Electronic paper display devices and electronic equipment

Abstract

This application provides an electronic paper display device and an electronic device, relating to the field of display technology. The electronic paper display device includes a display area and a border area located around the display area. The electronic paper display device includes: an array substrate, a top substrate, a flow dielectric layer, and a filling layer; the top substrate and the array substrate are disposed opposite each other; the flow dielectric layer is disposed between the array substrate and the top substrate, and the flow dielectric layer includes a filling liquid and conductive particles; the filling layer is disposed between the array substrate and the top substrate, and is located in the border area. The filling layer includes a first support structure and a sealant. The first support structure connects the array substrate and the top substrate, and the sealant is used to fill the gap between the array substrate and the top substrate and to bond the array substrate and the top substrate. This application aims to improve the product yield and reliability of the electronic paper display device and the electronic device.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to an electronic paper display device and an electronic device. Background Technology

[0002] With its low power consumption (no continuous power consumption for static display), zero blue light that is harmless to the eyes, and recyclable green characteristics, coupled with continuous breakthroughs in technologies such as flexible display and high resolution, electronic paper displays have not only gained widespread favor in the consumer market in recent years (such as e-book readers and electronic paper notebooks), but have also rapidly penetrated the commercial and industrial fields, becoming the core display component of products such as electronic logistics labels, smart price tags, and cold chain traceability labels.

[0003] Existing electronic paper displays include a display area, a bezel area surrounding the display area, a flow dielectric layer, an array substrate, and a top substrate. During production, adhesive is first applied to the bezel area, and electronic paste is filled into the flow dielectric layer. The array substrate and top substrate are then bonded, pressurized, and baked to form a closed box. However, during the bonding process, the bezel area of ​​the electronic paper display relies primarily on its frame structure for support, which is severely insufficient. Uneven pressure can easily cause deformation of the array substrate and top substrate, resulting in localized depressions in the bezel area and uneven box thickness. Furthermore, after bonding, pressing the bezel area with a finger or applying external pressure can also easily cause deformation of the array substrate and top substrate, leading to localized depressions and uneven box thickness. This ultimately reduces the product yield and reliability of electronic paper products.

[0004] Therefore, improving the product yield and reliability of electronic paper display devices has become an urgent problem to be solved. Utility Model Content

[0005] The main objective of this application is to provide an electronic paper display device and an electronic device, which aims to improve the product yield and reliability of the electronic paper display device and the electronic device.

[0006] In a first aspect, this application provides an electronic paper display device, the electronic paper display device including a display area and a border area located around the display area, the electronic paper display device including: an array substrate, a top substrate, a flow dielectric layer and a filling layer; the top substrate is disposed opposite to the array substrate; the flow dielectric layer is disposed between the array substrate and the top substrate, the flow dielectric layer including a filling liquid and conductive particles; the filling layer is disposed between the array substrate and the top substrate and located in the border area, the filling layer including a first support structure and a sealant, the first support structure connecting the array substrate and the top substrate, the sealant being used to fill the gap between the array substrate and the top substrate and to bond the array substrate and the top substrate.

[0007] In some embodiments, the array substrate includes a plurality of pixel units located in the display area;

[0008] The electronic paper display device further includes a second support structure located within the display area and disposed between each of the pixel units. The second support structure connects the array substrate and the top substrate.

[0009] In some embodiments, the number of the first support structures is at least greater than the number of the second support structures.

[0010] In some embodiments, the number of the first support structures is 1.5 to 2 times the number of the second support structures.

[0011] In some embodiments, the cross-sectional area of ​​the first support structure is smaller than the cross-sectional area of ​​the second support structure.

[0012] In some embodiments, the first support structure includes a plurality of support columns, the plurality of support columns being spaced apart; and / or,

[0013] The first support structure includes multiple pixel barriers, which are arranged to form a filling cavity for filling the sealant.

[0014] In some embodiments, the second support structure includes support pillars disposed at corner positions of the pixel unit; and / or,

[0015] The second support structure includes a pixel barrier wall, which is disposed around the periphery of the pixel unit.

