Tws earphone chip automatic test fixture

Abstract

This utility model provides an automated testing fixture for TWS earphone chips, belonging to the technical field of automated testing fixtures for earphone chips. It includes an operating table with two support rods fixedly connected to its upper surface, and a support plate fixedly connected to the upper ends of the two support rods. In use, an electric telescopic rod pushes a push plate, causing multiple matching dampers to push an upper probe closer to and press against the chip body positioned on the upper surface of the circuit board. This brings the circuit board closer to a lower probe, with the upper end of the lower probe and the lower end of the upper probe respectively contacting the pins of the chip body for testing. When the upper probe is subjected to force, a first spring and dampers absorb kinetic energy during their compression stroke, providing cushioning and preventing damage to the chip body due to excessive pressure. Simultaneously, the first spring and dampers work together to ensure a tight fit between the upper probe and the chip body. This design is applicable to circuit boards and chip bodies of different heights, reducing testing losses and saving production costs.

Description

Technical Field

[0001] This utility model relates to the field of automated testing fixtures for earphone chips, and more particularly to automated testing fixtures for TWS earphone chips. Background Technology

[0002] Earphone chips (such as TWS chips) belong to integrated circuits (ICs), which are miniature components that integrate transistors, resistors, capacitors and other components on a semiconductor substrate. They are responsible for key function processing. Earphone chips contain a variety of functional modules to achieve wireless connection with devices. Audio processing includes decoding audio signals, noise reduction algorithm processing, controlling charging and discharging, and optimizing power consumption. The chip is one of the core components on the circuit board and needs to be soldered on the PCB to work together with other components.

[0003] However, in the existing technical solutions, when testing headphone chips in batches, due to the inconsistent height of the headphone chips and circuit boards after installation, some headphone chips are easily damaged due to excessive force when the probes on the fixture hold the headphone chips, resulting in high testing losses, increased production costs, and defects. Utility Model Content

[0004] The purpose of this invention is to solve the technical problem in the existing technology that when testing earphone chips in batches, due to the inconsistent height of the earphone chips and circuit boards after installation, some earphone chips are easily damaged by excessive force when the probes on the fixture hold the earphone chips, resulting in large testing losses, increased production costs, and other defects. Therefore, an automated testing fixture for TWS earphone chips is proposed.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: an automated testing fixture for TWS earphone chips, including an operating table. Two support rods are fixedly connected to the upper surface of the operating table. A support plate is fixedly connected to the upper end of the two support rods. An electric telescopic rod is fixedly connected to the lower surface of the support plate. A push plate is fixedly connected to the lower end of the electric telescopic rod. Multiple dampers are fixedly connected at equal intervals to the lower surface of the push plate. A first spring is sleeved on the outer surface of each of the multiple dampers. A mounting plate is fixedly connected to one end of each of the multiple dampers. An upper probe is fixedly connected to one side surface of each of the multiple mounting plates. A base is fixedly connected to the upper surface of the operating table. Multiple mounting holes are equidistantly opened on the upper surface of the base. A second spring is fixedly connected to the bottom surface of the inner wall of each of the multiple mounting holes. A support ring is fixedly connected to the upper end of each of the multiple second springs. A lower probe is embedded inside each of the multiple second springs.

[0006] Furthermore, each of the multiple support rings has a circuit board on its upper surface, and each of the multiple circuit boards has a chip body on its upper surface.

[0007] Furthermore, the inner wall surfaces of the multiple mounting holes near the upper end are threaded with limit rings, and the inner wall surfaces of the limit rings are sleeved on the outer surface of the circuit board.

[0008] Furthermore, the outer surfaces of the multiple limiting rings are provided with multiple anti-slip grooves, and the multiple anti-slip grooves are distributed at equal intervals.

[0009] Furthermore, the outer surfaces of the plurality of dampers are each connected to an adjusting ring by a thread, and the plurality of adjusting rings are located above the plurality of first springs.

[0010] Furthermore, a bidirectional bearing is fixedly connected to the lower surface of each of the plurality of adjusting rings, and one end of each of the plurality of bidirectional bearings is fixedly connected to the upper end of the plurality of first springs.

