An assembly structure for a current output type pressure sensor

Abstract

This utility model discloses an assembly structure for a current output type pressure sensor, including a sensor housing with a component cavity inside. Within the component cavity, a pressure-sensing core, a lower ring seat, a circuit board, and an upper ring seat are arranged sequentially from bottom to top. An annular pressure groove is formed on the bottom inner ring side of the lower ring seat, pressing the pressure-sensing core against it. An annular support groove is formed on the top inner ring side of the lower ring seat, and the circuit board is placed within this groove. A slot is provided on the top surface of the lower ring seat, located outside the annular support groove, and this slot is deformable. A cone-shaped insertion point is located on the bottom surface of the upper ring seat, opposite the slot. When the cone-shaped insertion point is inserted into the slot, it expands the slot and compresses the annular support groove to fit tightly against the circuit board. This utility model prevents the circuit board from shaking within the pressure sensor and facilitates heat dissipation from the circuit board.

Description

Technical Field

[0001] This utility model relates to the field of pressure sensor technology, and in particular to an assembly structure for a current output type pressure sensor. Background Technology

[0002] Current-output pressure sensors typically output standard current signals, such as 4-20mA pressure sensors. They are among the most widely used and core pressure measurement devices in modern industrial automation and process control, converting physical pressure signals into standard current signals that are easy to transmit, process, and have strong anti-interference capabilities. The circuit board is a crucial component within a current-output pressure sensor, containing electronic components on both its top and bottom surfaces. During operation, the circuit board generates heat, thus requiring a good heat dissipation environment. Furthermore, after assembly, it's essential to prevent the circuit board from shifting within the sensor to avoid potential failure. Therefore, the assembly structure of the pressure sensor needs to be optimized. Summary of the Invention

[0003] Purpose of the invention: In order to overcome the shortcomings of the existing technology, this utility model provides an assembly structure for a current output type pressure sensor, which prevents the circuit board from shaking inside the pressure sensor and facilitates heat dissipation of the circuit board.

[0004] Technical Solution: To achieve the above objectives, this utility model provides an assembly structure for a current output type pressure sensor, comprising a sensor housing, an inner cavity containing a pressure-sensing core, a lower ring seat, a circuit board, and an upper ring seat arranged sequentially from bottom to top within the component cavity; an annular pressure groove is formed at the bottom of the inner ring side of the lower ring seat, and the lower ring seat presses down on the pressure-sensing core through the annular pressure groove; an annular support groove is formed at the top of the inner ring side of the lower ring seat, and the circuit board is placed in the annular support groove; an insertion slot is provided on the top surface of the lower ring seat, the insertion slot being located outside the annular support groove, and the insertion slot being deformable; a cone is provided on the bottom surface of the upper ring seat opposite to the insertion slot, and when the cone is inserted into the insertion slot, it expands the insertion slot and squeezes the annular support groove to fit tightly against the circuit board.

[0005] Furthermore, the depth of the annular groove is greater than the thickness of the circuit board; a latch is provided on the inner wall of the annular groove, and the latch is opposite to the upper edge of the circuit board; when the insert cone opens the insertion slot, it pushes the latch, causing the latch to deform and lock onto the upper edge of the circuit board.

[0006] Furthermore, a protrusion is provided on one side of the cone bottom of the insert; when the insert is inserted into the slot, the protrusion faces the slot and pushes against it.

[0007] Furthermore, the insertion slot, the insertion cone, and the bayonet are all annular structures.

[0008] Furthermore, the top surface of the lower ring seat is provided with several cuts that cut into the insertion slot and the snap-fit, dividing the insertion slot and the snap-fit ​​into at least two segments.

[0009] Furthermore, the inner diameter of the upper ring seat is smaller than the outer diameter of the circuit board.

[0010] Furthermore, a sealing ring is provided between the pressure-sensing core and the bottom of the component cavity.

[0011] Furthermore, an electrical connector is riveted to the sensor housing, forming a component cavity between the sensor housing and the electrical connector.

[0012] Furthermore, the annular pressure groove and the annular support groove in the lower ring seat are spaced apart, leaving a heat dissipation cavity between the circuit board and the pressure-sensitive core; the upper ring seat is positioned between the electrical connector and the circuit board, also leaving a heat dissipation cavity between the electrical connector and the circuit board.

[0013] Furthermore, both the upper ring seat and the lower ring seat are made of metallic thermally conductive materials.