[0016] In some embodiments, a buffer region is formed between the display area and the border region, and the electronic paper display device further includes a buffer cavity located in the buffer region.

[0017] In some embodiments, the array substrate is made of at least one of glass, acrylic sheet, polyimide, and polyethylene terephthalate; and / or,

[0018] The material of the top substrate includes at least one selected from glass, acrylic sheet, polyimide, and polyethylene terephthalate; and / or,

[0019] The material of the first support structure includes organic resin adhesive.

[0020] Secondly, this application provides an electronic device including an electronic paper display device as described in any one of the embodiments of the first aspect.

[0021] This application provides an electronic paper display device and an electronic device. The electronic paper display device includes an array substrate, a top substrate, a flow dielectric layer, and a filling layer. The top substrate and the array substrate are disposed opposite to each other. The flow dielectric layer is disposed between the array substrate and the top substrate, and includes a filling liquid and conductive particles. The filling layer is disposed between the array substrate and the top substrate, and is located in the border area. The filling layer includes a first support structure and a sealant. The first support structure connects the array substrate and the top substrate, and the sealant is used to fill the gap between the array substrate and the top substrate and to bond the array substrate and the top substrate. Since the filling layer located in the border area includes the first support structure and the sealant, on the one hand, the first support structure... The support structure fills most of the space in the frame area, reducing the amount of sealant used in the frame area. On the other hand, during the process of using sealant to bond the array substrate and the top substrate to form the box, and after the box is formed, even if the frame area is subjected to external pressure, the first support structure can effectively support the array substrate and the top substrate located on both sides of the frame area because the first support structure is in contact with the array substrate and the top substrate respectively. This prevents the array substrate and the top substrate from deforming and avoids local depressions in the frame area, thereby effectively avoiding the problem of uneven box thickness. This improves the product yield and reliability of electronic paper display devices and electronic devices. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of an electronic paper display device in the prior art;

[0024] Figure 2 for Figure 1 A cross-sectional view of the electronic paper display device along direction A;

[0025] Figure 3 This is a schematic diagram of the structure of an electronic paper display device according to an embodiment of this application;

[0026] Figure 4 for Figure 3 A cross-sectional view of the electronic paper display device in direction B;

[0027] Figure 5 This is a schematic diagram of the structure of an array substrate in an electronic paper display device according to an embodiment of this application;

[0028] Figure 6 for Figure 5 Cross-sectional view of the array substrate in the C direction;

[0029] Figure 7 A schematic diagram of the structure of an array substrate in an electronic paper display device provided in an embodiment of this application;

[0030] Figure 8 for Figure 7 A cross-sectional view of the array substrate in the D direction;

[0031] Figure 9 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0033] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all contents and operations / steps, nor do they necessarily need to be performed in the described order. For example, some operations / steps can be broken down, combined, or partially merged, so the actual execution order may change depending on the actual situation. It should be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the application. As used in this specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a," "an," and "the" are intended to include the plural forms.

[0034] It should be understood that, in order to clearly describe the technical solutions of the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with essentially the same function and effect. For example, the first callback function and the second callback function are only used to distinguish different callback functions and do not limit their order. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" do not necessarily mean they must be different.

[0035] It should also be understood that the term "and / or" as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0036] Existing electronic paper displays include a display area, a bezel area surrounding the display area, a flow dielectric layer, an array substrate, and a top substrate, such as... Figure 1 As shown, during production, adhesive is first applied to the bezel area and electronic paste is filled into the fluid dielectric layer. Then, the array substrate and top substrate are bonded, pressurized, and baked to form a closed box. However, during the bonding process of the array substrate and top substrate into the box, the bezel area of ​​the electronic paper display is mainly supported by the frame structure of the bezel, such as... Figure 2 As shown, its support is severely insufficient. Once the pressure is uneven, the array substrate and the top substrate are prone to deformation, causing local depressions in the frame area and resulting in uneven thickness of the box. Furthermore, after the array substrate and the top substrate are bonded together, once the frame area of ​​the electronic display is pressed with a finger or the frame area is squeezed by external pressure, the array substrate and the top substrate are also prone to deformation due to the severe lack of support in the frame area, causing local depressions in the frame area and resulting in uneven thickness of the box. This, in turn, reduces the product yield and reliability of electronic paper products.