[0011] Furthermore, linear bearings are slidably fitted onto the outer surfaces of both support rods, and the outer surfaces of the two linear bearings are embedded inside the push plate.

[0012] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0013] 1. In this utility model, multiple circuit boards are placed on the upper surfaces of multiple support rings. Then, an electric telescopic rod pushes a push plate, causing multiple matching dampers to push the upper probe closer to and press the chip body set on the upper surface of the circuit board. After the chip body is subjected to force, it is compressed by the support rings to compress the second spring. The support rings slide inside the mounting holes, bringing the circuit board closer to the lower probe. The upper end of the lower probe and the lower end of the upper probe respectively contact the pins of the chip body to test the chip body. When the upper probe is subjected to force, it compresses the first spring and dampers. The compression stroke of the first spring and dampers absorbs kinetic energy and provides buffering to prevent the chip body from being damaged by excessive pressure. At the same time, the first spring and dampers work together to ensure that the upper probe and the chip body fit tightly. This method can be applied to circuit boards and chip bodies of different heights, reducing test losses and saving production costs.

[0014] 2. In this utility model, the lower surface of the limiting ring and the upper surface of the support ring are attached to each other, limiting the stroke of the support ring. The inner wall surface of the limiting ring is attached to the outer surface of the circuit board for positioning the circuit board. When measuring chip bodies of different specifications, the adjusting ring is rotated, so that the adjusting ring moves up and down on the outer surface of the damper through the thread. The first spring is squeezed or stretched by the bidirectional bearing to adjust the initial stroke of the first spring. Under the condition that the stroke of the damper remains unchanged, the pressure of the upper probe on the chip body is controlled. When the lower probe needs to be inspected, the limiting ring is rotated. Multiple anti-slip grooves increase the contact area and friction, prevent slippage, and facilitate disassembly. The two linear bearings slide on the outer surface of the two support rods when the push plate moves, limiting the movement trajectory of the push plate, preventing the push plate from shaking, and ensuring the accuracy of the upper probe. Attached Figure Description

[0015] Figure 1 A three-dimensional structural schematic diagram of the automated testing fixture for TWS earphone chips provided by this utility model;

[0016] Figure 2 A cross-sectional perspective view of the TWS earphone chip automated testing fixture base provided by this utility model;

[0017] Figure 3 A cross-sectional perspective view of the mounting hole of the automated testing fixture for TWS earphone chips provided by this utility model;

[0018] Figure 4 A three-dimensional structural diagram of the damper of the automated testing fixture for TWS earphone chips provided by this utility model.

[0019] Legend: 1. Operating table; 2. Support rod; 3. Linear bearing; 4. Push plate; 5. Support plate; 6. Electric telescopic rod; 7. Base; 8. Limiting ring; 9. Anti-slip groove; 10. Circuit board; 11. Chip body; 12. First spring; 13. Damper; 14. Mounting plate; 15. Mounting hole; 16. Second spring; 17. Upper probe; 18. Lower probe; 19. Support ring; 20. Adjusting ring; 21. Double-sided bearing. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Example 1

[0022] like Figure 1-4As shown, this utility model provides a technical solution: an automated testing fixture for TWS earphone chips, including an operating table 1. Two support rods 2 are fixedly connected to the upper surface of the operating table 1. A support plate 5 is fixedly connected to the upper end of the two support rods 2. An electric telescopic rod 6 is fixedly connected to the lower surface of the support plate 5. A push plate 4 is fixedly connected to the lower end of the electric telescopic rod 6. Multiple dampers 13 are equidistantly fixedly connected to the lower surface of the push plate 4. A first spring 12 is sleeved on the outer surface of each of the multiple dampers 13. One end of each of the multiple dampers 13 is fixedly connected to a mounting... The plate 14 has an upper probe 17 fixedly connected to one side surface of each of the multiple mounting plates 14. The operating table 1 has a base 7 fixedly connected to the top. The upper surface of the base 7 has multiple mounting holes 15 equidistantly opened. The bottom surface of the inner wall of each of the multiple mounting holes 15 has a second spring 16 fixedly connected to it. The upper end of each of the multiple second springs 16 has a support ring 19 fixedly connected to it. The interior of each of the multiple second springs 16 has a lower probe 18 embedded in it. The upper surface of each of the multiple support rings 19 has a circuit board 10. The upper surface of each of the multiple circuit boards 10 has a chip body 11.

