Electro-optical assembly

Abstract

An electro-optic assembly includes a first substrate having a first surface and a second surface opposite to the first surface. A second substrate has a third surface and a fourth surface opposite to the third surface. The second and third surfaces face each other to define a gap having a cell pitch. A first electrode is coupled to the second surface, and a second electrode is coupled to the third surface. An electro-optic medium is located between the first and second electrodes. A conductor assembly is electrically coupled to the first electrode and defines at least one space containing a first conductive intermediate. A seal retains the electro-optic medium in the gap.

Description

Technical Field

[0001] This disclosure relates generally to an electro-optic device, and more specifically, to an electro-optic device having a conductor assembly and a connection system for electrically coupling the conductor assembly to the electro-optic device. Background Technology

[0002] There are known conductor assemblies and connection systems for electrically coupling conductor assemblies to electro-optic devices. However, the development of improved electro-optic assemblies remains a goal in this field. Utility Model Content

[0003] According to one aspect of this disclosure, the electro-optic assembly includes a first substrate having a first surface and a second surface opposite to the first surface. A second substrate has a third surface and a fourth surface opposite to the third surface. The second and third surfaces face each other to define a gap having a cell pitch. A first electrode is coupled to the second surface, and a second electrode is coupled to the third surface. An electro-optic dielectric is located between the first and second electrodes. A conductor assembly is electrically coupled to the first electrode and defines at least one space containing a first conductive intermediate. A seal retains the electro-optic dielectric in the gap.

[0004] According to another aspect of this disclosure, the electro-optic assembly includes a first substrate having a first surface and a second surface opposite to the first surface. A second substrate has a third surface and a fourth surface opposite to the third surface. The second and third surfaces face each other to define a gap having a cell pitch. A first electrode is coupled to the second surface, and a second electrode is coupled to the third surface. At least one of the first and second electrodes includes at least one isolation line defining at least one conductive island. An electro-optic medium is located between the first and second electrodes and is configured to be activated between transmission states. A conductor assembly is electrically coupled to the first and second electrodes and includes at least one conductive bridge that electrically couples at least one conductive island to the first and second electrodes opposite to at least one of the first and second electrodes including at least one isolation line.

[0005] According to another aspect of this disclosure, the electro-optic assembly includes a first substrate having a first surface and a second surface opposite to the first surface. A second substrate has a third surface and a fourth surface opposite to the third surface. The second and third surfaces face each other to define a gap having a cell pitch. A first electrode is coupled to the second surface, and a second electrode is coupled to the third surface. An electro-optic dielectric is located between the first and second electrodes. A conductor assembly includes a first conductive path and a second conductive path, the first conductive path being adhered to one of the first electrodes via a first conductive intermediate, and the second conductive path being coupled to the other of the first and second electrodes via a second conductive intermediate. A seal holds the electro-optic dielectric in the gap.

[0006] By referring to the following description, claims and drawings, those skilled in the art will further understand and appreciate these and other features, advantages and objectives of this disclosure. Attached Figure Description

[0007] In the attached diagram: Figure 1 This is a cross-sectional view of an electro-optic device according to the first construction of this disclosure; Figure 2 This is a cross-sectional view of an electro-optic device according to the second construction of this disclosure; Figure 3A This is a top view of a vehicle incorporating the electro-optical assembly according to this disclosure; Figure 3B This is a top perspective view of an aircraft incorporating the electro-optical assembly according to this disclosure; Figure 3C This is a front view of a building incorporating the electro-optical assembly according to this disclosure; Figure 3D This is a top perspective view of a goggle assembly incorporating an electro-optical assembly according to the present disclosure; Figure 4A This is a front perspective view of an electro-optic device having a conductor assembly and a first connection system according to the present disclosure; Figure 4B This is a cross-sectional view of the conductor assembly of the first connection system according to this disclosure; Figure 4C This is a top view of the conductor assembly of the first connection system according to this disclosure; Figure 4D This is a cross-sectional view of the conductor assembly of the first connection system according to this disclosure; Figure 5A This is a front perspective view of an electro-optic device having a conductor assembly and a second connection system according to the present disclosure; Figure 5B This is a front perspective view of an electro-optic device having a conductor assembly and a second connection system in a disassembled state according to the present disclosure; Figure 6A This is a front perspective view of an electro-optic device having a conductor assembly and a third connection system according to the present disclosure; Figure 6B This is a front perspective view of an electro-optic device having a conductor assembly and a third connection system in a disassembled state according to the present disclosure; Figure 6C This is a perspective view of the partially disassembled electro-optical assembly and third connection system according to this disclosure; Figure 6D This is a perspective view of the electro-optical assembly and the third connection system according to this disclosure; Figure 7A This is a front perspective view of an electro-optic device having a conductor assembly and a fourth connection system according to the present disclosure; Figure 7B This is a front perspective view of an electro-optic device having a conductor assembly and a fourth connection system in a disassembled state according to the present disclosure; Figure 7C This is a perspective view of the partially disassembled electro-optical assembly and fourth connection system according to this disclosure; Figure 7D This is a perspective view of the electro-optical assembly and the fourth connection system according to this disclosure; Figure 8A This is a perspective view of the electro-optical assembly and the fifth connection system in a partially disassembled state according to the present disclosure; Figure 8B This is a perspective view of the electro-optical assembly and the fifth connection system according to this disclosure; and Figure 9 This is a flowchart illustrating a method of connecting a conductor assembly to an electro-optic assembly according to the present disclosure. Detailed Implementation

[0008] The embodiments illustrated in this disclosure primarily concern a combination of method steps and apparatus components related to an electro-optic device having a conductor assembly and a connection system electrically coupling the conductor assembly to the electro-optic device. Therefore, apparatus components and method steps have been indicated where appropriate by conventional symbols in the figures, with only those specific details relevant to understanding the embodiments of this disclosure shown to avoid obscuring it, as this disclosure contains details that will be obvious to those skilled in the art and have the benefit of the description herein. Furthermore, the same numbers in the description and figures denote the same elements.

