Modular front end test card

Abstract

This utility model belongs to the field of PXI measurement instrument technology, specifically relating to a modular front-end test card. The modular front-end test card provided in this application integrates complex testing functions onto one or more compact boards, which are inserted into a standardized PXI chassis. By combining several daughter cards and base cards, it achieves the separation and collaboration of control, interface, power supply, and signal processing functions. The modularity of the PXI system allows users to flexibly add, replace, or reconfigure PXI test cards with different functions according to changes in testing requirements. The high degree of modularity facilitates software and hardware upgrades and maintenance.

Description

Technical Field

[0001] This utility model belongs to the field of PXI measurement instrument technology, specifically relating to a modular front-end test card. Background Technology

[0002] PXIe (PCI Express Extensions for Instrumentation) bus technology, with its advantages of high-speed data transmission, precise clock synchronization, and modularity, has been widely used in the field of automated test and measurement. Modular front-end test cards, as a core component of PXI systems, undertake multiple key test functions such as signal generation, acquisition, conditioning, and analysis.

[0003] With the rapid development of electronic technology, the complexity of devices under test (DUTs) is increasing, and the performance requirements for test systems are also rising, especially in the field of high-frequency signal testing such as radio frequency and microwave. Traditional modular front-end test cards, while pursuing higher integration, wider test frequency range, and more flexible functional configuration, also face many challenges.

[0004] Existing technology relies on benchtop instruments, which exhibit several inherent drawbacks when constructing complex, multi-functional automated testing systems. First, benchtop instruments are bulky and occupy significant physical space; building a complete testing system often requires one or more standard cabinets, resulting in a large footprint and high deployment costs. Second, system integration is complex. Benchtop instruments with different functions need to be interconnected via numerous external cables (such as RF cables, trigger lines, and data buses), leading to cumbersome and error-prone wiring, and potentially introducing signal attenuation and interference, affecting test accuracy.

[0005] Therefore, how to design a modular front-end test card that is compact, flexible in function, and easy to operate and maintain has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0006] The purpose of this invention is to provide a modular front-end test card.

[0007] To achieve the above objectives, this utility model provides a modular front-end test card, including... At least one base card; and At least one sub-card, which is communicatively connected to the base card; The base card includes a control module and an interface module; The sub-card includes a power module and several signal processing modules. Each signal processing module includes at least one attenuation unit, at least one amplification unit, and at least one filtering unit for processing signals. Each signal processing module has its signal input terminal and output terminal electrically connected to an input terminal and an output terminal, respectively. Several of the input terminals and output terminals are arranged side by side on the end side of the sub-card, and a plug-in panel is sleeved on it. The input terminals and output terminals are exposed through the plug-in panel. In some embodiments, the daughter card further includes a channel selection module comprising a plurality of radio frequency switches, and the control module is configured to control the switching state of the plurality of radio frequency switches to selectively establish a signal transmission path among the input terminals, the plurality of signal processing modules, and the output terminals.

[0008] In some embodiments, the sub-card is further fitted with a shielding component, the shielding component including a shielding base plate and a shielding cover plate, and the sub-card is accommodated between the shielding base plate and the shielding cover plate.

[0009] In some embodiments, heat dissipation grooves are respectively provided on the back of the shielding base plate and the shielding cover plate, and the shielding base plate, the sub-clamp and the shielding cover plate are connected by mounting fastening screws.

[0010] In some embodiments, the shielding member has openings at corresponding positions for the input and output terminals to pass through, and the periphery of the openings is covered with an electromagnetic shielding layer.

[0011] In some embodiments, the base card and the daughter card are connected via a board-to-board connector, and the shielding cover has a clearance groove at the position corresponding to the board-to-board connector, with an electromagnetic shielding layer covering the periphery of the clearance groove.

[0012] In some embodiments, the plug-in panel includes a connector, the connector including a first mounting hole and a second mounting hole, the base clip being fastened to the connector through the first mounting hole, and the plug-in panel being fastened to the connector through the second mounting hole.

