Silicon wafer drying equipment and silicon wafer processing production line

Abstract

The utility model discloses a kind of silicon wafer drying equipment and silicon wafer processing production line, it is related to silicon wafer processing technical field.The silicon wafer drying equipment includes base, transmission component and light source component, and transmission component is located at base;Light source component is located at base and is located above transmission component, and light source component is used to emit infrared light and irradiate silicon wafer, and the waveband of infrared light coincides with the absorption waveband of silicon wafer.The technical scheme provided by the utility model reduces the damage caused to silicon wafer in drying process, and improves the quality of silicon wafer.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing technology, and in particular to a silicon wafer drying equipment and a silicon wafer processing production line. Background Technology

[0002] The rapid development and technological innovation in the photovoltaic industry in recent years have made the trend of thinner silicon wafers a key direction for cost reduction. Along with this trend, the quality requirements for silicon wafer drying are also becoming increasingly stringent.

[0003] Traditional silicon wafer drying equipment mostly uses mechanical dewatering and hot air drying methods to dry silicon wafers. However, when dealing with thinner silicon wafers, this drying method can easily lead to micro-cracks or even breakage during the drying process, affecting the production quality of silicon wafers. Utility Model Content

[0004] The main purpose of this invention is to provide a silicon wafer drying equipment and silicon wafer processing production line, which aims to reduce the damage to silicon wafers during the drying process and improve the quality of silicon wafers.

[0005] To achieve the above objectives, the silicon wafer drying equipment proposed in this utility model includes:

[0006] abutment;

[0007] Transmission components, disposed on the base station; and

[0008] A light source assembly is disposed on the base and located above the transmission assembly. The light source assembly is used to emit infrared light and illuminate the silicon wafer. The wavelength of the infrared light coincides with the absorption wavelength of the silicon wafer.

[0009] In one embodiment, the wavelength of the infrared light is greater than or equal to 980 nm and less than or equal to 1080 nm.

[0010] In one embodiment, the light source assembly includes:

[0011] The bracket is detachably mounted on the base; and

[0012] A light generator is disposed on the bracket and its light emission direction is toward the transmission component. The light generator is used to emit the infrared light.

[0013] In one embodiment, the light generator is configured as a surface light source.

[0014] In one embodiment, the light source assembly further includes:

[0015] An adjustment structure is provided to connect the support and the base, and the adjustment structure is used to adjust the distance between the light generator and the transmission component.

[0016] In one embodiment, the adjustment structure includes:

[0017] Clamping teeth are provided on the side of the bracket, and multiple clamping teeth are evenly spaced, forming a clamping opening between adjacent clamping teeth; and

[0018] A support plate is disposed on the base and located above the transmission component. The support plate has a notch, and the bracket can pass through the notch so that the side wall of the notch can be engaged with any of the slots.

[0019] In one embodiment, the silicon wafer drying equipment further includes:

[0020] An infrared thermal imaging sensor is disposed on the base and located above the transmission component; and

[0021] The control system is electrically connected to the infrared thermal imaging sensor and the light source assembly.

[0022] In one embodiment, the silicon wafer drying equipment further includes:

[0023] The air knife is detachably mounted on the base and located above the transmission component. The air knife and the light source component are arranged sequentially along the transmission direction of the transmission component.

[0024] In one embodiment, the sidewall of the base is provided with a plurality of mounting steps, which are spaced apart in a direction perpendicular to the conveying direction of the transmission component, and the end of the air knife is detachably mounted on any of the mounting steps.

[0025] This utility model also proposes a silicon wafer processing production line, including the silicon wafer drying equipment described in any of the above embodiments.

[0026] The technical solution of this utility model involves setting up a base, a transmission component, and a light source component in a silicon wafer drying equipment. The transmission component is located on the base; the light source component is located on the base and above the transmission component. The light source component emits infrared light to irradiate the silicon wafer, and the wavelength of the infrared light coincides with the absorption wavelength of the silicon wafer. Compared with the existing silicon wafer drying equipment that uses mechanical dewatering and hot air drying methods, the technical solution of this utility model sets up a light source component for emitting infrared light. Since the wavelength of the infrared light coincides with the absorption wavelength of the silicon wafer, the overlapping wavelength is used to perform non-contact drying of the silicon wafer, reducing damage to the silicon wafer during the drying process and improving the quality of the silicon wafer. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0028] Figure 1 A schematic diagram of a structure of an embodiment of the silicon wafer drying equipment provided by this utility model;

[0029] Figure 2 for Figure 1 A schematic diagram of the structure of an embodiment from another perspective;

[0030] Figure 3 for Figure 1 A structural schematic diagram of an embodiment from another perspective;

[0031] Figure 4 for Figure 3 An enlarged view of an embodiment at point A.