[0014] Beneficial effects: The assembly structure of the current output type pressure sensor of this utility model has the following beneficial effects:

[0015] 1) The pressure sensor has an upper ring seat and a lower ring seat. The circuit board is placed in the annular groove of the lower ring seat. There is an insertion slot on the top surface of the lower ring seat and an insertion cone on the bottom surface of the upper ring seat opposite to the insertion slot. When the insertion cone is inserted into the insertion slot, it opens the insertion slot and squeezes the annular groove to fit tightly against the circuit board, thereby preventing the circuit board from shaking inside the pressure sensor.

[0016] 2) The upper and lower ring seats can separate the circuit board, electrical connectors and pressure sensing core, thus leaving heat dissipation cavities on both sides of the circuit board, which is beneficial to the heat dissipation of the circuit board; both the upper and lower ring seats are metal rings, which makes it easier to conduct the heat generated by the circuit board to the outside of the pressure sensor. Attached Figure Description

[0017] Appendix Figure 1 This is a schematic diagram of the overall structure of the pressure sensor;

[0018] Appendix Figure 2 This is a schematic diagram of the lower ring base;

[0019] Appendix Figure 3 This is a schematic diagram illustrating the changes in the insertion of the cone into the slot. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings.

[0021] As attached Figures 1 to 2The assembly structure of a current output type pressure sensor includes a sensor housing 1, inside which is a component cavity 2. Within the component cavity 2, a pressure-sensing core 3, a lower ring seat 4, a circuit board 5, and an upper ring seat 6 are arranged sequentially from bottom to top. An electrical connector 14 is riveted to the sensor housing 1, pressing against the upper ring seat 6. The component cavity 2 is formed between the sensor housing 1 and the electrical connector 14. The pressure-sensing core 3 is electrically connected to the circuit board 5 via a pin 16, and the circuit board 5 is connected to the electrical connector 14 via a wire 15. When pressure is applied to the pressure-sensing core 3, it converts the pressure information into an electrical signal and transmits it to the circuit board 5. The circuit board 5 then outputs the electrical signal through the electrical connector 14.

[0022] A pressure-sensing channel is also provided on the sensor housing 1, through which fluid can reach the pressure-sensing surface of the pressure-sensing core 3, thereby applying pressure to the pressure-sensing core 3. A sealing ring 13 is provided between the pressure-sensing core 3 and the bottom of the component cavity 2 to prevent fluid from seeping into the component cavity 2.

[0023] The lower ring seat 4 is separated from the bottom of the component cavity 2 by a gap. An annular pressure groove 7 is formed on the bottom of the inner ring side of the lower ring seat 4. The annular pressure groove 7 surrounds the pressure-sensing core 3. The lower ring seat 4 presses the pressure-sensing core 3 through the annular pressure groove 7, pressing the pressure-sensing core 3 tightly to the bottom of the component cavity 2.

[0024] An annular groove 8 is formed on the top of the inner ring side of the lower ring seat 4, and the circuit board 5 is placed in the annular groove 8. The outer diameter of the annular groove 8 is slightly larger than the outer diameter of the circuit board 5, making it easier for the circuit board 5 to be placed in the annular groove 8. However, this also causes the circuit board 5 to wobble in the annular groove 8. The wobble of the circuit board 5 in the pressure sensor will increase the risk of failure of the circuit board 5. Therefore, it is necessary to prevent the circuit board 5 from wobble in the pressure sensor.

[0025] In this invention, a slot 9 is provided on the top surface of the lower ring seat 4. The slot 9 is located outside the annular groove 8 and is deformable. A cone 10 is located on the bottom surface of the upper ring seat 6, opposite to the slot 9. When the cone 10 is inserted into the slot 9, it expands the slot 9 and also squeezes the annular groove 8 into a narrower shape. After the annular groove 8 narrows, its inner wall deforms to fit tightly against the circuit board 5, thus preventing the circuit board 5 from shaking within the annular groove 8. Furthermore, when the cone 10 is inserted into the slot 9, it also exerts a squeezing effect on the outer ring side of the lower ring seat 4, causing the outer ring of the lower ring seat 4 to deform and fit tightly against the inner wall of the component cavity 2, preventing the lower ring seat 4 and the circuit board 5 from shaking as a whole within the component cavity 2.