[0009] For the purposes described herein, the terms “upper,” “lower,” “right,” “left,” “back,” “front,” “vertical,” “horizontal,” and their derivatives should be used interchangeably with those used in this document. Figure 1The orientation of this disclosure is relevant to the intended viewpoint. Unless otherwise stated, the term "front" refers to the device surface closer to the intended observer of the device, and the term "back" refers to the device surface farther from the intended observer of the device. However, it should be understood that various alternative orientations may be adopted in this disclosure, except as expressly specified otherwise. It should also be understood that the specific devices and processes illustrated in the drawings and described in the following description are merely exemplary embodiments of the inventive concept as defined in the appended claims. Therefore, unless otherwise expressly stated in the claims, the specific dimensions and other physical characteristics relating to the embodiments disclosed herein should not be considered limiting.

[0010] The terms “comprising,” “including,” or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements may include not only those elements but also other elements not expressly listed or not inherent to such process, method, article, or apparatus. An element preceded by “comprising…” does not, in the absence of further constraints, exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0011] refer to Figure 1 , Figures 3A to 4D Reference numeral 10A generally denotes an electro-optic assembly of a first configuration. The electro-optic assembly 10A includes a first substrate 12 having a first surface 14 and a second surface 16 opposite to the first surface 14. A second substrate 18 has a third surface 20 and a fourth surface 22 opposite to the third surface 20, the second surface 16 and the third surface 20 facing each other to define a gap 24 having a cell pitch. A first electrode 26A is coupled to the second surface 16, and a second electrode 26B is coupled to the third surface 20. An electro-optic dielectric 28 is located between the first electrode 26A and the second electrode 26B. A conductor assembly 30 is electrically coupled to the first electrode 26A and the second electrode 26B and defines at least one space 46 containing a first conductive intermediate 48. A seal holds the electro-optic dielectric 28 within the gap 24.

[0012] Now for reference Figures 1 to 9 , Figure 1 , Figures 4A to 4D The illustrated conductor assembly 30 is a component of the first connection system 32A. However, as will be understood upon further reading, the conductor assembly 30 may also be a component of the second connection system 32B. Figures 5A to 5B ), Third Connection System 32C ( Figures 6A to 6D ), Fourth Connection System 32D ( Figures 7A to 7D ), First connection system 32E ( Figures 8A to 8B) and / or combinations thereof. Generally, the connection systems 32A to 32E described herein are independent of cell pitch (i.e., the depth of gap 24), internal forces from substrates 12, 18 (e.g., via clamping), and provide improved uniformity because conductor assembly 30 does not interfere with (e.g., via outward bias force) cell pitch.

[0013] Now for reference Figure 1 The first substrate 12 and the second substrate 18 may be formed of a flexible plastic material, or alternatively of a glass and / or ceramic material. For example, the plastic material may be selected from a variety of different polymer compositions. The electro-optic medium 28 may be held within the gap 24 via a seal 34 extending along the periphery of the electro-optic assembly 10A. The electro-optic medium 28 may be configured based on liquid crystal technology, or utilize at least one anode and one cathode and / or electrodes 26A, 26B suspended in the electro-optic medium. A first electrical bus 36A may be electrically coupled to the first electrode 26A and the conductor assembly 30, and a second electrical bus 36B may be electrically coupled to the second electrode 26B and the conductor assembly 30. More specifically, the electrical buses 36A, 36B may supply current to the electrodes 26A, 26B via the conductor assembly 30 (e.g., a flexible conductor). In some embodiments, the conductor assembly 30 may be connected directly to the first bus 36A and the second bus 36B or via a conductive intermediary. The conductor assembly 30 may be configured to receive electrical energy via a power source (not shown). Although electrical buses 36A and 36B are illustrated as being located on the same side of the electro-optical assembly 10A, it should be understood that electrical buses 36A and 36B may be located on different (e.g., opposite) sides. It is conceivable that in some embodiments, instead of using electrical buses 36A and 36B, conductor assembly 30 may directly (e.g., via one or more conductive intermediates) supply current to electrodes 26A and 26B. As depicted, conductor assembly 30 may be located at least partially between the first substrate 12 and the second substrate 18.

