Integrated circuit module and integrated circuit module test system

Abstract

This application relates to an integrated circuit module (1) having pads. The pads of the integrated circuit module (1) include conventional pads (11) and at least two test-specific pads (12), wherein the length of the test-specific pads (12) is at least twice the length of the conventional pads (11). This application also relates to an integrated circuit module testing system, including the integrated circuit module (1) and a test fixture (2) as described above.

Description

Technical Field

[0001] This application relates to the field of electronic testing technology, and in particular to an integrated circuit module and an integrated circuit module testing system for testing the integrated circuit module. Background Technology

[0002] With the continuous development of integrated circuit technology, integrating multiple core chips onto small printed circuit boards (PCBs) to form integrated circuit modules, such as smart modules, has become a mainstream trend in electronic product design and manufacturing. These modules are highly integrated and compact, often using pads or perforated holes for electrical connections. During module production, software programming and functional testing are typically required. Therefore, matching test fixtures need to be designed to ensure reliable contact between test probes and module pads, thereby completing the testing of the module's electrical performance.

[0003] In existing technologies, most test fixtures use test sockets as connectors. Test sockets typically include components such as pressure plates, trays, pin plates, and adapter plates, relying on a precise metal and plastic structure to achieve electrical connection between the integrated circuit module under test and the test system. The main body of the test socket is machined from alloy materials, while the tray for holding the module under test is made of electrostatic dissipative plastic; these materials themselves have high rigidity and hardness. The probes used in the test sockets are double-headed probes, and to meet the requirements of module layout and wiring, the spacing between adjacent probes on the tray—also known as probe accuracy—is no more than 1 mm or even smaller. Therefore, this type of fixture has a complex structure, is difficult to manufacture, has a long manufacturing cycle, and is expensive. During use, the pressure plate structure requires manual rotation, which depends on the operator's skill level, resulting in low stability, long processing time, and low efficiency. Once the module size or signal lead position changes, multiple components of the test socket need to be redesigned and manufactured, lacking versatility. Meanwhile, the maintenance and replacement of the test socket structure is quite complicated, and it has high requirements for probe accuracy, adapter board flatness, electroplating process, etc., which further increases maintenance costs and failure risks.

[0004] Therefore, it is desirable to design an integrated circuit module testing system with a simpler structure, stronger adaptability, and lower processing and maintenance costs to overcome the drawbacks of existing test sockets. Utility Model Content

[0005] To address the problems of complex structure, high manufacturing cost, low testing efficiency, and difficult maintenance associated with traditional socket connector test fixtures in existing technologies, this invention innovatively proposes an integrated circuit module and an integrated circuit module test system consisting of the integrated circuit module and a test fixture. The traditional socket connector is replaced by improving the structure of the integrated circuit module's pads and the test fixture.

[0006] Therefore, this utility model provides an integrated circuit module, wherein the integrated circuit module is provided with pads, wherein the pads of the integrated circuit module include conventional pads and at least two test-specific pads, and the length of the test-specific pads is at least twice the length of the conventional pads.

[0007] In the above-described solution according to this utility model, by increasing the length of the test pad, the probe contact area can be expanded, thereby providing greater freedom for the arrangement of probes without changing the pad spacing, significantly reducing the processing accuracy requirements and manufacturing difficulty of probes in the test fixture; at the same time, the integrated circuit module tested by this solution does not need to use the traditional socket connector, effectively reducing the manufacturing and maintenance costs of the test fixture.

[0008] The integrated circuit module according to the embodiments of the present invention may also include one or more of the following optional features, individually or in combination.

[0009] Preferably, the test pads are arranged on at least one side of the integrated circuit module.

[0010] Preferably, the test pad is rectangular.

[0011] This utility model also provides an integrated circuit module testing system, including an integrated circuit module and a test fixture as described above. The test fixture includes a pressure plate, a tray and a pin plate. The pin plate is provided with probes. The probes include at least a number of dedicated probes that are consistent with the number of the dedicated test pads. During testing, the dedicated probes form a one-to-one electrical contact with the dedicated test pads.