[0023] In this embodiment, during use, multiple circuit boards 10 are placed on the upper surfaces of multiple support rings 19. Then, the electric telescopic rod 6 pushes the push plate 4, causing multiple matching dampers 13 to push the upper probe 17 close to and press the chip body 11 disposed on the upper surface of the circuit board 10. After being subjected to force, the chip body 11 compresses the second spring 16 through the support rings 19. The support rings 19 slide inside the mounting holes 15, causing the circuit board 10 to approach the lower probe 18. The upper end of the lower probe 18 and the lower end of the upper probe 17 respectively contact the pins of the chip body 11, thus testing the chip body 11. When probe 17 is subjected to force, it compresses the first spring 12 and damper 13. The compression stroke of the first spring 12 and damper 13 absorbs kinetic energy and provides buffering to prevent damage to the chip body 11 due to excessive pressure. At the same time, the first spring 12 and damper 13 work together to ensure that the upper probe 17 and the chip body 11 fit tightly together. This method is applicable to circuit boards 10 and chip bodies 11 of different heights, reducing testing losses and saving production costs. The electric telescopic rod 6, circuit board 10 and chip body 11 are existing technologies and common devices in daily life. Specific models can be selected according to needs, so they will not be described in detail here.

[0024] Example 2

[0025] like Figure 1-4As shown, the inner wall surfaces of multiple mounting holes 15 near the upper end are threaded with limit rings 8. The inner wall surface of the limit rings 8 is sleeved on the outer surface of the circuit board 10. Multiple anti-slip grooves 9 are opened on the outer surface of the multiple limit rings 8, and the multiple anti-slip grooves 9 are evenly distributed. The outer surfaces of multiple dampers 13 are threaded with adjusting rings 20. The multiple adjusting rings 20 are located above the multiple first springs 12. The lower surfaces of the multiple adjusting rings 20 are fixedly connected with bidirectional bearings 21. One end of the multiple bidirectional bearings 21 is fixedly connected to the upper end of the multiple first springs 12. The outer surfaces of the two support rods 2 are slidably sleeved with linear bearings 3. The outer surfaces of the two linear bearings 3 are embedded in the interior of the push plate 4.

[0026] In this embodiment, the lower surface of the limiting ring 8 and the upper surface of the support ring 19 are attached to each other, limiting the stroke of the support ring 19. The inner wall surface of the limiting ring 8 is attached to the outer surface of the circuit board 10 to position the circuit board 10. When measuring chip bodies 11 of different specifications, the adjusting ring 20 is rotated so that the adjusting ring 20 moves up and down on the outer surface of the damper 13 through the thread. The first spring 12 is squeezed or stretched by the bidirectional bearing 21 to adjust the initial stroke of the first spring 12. Under the condition that the stroke of the damper 13 remains unchanged, the pressure of the upper probe 17 on the chip body 11 is controlled. When the lower probe 18 needs to be inspected, the limiting ring 8 is rotated. Multiple anti-slip grooves 9 increase the contact area and friction to prevent slippage and facilitate disassembly. The two linear bearings 3 slide on the outer surface of the two support rods 2 when the push plate 4 moves, limiting the movement trajectory of the push plate 4, preventing the push plate 4 from shaking, and ensuring the accuracy of the upper probe 17.