[0014] Now for reference Figure 2An example of a second-construction electro-optic assembly 10B is illustrated. Unless otherwise specified, the second construction may share all the same features, dimensions, materials, and components as the first construction. However, the electro-optic assembly does not include the first bus 36A and the second bus 36B; instead, the electrodes 26A, 26B are electrically coupled to the conductor assembly 30 directly (e.g., via one or more conductive intermediates) or via conductive intermediates other than the first bus 36A and the second bus 36B. For example, it is contemplated that conductive wrappers 39A, 39B may extend over the edges (i.e., peripheral edges) of the electrodes 26A, 26B and the substrates 12, 18 to allow the conductor assembly 30 to be electrically coupled along the peripheral edges of the electrodes 26A, 26A. In some embodiments, conductive wrappers 39A, 39B may include a first conductive wrapper 39A extending over the first surface 14, the second surface 16, or a portion of both the first surface 14 and the second surface 16. The first conductive wrapper 39A may further extend along the peripheral edges of the first substrate 12 and the first electrode 26A. In some embodiments, a first conductive envelope 39A may extend over a portion of the second surface 16, such that a portion of the first conductive envelope 39A is located between the first electrode 26A and the second surface 16. In other embodiments, the first electrode 26A may be located between a portion of the first conductive envelope 39A and the second surface 16 (e.g., sandwiched between the portion of the first conductive envelope and the second surface). The conductive envelopes 39A and 39B may also include a second conductive envelope 39B coupled to the second substrate 18 and the second electrode 26B in the same manner as the first conductive envelope 39A is coupled to the first substrate 12 and the first electrode 26A. Although the conductive envelopes 39A and 39B are illustrated as being located on the same side of the electro-optic assembly 10B, it should be understood that the conductive envelopes 39A and 39B may be located on different (e.g., opposite) sides. Similar to Figure 1 The electro-optic medium 28 can be configured based on liquid crystal technology, or utilize at least one anode and one cathode and / or electrodes 26A, 26B suspended in the electro-optic medium.

[0015] Continue to refer to Figure 2The conductor assembly 30 can be single (electrically coupled to both electrodes 26A and 26B), multiple (e.g., a first conductor assembly 30 electrically coupled to the first electrode 26A and a second conductor assembly 30 electrically coupled to the second electrode 26B), or branched (e.g., a conductor assembly 30 having a first branch electrically coupled to the first electrode 26A and a second branch electrically coupled to the second electrode 26B). The conductor assembly 30 may also include a first conductive port 31A supplying power to the first electrode 26A and a second conductive port 31B supplying power to the second electrode 26B. As used herein, a “conductive port” refers to a portion of the conductor assembly 30 that transmits electrical energy to the electrodes 26A, 26B and / or any intermediate structure between the conductor assembly 30 and the electrodes 26A, 26B. In some embodiments, each conductive port 31A, 31B may be electrically coupled to a discrete branch (e.g., conductive path 37) within the conductor assembly 30. In this manner, the conductive assembly 30 (e.g., a flexible conductor) includes each conductive path 37, and each conductive path 37 can independently and selectively transmit electrical energy. Conductive ports 31A, 31B can be located on a single conductor assembly 30, different branches, or completely different conductor assemblies 30. The conductor assembly 30 can be electrically coupled to electrodes 26A, 26B (e.g., via conductive intermediates such as conductive paste, epoxy resin, foam, tape, adhesive, ink, solder, combinations thereof, etc.) using conductive intermediates. Figure 2 Conductive inclusions 39A, 39B or Figure 1 (buses 36A and 36B in the figure). The conductive intermediate can be isotropic, anisotropic, curable, or non-curable, exhibiting high or low hardness characteristics before or after curing. It should be understood that various conductor assemblies 30, conductive ports 31A and 31B, and conductive intermediates can be incorporated into the electro-optic assembly 10A of the first configuration. As depicted, the conductor assembly 30 may be at least partially located between the first substrate 12 and the second substrate 18.

[0016] refer to Figures 3A to 3D Electro-optic assemblies 10A and 10B can switch between a substantially transmissive state and a substantially darkened state. In other embodiments, electro-optic assemblies 10A and 10B are configured as electrochromic devices that can switch between a high-reflectivity state and a low-reflectivity partially transmissive state. Various embodiments of electro-optic assemblies 10A and 10B can be combined with one or more structures 42A to 42D. Figure 3A Example Already The automotive 42A employs electro-optical assemblies 10A and 10B, which are used in interior rearview mirrors, sunroofs, windshields, side windows, head-up displays, combinations thereof, and / or other interior vehicle locations. The automotive 42A may include commercial vehicles, emergency vehicles, and passenger vehicles. Figure 3BAn example is an aircraft 42B that employs electro-optical assemblies 10A and 10B (e.g., front window, side window, head-up display). Figure 3C Example Already Building 42C employs electro-optical components 10A and 10B (e.g., windows). Building 42C can be a residential building, a commercial building, etc. Figure 3D An example of goggles 42D employing electro-optical assemblies 10A and 10B is shown. For example, the goggles could be glasses with dimming capabilities, augmented reality, mixed reality, virtual reality, etc. Generally, the electro-optical assemblies 10A and 10B can be incorporated into any environment where electrochromic effects are beneficial, such as altering the state of windows, mirrors, displays, and / or other structures and environments.

[0017] refer to Figures 1 to 3D The first substrate 12 (e.g., the distance between the first surface 14 and the second surface 16) and / or the second substrate 18 (e.g., the distance between the third surface 20 and the fourth surface 22) may each define a thickness. The thickness may be less than 1.0 mm, for example, less than 0.5 mm, less than 0.4 mm, less than 0.3 mm, less than 0.2 mm, between 0.5 mm and 0.4 mm, between 0.4 mm and 0.3 mm, or between 0.3 mm and 0.2 mm. The conductor assembly 30 may be configured as various electrical conductor assemblies, such as wires, flexible conductor assemblies (as depicted), or other types of electrical conductor assemblies, which may include conductive and insulating portions (e.g., sheaths, outer coatings, etc.) for various cell pitches and substrate 12, 18 thicknesses.