[0012] In the above-described solution according to this utility model, by redesigning the test fixture for testing the novel integrated circuit module, a set of structural components including a pressure plate, a tray, and a pin plate is used to replace the traditional socket connector. This simplifies the structure of the test fixture, improves testing efficiency and system compatibility, and promotes low-cost, high-efficiency functional testing during the integrated circuit module production stage.

[0013] Preferably, at least one of the dedicated probes is not aligned with the center of the dedicated test pad when it makes electrical contact with the dedicated test pad.

[0014] Conventional solder pads are typically arranged at equal intervals, requiring probes to make precise contact with them. This results in very small probe spacing, high manufacturing difficulty, and low reliability. The integrated circuit module testing system according to this invention uses a newly designed extended solder pad for testing. The dedicated probes and pads no longer need to be strictly aligned; instead, they can be flexibly arranged. Specifically, the centers of the probes and pads can be offset, thereby increasing the spacing between adjacent probes and reducing the need for precise probe manufacturing.

[0015] Preferably, at least two of the dedicated probes are arranged in a non-equidistant manner.

[0016] Preferably, the dedicated probe is a single-headed probe.

[0017] Preferably, the test fixture tray has a groove that matches the shape and size of the integrated circuit module for fixing the integrated circuit module.

[0018] Preferably, the tray and needle plate of the test fixture are replaceable or adjustable.

[0019] This invention significantly simplifies the manufacturing process of test fixtures, shortens the processing cycle, reduces manufacturing and maintenance costs, and improves testing efficiency and stability through the innovative design of dedicated test pads and the optimization of the corresponding test fixture structure. It is suitable for the production testing of highly integrated, compact integrated circuit modules. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application and their differences and improvements over the prior art, the accompanying drawings used in the description of the embodiments will be briefly introduced below. It will be readily understood by those skilled in the art that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. For illustrative purposes, these drawings may not be drawn to scale. In the drawings:

[0021] Figure 1 An integrated circuit module according to an embodiment of the present invention is schematically shown;

[0022] Figure 2 The tray and needle plate of the test fixture according to an embodiment of the present invention are schematically shown;

[0023] Figure 3 A test fixture according to an embodiment of the present invention is illustrated schematically.

[0024] List of reference numerals in the attached diagram:

[0025] 1 Integrated circuit module; 11 Standard pads; 12 Test pads; 2 Test fixture; 21 Pressure plate; 22 Tray; 23 Pin plate; 24 Probe drilling; 25 Groove. Detailed Implementation

[0026] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings.

[0027] In this application, an "integrated circuit module" is an electronic component with independent functions formed by integrating one or more integrated circuit chips and related electronic components (such as resistors, capacitors, inductors, connectors, etc.) on the same substrate according to specific functional requirements and through packaging processes.

[0028] In this application, "generally rectangular" means that the overall shape of an object is basically rectangular (including square), even if there are minor changes in shape (such as corner cuts, waves, and jagged edges) in some parts, as long as it does not affect the overall impression that the object is rectangular to the observer.

[0029] In this application, "length" refers to the largest of the various dimensions that constitute the shape of an object.

[0030] Figure 1 An integrated circuit module 1 according to an embodiment of the present invention is schematically illustrated. The integrated circuit module 1 is generally rectangular, such as square or elongated, and has pads for electrical connections, including conventional pads 11 and test-specific pads 12. Two test-specific pads 12 are shown in the figure. The conventional pads 11 are, for example, perforated pads evenly spaced along the perimeter of the module 1, commonly known as stamp holes. The test-specific pads 12 may also be located in the edge region of the integrated circuit module 1 and are elongated relative to the conventional pads 11 in the direction from the module edge towards the module interior. After elongation, the test-specific pads 12 are rectangular in shape and at least twice the length of the conventional pads 11 to provide sufficient margin for probe contact. According to one example, the length of the conventional pads 11 is 1 mm, and the length of the test-specific pads 12 is 2 mm to 2.2 mm.

[0031] It should be understood that the specific number, size, shape (e.g., rectangle, ellipse, etc.) and position of the test pads are not limited to the illustrated representation, but can be flexibly set to meet different requirements of integrated circuit module layout and wiring and test fixture probe electrical connections. Conventional pads can also take various common forms, including but not limited to stamp hole forms. Similarly, it should be understood that although the test pad 12 in this embodiment is elongated from the module edge towards the module interior, those skilled in the art can elongate the pads in any direction within the board surface according to specific circuit design and probe arrangement requirements. As long as the technical effect of expanding the area available for contact with the probes is achieved, it should be considered an implementation of this utility model.