[0027] Working principle: such as Figure 1-4As shown, in use, multiple circuit boards 10 are placed on the upper surfaces of multiple support rings 19. Then, the electric telescopic rod 6 pushes the push plate 4, causing multiple matching dampers 13 to push the upper probe 17 close to and press the chip body 11 set on the upper surface of the circuit board 10. After being subjected to force, the chip body 11 compresses the second spring 16 through the support rings 19. The support rings 19 slide inside the mounting holes 15, causing the circuit board 10 to approach the lower probe 18. The upper end of the lower probe 18 and the lower end of the upper probe 17 respectively contact the pins of the chip body 11 to test the chip body 11. When the upper probe 17 is subjected to force, it compresses the first spring 12 and the damper 13. The first spring 12 and the damper 13 absorb kinetic energy during their compression stroke, providing buffering to prevent the chip body 11 from being damaged by excessive pressure. At the same time, the first spring 12 and the damper 13 work together to ensure that the upper probe 17 and the chip body 11 are in close contact, enabling... Suitable for circuit boards 10 and chip bodies 11 of different heights, the lower surface of the limiting ring 8 and the upper surface of the support ring 19 are attached to each other to limit the stroke of the support ring 19. The inner wall surface of the limiting ring 8 and the outer surface of the circuit board 10 are attached to each other to position the circuit board 10. When measuring chip bodies 11 of different specifications, the adjusting ring 20 is rotated to move up and down on the outer surface of the damper 13 through the thread. The first spring 12 is squeezed or stretched by the bidirectional bearing 21 to adjust the initial stroke of the first spring 12. Under the condition that the stroke of the damper 13 remains unchanged, the pressure of the upper probe 17 on the chip body 11 is controlled. When the lower probe 18 needs to be inspected, the limiting ring 8 is rotated. Multiple anti-slip grooves 9 increase the contact area and friction to prevent slippage and facilitate disassembly. The two linear bearings 3 slide on the outer surface of the two support rods 2 when the push plate 4 moves to limit the movement trajectory of the push plate 4 and prevent the push plate 4 from shaking.

[0028] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the present utility model.

Claims

1. An automated testing fixture for TWS earphone chips, comprising an operating table (1), characterized in that: Two support rods (2) are fixedly connected to the upper surface of the operating table (1). A support plate (5) is fixedly connected to the upper end of the two support rods (2). An electric telescopic rod (6) is fixedly connected to the lower surface of the support plate (5). A push plate (4) is fixedly connected to the lower end of the electric telescopic rod (6). Multiple dampers (13) are fixedly connected at equal intervals to the lower surface of the push plate (4). A first spring (12) is sleeved on the outer surface of each of the multiple dampers (13). One end of each of the multiple dampers (13) is fixedly connected to... A mounting plate (14) is attached, and an upper probe (17) is fixedly connected to one side surface of each of the mounting plates (14). A base (7) is fixedly connected to the upper surface of the operating table (1). A plurality of mounting holes (15) are equidistantly opened on the upper surface of the base (7). A second spring (16) is fixedly connected to the bottom surface of the inner wall of each of the mounting holes (15). A support ring (19) is fixedly connected to the upper end of each of the second springs (16). A lower probe (18) is embedded inside each of the second springs (16).

2. The automated testing fixture for TWS earphone chips according to claim 1, characterized in that: The upper surfaces of the multiple support rings (19) are provided with circuit boards (10), and the upper surfaces of the multiple circuit boards (10) are provided with chip bodies (11).

3. The automated testing fixture for TWS earphone chips according to claim 2, characterized in that: Multiple mounting holes (15) are threaded to the inner wall surfaces near the upper end with limiting rings (8), and the inner wall surfaces of the limiting rings (8) are sleeved on the outer surface of the circuit board (10).

4. The automated testing fixture for TWS earphone chips according to claim 3, characterized in that: Multiple anti-slip grooves (9) are provided on the outer surface of the multiple limiting rings (8), and the multiple anti-slip grooves (9) are distributed at equal intervals.

5. The automated testing fixture for TWS earphone chips according to claim 1, characterized in that: The outer surfaces of the plurality of dampers (13) are threadedly connected with adjusting rings (20), and the plurality of adjusting rings (20) are located above the plurality of first springs (12).

6. The automated testing fixture for TWS earphone chips according to claim 5, characterized in that: The lower surfaces of the plurality of adjusting rings (20) are fixedly connected with bidirectional bearings (21), and one end of the plurality of bidirectional bearings (21) is fixedly connected to the upper end of the plurality of first springs (12).

7. The automated testing fixture for TWS earphone chips according to claim 1, characterized in that: The outer surfaces of the two support rods (2) are slidably fitted with linear bearings (3), and the outer surfaces of the two linear bearings (3) are embedded in the inside of the push plate (4).

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