[0018] Now for reference Figures 4A to 4B An example of a first connection system 32A is illustrated. The first connection system 32A can be electrically coupled to any of the constructed electro-optic assemblies 10A, 10B, incorporated into any of the structures 42A to 42D, and utilizes variations of the conductor assembly 30 and conductive intermediate as described above. Unless otherwise specified, the first connection system 32A can share all the same features, dimensions, materials, and components as the other connection systems 32B to 32E. More specifically, the first connection system 32A includes a conductor assembly 30, and the conductor assembly 30 includes protrusions 44 defining a pair of opposing spaces 46 (e.g., as shown in the image). Figure 4BTwo pairs of opposing protrusions 44 are depicted. A first conductive port 31A may be located in one of the spaces 46, and a second conductive port 31B may be located in the opposing space 46. Conductive intermediates 48 (such as those described above) may be located in each of the spaces 46 and contact each of the conductive ports 31A, 31B for supplying electrical energy to the electrodes 26A, 26B. In this way, the protrusions 44 center the conductive ports 31A, 31B from the electrodes 26A, 26B to provide a position for the conductive intermediates 48. During assembly, the conductor assembly 30 may be inserted after the seal 34 is installed, before curing, or after curing. Thus, the conductor assembly 30 may be electrically coupled to the electrodes 26A, 26B in various unit spacing configurations. The protrusions 44 also serve to facilitate insertion (e.g., by increasing rigidity), confine the conductive intermediates 48 within the respective opposing spaces 46, and electrically isolate the conductive ports 31A, 31B from each other. In some embodiments, the protrusion 44 and the space 46 may be located only on the section between the insertion substrates 12 and 18 of the conductor assembly 30.

[0019] refer to Figure 4C and Figure 4D In some embodiments, the protrusion 44 may be formed as part of the outer coating 35. More specifically, the conductor assembly 30 and / or conductive path 37 may be substantially embedded in or encapsulated within the outer coating 35, but include openings that expose only the conductive ports 31, 31B. The outer coating 35 may define the protrusion 44 around the openings exposing the conductive ports 31A, 31B to retain the conductive intermediate 48 within the space 46. Figure 4D As best shown, the conductor assembly 30 may include a conductor assembly substrate 33 connected to conductive ports 31A, 31B and an outer coating 35 located above the conductor assembly substrate 33 and a portion of the conductive ports 31A, 31B and / or conductive path 37. Figure 4C and Figure 4D ).

[0020] Continue to refer to Figure 4C and Figure 4DThe outer coating 35 is depicted as forming the protrusion 44. However, it should be understood that other materials, structures, and components (e.g., formed of non-conductive materials) may be used to form the protrusion 44. Furthermore, regardless of the material used, the protrusion 44 may be separable from the outer coating 35. For example, the protrusion 44 may be shaped as ridges, ribs, pillars, and / or define intervals and expose conductive ports 31A, 31B to maintain other shapes of the conductive intermediate 48. In some embodiments, a single protrusion 44 may be used. Similarly, a space 46 is defined between the protrusions 48 and may include recesses, channels, and / or other shapes. Moreover, while the conductive ports 31A, 31B and the conductive path 37 are illustrated as being located on opposite sides of the conductor assembly 30 (e.g., on opposite sides of the conductor assembly substrate 33), it should be understood that both the conductive path 37 and / or the conductive ports 31A, 31B may be located on the same side of the conductor assembly substrate 33 and electrically isolated by one or more of the outer coating 35 and the protrusion 44. In some implementations, conductive ports 31A, 31B may be offset along the length of the conductor assembly substrate 33 to ensure isolation between conductive paths 37.

[0021] Now for reference Figures 5A to 5BExample 32 illustrates a second connection system 32B. The second connection system 32B can be electrically coupled to any of the constructed electro-optic assemblies 10A, 10B, incorporated into any of the structures 42A to 42D, and utilizes variations of the conductor assembly 30 and conductive intermediates as described above. Unless otherwise specified, the second connection system 32B may share all the same features, dimensions, materials, and components as the other connection systems 32A, 32C to 32E. More specifically, the second connection system 32B includes a first conductive intermediate 50 and a second conductive intermediate 52, as described above. The first conductive intermediate 50 may be the same as or different from the second conductive intermediate 52. More specifically, the first conductive intermediate 50 is configured to adhere (e.g., conductive adhesive, epoxy resin, etc.) to the conductor assembly 30 (e.g., one of the conductive ports 31A, 31B) in an electrically coupled relationship (e.g., direct contact, via buses 36A, 36B, or via conductive wrappers 39A, 39B) with one of the electrodes 26A, 26B (e.g., direct contact, via buses 36A, 36B, or via conductive wrappers 39A, 39B). On the other hand, the second conductive intermediate 52 may be configured to adhere or not adhere, but is deposited on the opposing conductive ports 31A, 31B after being adhered by the first conductive intermediate 50. During assembly, the conductor assembly 30 is adhered via the first conductive intermediate 50 before connecting the first substrate 12 and the second substrate 18 (e.g., depositing a seal 34). Then, the second conductive intermediate 52 is deposited after the conductor assembly 30 is adhered via the first conductive intermediate 50 and before or after connecting the first substrate 12 and the second substrate 18. The second conductive intermediate 52 may be non-curable or exhibit low hardness characteristics before and after curing to prevent outward pressure between substrates 12, 18 and promote uniform cell spacing. In some embodiments, the second conductive intermediate 52 is curable but is deposited at some point during the assembly process (e.g., after the deposition of seal 34), such that the second intermediate 52 cures after the curing of seal 34 or during the same time period.