[0032] Figure 2 and Figure 3The test fixture 2, sometimes also called a test tooling, is schematically shown in an embodiment of the integrated circuit module test system according to the present invention. The structure of the test fixture 2 has been modified to accommodate the aforementioned novel test pads, eliminating the need for conventional socket connectors commonly used in the prior art. Specifically, the test fixture 2 includes a pressure plate 21, a tray 22, and a pin plate 23. Probes are provided on the pin plate 23 for forming electrical contact with the test pads 12 on the integrated circuit module 1 during testing.

[0033] Figure 2 The diagram schematically illustrates an example of the distribution of probe holes 24 on the needle plate 23. These probe holes are used to mount probes, and therefore their distribution represents the distribution of probes. It should be understood that the tray 22 has corresponding probe holes 24 and... Figure 2 The probe through-holes, when viewed from above, allow the probes to pass through the tray 22 and form electrical contact with the pads of the integrated circuit module 1 placed on it. The specific positions of the probes are arranged according to the positions of the dedicated test pads on the integrated circuit module. Due to the increased length of the dedicated test pads, the probes do not need to be aligned with the center of the pads, and even deviations from them do not affect reliable contact with the pads. This results in a greater spacing between adjacent probes than the probe spacing for conventional pads in traditional socket connectors. This optimizes the accuracy and density of the probes and increases the freedom of probe selection; for example, thicker probes can be selected. In practice, it has been found that the probe spacing of this invention, at 1.3mm, achieves the same probe accuracy as 1mm in a socket solution. Moreover, single-headed probes can be used, which are easier to operate than double-headed probes.

[0034] See Figure 3 The tray 22 in the test fixture 2 is preferably provided with a positioning groove 25 that matches the shape and size of the integrated circuit module 1, for reliably positioning and fixing the module 1. The test fixture according to the embodiment of this utility model has good versatility and adaptability. When the size, shape, or position of the test pad 12 of the integrated circuit module 1 changes, only replacement or adjustment is required. Figure 2 The corresponding tray 22 and pin plate 23 are shown. For example, when the size or shape of module 1 changes, only the shape or size of the tray groove 25 needs to be changed; when the position of the solder pads changes, only the probe through holes and probe drill holes on the tray 22 and pin plate 23 need to be reconfigured. All of the above structural components can be processed using conventional bakelite materials, and can be quickly and cost-effectively replaced and upgraded with general-purpose machine tools, significantly reducing the manufacturing and maintenance costs of the test fixture.

[0035] During testing using the integrated circuit module testing system according to this embodiment of the invention, the integrated circuit module to be tested is placed in a matching groove in the test fixture tray. A pressure plate presses down, causing the test pads on the module to contact the probes on the probe plate one by one, thus establishing the test signal. The test signal can be guided by the probes to subsequent adapter boards or the testing system to complete the electrical testing of the module's function.

[0036] The special pad design and the matching test fixture provided by this utility model have the following beneficial effects:

[0037] - Reduce manufacturing costs: The special pad structure is simple, the size optimization is clear, and it is easy to implement in conventional PCB manufacturing processes, which can effectively reduce manufacturing and processing costs;

[0038] - Reduced design complexity of the adapter board: This solution can be used with standard probe structures when paired with test fixtures, and the adapter board can also be manufactured using conventional soldering processes, eliminating the need for complex custom designs.

[0039] This design significantly reduces the development and adaptation requirements of adapter boards;

[0040] - Simplify the maintenance of test fixtures: In actual use, only routine dust cleaning and damage screening of the probe surface are required, without the need for frequent replacement of complex parts, which significantly reduces the manpower and cost required for maintenance;

[0041] - Shortened development cycle: Because this solution uses simplified components, both processing and assembly can be completed quickly, which helps to shorten the development and testing cycle of integrated circuit modules and improve production efficiency.