[0037] Based on this, embodiments of this application provide an electronic paper display device 1100 and an electronic device 1000, aiming to improve the product yield and reliability of the electronic paper display device 1100 and the electronic device 1000.

[0038] For example, the electronic paper display device 1100 provided in this application can be a microcavity electronic paper display (MED). A microcavity electronic paper display (MED) mainly involves creating a dam structure on the surface of a thin-film transistor (TFT) to surround each pixel unit, and filling a flow dielectric layer with an electronic paste containing black and white particles for imaging. Finally, it is encapsulated with a top glass plate. The cavity formed by multiple dam structures in the microcavity electronic paper display is thus the microcavity structure. The microcavity electronic paper display (MED) can control the color change of the particles in the electronic paste using an electric field, achieving a high-contrast, high-reflection, and high-color-gamut display effect through particle reflection of light.

[0039] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0040] Please refer to Figure 3 , Figure 4 In a first aspect, this application provides an electronic paper display device 1100, which includes a display area 1 and a border area 2 located around the display area 1. The electronic paper display device 1100 includes an array substrate 100, a top substrate 200, a flow medium layer 300, and a filling layer. The top substrate 200 is disposed opposite to the array substrate 100. The flow medium layer 300 is disposed between the array substrate 100 and the top substrate 200 and includes a filling liquid and conductive particles. The filling layer is disposed between the array substrate 100 and the top substrate 200 and is located in the border area 2. The filling layer includes a first support structure 400 and a sealant 500. The first support structure 400 connects the array substrate 100 and the top substrate 200, and the sealant 500 is used to fill the gap between the array substrate 100 and the top substrate 200 and to bond the array substrate 100 and the top substrate 200.

[0041] It should be noted that during the process of bonding the array substrate 100 and the top substrate 200 to form the housing, due to insufficient support in the frame area 2, once the frame area 2 is subjected to external pressure, the array substrate 100 and the top substrate 200 are prone to deformation. This will not only cause uneven housing thickness in the frame area 2, but will also further cause uneven housing thickness in the display area 1. The areas with thinner housing thickness will appear brighter, while the areas with thicker housing thickness will appear darker, resulting in poor display effect and affecting user experience.

[0042] It is understandable that, since the filling layer in the frame area 2 includes the first support structure 400 and the sealant 500, on the one hand, the first support structure 400 fills most of the space in the frame area 2, reducing the amount of sealant 500 used in the frame area 2. On the other hand, during the process of using the sealant 500 to bond the array substrate 100 and the top substrate 200 to form the box, and after the box is formed, even if the frame area 2 is subjected to external pressure, the first support structure 400 can effectively support the array substrate 100 and the top substrate 200 located on both sides of the frame area 2, preventing deformation of the array substrate 100 and the top substrate 200, avoiding local depressions in the frame area 2, thereby effectively avoiding the problem of uneven box thickness, and thus improving the display effect, product yield and reliability of the electronic paper display device 1100.

[0043] It should be noted that the array substrate 100 and the top substrate 200 are located on the sides of the display area 1 and the bezel area 2, respectively. In the bezel area 2, the gap between the array substrate 100 and the top substrate 200 is filled by a filling layer. In the display area 1, the gap between the array substrate 100 and the top substrate 200 is filled by a flow medium layer 300.

[0044] For example, in the case where the electronic paper display device 1100 is a microcavity electronic paper display (MED), the flow medium layer 300 includes a filling liquid and conductive particles, and the conductive particles may include black particles and white particles with different electrical properties.