[0022] Now for reference Figures 6A to 6DA third connection system 32C is illustrated. The third connection system 32C can be electrically coupled to any of the electro-optic assemblies 10A, 10B, incorporated into any of the structures 42A to 42D, and utilizes variations of the conductor assembly 30 and conductive intermediates as described above. Unless otherwise specified, the third connection system 32C can share all the same features, dimensions, materials, and components as the other connection systems 32A, 32B, 32D, and 32E. More specifically, the third connection system 32C includes an isolation trench 54 in at least one of the first electrode 26A and / or the second electrode 26B. The isolation trench 54 can be formed by a variety of processes, including cutting, etching, laser ablation, other types of ablation, and / or other methods. The conductor assembly 30 includes conductive ports 31A, 31B (not shown) on the same side. For example, a first conductive port 31A may be electrically coupled to a first electrode 26A, and a second conductive port 31B may be electrically coupled to a conductive island portion 56 defined by an isolation trench 54 in the first electrode 26A. A conductive bridge 58 extends from the conductive island portion 56 to the second electrode 26B. The conductive bridge 58 may be formed of a conductive intermediate (such as one or more of the conductive intermediates described above). In some embodiments, the conductor assembly 30 defines a non-linear end portion 60 that matches the contours of the first substrate 12 and the second substrate 18. It should be understood that the isolation trench 54 and the conductive island portion 56 may be defined by the second electrode 26B, and the conductive bridge 58 may extend to the first electrode 26A.

[0023] Now for reference Figures 7A to 7DAn example of a fourth connection system 32D is illustrated. The fourth connection system 32D can be electrically coupled to any of the electro-optic assemblies 10A, 10B, incorporated into any of the structures 42A to 42D, and utilizes variations of the conductor assembly 30 and conductive intermediate as described above. Unless otherwise specified, the fourth connection system 32D can share all the same features, dimensions, materials, and components as the other connection systems 32A to 24C and 32E. More specifically, the fourth connection system 32D includes a pair of isolation trenches 62A, 62B, wherein the first isolation trench 62A is located in the first electrode 26A and the second isolation trench 62B is located in the second electrode 26B. The isolation trenches 62A, 62B can be formed by a variety of processes, including cutting, etching, laser ablation, other types of ablation, and / or other methods. A first isolation trench 62A may define a first conductive island portion 64A in the first electrode 26A, and a second isolation trench 62B may define a second conductive island portion 64B in the second electrode 26B. These two conductive island portions can be used to prevent short circuits during placement of the conductive intermediate 48. The conductor assembly 30 may include conductive ports 31A, 31B on the same side. The first conductive port 31A is electrically coupled to the first conductive island portion 64A, and the second conductive port 31B is electrically coupled to the second conductive island portion 64B. A pair of through holes 66A, 66B are formed in one of the first substrate 12 and the second substrate 18 and aligned with the conductive ports 31A, 31B. A conductive bridge 68 may then be inserted into the through holes 66A, 66B to electrically couple the conductor assembly 30 to each of the first electrode 26A and the second electrode 26B, respectively. The conductive bridge 68 may be formed of a conductive intermediate (such as one or more of the conductive intermediates described above). In some embodiments, conductor assembly 30 defines a non-linear end portion 70 that matches the contours of the first substrate 12 and the second substrate 18. It should be understood that, in addition to the fourth connection system 32D, the third connection system 32C may also utilize vias. It should also be understood that the fourth connection system 32D may consist only of a first via 66A, a first conductive island portion 64A, and a first isolation trench 62A, wherein the second conductive port 31B is directly connected to either the second electrode 26B or the first electrode 26A.

[0024] Now for reference Figure 8A and Figure 8BThe diagram illustrates a fifth connection system 32E. The fifth connection system 32E can be electrically coupled to any of the electro-optic assemblies 10A, 10B, incorporated into any of the structures 42A to 42D, and utilizes variations of the conductor assembly 30 and conductive intermediates as described above. Unless otherwise specified, the fifth connection system 32E can share all the same features, dimensions, materials, and components as the other connection systems 32A to 24D. More specifically, the fifth connection system 32E includes an isolation trench 54 in at least one of the first electrode 26A and / or the second electrode 26B. The isolation trench 54 can be formed by a variety of processes, including cutting, etching, laser ablation, other types of ablation, and / or other methods. The conductor assembly 30 includes conductive ports 31A, 31B on the same side that can be spaced apart in the width direction along the conductor assembly 30. For example, a first conductive port 31A may be electrically coupled to a first electrode 26A, and a second conductive port 31B may be electrically coupled to a conductive island portion 74 defined by an isolation groove 72 in the first electrode 26A. A conductive bridge 76 extends from the conductive island portion 74 to the second electrode 26B. The conductive bridge 76 may be formed of a conductive intermediate (such as one or more of the conductive intermediates described above). It should be understood that the isolation groove 72 and the conductive island portion 74 may be defined by the second electrode 26B, and the conductive bridge 76 may extend to the first electrode 26A. In some embodiments, the conductive island portion 74 is primarily formed on a tab 78 extending outward from the seal 34.

