A stress adjusting device and a chip stress testing system for chip stress testing

Abstract

This utility model relates to a stress adjustment device and a chip stress testing system for chip stress testing, comprising: a base; a cantilever structure, one end of which is connected to the base and the other end is suspended, for supporting the chip under test; a cold screen, which covers the base and the chip under test; and a cantilever driving assembly, the bottom of which is located inside the cold screen and connected to the suspended end of the cantilever structure, and the top extending to the outside of the cold screen. This invention allows the cantilever structure to bend and deform by applying force to the cantilever driving assembly during testing, thereby applying stress changes of different directions and magnitudes to the chip under test, and thus obtaining chip performance parameters under different stress conditions, without the need to disassemble and reassemble other structures such as the liquid nitrogen Dewar assembly.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing, and in particular to a stress adjustment device and a chip stress testing system for chip stress testing. Background Technology

[0002] Temperature variations in the operating environment can cause thermal stress on chips (such as those used in infrared focal plane detectors), leading to performance degradation and reduced reliability. Therefore, during chip design and manufacturing, it is necessary to test the changes in the chip's photoelectric performance parameters under stress and to improve the chip structure design based on the results of these parameter changes.

[0003] For example, in the application document with application number 202411184799.4 and patent name "Comprehensive Testing Device and Testing Method for Multi-Temperature Zone Stress Deformation of Infrared Detector Chip", the chip is placed on a specially made liquid nitrogen Dewar, and the chip is heated by the Dewar cooling / heating wire to detect the stress change on the chip surface under different temperature environments.

[0004] However, the above technical solutions can only be used to detect chip stress changes caused by different temperatures. During the detection process, no force can be directly applied to the chip, and the chip stress changes caused by external stress cannot be detected. Utility Model Content

[0005] The purpose of this invention is to provide a stress adjustment device and a chip stress testing system for chip stress testing. During the testing process, the cantilever structure can be driven to bend and deform by applying force to the cantilever drive component, so as to apply stress changes of different directions and magnitudes to the chip under test, thereby obtaining chip performance parameters under different stress conditions, without the need to disassemble and reassemble other structures such as liquid nitrogen Dewar components.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A stress conditioning device for chip stress testing is provided, comprising:

[0008] Base;

[0009] A cantilever structure, with one end connected to the base and the other end suspended, is used to support the chip to be tested.

[0010] A cold screen is placed over the base and the chip under test.

[0011] Additionally, a cantilever drive assembly, the bottom of which is located inside the cold screen and connected to one of the cantilever structures that are suspended, and the top of which extends to the outside of the cold screen.

[0012] Preferably, the stress adjustment device further includes:

[0013] A liquid nitrogen Dewar assembly, which is connected to the base;

[0014] And, a cover, which is sealed to the liquid nitrogen Dewar assembly to form an internal housing space for accommodating the base, cantilever structure, and cold shield;

[0015] The cantilever drive assembly extends to the outside of the cover and is sealed to the cover.

[0016] Preferably, the stress adjustment device further includes: a guide seat having a through hole that threadedly engages with the cantilever drive assembly;

[0017] By driving the portion of the cantilever drive assembly extending outside the cold screen to rotate, the cantilever drive assembly and the through hole undergo threaded transmission, thereby driving the cantilever structure to undergo bending deformation.

[0018] Preferably, the cantilever drive assembly includes: a screw, the bottom of which is connected to one suspended end of the cantilever structure, the top of which extends to the outside of the cold screen and is located inside the cover;

[0019] And a drive rod, the bottom of which is connected to the screw, the top of which passes through the cover and extends to the outside of the cover, the screw and the drive rod rotating synchronously.

[0020] Preferably, the cantilever drive assembly further includes a clamping member connected to the screw, used to clamp and fix one suspended end of the cantilever structure.

[0021] Preferably, the clamping member is an "I" or "C" shaped structure, including an upper plate structure, a connector and a lower plate structure. The upper plate structure is connected to the bottom of the screw, and the two ends of the connector are respectively connected to the upper plate structure and the lower plate structure.

[0022] The cantilever structure has a U-shaped structure at one end, which has a first free end and a second free end that are opposite and parallel to each other, and a slot is formed between the first free end and the second free end to engage with the connector.