[0013] In some embodiments, a shielding strip is provided at the joint between the plug-in panel and the bottom card and the daughter card.

[0014] In some embodiments, a protective cover is also installed on the back of the base card.

[0015] In some embodiments, at least one side of the plug-in panel is provided with a plug-in aid.

[0016] This application provides a modular front-end test card that integrates complex testing functions onto one or more compact boards and inserts them into a standardized PXI chassis. By combining several daughter cards and base cards, it achieves the separation and collaboration of control, interface, power supply, and signal processing functions. The modularity of the PXI system allows users to flexibly add, replace, or reconfigure PXI test cards with different functions according to changes in testing requirements. It has a high degree of modularity, which facilitates the upgrading and maintenance of software and hardware. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of a modular front-end test card provided in one embodiment of this application; Figure 2 This is a schematic diagram of a modular front-end test card provided in one embodiment of this application; Figure 3 This is a schematic diagram of the plug-in panel provided in one embodiment of this application; Figure 4 This is a schematic diagram of the structure of a shielding component provided in an embodiment of this application; Figure 5 This is a schematic diagram of the back structure of the shielding base plate provided in one embodiment of this application; Figure 6 This is a schematic diagram of the back structure of a shielding cover provided in an embodiment of this application; Figure 7 This is a schematic diagram of the structure of a modular front-end test card provided in one embodiment of this application; Figure 8 This is a schematic diagram of the structure of a connector provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of a modular front-end test card provided in one embodiment of this application.

[0018] In the diagram: base card 1, control module 11, interface module 12, protective shell 13; Sub-card 2, power module 21, signal processing module 22, attenuation unit 221, amplification unit 222, filtering unit 223, channel selection module 23, input terminal 24, output terminal 25; Plug-in panel 3, pull-out aid 31, connector 32, first mounting hole 321, second mounting hole 322, shielding strip 33; Shielding component 4, shielding base plate 41, shielding cover plate 42, heat dissipation groove (411, 421), clearance groove 423, opening 43, electromagnetic shielding layer (423a, 431). Board-to-board connector 5. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] This application provides a modular front-end test card.

[0021] Figure 1 This is a schematic diagram of the structure of a modular front-end test card provided in one embodiment of this application.

[0022] Figure 2 This is a schematic diagram of a modular front-end test card provided in one embodiment of this application.

[0023] Please refer to the following at the same time Figure 1 and Figure 2 This application provides a modular front-end test card, which mainly includes at least one base card 1 and at least one sub-card 2 that is connected to the base card 1 through a board-to-board connector 5.

[0024] The base card 1 serves as the foundation for connecting the modular front-end test card to the PXI chassis backplane, integrating a control module 11 and an interface module 12. The control module 11, which can employ an FPGA or microprocessor, is responsible for the overall logic control of the modular front-end test card, communication with the PXI bus, and issuing control commands and reading status information from the functional modules on the daughter card 2. The interface module 12 provides a PXI bus interface for data exchange and power supply with the PXI chassis.

[0025] Daughter card 2 is the core component for implementing specific signal testing and functional processing. Daughter card 2 integrates a power module 21, several signal processing modules 22, and a channel selection module 23.

[0026] The power module 21 is responsible for converting the power obtained from the PXI bus or external power supply into the stable operating voltage required by each module on the daughter card 2.

[0027] Each signal processing module 22 is designed to perform a specific processing procedure on the input signal. Internally, it includes at least one attenuation unit 221, one amplification unit 222, and one filtering unit 223. The attenuation unit 221 is used to adjust the signal amplitude, the amplification unit 222 is used to increase the signal strength, and the filtering unit 223 is used to select signals within a specific frequency range or remove noise. The number of signal processing modules 22, as well as the specific parameters and connection order of each internal unit, can be flexibly configured according to actual application requirements; this application does not impose any limitations on this.

[0028] The signal input and output terminals of each signal processing module 22 are electrically connected to the input terminal 24 and output terminal 25 located on the end side of the daughter card 2 via internal wiring. A plurality of input terminals 24 and output terminals 25 are arranged side by side in an array on the end side of the daughter card 2. Specifically, the input terminals 24 and output terminals 25 can be SMA connectors or SMP connectors.