[0032] Explanation of icon numbers:

[0033] 100. Base; 110. Base plate; 120. Side plate; 121. Mounting step; 130. Support plate; 131. Notch;

[0034] 200. Conveying assembly; 210. Conveying roller; 220. Power unit;

[0035] 310. Bracket; 311. Mounting base; 312. Connecting plate; 313. Clamping teeth; 320. Light generator; 321. Irradiation area; 330. Limiting component;

[0036] 410. Infrared thermal imaging sensor;

[0037] 500, Air knife; 510, Second connecting hole;

[0038] 600. Silicon wafer.

[0039] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0040] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0041] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0042] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0043] The rapid development and technological innovation in the photovoltaic industry in recent years have made the trend of thinner silicon wafers a key direction for cost reduction. Along with this trend, the quality requirements for silicon wafer drying are also becoming increasingly stringent.

[0044] Traditional silicon wafer drying equipment mostly uses mechanical dewatering and hot air drying methods to dry silicon wafers. However, when dealing with thinner silicon wafers, this drying method can easily lead to micro-cracks or even breakage during the drying process, affecting the production quality of silicon wafers.

[0045] This invention proposes a silicon wafer drying device to reduce damage to silicon wafers during the drying process and improve the quality of silicon wafers.

[0046] Please see Figures 1 to 3In one embodiment, the silicon wafer drying equipment includes a base 100, a transmission component 200, and a light source component. The transmission component 200 is disposed on the base 100. The light source component is disposed on the base 100 and located above the transmission component 200. The light source component is used to emit infrared light and irradiate the silicon wafer 600. The wavelength of the infrared light coincides with the absorption wavelength of the silicon wafer 600.

[0047] The base 100 is used to provide an installation foundation and support for the silicon wafer drying equipment. In one embodiment, the base 100 includes a substrate 110 and support feet. The support feet are disposed at the bottom of the substrate 110 and arranged around the periphery of the substrate 110 to provide support for the substrate 110. The substrate 110 is used to provide an installation platform for other functional structures of the silicon wafer drying equipment.

[0048] The transfer assembly 200 is used to move the silicon wafer 600. The transfer assembly 200 has an infeed end and an outlet end, and is capable of moving the silicon wafer 600 from the infeed end to the outlet end. In one embodiment, the transfer assembly 200 includes a power component 220 and a plurality of conveyor rollers 210, which are arranged in parallel and spaced apart on the base 100. The power component 220 is drivenly connected to the plurality of conveyor rollers 210, causing the plurality of conveyor rollers 210 to rotate synchronously to move the silicon wafer 600. The power component 220 can be configured as a motor or cylinder, and can be drivenly connected to the conveyor rollers 210 via a synchronous belt, synchronous pulley, or rack and pinion structure; no limitation is made here. In one embodiment, the length of a single conveyor roller 210 is greater than the total length of the plurality of silicon wafers 600, so that the transfer assembly 200 can simultaneously move the plurality of silicon wafers 600 arranged side-by-side. In another embodiment, the length of a single conveyor roller 210 may also be adapted to the length of a single silicon wafer 600, so that the conveying assembly 200 can only move a single row of silicon wafers 600. The specific length of a single conveyor roller 210 can be flexibly set according to actual needs and the size of the silicon wafer 600, and is not limited here. Of course, in other embodiments, the conveying assembly 200 may also include a conveyor belt and a power component 220, and is not limited here.

[0049] The light source assembly emits infrared light to heat the silicon wafer 600. The wavelength of the infrared light coincides with the absorption wavelength of the silicon wafer 600, allowing the silicon wafer 600 to fully absorb the infrared light. The infrared light can then specifically dry the silicon wafer 600 to avoid affecting operators and other structures. In one embodiment, the light source assembly is located between the discharge end and the feed end, and is positioned close to the discharge end. The light emission direction of the light source assembly is towards the transmission assembly 200, so that the light source assembly forms an irradiation area 321 on the transmission path of the transmission assembly 200. In one embodiment, multiple sets of light source assemblies are provided. These multiple sets of light sources are located on the same horizontal plane parallel to the transmission assembly 200 and are spaced apart in a direction perpendicular to the conveying direction of the transmission assembly 200. Silicon wafers 600 located in the same column can sequentially pass through the irradiation area 321 formed by the same set of light source assemblies, and the multiple irradiation areas 321 of the multiple sets of light source assemblies can simultaneously irradiate the multiple silicon wafers 600 arranged side by side. Of course, in other embodiments, the number of light source components can be set according to the number of rows of silicon wafers 600 transmitted by the transmission component 200; or, only one set of light source components can be set, and the irradiation area 321 formed by one set of light source components can simultaneously irradiate multiple silicon wafers 600 arranged in parallel. Here, there is no limitation.