[0023] Preferably, the stress adjustment device further includes:

[0024] A cylindrical component that connects to the outer wall of the cover, with the top of the drive rod extending to the outside of the cylindrical component;

[0025] A sealing ring is disposed between the inner wall surface of the cylindrical component and the outer wall surface of the drive rod to seal the mating gap;

[0026] A sealing cap is fitted over the cylindrical member and threaded to the outer wall of the cylindrical member, and the top of the drive rod extends to the outside of the sealing cap.

[0027] Preferably, the screw has a hollow receiving portion, and the bottom of the drive rod is sleeved inside the receiving portion and fixedly connected to the inner wall surface of the receiving portion.

[0028] Preferably, the stress adjustment device further includes:

[0029] A filter, which is mounted on the cold screen;

[0030] And a light-transmitting sheet, which is mounted on the cover;

[0031] Furthermore, the positions of the filters and light-transmitting sheets correspond to the chip under test.

[0032] On the other hand, a chip stress testing system is also provided, which includes the stress adjustment device and a signal analysis component. The signal analysis component is used to acquire the photoelectric signal change of the chip under test when the cantilever drive component applies a stress change to the chip under test, analyze it, and output the analysis result.

[0033] In summary, this utility model has the following advantages compared with the prior art:

[0034] This invention can regulate the temperature of the environment in which the chip under test is located by using liquid nitrogen Dewar cooling components to meet the operating temperature requirements of the chip under test, so that the chip under test can be subjected to stress testing in the operating temperature environment. It is especially suitable for stress testing of infrared detector chips that need to operate in low temperature environments.

[0035] Meanwhile, during the testing process, only the part of the cantilever drive component that extends outside the cover needs to be applied to drive the cantilever structure to bend and deform, so as to apply stress changes of different directions and magnitudes to the chip under test, thereby obtaining the chip performance parameters under different stress conditions, without the need to disassemble and reassemble other structures such as the liquid nitrogen Dewar component. Attached Figure Description

[0036] Figure 1 This is a partial structural diagram of the stress adjustment device (excluding the cold shield and cover) in this utility model;

[0037] Figure 2 This is a partial cross-sectional view of the stress adjustment device in this utility model;

[0038] Figure 3 This is a cross-sectional view of the screw and clamping component in this utility model;

[0039] Figure 4This is an overall structural diagram of the cantilever structure in this utility model. Detailed Implementation

[0040] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the protection scope of the present utility model.

[0041] Example 1

[0042] like Figure 1-2 As shown, this embodiment provides a stress adjustment device for chip stress testing, which includes:

[0043] Liquid nitrogen Dewar assembly 1;

[0044] Base 2, which is connected to the liquid nitrogen Dewar assembly 1;

[0045] The cantilever structure 4 has one end connected to the base 2 and the other end suspended, used to support the chip to be tested 100. In this embodiment, the chip to be tested 100 includes an infrared detector chip, which can be connected to the surface of the cantilever structure 4 by means of low-temperature adhesive bonding. The cantilever structure 4 is a sheet-like structure that can be bent and deformed, and it can be made of materials such as metal and plastic.

[0046] The cold screen 5 is placed over the guide seat 3, the base 2 and the chip to be tested 100, and is connected to the liquid nitrogen Dewar assembly 1.

[0047] The cover 6 is sealed to the liquid nitrogen Dewar assembly 1 to form an internal accommodating space 61 for accommodating the base 2, cantilever structure 4, and cold shield 5. For example, in this embodiment, the joint 62 between the liquid nitrogen Dewar assembly 1 and the cover 6 can be connected by threads or by adding sealing rings or other sealing components to achieve a sealing effect.

[0048] The cantilever drive assembly has its bottom passing through the cover 6 and the cold screen 5 in sequence, extending into the interior of the cold screen 5 and connecting to the suspended end of the cantilever structure 4. Its top extends to the exterior of the cover 6 and is sealed to the cover 6. By applying a force to the portion of the cantilever drive assembly extending to the exterior of the cover 6 (e.g., by applying a force to the cantilever drive assembly through a pushing or pulling motion in the height direction), the cantilever drive assembly generates a linear motion in the height direction, thereby driving the cantilever structure 4 to undergo bending deformation, and further applying stress changes to the chip 100 under test.

[0049] In this embodiment, the connection between the liquid nitrogen Dewar assembly 1 and the base 2, and the connection between the base 2 and the cantilever structure 4, can be completed by screws / bolts or other structures. The chip under test 100 is connected to the control unit (such as a PCB board) on the liquid nitrogen Dewar assembly 1 by wire bonding technology, so that the photoelectric signal generated by the chip under test 100 can be transmitted to the outside of the cover 6 through the control unit, so as to analyze the photoelectric signal and obtain the relevant performance parameters of the chip under test 100.