[0029] In some implementations, the channel selection module 23 is used to select from multiple signal paths to achieve flexible signal routing between different input terminals 24, signal processing modules 22, and output terminals 25. In this embodiment, the channel selection module 23 includes multiple RF switches (not shown), and the control module 11 controls the switching state of these RF switches through control signal lines, thereby selectively establishing the desired signal transmission path. Specifically, an input signal can be directed to a specific signal processing module 22 for processing, and then the processed signal can be directed to a specific output terminal 25.

[0030] Figure 3 This is a schematic diagram of the plug-in panel provided in one embodiment of this application.

[0031] Reference Figure 3 To facilitate user insertion and removal of the modular front-end test card and protect the input terminal 24 and output terminal 25, as well as to increase the structural strength of the connection between the base card 1 and the daughter card 2, a plug-in panel 3 is sleeved on the end side of the daughter card 2. Both the input terminal 24 and the output terminal 25 pass through the plug-in panel and are exposed on its outside for connection with external test cables.

[0032] Figure 4 This is a schematic diagram of the shielding component provided in one embodiment of this application.

[0033] Reference Figure 4 The daughter card 2 is also equipped with a shielding component 4, which is made of copper alloy or other high thermal conductivity metals. It can be used to achieve electromagnetic shielding while also taking into account the heat dissipation requirements of the daughter card 2 during signal processing.

[0034] Please refer to the following at the same time Figures 4 to 6 In some embodiments, the shielding element 4 is composed of a shielding base plate 41 and a shielding cover plate 42. The sub-card 2 is accommodated between the shielding base plate 41 and the shielding cover plate 42, forming a closed shielding cavity.

[0035] Reference Figure 4 In some embodiments, the shielding member 4 has an opening 43 at a corresponding position for the input terminal 24 and the output terminal 25 to pass through. The periphery of the opening 43 is covered with an electromagnetic shielding layer 431 to ensure the integrity of the shielding.

[0036] Figure 5This is a schematic diagram of the back structure of the shielding base plate provided in one embodiment of this application.

[0037] Figure 6 This is a schematic diagram of the back structure of a shielding cover provided in one embodiment of this application.

[0038] Please refer to the following at the same time Figure 5 and Figure 6 In some embodiments, the back sides (i.e., the sides that do not contact the daughter card 2) of the shielding base plate 41 and the shielding cover plate 42 are respectively provided with a plurality of heat dissipation grooves 411 and 421 to increase the contact area between the shielding base plate 41 and the shielding cover plate 42 and the air, so as to better conduct the heat generated by the daughter card 2 during operation to the shielding component 4 and dissipate it into the external environment. The shielding base plate 41, the daughter card 2 and the shielding cover plate 42 are connected and fixed by fastening screws to ensure the integrity of the structure and good thermal contact.

[0039] In some embodiments, the base card 1 and the daughter card 2 are connected via a board-to-board connector 5. The shielding cover 42 has a clearance groove 423 at a position corresponding to the board-to-board connector 5 for the board-to-board connector 5 to pass through. The periphery of the clearance groove 423 is also covered with an electromagnetic shielding layer 423a to reduce electromagnetic leakage at this location.

[0040] Figure 7 This is a schematic diagram of the structure of a modular front-end test card provided in one embodiment of this application.

[0041] Figure 8 This is a schematic diagram of the structure of a connector provided in an embodiment of this application.

[0042] Please refer to the following at the same time Figure 7 and Figure 8 In some embodiments, the plug-in panel 3 includes a connector 32, which has a first mounting hole 321 and a second mounting hole 322. The base card 1 is fastened to the connector 32 via the first mounting hole 321 using screws or other fasteners. The main body of the plug-in panel is also fastened to the connector 32 via the second mounting hole 322 using screws or other fasteners. This ensures that the plug-in panel is firmly fixed to the base card 1 and the daughter card 2, improving the mechanical strength of the entire modular front-end test card front end.