[0045] Specifically, the flow medium layer 300 is disposed between the top substrate 200 and the array substrate 100, and the flow medium layer 300 forms a closed cavity containing a filling liquid and conductive particles distributed in the filling liquid.

[0046] For example, black and white particles can have different electrical charges. For instance, white particles may carry a negative charge and black particles may carry a positive charge; or white particles may carry a positive charge and black particles may carry a negative charge. No specific limitation is made here.

[0047] Black and white particles can undergo electrophoresis under voltage, controlling their positional distribution within the fluid dielectric layer 300 and thus creating different grayscale levels on the screen surface. Utilizing the principle of attraction between positive and negative particles, when an electric field is applied, corresponding black or white particles move to the top of the fluid dielectric layer 300, allowing the user to see black or white within that display area. Applying different voltages to the same fluid dielectric layer 300 will result in a half-black, half-white appearance at the top, allowing the user to see gray within that display area.

[0048] Specifically, electrode layers are provided in both the top substrate 200 and the array substrate 100. Under the joint driving action of the electrode layers in the top substrate 200 and the array substrate 100, black and white particles in the flow medium layer 300 are arranged to achieve the display and switching of different images.

[0049] In some embodiments, the array substrate 100 includes a border located in the border region 2, such as Figure 5 , Figure 7 As shown; or the top substrate 200 includes a border located in the border region 2. In this application, the location of the border is not limited in too much. Further, a filling layer is disposed between the array substrate 100 and the top substrate 200 and is located within the border. The filling layer includes a first support structure 400 and a sealant 500. The first support structure 400 connects the array substrate 100 and the top substrate 200. The sealant 500 is used to fill the gaps in the border and bond the array substrate 100 and the top substrate 200.

[0050] It should be noted that, on the one hand, the first support structure 400 fills most of the space in the frame, reducing the amount of sealant 500 used in the frame. On the other hand, during the process of using sealant 500 to bond the array substrate 100 and the top substrate 200 to form the box, and after the box is formed, even if the frame opening is squeezed by external pressure, the first support structure 400 can effectively support the array substrate 100 and the top substrate 200 located on both sides of the frame, preventing the array substrate 100 and the top substrate 200 from deforming, avoiding local depressions at the frame opening, thereby effectively avoiding the problem of uneven box thickness, and thus improving the product yield, display effect and reliability of the electronic paper display device 1100.

[0051] In some embodiments, refer to Figure 3 , Figure 4 , Figure 5 as well as Figure 6 The first support structure 400 includes multiple support columns spaced apart. For example, the support columns can be cylindrical, square, or other irregularly shaped columnar structures; this application does not impose excessive limitations on the structure of the support columns. And / or, the first support structure 400 includes multiple pixel barriers, such as... Figure 7 As shown, multiple pixel barriers surround a filling cavity 10, which is used to fill sealant 500. For example, the pixel barriers can be square blocks, trapezoidal blocks, parallelogram blocks or other irregularly shaped block structures. In this application, the structure of the pixel barriers is not limited in too much.

[0052] It should be noted that within the border area 2, the height of the support pillars and the height of the pixel barrier are the same as the height of the gap between the array substrate 100 and the top substrate 200, which helps to avoid uneven thickness of the box.

[0053] For example, refer to Figure 5 Within the border area 2, if the first support structure 400 consists of multiple support columns, the multiple support columns are arranged in a column direction to form a support group, and the multiple support groups are spaced apart and parallel to the long side direction of the border area 2, the sealant 500 is used to fill the gaps between the support columns.

[0054] For example, refer to Figure 7 Within the border area 2, if the first support structure 400 is composed of multiple pixel walls, the multiple pixel walls surround and form a filling cavity 10. The filling cavity 10 can be a square, triangle, parallelogram or other irregular polygonal cavity structure. In this application, the structure of the filling cavity 10 is not limited too much.