[0050] The technical solution of this utility model involves setting up a base 100, a transmission component 200, and a light source component in a silicon wafer drying equipment. The transmission component 200 is located on the base 100; the light source component is located on the base 100 and above the transmission component 200. The light source component emits infrared light to irradiate the silicon wafer 600, and the wavelength of the infrared light coincides with the absorption wavelength of the silicon wafer 600. Compared with the existing silicon wafer 600 drying setup that uses mechanical dewatering and hot air drying, the technical solution of this utility model sets up a light source component for emitting infrared light. Since the wavelength of the infrared light coincides with the absorption wavelength of the silicon wafer 600, the silicon wafer 600 is dried non-contactly using the overlapping wavelength, reducing damage to the silicon wafer 600 during the drying process and improving the quality of the silicon wafer 600.

[0051] In one embodiment, the wavelength of the infrared light is greater than or equal to 980 nm and less than or equal to 1080 nm.

[0052] Infrared light with wavelengths greater than or equal to 980 nm and less than or equal to 1080 nm belongs to near-infrared light, which is invisible, has good penetrating power, and a certain thermal effect. In one embodiment, the peak value of the absorption band of the silicon wafer 600 is between 980 nm and 1080 nm, and the wavelength range of infrared light can cover the absorption peak value of the silicon wafer 600, allowing the silicon wafer 600 to quickly absorb the energy of infrared light to rapidly evaporate the moisture on its surface. Of course, in other embodiments, the wavelength range of the infrared light emitted by the light source component can be flexibly set according to the absorption band of the silicon wafer 600, and is not limited here.

[0053] The technical solution of this utility model embodiment can achieve non-contact and rapid drying of silicon wafer 600 by limiting the wavelength of infrared light; by using the overlapping wavelength of infrared light for drying, it is targeted and avoids burns and damage to operators and other structures during the heating process, thus improving the safety of drying.

[0054] Please see Figures 1 to 3 In one embodiment, the light source assembly includes a bracket 310 and a light generator 320. The bracket 310 is detachably mounted on the base 100. The light generator 320 is mounted on the bracket 310 and emits light in the direction of the transmission assembly 200. The light generator 320 is used to emit infrared light.

[0055] In one embodiment, the bracket 310 is detachably mounted on the base 100, and the light generator 320 is mounted on the side of the bracket 310 facing the transmission component 200, with the light emission direction of the light generator 320 facing the transmission component 200. In another embodiment, the bracket 310 includes a connecting plate 312 and a fixing base 311. The fixing base 311 is mounted on one side of the support plate 130 and is detachably connected to the base 100, and the light generator 320 is fixed to the fixing base 311.

[0056] In one embodiment, the light generator 320 is configured as a surface light source. Specifically, in one embodiment, the light generator 320 is configured as a vertical-cavity surface-emitting laser (VCSEL) array, comprising multiple VCSEL units arranged in a two-dimensional array to form a surface light source. The VCSEL array emits light directly, without relying on optical fibers, and its divergence angle is typically between 10° and 20°, or even smaller, resulting in more concentrated light. In another embodiment, the light generator 320 includes an edge-emitting semiconductor laser diode (EDD) array and a microlens or DOE. The edge-emitting DCD array comprises multiple laser emitting units arranged in a linear or strip-like pattern, shaped into a surface light source by configuring microlenses or DOEs. The edge-emitting DCD array also does not rely on optical fibers, emitting light directly in space, and the divergence angle of the optically shaped edge-emitting DCD array is typically between 1° and 10°, similarly achieving light concentration.

[0057] The technical solution of this utility model embodiment, by configuring the light generator 320 as a surface light source, can form a larger irradiation area, while providing high power density, high uniformity and low heat load, ensuring the uniformity of light in the irradiation area 321, and thus ensuring drying uniformity and drying efficiency.

[0058] Please see Figures 2 to 4 In one embodiment, the light source assembly further includes an adjustment structure connecting the bracket 310 and the base 100. The adjustment structure is used to adjust the distance between the light generator 320 and the transmission assembly 200.