[0043] In some embodiments, a shielding strip 33 is provided on both sides of the joint formed by the plug-in panel 3 and the bottom card 1 to prevent electromagnetic leakage. The shielding strip 33 can be a glass copper spring or a conductive rubber strip.

[0044] Figure 9 This is a schematic diagram of the structure of a modular front-end test card provided in one embodiment of this application.

[0045] Reference Figure 9In some embodiments, a protective shell 13 is also provided on the back of the base card 1 to protect the components on the back of the base card 1. Specifically, the protective shell can be made of metal or other high-strength structural materials.

[0046] Please refer to both 1 and 2. Figure 2 When the modular front-end test card is inserted into the PXI chassis and powered on, the control module 11 on the base card 1 establishes communication with the PXI bus through the interface module 12. The user or host computer sends test commands to the control module 11 through the PXI bus. According to the commands, the control module 11 sends control signals to the channel selection module 23 on the daughter card 2 through the board-to-board connector 5 to configure the state of the RF switch, thereby selecting a specific signal input terminal 24, one or more signal processing modules 22, and a specific signal output terminal 25 to form the required signal test path. The external signal under test enters the daughter card 2 through the selected input terminal 24, and after being processed by the signal processing module 22 on the selected path for signal attenuation, amplification, filtering, etc., it is output from the selected output terminal 25, or the processing result is fed back to the PXI bus through the board-to-board connector 5 and the base card 1. Throughout the process, the shield 4 and the shielding strip 33 effectively suppress internal and external electromagnetic interference, ensuring the quality of the test signal. At the same time, the heat generated is dissipated in time through the heat dissipation surface on the shield 4, ensuring the stability of continuous testing.

[0047] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A modular front-end test card, characterized in that, include At least one base card; and At least one sub-card, which is communicatively connected to the base card; The base card includes a control module and an interface module; The sub-card includes a power module and several signal processing modules. Each signal processing module includes at least one attenuation unit, at least one amplification unit, and at least one filtering unit for processing signals. Each signal processing module has an input terminal and an output terminal electrically connected to its signal input terminal and output terminal, respectively. Several of the input terminals and output terminals are arranged side by side on the end side of the sub-card, and a plug-in panel is sleeved on it. The input terminals and the output terminals are exposed through the plug-in panel.

2. The modular front-end test card according to claim 1, characterized in that, The sub-card also includes a channel selection module, which includes multiple radio frequency switches. The control module is configured to control the switching state of the multiple radio frequency switches to selectively establish signal transmission paths between the input terminals, the signal processing modules, and the output terminals.

3. The modular front-end test card according to claim 1, characterized in that, The sub-card is also fitted with a shielding component, which includes a shielding base plate and a shielding cover plate, and the sub-card is accommodated between the shielding base plate and the shielding cover plate.

4. The modular front-end test card according to claim 3, characterized in that, The back of the shielding base plate and the shielding cover plate are respectively provided with heat dissipation grooves, and the shielding base plate, the sub-clamp and the shielding cover plate are connected by mounting fastening screws.

5. The modular front-end test card according to claim 3, characterized in that, The shielding component has openings at corresponding positions for the input and output terminals to pass through.

6. The modular front-end test card according to claim 3, characterized in that, The bottom card and the sub-card are connected by a board-to-board connector. The shielding cover has a clearance groove at the position corresponding to the board-to-board connector, and the periphery of the clearance groove is covered with an electromagnetic shielding layer.

7. The modular front-end test card according to claim 1, characterized in that, The plug-in panel includes a connector, which includes a first mounting hole and a second mounting hole. The base is fastened to the connector through the first mounting hole, and the plug-in panel is fastened to the connector through the second mounting hole.

8. The modular front-end test card according to claim 6, characterized in that, A shielding strip is provided at the joint between the plug-in panel and the bottom card and the daughter card.

9. The modular front-end test card according to claim 1, characterized in that, The back of the base card is also fitted with a protective cover.

10. The modular front-end test card according to claim 1, characterized in that, At least one side of the plug-in panel is provided with a plug-in aid.

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