[0055] For example, within the border area 2, if the first support structure 400 is composed of multiple support pillars and multiple pixel walls, the multiple pixel walls surround to form a filling cavity 10, the multiple filling cavities 10 are spaced apart from the multiple support pillars, and sealant 500 is injected into the gap between the pixel walls and the support pillars and the filling cavity 10.

[0056] It should be noted that, on the one hand, the first support structure 400, composed of multiple support pillars, multiple pixel barriers, or a combination of multiple support pillars and multiple pixel barriers, fills most of the space in the border area 2, reducing the amount of sealant 500 used in the border area 2. On the other hand, during the process of using sealant 500 to bond the array substrate 100 and the top substrate 200 to form the box, and after the box is formed, even if the border area 2 is subjected to external pressure, the first support structure 400 can effectively and uniformly support the array substrate 100 and the top substrate 200 located on both sides of the border area 2, preventing deformation of the array substrate 100 and the top substrate 200, avoiding local depressions in the border area 2, and thus effectively avoiding uneven box thickness. This improves the product yield, display effect, and reliability of the electronic paper display device 1100.

[0057] In some embodiments, refer to Figure 4 , Figure 5 , Figure 6 , Figure 7 as well as Figure 8The array substrate 100 includes a plurality of pixel units 110 located in the display area 1; the electronic paper display device 1100 also includes a second support structure 600, which is located in the display area 1 and disposed between each pixel unit 110, and the second support structure 600 connects the array substrate 100 and the top substrate 200.

[0058] It should be noted that the flow medium layer 300 is disposed between the array substrate 100 and the top substrate 200, and the flow medium layer 300 is located in the display area 1. The flow medium layer 300 includes a filling liquid and conductive particles.

[0059] It should be noted that the array substrate 100 and the top substrate 200 are bonded together to form a housing. In the display area 1, if the housing thickness is uneven, in areas with thinner housing thickness, the movement path of conductive particles is shorter, and the number of particles reaching the electrode surface is greater, resulting in local brightness being too bright. In areas with thicker housing thickness, the movement path of conductive particles is longer, and the number of particles reaching the electrode surface is less, resulting in local brightness being too dark. This leads to uneven display in the display area 1, which can easily cause cloud-like or mottled phenomena on the screen, resulting in poor display effect and affecting user experience.

[0060] Understandably, during the process of using sealant 500 to bond the array substrate 100 and the top substrate 200 to form the housing, and after the housing is formed, even if the display area 1 is subjected to external pressure, the second support structure 600 can effectively and uniformly support the array substrate 100 and the top substrate 200 located on both sides of the display area 1, preventing deformation of the array substrate 100 and the top substrate 200, avoiding local depressions in the display area 1, thereby further effectively avoiding the problem of uneven housing thickness, and thus improving the product yield, display effect and reliability of the electronic paper display device 1100 and the electronic device 1000.

[0061] In some embodiments, the second support structure 600 includes support columns, such as... Figure 3 , Figure 5 As shown, the support pillars are located at the corner positions of the pixel unit 110; for example, the support pillars can be cylindrical, square, or other irregularly shaped columnar structures, and the structure of the support pillars is not excessively limited in this application. And / or, the second support structure 600 includes pixel barriers, such as... Figure 7 As shown, pixel barriers are disposed around the pixel unit 110.

[0062] For example, within the display area 1, if the second support structure 600 is composed of multiple pixel barriers, the multiple pixel barriers are disposed on the periphery of the pixel unit 110 to form a cavity, and the flow medium layer 300 is used to fill the cavity.

[0063] For example, in display area 1, if the second support structure 600 is composed of multiple support pillars and the support pillars are located at the corner positions of pixel unit 110, the flow medium layer 300 is used to fill the gaps between the multiple support pillars.

[0064] For example, within the display area 1, if the second support structure 600 is composed of multiple pixel walls and multiple support pillars, the multiple pixel walls are disposed around the pixel unit 110 to form a cavity, the cavity 10 is spaced apart from the support pillars, and the flow medium layer 300 is used to fill the gap between the pixel walls and the support pillars and the inside of the cavity.