[0025] Now for reference Figure 9 This illustrates a method 100 for forming an electro-optic assembly. At 102, method 100 includes applying a first electrode to a first substrate and applying a second electrode to a second substrate. Step 102 may include forming one or more isolation lines in one or both of the first and second electrodes. At 104, method 100 includes depositing a seal between the first and second substrates. At 106, method 100 includes connecting a conductor assembly electrically coupled to one or both of the first and second electrodes (e.g., directly or via a conductive distributor). Step 106 may include connecting a connector as part of a connection system, such as connection systems 32A to 32E and the previously described related steps. Step 106 may include, at 108, connecting the conductor assembly before curing the seal (e.g., after depositing the seal). Alternatively, step 106 may include, at step 110, connecting the conductor assembly after curing the seal (i.e., after depositing the seal). Alternatively, step 112 may include connecting the conductor assembly prior to depositing the seal. For example, in some embodiments, the conductor assembly may be connected to an electrode prior to depositing or curing the seal, and then electrically coupled to another electrode using a conductive intermediate after depositing or curing the seal.

[0026] Now for reference Figures 1 to 9 When activated, the electro-optic assemblies 10A and 10B exhibit greater deformation in the region near the electrical contacts within approximately 5 mm outside the seal than inside the seal 34. When comparing the region outside the main seal, including the contacts, the deformation in the electro-optic device may be a result of a mismatch in material thermal expansion. If the main seal is cured above room temperature and the conductive epoxy is also cured in the same operation, residual stresses associated with the contact area will exist when the parts cool to room temperature, and the shrinkage rate of this contact area may differ from that of the main seal. More specifically, when this deformation is detectable inside the main seal, the sensing quality of the electro-optic device is reduced. Therefore, the conductor assembly 30 and the conductive intermediate, as described herein, can be configured to physically bridge the space between the two substrates 12 and 18 in the region outside the seal 34. More specifically, optical deformation inside the seal 34 can be reduced or eliminated by curing the contact material (e.g., the conductive intermediate) after the seal 34 has been cured and the spacing has been set. In this way, although there may be stress and optical deformation on the outside of the seal 34, the seal 34 will act as a barrier to such deformation in the inner direction, thereby greatly reducing or eliminating deformation inside the seal 34.

[0027] The disclosures herein are further summarized in the following paragraphs and are further characterized as any and all combinations of the aspects described herein.

[0028] According to one aspect of this disclosure, the electro-optic assembly includes a first substrate having a first surface and a second surface opposite to the first surface. A second substrate has a third surface and a fourth surface opposite to the third surface. The second and third surfaces face each other to define a gap having a cell pitch. A first electrode is coupled to the second surface, and a second electrode is coupled to the third surface. An electro-optic dielectric is located between the first and second electrodes. A conductor assembly is electrically coupled to the first electrode and defines at least one space containing a first conductive intermediate. A seal retains the electro-optic dielectric in the gap.

[0029] According to another aspect, the first substrate and the second substrate are defined with a thickness of 0.4 mm or less.

[0030] According to another aspect, the seal forms a deformation barrier, and the unit spacing exhibits greater deformation on the outside of the seal than on the inside of the seal in a region of approximately 5 mm within the conductor assembly.

[0031] According to another aspect, the conductor assembly is configured to be continuously bridged between the first electrode and the second electrode.

[0032] According to another aspect, the conductor assembly includes at least a pair of protrusions defining at least one space.

[0033] According to another aspect, at least one pair of protrusions includes a first pair of protrusions and a second pair of protrusions defining a first space and a second space, a first conductive intermediate being located in the first space, and a second conductive intermediate being located in the second space.

[0034] According to another perspective, at least one pair of protrusions is part of the outer coating that essentially encapsulates the conductor assembly.

[0035] According to another aspect, the first conductive intermediate includes a conductive adhesive or paste for bonding the conductor assembly to at least one of the first electrode or the second electrode.

[0036] According to another aspect, the first conductive intermediate includes a material that exhibits lower hardness characteristics than the seal.

[0037] According to another aspect, the conductor assembly extends at least partially between the first substrate and the second substrate.

[0038] According to another aspect, the conductor assembly includes a first conductive intermediate and a second conductive intermediate, the first conductive intermediate and the second conductive intermediate being respectively coupled to one of a first conductive package or a first bus and a second conductive package or a second bus.

[0039] According to another aspect, the first conductive envelope extends at least partially along the outer periphery of the first substrate and at least partially around the second surface.

[0040] According to another aspect of this disclosure, the electro-optic assembly includes a first substrate having a first surface and a second surface opposite to the first surface. A second substrate has a third surface and a fourth surface opposite to the third surface. The second and third surfaces face each other to define a gap having a cell pitch. A first electrode is coupled to the second surface, and a second electrode is coupled to the third surface. At least one of the first and second electrodes includes at least one isolation line defining at least one conductive island. An electro-optic medium is located between the first and second electrodes and is configured to be activated between transmission states. A conductor assembly is electrically coupled to the first and second electrodes and includes at least one conductive bridge that electrically couples at least one conductive island to the first and second electrodes opposite to at least one of the first and second electrodes including at least one isolation line.