[0059] In one embodiment, the adjustment structure includes locking teeth 313 and a support plate 130. The locking teeth 313 are located on the side of the bracket 310, and multiple locking teeth 313 are evenly spaced, forming a locking slot between adjacent locking teeth 313. The support plate 130 is located on the base 100 and above the transmission component 200. The support plate 130 has a notch 131 through which the bracket 310 can pass, allowing the sidewall of the notch 131 to engage with any locking slot. In one embodiment, both the support plate 130 and the fixing seat 311 are parallel to the plane of the transmission component 200, and the axial direction of the notch 131 and the connecting plate 312 are perpendicular to the plane of the transmission component 200. The locking teeth 313 are located on the side of the connecting plate 312 and are evenly spaced along a direction perpendicular to the plane of the transmission component 200. The spacing between adjacent locking teeth 313 is adapted to the diameter and depth of the notch 131 to ensure that the sidewall of the notch 131 can stably engage with any locking slot. By engaging the notch 131 with bayonets at different positions, the distance between the light generator 320 and the transmission component 200 can be adjusted, thereby changing the area of ​​the irradiation region 321. In one embodiment, two connecting plates 312 are provided parallel to each other, and both connecting plates 312 are provided with locking teeth 313 to engage with the same sidewall of the notch 131, further ensuring the installation stability of the light generator 320. Of course, in other embodiments, one or more connecting plates 312 may be provided, which is not limited here. In one embodiment, the fixing base 311 is provided with a limiting member 330 on the side facing the support plate 130. The extending direction of the limiting member 330 is parallel to the extending direction of the connecting plate 312, and a limiting member 330 is provided on each of the opposite sides of the connecting plate 312. Both limiting members 330 abut against the outer periphery of the notch 131 to further provide support and limitation for the light generator 320, so that the light generator 320 can be stably installed on the support plate 130. The limiting member 330 is telescopically adjustable to accommodate the distance between the fixed plate and the support plate 130. The limiting member 330 can be an elastic element such as a spring or silicone, or a telescopic rod, etc., and is not limited here. Of course, in other embodiments, the adjustment structure may also include a threaded hole in the support plate 130, with a threaded rod on the connecting plate 312 for screwing into the threaded hole. Rotating the connecting plate 312 adjusts the distance between the light generator 320 and the transmission assembly 200, and is not limited here either.

[0060] The technical solution of this utility model embodiment, by setting an adjustment structure, can realize the adjustment of the distance between the light generator 320 and the transmission component 200, thereby realizing the adjustment of the area of ​​the irradiation area 321, and improving the flexibility of use.

[0061] Please see Figure 2In one embodiment, the silicon wafer drying equipment further includes an infrared thermal imaging sensor 410 and a control system (not shown in the figure). The infrared thermal imaging sensor 410 is disposed on the base 100 and located above the transmission assembly 200; the control system is electrically connected to the infrared thermal imaging sensor 410 and the light source assembly.

[0062] In one embodiment, an infrared thermal imaging sensor 410 is disposed on the side of the support plate 130 facing the transmission assembly 200 and close to the light generator 320. The infrared thermal imaging sensor 410 is tilted at approximately 45° relative to the support plate 130 to ensure that the infrared thermal imaging sensor 410 can completely detect the irradiated area 321. The infrared thermal imaging sensor 410 can scan the silicon wafer 600 located in the irradiated area 321 in real time and generate a temperature image. The infrared thermal imaging sensor 410 transmits the generated real-time temperature image to the control system, so that the control system controls the power of the light generator 320 according to the real-time temperature. In one embodiment, the control system includes a processing unit and a controller. The processing unit is electrically connected to the controller and the infrared thermal imaging sensor 410, and the controller is electrically connected to the light generator 320. The processing unit has a preset temperature value. By comparing the real-time temperature with the preset temperature value, it determines whether the power of the light generator 320 needs to be adjusted and how the power should be adjusted, and then controls the light generator 320 to change its power through the controller. The specific functions of the control system can be implemented by a logic algorithm, which is not limited here. In one embodiment, the number of infrared thermal imaging sensors 410 can be flexibly set according to the number of light generators 320 to achieve one-to-one detection of the irradiated area 321. There is no limitation on this.

[0063] The technical solution of this utility model embodiment, by setting an infrared thermal imaging sensor 410 and a control system, can detect the drying status of the silicon wafer 600 by the light generator 320, and control the power of the light generator 320 according to the detection status, thereby improving the reliability and safety of drying, avoiding damage to the silicon wafer 600, and thus improving the quality of the silicon wafer 600.

[0064] Please see Figure 1 and Figure 2 In one embodiment, the silicon wafer drying equipment further includes an air knife 500, which is detachably mounted on the base 100 and located above the transmission assembly 200. The air knife 500 and the light source assembly are arranged sequentially along the transmission direction of the transmission assembly 200.