[0065] In some embodiments, refer to Figure 5 The number of the first support structure 400 is at least greater than the number of the second support structure 600.

[0066] For example, the first support structure 400 can be a support column or a pixel barrier, and the second support structure 600 can be a support column or a pixel barrier. Multiple first support structures 400 are provided in the border area 2, and multiple second support structures 600 are provided in the display area 1.

[0067] For example, multiple first support structures 400 are provided in the border area 2. If the first support structure 400 is a support column, the multiple first support structures 400 are arranged in a column to form a support group. The multiple support groups are arranged at intervals and parallel to the long side direction of the border area 2. The sealant 500 is used to fill the gaps between the support columns.

[0068] For example, multiple first support structures 400 are provided in the border area 2. If the first support structure 400 is a pixel barrier, the multiple first support structures 400 surround to form a filling cavity 10, and the filling cavity 10 is used to inject sealant 500.

[0069] Understandably, the synergistic effect of the first support structure 400 and the second support structure 600 strengthens the support for the box body, which helps to maintain the uniformity of the box body thickness, ensure the display effect, and improve the product yield.

[0070] It should be noted that if more second support structures 600 are set in display area 1, although the support for the box in display area 1 can be improved, since the first support structure 400 and the second support structure 600 are not transparent, more second support structures 600 will block more reflected light, and the display effect will be reduced.

[0071] It should be further explained that during the process of bonding the array substrate 100 and the top substrate 200 to form the housing, the main stress-bearing area is the frame area 2. By setting more first support structures 400 in the frame area 2, the support for the array substrate 100 and the top substrate 200 can be effectively improved, preventing deformation of the array substrate 100 and the top substrate 200. Furthermore, since the frame area 2 is located around the display area 1, the first support structures 400 in the frame area 2 can directly bear the edge load, preventing the load from spreading to the middle display area 1, indirectly reducing the stress burden on the display area 1. It is not necessary to set more second support structures 600 in the display area 1 to effectively maintain the thickness of the housing at the display area 1, thereby avoiding blocking more reflected light and further improving the display effect of the display area 1.

[0072] In some embodiments, the number of first support structures 400 is 1.5 to 2 times the number of second support structures 600.

[0073] In some embodiments, refer to Figure 5 The cross-sectional area of ​​the first support structure 400 is smaller than that of the second support structure 600.

[0074] It is understandable that, since the cross-sectional area of ​​the first support structure 400 is smaller than that of the second support structure 600, more first support structures 400 can be set in the frame area 2 to enhance the support for the array substrate 100 and the top substrate 200, thereby preventing the load from spreading to the middle display area 1 and indirectly reducing the stress on the display area 1. It is also possible to effectively maintain the thickness of the box at the display area 1 without setting more second support structures 600 in the display area 1, thereby avoiding blocking more reflected light and further improving the display effect of the display area 1.

[0075] In some embodiments, refer to Figure 4 , Figure 6 , Figure 8 A buffer area 3 is formed between the display area 1 and the border area 2. The electronic paper display device 1100 also includes a buffer cavity located in the buffer area 3.

[0076] Understandably, during the process of pressing and bonding the array substrate 100 and the top substrate 200 to form the housing, if there is too much sealant 500 in the frame area 2 or too much filler liquid in the display area 1, a buffer area 3 can be provided between the display area 1 and the frame area 2. The buffer cavity in the buffer area 3 can better accommodate the filler liquid overflowing from the display area 1, and can also better accommodate the sealant 500 overflowing from the frame area 2. This prevents the sealant 500 from flowing from the frame area 2 to the display area 1 and affecting the display effect, and prevents the filler liquid from flowing from the display area 1 to the frame area 2 and affecting the sealing effect, thereby further improving the product yield of the electronic paper display device 1100.