[0041] According to another aspect, at least one conductive bridge is located in a via defined by a first substrate or a second substrate.

[0042] According to another aspect, conductive bridges include at least one of conductive paste, epoxy resin, foam, tape, adhesive, ink, and solder.

[0043] According to another aspect, at least one isolation line includes a first isolation line and a second isolation line, and at least one conductive island includes a first conductive island and a second conductive island.

[0044] According to another aspect, the conductor assembly extends at least partially between the first substrate and the second substrate.

[0045] According to another aspect, the conductor assembly defines a non-linear end portion that matches the profile of at least one of the first and second substrates.

[0046] According to another aspect, an isolation line in one of the first and second electrodes defines a conductive island portion on an outwardly extending tab, and a conductive bridge electrically couples the conductive island portion to the opposite of the first and second electrodes.

[0047] According to another aspect of this disclosure, the electro-optic assembly includes a first substrate having a first surface and a second surface opposite to the first surface. A second substrate has a third surface and a fourth surface opposite to the third surface. The second and third surfaces face each other to define a gap having a cell pitch. A first electrode is coupled to the second surface, and a second electrode is coupled to the third surface. An electro-optic dielectric is located between the first and second electrodes. A conductor assembly includes a first conductive path and a second conductive path, the first conductive path being adhered to one of the first electrodes via a first conductive intermediate, and the second conductive path being coupled to the other of the first and second electrodes via a second conductive intermediate. A seal holds the electro-optic dielectric in the gap.

[0048] According to another aspect, the first conductive intermediate is formed by a conductive adhesive, and the second conductive intermediate is formed by a conductive material that exhibits lower hardness characteristics than the seal.

[0049] According to another aspect of this disclosure, the electro-optic assembly includes a first substrate and a second substrate with a thickness of 0.4 mm or less, and when activated, the electro-optic assembly exhibits greater deformation outside the seal than inside the seal in the region near the electrical contacts within about 5 mm.

[0050] Those skilled in the art will understand that the construction of the described disclosure and other components is not limited to any particular material. Unless otherwise described herein, other exemplary embodiments of this disclosure can be formed from a wide variety of materials.

[0051] For the purposes of this disclosure, the term "coupled" (in all its forms, couple, coupling, coupled, etc.) generally means two components that are directly or indirectly (electrically or mechanically) joined to each other. Such a joint may be inherently static or inherently movable. Such a joint may be achieved using two (electrically or mechanical) parts and any additional intermediate member that forms a single whole with or with the two parts. Unless otherwise stated, such a joint may be inherently permanent, or inherently removable or detachable.

[0052] As used herein, the term "about" means that a quantity, size, formulation, parameter, and other quantity and characteristic is not exact and need not be exact, but may be approximate and / or larger or smaller as required, reflecting tolerances, conversion factors, rounding, measurement errors, and other factors known to those skilled in the art. When the term "about" is used to describe a range value or endpoint, this disclosure should be understood to include the specific value or endpoint mentioned. Regardless of whether the numerical value or endpoint of a range in the specification refers to "about," the numerical value or endpoint of a range is intended to include two embodiments: one modified by "about" and one not modified by "about." It should be further understood that each endpoint of a range is meaningful relative to and independent of the other endpoint.

[0053] As used herein, the terms “substantially,” “basically,” and variations thereof are intended to indicate that the described feature is equal to or approximately equal to a value or description. For example, a “substantially flat” surface is intended to mean a flat or substantially flat surface. Furthermore, “substantially” is intended to mean that two values ​​are equal or approximately equal. In some embodiments, “substantially” may mean values ​​within about 10% of each other, such as within about 5% of each other, or within about 2% of each other.

[0054] It is also worth noting that the construction and arrangement of the elements of this disclosure as shown in the exemplary embodiments are merely illustrative. Although only a few embodiments of the invention have been described in detail in this disclosure, those skilled in the art who consult this disclosure will readily understand that many modifications are possible (e.g., variations in the size, dimensions, structure, shape and proportion, parameter values, mounting arrangements, use of materials, color, orientation, etc. of various elements) without substantially departing from the novel teachings and advantages of the subject matter. For example, elements shown as integrally formed may be constructed from multiple parts, or elements shown as multiple parts may be integrally formed; the operation of interfaces may be reversed or otherwise altered; the structure and / or the length or width of components or connectors or other elements of the system may be changed; and the nature or number of adjustment positions provided between elements may be changed. It should be noted that the elements and / or assemblies of the system may be constructed from any of a wide variety of materials that provide sufficient strength or durability, and may be available in any of a wide variety of colors, textures, and combinations. Therefore, all such modifications are intended to be included within the scope of this invention. Other substitutions, modifications, changes, and omissions may be made in the design, operating conditions, and arrangement of desired and other exemplary embodiments without departing from the spirit of this invention.

[0055] It should be understood that any described process or step within a described process may be combined with other disclosed processes or steps to form a structure within the scope of this disclosure. The exemplary structures and processes disclosed herein are for illustrative purposes and should not be construed as limiting.

[0056] It should also be understood that changes and modifications may be made to the above structures and methods without departing from the concepts of this disclosure, and it should also be understood that such concepts are intended to be covered by the appended claims unless the wording of those claims expressly states otherwise.