[0050] During stress testing, the liquid nitrogen Dewar assembly 1 is evacuated and filled with liquid nitrogen for cooling, so that the internal ambient temperature of the cold screen 5 is reduced to meet the operating temperature requirements of the chip under test 100, such as the temperature being reduced to 80K or below, to meet the operating temperature requirements of the infrared focal plane detector chip, etc.

[0051] A force is applied to the cantilever drive assembly, causing it to move linearly in the height direction. This further drives the cantilever structure 4, connected to the bottom of the cantilever drive assembly, to undergo upward / downward bending deformation, thereby applying compressive / tensile stress to the chip under test 100. Simultaneously, in this embodiment, the stroke of the linear movement of the cantilever drive assembly can be adjusted to regulate the stress applied to the chip under test 100. For example, increasing the downward stroke of the cantilever drive assembly increases the bending degree of the cantilever structure 4, thus increasing the tensile stress applied to the chip under test 100. Similarly, increasing the upward stroke of the cantilever drive assembly increases the upward bending degree of the cantilever structure 4, thus increasing the compressive stress applied to the chip under test 100. Since the deformation of the chip is typically at the micrometer level, in this embodiment, the stroke of the linear movement of the cantilever drive assembly can be controlled within 5-10 mm to avoid excessive stress on the chip under test 100, which could lead to breakage.

[0052] Therefore, the chip stress testing device in this embodiment has a simple structure and is easy to operate. It can adjust the temperature of the environment where the chip under test is located by cooling with liquid nitrogen Dewar components to meet the working temperature requirements of the chip under test. This allows the chip under test to be stressed under operating temperature conditions, so as to obtain performance parameter data that is closer to the actual working environment. At the same time, during the test, only the part of the cantilever drive component that extends to the outside of the cover needs to be applied to drive the cantilever structure to bend and deform, so as to apply stress changes of different directions and magnitudes to the chip under test, thereby obtaining chip performance parameters under different stress conditions. There is no need to disassemble and reassemble other structures such as liquid nitrogen Dewar components.

[0053] Example 2:

[0054] The only difference between this embodiment and Embodiment 1 is that the stress adjustment device further includes:

[0055] The guide seat 3 has a through hole 31 in the height direction, and the bottom of the guide seat 3 is connected to the liquid nitrogen Dewar assembly 1 and / or the base 2; the bottom of the cantilever drive assembly passes through the through hole 31 and is threaded into the through hole 31.

[0056] By driving the portion of the cantilever drive assembly extending outside the cover 6 to rotate, the cantilever drive assembly and the through hole 31 undergo threaded transmission, causing the cantilever drive assembly to generate linear motion in the height direction, thereby driving the cantilever structure 4 to undergo bending deformation.

[0057] For example, when the portion of the cantilever drive assembly extending outside the cover 6 is driven to rotate clockwise (counterclockwise) by other tools (such as screwdrivers), the cantilever drive assembly moves downward (upward), thereby driving the cantilever structure 4 to undergo downward (upward) deformation to apply tensile stress (compressive stress) to the chip 100 under test.

[0058] Therefore, the movement of the cantilever drive assembly can be made more stable through the threaded transmission between the cantilever drive assembly and the guide seat 3. At the same time, the deformation of the cantilever structure 4 can be adjusted by the rotation amplitude and number of rotations of the cantilever drive assembly. For example, the more clockwise rotations the cantilever drive assembly makes, the greater the downward stroke of the cantilever drive assembly, and the greater the deformation of the cantilever structure 4 that causes it to bend downwards.

[0059] Specifically, the cantilever drive assembly includes:

[0060] The screw 7 passes through the through hole 31 and is threaded into the through hole 31. The bottom of the screw 7 is located below the interior space of the cover 6 and is connected to the suspended end of the cantilever structure 4. The top passes through the cold screen 5 and extends to the outside of the cold screen 5 and is located inside the cover 6. Meanwhile, the screw 7 is clearance-fitted with the cold screen 5.

[0061] The drive rod 8 is connected to the screw 7 at its bottom and passes through the cover 6 at its top, extending to the outside of the cover 6. The screw 7 and the drive rod 8 are coaxially arranged and rotate synchronously. At the same time, the drive rod 8 is clearance-fitted with the cover 6.