[0077] In some embodiments, the array substrate 100 is made of at least one of glass, acrylic sheet, polyimide, and polyethylene terephthalate; and / or, the top substrate 200 is made of at least one of glass, acrylic sheet, polyimide, and polyethylene terephthalate; and / or, the first support structure 400 is made of organic resin adhesive.

[0078] Secondly, referring to Figure 9 This application provides an electronic device 1000, which includes an electronic paper display device 1100 as described in any of the embodiments of the first aspect.

[0079] This application provides an electronic paper display device 1100 and an electronic device 1000. The electronic paper display device 1100 includes an array substrate 100, a top substrate 200, a flow dielectric layer 300, and a filling layer. The top substrate 200 is disposed opposite to the array substrate 100. The flow dielectric layer 300 is disposed between the array substrate 100 and the top substrate 200, and includes a filling liquid and conductive particles. The filling layer is disposed between the array substrate 100 and the top substrate 200, and is located in the border region 2. The filling layer includes a first support structure 400 and a sealant 500. The first support structure 400 connects the array substrate 100 and the top substrate 200, and the sealant 500 is used to fill the gap between the array substrate 100 and the top substrate 200 and to bond the array substrate 100 and the top substrate 200. The filling layer located in the border region 2 includes the first support structure 400. The first support structure 400 fills most of the space in the frame area 2, reducing the amount of sealant 500 used in the frame area 2. Furthermore, during the process of bonding the array substrate 100 and the top substrate 200 with sealant 500 to form the housing, and after the housing is formed, even if the frame area 2 is subjected to external pressure, the first support structure 400 effectively supports the array substrate 100 and the top substrate 200 located on both sides of the frame area 2, preventing deformation of the array substrate 100 and the top substrate 200 and avoiding localized depressions in the frame area 2. This effectively avoids uneven housing thickness, thereby improving the product yield and reliability of the electronic paper display device 1100 and the electronic device 1000.

[0080] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0081] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0082] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0083] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0084] The above embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of protection of this application. Any non-substantial changes and substitutions made by those skilled in the art based on this application shall fall within the scope of protection claimed by this application.

Claims

1. An electronic paper display device, characterized in that, The electronic paper display device includes a display area and a border area located around the display area. The electronic paper display device includes: Array substrate; A top substrate, which is disposed opposite to the array substrate; A flow medium layer is disposed between the array substrate and the top substrate, and the flow medium layer includes a filling liquid and conductive particles; A filler layer is disposed between the array substrate and the top substrate, and located in the border area. The filler layer includes a first support structure and a sealant. The first support structure connects the array substrate and the top substrate, and the sealant is used to fill the gap between the array substrate and the top substrate and to bond the array substrate and the top substrate.

2. The electronic paper display device according to claim 1, characterized in that, The array substrate includes a plurality of pixel units located in the display area; The electronic paper display device further includes a second support structure located within the display area and disposed between each of the pixel units. The second support structure connects the array substrate and the top substrate.

3. The electronic paper display device according to claim 2, characterized in that, The number of the first support structure is at least greater than the number of the second support structure.

4. The electronic paper display device according to claim 3, characterized in that, The number of the first support structure is 1.5 to 2 times the number of the second support structure.

5. The electronic paper display device according to claim 2, characterized in that, The cross-sectional area of ​​the first support structure is smaller than that of the second support structure.

6. The electronic paper display device according to claim 1, characterized in that, The first support structure includes a plurality of support columns, which are spaced apart; and / or, The first support structure includes multiple pixel barriers, which are arranged to form a filling cavity for filling the sealant.

7. The electronic paper display device according to claim 2, characterized in that, The second support structure includes support pillars, which are disposed at the corner positions of the pixel unit; and / or, The second support structure includes a pixel barrier wall, which is disposed around the periphery of the pixel unit.

8. The electronic paper display device according to claim 1, characterized in that, A buffer area is formed between the display area and the border area, and the electronic paper display device further includes a buffer cavity located in the buffer area.

9. An electronic device, characterized in that, The electronic device includes the electronic paper display device as described in any one of claims 1-8.

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