[0042] Table 1 below specifically lists the comparison results between the proposed solution and the traditional socket solution in practice.

[0043] Table 1

[0044] Socket solution This application proposal Processing costs ≥5000 yuan ≤500 yuan Processing cycle 2-3 weeks ≤1 week Maintenance difficulty Disaster easy Adapter board design requirements High flatness is required, and a hard gold electroplating process is necessary. Conventional design

[0045] The probes described in the above embodiments mainly refer to dedicated probes used in conjunction with the novel test pads designed in this utility model. However, the scope of protection of this utility model does not limit the test fixture to include only such probes, nor does it exclude the inclusion of other types of probes for other functions or connection purposes in the test fixture. Therefore, integrated circuit module test systems that include test fixtures with such multiple types of probes should also be included within the scope of protection of this utility model.

[0046] It should be understood that, unless otherwise defined, all terms used in this application, including technical and scientific terms, have the same meaning as would be normally understood by one of ordinary skill in the art to which this application pertains upon understanding this application. Furthermore, in the description of examples, detailed descriptions of well-known related structures or functions will be omitted where such detailed description would lead to a vague interpretation of this application. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular forms “a,” “an,” and “the” used in this application are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or,” as may be used in this application, refers to and includes any or all possible combinations of one or more associated listed items.

[0047] Terms such as "upper," "lower," "left," "right," "front," "rear," "thickness," "radial," and "axial," used in this application to describe the relationship of one feature relative to another as shown in the accompanying drawings, are for illustrative purposes and are not limited to a single location or spatial orientation. It is understood that, depending on the product's placement, the terms describing spatial relative positions may be intended to include different orientations besides those shown in the figures, and should not be construed as limiting. Furthermore, the descriptive term "horizontal," as used in this application, is not entirely equivalent to "along the direction perpendicular to gravity," and allows for a certain angle of inclination. The terms "comprising" or "including," as used in this application, indicate that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. It should be understood that the terms "first," "second," and similar terms used in this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components.

[0048] The foregoing has provided a detailed description of non-limiting embodiments of the present invention, wherein some conventional technical content in the prior art has been simplified or omitted in order to teach the principles of the present invention. Those skilled in the art should understand that the different features described above with reference to multiple embodiments can be combined in various ways to form more embodiments of the present invention. Furthermore, those skilled in the art can make various modifications, equivalent substitutions, and variations to the above embodiments without departing from the spirit and concept of the present invention. Therefore, the present invention is not limited to the above embodiments, but is only defined by the appended claims and their equivalents.

Claims

1. An integrated circuit module (1), wherein the integrated circuit module is provided with pads, characterized in that, The pads of the integrated circuit module (1) include conventional pads (11) and at least two test-specific pads (12), wherein the length of the test-specific pads (12) is at least twice the length of the conventional pads (11).

2. The integrated circuit module according to claim 1, characterized in that, The test pad (12) is arranged on at least one side of the integrated circuit module (1).

3. The integrated circuit module according to any one of claims 1 to 2, characterized in that, The test pad (12) is rectangular.

4. An integrated circuit module testing system, characterized in that, The test fixture (2) includes an integrated circuit module (1) as described in any one of claims 1 to 3, the test fixture (2) including a pressure plate (21), a tray (22) and a pin plate (23), the pin plate (23) being provided with probes, the probes including at least a number of dedicated probes consistent with the number of the dedicated test pads (12), and the dedicated probes forming a one-to-one electrical contact with the dedicated test pads (12) during testing.

5. The system according to claim 4, characterized in that, At least one of the dedicated probes is not aligned with the center of the test dedicated pad (12) when it makes electrical contact with the test dedicated pad (12).

6. The system according to claim 4, characterized in that, At least two of the dedicated probes are arranged in a non-equidistant manner.

7. The system according to any one of claims 4 to 6, characterized in that, The special probe is a single-headed probe.

8. The system according to any one of claims 4 to 6, characterized in that, The test fixture (2) has a tray (22) with a groove (25) that matches the shape and size of the integrated circuit module (1) for fixing the integrated circuit module (1).

9. The system according to any one of claims 4 to 6, characterized in that, The tray (22) and needle plate (23) of the test fixture (2) are replaceable or adjustable.

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