[0065] In one embodiment, the base 100 includes a side plate 120. The end of the air knife 500 and the end of the support plate 130 are both disposed on the side plate 120. The air knife 500 is electrically connected to the control system, which can control the air knife 500 to change the air volume and air speed. The air outlet direction of the air knife 500 is towards the transmission component 200. The air knife 500 forms a hot air area on the transmission component 200. The transmission component 200 drives the silicon wafer 600 to move and sequentially pass through the hot air area and the irradiation area 321. The air knife 500 can perform pre-dehydration treatment on the silicon wafer 600.

[0066] In one embodiment, the sidewall of the base 100 is provided with a plurality of mounting steps 121, which are spaced apart in a direction perpendicular to the conveying direction of the transmission assembly 200, and the end of the air knife 500 is detachably mounted on any of the mounting steps 121.

[0067] In one embodiment, a plurality of mounting steps 121 are arranged parallel to each other on the side plate 120. Each mounting step 121 is provided with a first connecting hole, and the end of the air knife 500 is provided with a second connecting hole 510. The second connecting hole 510 can be detachably connected to the first connecting hole of any mounting step 121 by means of fasteners. The plurality of mounting steps 121 are arranged at intervals in a direction perpendicular to the conveying direction of the transmission assembly 200. By using fasteners to connect the second connecting hole 510 to the first connecting hole at different positions, the distance between the air knife 500 and the transmission assembly 200 can be adjusted. The fasteners can be screws or pins, etc., and are not limited here. Of course, in other embodiments, the air knife 500 can also be detachably connected to any mounting step 121 by means of snap-fit ​​or adsorption, and are not limited here.

[0068] The technical solution of this utility model embodiment, by setting the air knife 500, can pre-dehydrate the silicon wafer 600, thereby improving the drying efficiency; by setting the installation step 121, the distance between the air knife 500 and the transmission component 200 can be adjusted, thereby adjusting the area of ​​the hot air zone and improving the flexibility of use.

[0069] This utility model also proposes a silicon wafer processing production line, including the silicon wafer drying equipment of the above embodiments, the specific structure of which refers to the above embodiments. Since this silicon wafer processing production line adopts all the technical solutions of all the above embodiments, it possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated further here.

[0070] The above description is merely an exemplary embodiment of the present utility model and does not limit the scope of protection of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present utility model.

Claims

1. A silicon wafer drying device, characterized in that, include: abutment; The transmission component is located on the base station; as well as A light source assembly is disposed on the base and located above the transmission assembly. The light source assembly is used to emit infrared light and illuminate the silicon wafer. The wavelength of the infrared light coincides with the absorption wavelength of the silicon wafer.

2. The silicon wafer drying equipment as described in claim 1, characterized in that, The wavelength of the infrared light is greater than or equal to 980 nm and less than or equal to 1080 nm.

3. The silicon wafer drying equipment as described in claim 1, characterized in that, The light source assembly includes: The bracket is detachably mounted on the base; and A light generator is disposed on the bracket and its light emission direction is toward the transmission component. The light generator is used to emit the infrared light.

4. The silicon wafer drying equipment as described in claim 3, characterized in that, The light generator is configured as a surface light source.

5. The silicon wafer drying equipment as described in claim 3, characterized in that, The light source assembly also includes: An adjustment structure is provided to connect the support and the base, and the adjustment structure is used to adjust the distance between the light generator and the transmission component.

6. The silicon wafer drying equipment as described in claim 5, characterized in that, The adjustment structure includes: Clamping teeth are provided on the side of the bracket, and multiple clamping teeth are evenly spaced, forming a clamping opening between adjacent clamping teeth; and A support plate is disposed on the base and located above the transmission component. The support plate has a notch, and the bracket can pass through the notch so that the side wall of the notch can be engaged with any of the slots.

7. The silicon wafer drying equipment as described in claim 1, characterized in that, The silicon wafer drying equipment also includes: An infrared thermal imaging sensor is disposed on the base and located above the transmission component; and The control system is electrically connected to the infrared thermal imaging sensor and the light source assembly.

8. The silicon wafer drying equipment as described in claim 1, characterized in that, The silicon wafer drying equipment also includes: The air knife is detachably mounted on the base and located above the transmission component. The air knife and the light source component are arranged sequentially along the transmission direction of the transmission component.

9. The silicon wafer drying equipment as described in claim 8, characterized in that, The base has multiple mounting steps on its sidewalls. These mounting steps are spaced apart in a direction perpendicular to the conveying direction of the transmission component. The end of the air knife is detachably mounted on any of the mounting steps.

10. A silicon wafer processing production line, characterized in that, Includes the silicon wafer drying equipment as described in any one of claims 1 to 9.

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