[0062] Preferably, in this embodiment, the screw 7 has a hollow receiving portion 71, and the bottom of the drive rod 8 is sleeved inside the receiving portion 71 and fixedly connected to the inner wall surface of the receiving portion 71.

[0063] When the drive rod 8 is driven to rotate clockwise (counterclockwise) to the top of the cover 6 by other tools (such as screwdrivers), the cantilever drive assembly moves downward (upward), which drives the cantilever structure 4 to undergo downward (upward) deformation, thereby applying tensile stress (compressive stress) to the chip 100 under test.

[0064] Example 3:

[0065] The only difference between this embodiment and embodiment 1 or 2 is that, Figure 1 As shown, the cantilever drive assembly further includes a clamping member 16, which is used to clamp and fix one of the cantilever structures 4 that are suspended.

[0066] Specifically, such as Figure 3 As shown, the clamping member 16 is generally of an "I" or "C" shape, including an upper sheet structure 161, a connector 162, and a lower sheet structure 163. The upper sheet structure 161 is connected to the bottom of the screw 7. The two ends of the connector 162 are respectively connected to the upper sheet structure 161 and the lower sheet structure 163. The upper sheet structure 161 and the lower sheet structure 163 are parallel to each other, and the upper sheet structure 161, the connector 162, and the lower sheet structure 163 can be integrally formed.

[0067] At the same time, such as Figure 4 As shown, the cantilever structure 4 has a U-shaped structure at one of its suspended ends, which has a first free end 41 and a second free end 42 that are opposite and parallel to each other, and a slot 43 is formed between the first free end 41 and the second free end 42 to engage with the connector 162.

[0068] When the connector 162 and the slot 43 are engaged with each other, the upper plate structure 161 and the lower plate structure 163 are respectively located above and below the cantilever structure 4, and the orthographic projection of the upper plate structure 161 and the lower plate structure 163 on the cantilever structure 4 completely covers the slot 43. This ensures that when the screw 7 moves upward or downward in a linear motion, the upper plate structure 161 and the lower plate structure 163 can hold the suspended end of the cantilever structure 4 and cause the suspended end of the cantilever structure 4 to bend upward or downward.

[0069] Example 4:

[0070] The only difference between this embodiment and any one of embodiments 1-3 is that, Figure 2 As shown, the stress adjustment device further includes a sealing assembly for sealing the mating point between the drive rod 8 and the cover 6.

[0071] Specifically, the sealing assembly includes:

[0072] A cylindrical member 9 is connected to the outer wall of the cover 6. The bottom of the drive rod 8 passes through the cylindrical member 9 and extends into the interior of the cover 6, while the top extends to the exterior of the cylindrical member 9. In this embodiment, the cylindrical member 9 can be integrally formed with the cover 6.

[0073] A sealing ring 10 is disposed between the inner wall surface of the cylindrical member 9 and the outer wall surface of the drive rod 8 to seal the mating gap between the two.

[0074] A sealing cap 11 is fitted over the cylindrical member 9 and threadedly connected to the outer wall of the cylindrical member 9. The top of the drive rod 8 extends to the outside of the sealing cap 11.

[0075] Therefore, this embodiment uses the sealing assembly to seal the assembly gap between components, so as to prevent cold leakage during the cooling of the liquid nitrogen Dewar assembly 1 and thus affect the cooling effect.

[0076] Example 5:

[0077] The only difference between this embodiment and any one of embodiments 1-4 is that, Figure 2 As shown, the stress adjustment device further includes:

[0078] Filter hole 12 is formed on the cold screen 5;

[0079] A filter 13 is installed at the filter aperture 12;

[0080] Light-transmitting hole 14 is formed on the cover 6;

[0081] A light-transmitting sheet 15 is installed at the light-transmitting hole 14;

[0082] Furthermore, the positions of the filter 13 and the light-transmitting sheet 15 correspond to the chip 100 under test;

[0083] Therefore, the wavelength of light incident on the cold screen 5 can be controlled by the filter 13 and the light-transmitting sheet 15 to adapt to the functions of different types of chips under test 100. For example, when the chip under test 100 is a long-wave chip, a long-wave filter is selected to filter the wavelength of light so that the light incident on the cold screen 5 is a wavelength that can be sensed by the long-wave chip.

