.

[0071] Please see Figures 1-3 In a second aspect, this utility model provides a refrigerator that includes the defrosting system of any of the above embodiments.

[0072] The refrigerator of this invention employs a defrosting system according to any of the above embodiments. A semiconductor cooling chip 50 is installed within the air supply duct 20, and the semiconductor cooling chip 50 and the evaporator 30 are positioned upstream of the air supply duct 20 in the airflow direction. The cold end of the semiconductor cooling chip 50 actively frosts, reducing the moisture content within the air supply duct 20, thus preventing frost formation on the evaporator 30 due to lack of moisture. Furthermore, the semiconductor cooling chip 50 can also reverse the direction of current to interchange its cold and hot ends, eliminating its own frost through heating. This results in high defrosting efficiency, low energy consumption, and minimal temperature fluctuations in the compartment 10.

[0073] It is worth mentioning that the air supply vent 211 and return vent 221 of the compartment 10 are connected to the outside. When the defrosting system defrosts, in order to accelerate the defrosting of the semiconductor cooling chip 50 and at the same time exhaust the hot and humid gas generated during defrosting, the defrosting mode air inlet 212 and the defrosting mode air outlet 213 are opened to circulate the air externally and quickly defrost.

[0074] A third aspect of this invention provides a defrosting method for a defrosting system. This defrosting method is used in the defrosting apparatus of any of the above embodiments.

[0075] In one embodiment, the defrosting method includes:

[0076] S10: Determine whether the first defrost temperature is lower than the defrost entry temperature;

[0077] S11: If so, the defrosting system enters enhanced defrosting mode;

[0078] S12: If not, determine whether the second defrosting temperature of the compartment is lower than the set value.

[0079] The defrost entry temperature is set as the critical temperature for entering the enhanced defrost mode. The first defrost temperature is the real-time temperature of the evaporator collected by the first defrost temperature sensor.

[0080] Furthermore, after the defrosting system enters the enhanced defrosting mode, the defrosting method also includes S20: determining whether the first defrosting temperature is higher than the defrosting exit temperature.

[0081] S21: If so, exit the enhanced frost mode and determine whether the room temperature is lower than the set value.

[0082] S22: If not, the defrosting system will again determine whether the first defrosting temperature is higher than the defrosting exit temperature, until the first defrosting temperature is higher than the defrosting exit temperature.

[0083] The defrost exit temperature is higher than the defrost entry temperature.

[0084] Furthermore, the defrosting method also includes S30: determining whether the room temperature is lower than the set value;

[0085] S31: If so, the system enters shutdown mode;

[0086] S32: If not, the system enters cooling mode.

[0087] The set temperature is higher than the defrost exit temperature.

[0088] Furthermore, after the system enters the shutdown mode, the defrosting method also includes S40: determining whether the second defrosting temperature is lower than the defrosting entry temperature.

[0089] S41: If so, the system enters defrosting mode, adjusts the direction of the semiconductor cooling equipment, and defrosts by heating and sublimation.

[0090] S42: If not, check again whether the room temperature is lower than the set value.

[0091] Furthermore, after the system enters defrosting mode, adjusts the direction of the semiconductor refrigeration equipment, and defrosts through heating sublimation, it also includes: S50 determining whether the temperature fluctuation of the compartment is greater than the preset value;

[0092] S51: If so, the system enters cooling mode;

[0093] S52: If not, the system enters cooling mode.

[0094] The defrosting system switches between four operating modes: normal cooling mode, shutdown mode, defrosting mode, and enhanced defrosting mode, using the defrosting method of this embodiment.

[0095] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom still fall within the protection scope of this invention.

Claims

1. A defrosting system, characterized in that, include: A compartment, in which an air supply duct is formed, and an evaporator is installed in the air supply duct; An air supply fan is installed within the air supply duct; A semiconductor cooling chip is disposed within the air supply channel and is located upstream of the evaporator in the air supply direction of the air supply channel.

2. The defrosting system according to claim 1, characterized in that, The room is also equipped with a partition, which divides the air supply channel into a first channel and a second channel. The thermoelectric cooler is located in the first channel, and the evaporator is located in the second channel. The thermoelectric cooler and the evaporator are spaced apart.

3. The defrosting system according to claim 2, characterized in that, The partition is provided with an opening and a damper for opening or closing the opening; the opening connects the first channel and the second channel, and when the damper is open, the first channel and the second channel are connected; when the damper is closed, the first channel and the second channel are isolated from each other.

4. The defrosting system according to claim 3, characterized in that, It also includes a control module and a second defrost temperature sensor. The control module is electrically connected to the second defrost temperature sensor, the air supply fan, and the damper, respectively. The second defrost temperature sensor is located near the semiconductor refrigeration chip.

5. The defrosting system according to claim 4, characterized in that, It also includes a defrost fan, a defrost mode air inlet, and a defrost mode air outlet. The defrost fan is located in the first channel. The defrost mode air inlet and defrost mode air outlet are located at opposite ends of the defrost fan. Both the defrost mode air inlet and defrost mode air outlet are used to connect with the outside. The defrost fan is used to drive air to circulate between the compartment and the outside. The semiconductor cooling chip is located on the air supply path of the defrost fan.

6. The defrosting system according to claim 5, characterized in that, It also includes an electric heater, with the air blower located at one end of the evaporator and the electric heater located at the opposite end of the evaporator.

7. The defrosting system according to claim 6, characterized in that, It also includes a first defrost temperature sensor, and the control module is electrically connected to the defrost fan, the electric heater and the first defrost temperature sensor respectively; the first defrost temperature sensor is located near the evaporator.

8. The defrosting system according to any one of claims 1 to 7, characterized in that, The two ends of the semiconductor cooling chip are a hot electrode and a cold electrode, respectively, and the hot electrode and the cold electrode can switch between each other following the direction of the current.

9. The defrosting system according to any one of claims 1 to 7, characterized in that, The input end of the air supply channel is a return air inlet, and the output end of the air supply channel is an air supply outlet. The air supply fan is used to drive the air in the room to circulate between the return air inlet and the air supply outlet.

10. A refrigerator, characterized in that, include: The defrosting system according to any one of claims 1 to 9.

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