Claims

1. An electro-optical assembly, characterized by The electro-optic assembly includes: A first substrate, the first substrate having a first surface and a second surface opposite to the first surface; A second substrate having a third surface and a fourth surface opposite to the third surface, the second surface and the third surface facing each other to define a gap having a cell pitch; A first electrode, the first electrode being coupled to the second surface; A second electrode, which is coupled to the third surface; An electro-optic medium located between the first electrode and the second electrode and configured to be activated between transmission states; A conductor assembly electrically coupled to the first electrode and defining at least one space containing a first conductive intermediate; and A seal that holds the electro-optic medium within the gap.

2. The electro-optical assembly of claim 1, wherein, The first substrate and the second substrate are defined with a thickness of 0.4 mm or less.

3. The electro-optical assembly of claim 1, wherein, The seal forms a deformation barrier, and the unit spacing exhibits greater deformation on the outside of the seal than on the inside of the seal in a region within approximately 5 mm of the conductor assembly.

4. The electro-optical assembly as claimed in claim 1, characterized in that, The conductor assembly is configured to continuously bridge between the first electrode and the second electrode.

5. The electro-optic assembly as described in any one of claims 1 to 4, characterized in that, The conductor assembly includes at least one pair of protrusions defining the at least one space.

6. The electro-optical assembly as described in claim 5, characterized in that, The at least one pair of protrusions includes a first pair of protrusions and a second pair of protrusions defining a first space and a second space, the first conductive intermediate being located in the first space, and the second conductive intermediate being located in the second space.

7. The electro-optical assembly as described in claim 5, characterized in that, The at least one pair of protrusions are part of an outer coating that substantially encapsulates the conductor assembly.

8. The electro-optic assembly as described in any one of claims 1 to 4, characterized in that, The first conductive intermediate includes a conductive adhesive or paste for bonding the conductor assembly to at least one of the first electrode or the second electrode.

9. The electro-optical assembly as claimed in claim 8, characterized in that, The first conductive intermediate comprises a material that exhibits lower hardness characteristics than the seal.

10. The electro-optic assembly as claimed in any one of claims 1 to 4, characterized in that, The conductor assembly extends at least partially between the first substrate and the second substrate.

11. The electro-optic assembly as claimed in any one of claims 1 to 4, characterized in that, The conductor assembly includes a first conductive intermediate and a second conductive intermediate, the first conductive intermediate and the second conductive intermediate being respectively coupled to one of a first conductive package or a first bus and a second conductive package or a second bus.

12. The electro-optical assembly as claimed in claim 11, characterized in that, The first conductive encapsulation extends at least partially along the outer periphery of the first substrate and at least partially around the second surface.

13. An electro-optical assembly, characterized in that, The electro-optic assembly includes: A first substrate, the first substrate having a first surface and a second surface opposite to the first surface; A second substrate having a third surface and a fourth surface opposite to the third surface, the second surface and the third surface facing each other to define a gap having a cell pitch; A first electrode coupled to the second surface and a second electrode coupled to the third surface, wherein at least one of the first electrode and the second electrode includes at least one isolation line defining at least one conductive island; An electro-optic medium, located between the first electrode and the second electrode and configured to be activated between transmission states; and A conductor assembly electrically coupled to a first electrode and a second electrode and including at least one conductive bridge, the at least one conductive bridge electrically coupling the at least one conductive island to the first electrode and the second electrode opposite to at least one of the first electrode and the second electrode including at least one isolation line.

14. The electro-optical assembly as claimed in claim 13, characterized in that, The at least one conductive bridge is located in a via defined by the first substrate or the second substrate.

15. The electro-optic assembly as claimed in any one of claims 13 to 14, characterized in that, The at least one isolation line includes a first isolation line and a second isolation line, and the at least one conductive island includes a first conductive island and a second conductive island.

16. The electro-optic assembly as claimed in any one of claims 13 to 14, characterized in that, The conductor assembly extends at least partially between the first substrate and the second substrate.

17. The electro-optical assembly as claimed in claim 13, characterized in that, The conductor assembly defines a non-linear end portion that matches the contour of at least one of the first substrate and the second substrate.

18. The electro-optical assembly as claimed in claim 13, characterized in that, The isolation line in one of the first electrode and the second electrode defines a conductive island portion on an outwardly extending tab, and the conductive bridge electrically couples the conductive island portion to the opposite of the first electrode and the second electrode.

19. An electro-optical assembly, characterized in that, The electro-optic assembly includes: A first substrate, the first substrate having a first surface and a second surface opposite to the first surface; A second substrate having a third surface and a fourth surface opposite to the third surface, the second surface and the third surface facing each other to define a gap having a cell pitch; A first electrode, the first electrode being coupled to the second surface; A second electrode, which is coupled to the third surface; An electro-optic medium located between the first electrode and the second electrode and configured to be activated between transmission states; A conductor assembly including a first conductive path and a second conductive path, the first conductive path being adhered to one of the first electrodes via a first conductive intermediate, and the second conductive path being coupled to the other of the first and second electrodes via a second conductive intermediate; and A seal that holds the electro-optic medium within the gap.

20. The electro-optical assembly as claimed in claim 19, characterized in that, The first conductive intermediate is formed of a conductive adhesive, and the second conductive intermediate is formed of a conductive material that exhibits lower hardness characteristics than the seal.

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