[0084] Example 6:

[0085] This embodiment provides a chip stress testing system, which includes: the stress adjustment device described in any one of embodiments 1-5, and a signal analysis component, which is used to acquire the photoelectric signal change of the chip 100 under test when the cantilever drive component applies a stress change to the chip 100 under test, analyze it, and output the analysis results.

[0086] In summary, the chip stress adjustment device in this application has a simple structure, is easy to operate, and has good sealing performance. It can adjust the temperature of the environment where the chip under test is located by cooling with liquid nitrogen Dewar components to meet the operating temperature requirements of the chip under test, so that the chip under test can be subjected to stress testing in the operating temperature environment. It is especially suitable for stress testing of infrared detector chips that need to work in low temperature environments.

[0087] Meanwhile, during the testing process, only the part of the cantilever drive component that extends outside the cover needs to be applied to drive the cantilever structure to bend and deform, so as to apply stress changes of different directions and magnitudes to the chip under test, thereby obtaining the chip performance parameters under different stress conditions, without the need to disassemble and reassemble other structures such as the liquid nitrogen Dewar component.

[0088] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A stress adjustment device for chip stress testing, characterized in that, include: Base; A cantilever structure, with one end connected to the base and the other end suspended, is used to support the chip to be tested. A cold screen is placed over the base and the chip under test. Additionally, a cantilever drive assembly, the bottom of which is located inside the cold screen and connected to one of the cantilever structures that are suspended, and the top of which extends to the outside of the cold screen.

2. The stress adjustment device as described in claim 1, characterized in that, The stress adjustment device further includes: A liquid nitrogen Dewar assembly, which is connected to the base; And, a cover, which is sealed to the liquid nitrogen Dewar assembly to form an internal housing space for accommodating the base, cantilever structure, and cold shield; The cantilever drive assembly extends to the outside of the cover and is sealed to the cover.

3. The stress adjustment device as described in claim 1, characterized in that, The stress adjustment device further includes: a guide seat having a through hole that is threadedly engaged with the cantilever drive assembly; By driving the portion of the cantilever drive assembly extending outside the cold screen to rotate, the cantilever drive assembly and the through hole undergo threaded transmission, thereby driving the cantilever structure to undergo bending deformation.

4. The stress adjustment device as described in claim 2, characterized in that, The cantilever drive assembly includes: a screw, the bottom of which is connected to one of the cantilever structures that are suspended, and the top of which extends to the outside of the cold screen and is located inside the cover; And a drive rod, the bottom of which is connected to the screw, the top of which passes through the cover and extends to the outside of the cover, the screw and the drive rod rotating synchronously.

5. The stress adjustment device as described in claim 4, characterized in that, The cantilever drive assembly further includes a clamping member connected to the screw, used to clamp and fix one suspended end of the cantilever structure.

6. The stress adjustment device as described in claim 5, characterized in that, The clamping component is an "I" or "C" shaped structure, including an upper plate structure, a connector and a lower plate structure. The upper plate structure is connected to the bottom of the screw, and the two ends of the connector are respectively connected to the upper plate structure and the lower plate structure. The cantilever structure has a U-shaped suspended end, which has a first free end and a second free end that are opposite and parallel to each other, and a slot is formed between the first free end and the second free end to engage with the connector.

7. The stress adjustment device as described in claim 4, characterized in that, The stress adjustment device further includes: A cylindrical component that connects to the outer wall of the cover, with the top of the drive rod extending to the outside of the cylindrical component; A sealing ring is disposed between the inner wall surface of the cylindrical component and the outer wall surface of the drive rod to seal the mating gap; A sealing cap is fitted over the cylindrical member and threaded to the outer wall of the cylindrical member, and the top of the drive rod extends to the outside of the sealing cap.

8. The stress adjustment device as described in claim 4, characterized in that, The screw has a hollow receiving portion, and the bottom of the drive rod is sleeved inside the receiving portion and fixedly connected to the inner wall surface of the receiving portion.

9. The stress adjustment device as described in claim 2, characterized in that, The stress adjustment device further includes: A filter, which is mounted on the cold screen; And a light-transmitting sheet, which is mounted on the cover; Furthermore, the positions of the filter and the light-transmitting sheet correspond to the chip under test.

10. A chip stress testing system, characterized in that, include: The stress adjustment device and signal analysis component according to any one of claims 1-9, wherein the signal analysis component is used to acquire the photoelectric signal change of the chip under test when the cantilever drive component applies a stress change to the chip under test, analyze it, and output the analysis result.

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