[0026] Furthermore, since the pressure sensor in this application is a current-output type pressure sensor, its internal circuit board 5 has electronic components on both its upper and lower surfaces. When the current-output type pressure sensor is working, the circuit board 5 generates heat, and the upper ring seat 4 and lower ring seat 6 provide a good heat dissipation environment for the circuit board 5. Specifically, the annular pressure groove 7 and the annular support groove 8 in the lower ring seat 4 are spaced apart, thus leaving a heat dissipation cavity between the circuit board 5 and the pressure-sensing core 3. The electrical connector 14 presses onto the upper ring seat 6, meaning the upper ring seat 6 is positioned between the electrical connector 14 and the circuit board 5, thus also leaving a heat dissipation cavity between the electrical connector 14 and the circuit board 5. The heat dissipation cavities on both sides of the circuit board 5 facilitate heat dissipation. Both the upper ring seat 6 and the lower ring seat 4 are made of metallic thermally conductive materials with good thermal conductivity; therefore, the heat generated by the circuit board 5 is more easily conducted to the outside of the pressure sensor through the upper ring seat 6 and lower ring seat 4. During the assembly of the pressure sensor, thermally conductive adhesive can be injected between the upper ring seat 6, the lower ring seat 4, the circuit board 5, and the sensor housing to further improve the heat dissipation effect of the circuit board 5.

[0027] The inner diameter of the upper ring seat 6 is smaller than the outer diameter of the circuit board 5, so the upper ring seat 6 can prevent the circuit board 5 from detaching from the annular support groove 8.

[0028] In one embodiment, the depth of the annular groove 8 is slightly less than the thickness of the circuit board 5. In this case, the upper ring seat 6 presses directly onto the circuit board 5 and presses the circuit board 5 tightly within the annular groove 8, thereby preventing the circuit board 5 from wobbling up and down within the annular groove 8. However, with this method, the contact area between the upper ring seat 6 and the circuit board 5 is small, resulting in poor overall structural stability. Moreover, this also leads to poor heat conduction between the upper ring seat 6 and the lower ring seat 5, which is detrimental to the heat dissipation of the circuit board 5.

[0029] In another embodiment, the depth of the annular groove 8 is slightly greater than the thickness of the circuit board 5. When the upper ring seat 6 presses on the lower ring seat 4, the bottom surface of the upper ring seat 6 is separated from the circuit board 5 by a gap. In this case, the upper ring seat 6 directly presses on the lower ring seat 4, and the contact area between the upper ring seat 6 and the lower ring seat 4 is large, thus the overall structural stability is high. A latch 11 is provided on the inner wall of the annular groove 8, and the latch 11 is located near the upper edge of the inner wall of the annular groove 8. When the circuit board 5 is placed in the annular groove 8, the latch 11 is opposite to the upper edge of the circuit board 5, that is, the upper edge of the latch 11 is higher than the upper edge of the circuit board 5, and the lower edge of the latch 11 is lower than the upper edge of the circuit board 5. (See attached diagram) Figure 3 As shown, when the insert cone 10 opens the slot 9, the insert cone 10 will push the latch 11 toward the circuit board 5 to deform, so that the latch 11 deforms to catch the upper edge of the circuit board 5, thereby preventing the circuit board 5 from shaking up and down in the annular groove 8.

[0030] Specifically, a protrusion 12 is provided on the side of the bottom of the insertion cone 10 near the circuit board 5. When the insertion cone 10 is inserted into the insertion slot 9, the protrusion 12 faces and pushes against the retaining slot 11, thereby deforming the retaining slot 11. (See attached diagram) Figure 3 As shown, the cross-section of the slot 9 is conical, and the cross-section of the cone 10 is also conical. The taper of the cone 10 is greater than that of the slot 9, so the cone 10 will expand the slot 9 when it is inserted into it. Due to the presence of the protrusion 12, the deformation at the location of the latch 11 is greater, so that the latch 11 can deform to fasten onto the circuit board 5, thereby preventing the circuit board 5 from shaking up and down.

[0031] The insertion slot 9, the insertion cone 10, and the bayonet 11 are all annular structures. (See attached image) Figure 2 As shown, the top surface of the lower ring seat 4 is provided with several cuts 17. The cuts 17 cut into the slot 9 and the bayonet 11, dividing the slot 9 and the bayonet 11 into at least two segments, thereby making the slot 9 and the bayonet 11 more easily deformable.

[0032] In the assembly process of this utility model's pressure sensor, the sealing ring 13, pressure-sensing core 3, lower ring seat 4, circuit board 5, and upper ring seat 6 are placed into the component cavity 2. The electrical connector 14 is pressed onto the upper ring seat 6. The pressure-sensing core 3 is connected to the circuit board 5 via a pin 16, and the circuit board 5 is connected to the electrical connector 14 via a wire 15. Then, the upper edge of the sensor housing 1 is pressed against the electrical connector 14 by riveting. During the riveting process, pressure is transmitted to the upper ring seat 6, causing the insert cone 10 to insert into the slot 9, opening the slot 9, and squeezing the annular groove 8 to fit tightly against the circuit board 5. In addition, the protrusion 12 on the insert cone 10 pushes the retainer 11, causing the retainer 11 to lock onto the circuit board 5, thereby preventing the circuit board 5 from shaking inside the pressure sensor and reducing the risk of circuit board 5 failure. In addition, the upper ring seat 6 and the lower ring seat 4 can separate the circuit board 5, the electrical connector 14 and the pressure sensing core 3, thereby leaving heat dissipation cavities on both sides of the circuit board 5, which is beneficial to the heat dissipation of the circuit board 5.

[0033] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. An assembly structure for a current output type pressure sensor, characterized in that: The sensor housing (1) contains a component cavity (2), and the component cavity (2) contains a pressure-sensing core (3), a lower ring seat (4), a circuit board (5), and an upper ring seat (6) arranged sequentially from bottom to top. An annular groove (7) is formed at the bottom of the inner ring side of the lower ring seat (4), and the lower ring seat (4) presses the pressure-sensing core (3) through the annular groove (7). An annular support groove (8) is formed at the top of the inner ring side of the lower ring seat (4), and the circuit board (5) is placed in the annular support groove (8). A slot (9) is provided on the top surface of the lower ring seat (4), and the slot (9) is located outside the annular support groove (8), and the slot (9) is deformable. The bottom surface of the upper ring seat (6) has a cone (10) opposite to the slot (9). When the cone (10) is inserted into the slot (9), it opens the slot (9) and squeezes the annular support groove (8) to fit tightly against the circuit board (5).

2. The assembly structure of a current output type pressure sensor according to claim 1, characterized in that: The depth of the annular groove (8) is greater than the thickness of the circuit board (5); a slot (11) is provided on the inner wall of the annular groove (8), and the slot (11) is opposite to the upper edge of the circuit board (5); when the insert cone (10) opens the insert slot (9), it pushes the slot (11) so that the slot (11) deforms to catch the upper edge of the circuit board (5).

3. The assembly structure of a current output type pressure sensor according to claim 2, characterized in that: The bottom of the insert (10) is provided with a protrusion (12); when the insert (10) is inserted into the insert slot (9), the protrusion (12) is opposite to the slot (11) and pushes the slot (11).

4. The assembly structure of a current output type pressure sensor according to claim 2, characterized in that: The insertion slot (9), the insertion cone (10), and the bayonet (11) are all annular structures.

5. The assembly structure of a current output type pressure sensor according to claim 4, characterized in that: The top surface of the lower ring seat (4) is provided with several cuts (17), which cut into the insertion slot (9) and the bayonet (11), dividing the insertion slot (9) and the bayonet (11) into at least two segments.

6. The assembly structure of a current output type pressure sensor according to claim 1, characterized in that: The inner diameter of the upper ring seat (6) is smaller than the outer diameter of the circuit board (5).

7. The assembly structure of a current output type pressure sensor according to claim 1, characterized in that: A sealing ring (13) is provided between the pressure-sensing core (3) and the bottom of the component cavity (2).

8. The assembly structure of a current output type pressure sensor according to claim 1, characterized in that: An electrical connector (14) is riveted to the sensor housing (1), and a component cavity (2) is formed between the sensor housing (1) and the electrical connector (14).

9. The assembly structure of a current output type pressure sensor according to claim 8, characterized in that: The annular pressure groove (7) and the annular support groove (8) in the lower ring seat (4) are spaced apart, so that a heat dissipation cavity is left between the circuit board (5) and the pressure sensing core (3); the upper ring seat (6) is placed between the electrical connector (14) and the circuit board (5), so that a heat dissipation cavity is also left between the electrical connector (14) and the circuit board (5).

10. The assembly structure of a current output type pressure sensor according to claim 9, characterized in that: Both the upper ring seat (6) and the lower ring seat (4) are made of metal thermally conductive materials.

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