A photolithography machine

Abstract

The utility model provides a kind of photoetching machine, including process cavity and sampling tube;One end of sampling tube is arranged in process cavity, the other end extends to process cavity outside, and the tube wall of sampling tube is sealingly connected with the cavity wall of process cavity.The photoetching machine is connected with ammonia gas analyzer when normal working, one end of sampling tube is located in process cavity, and ammonia gas analyzer is also connected with alarm by a controller, and thus, ammonia gas analyzer can collect the gas in process cavity in real time through sampling tube, and then the ammonia concentration in process cavity is detected in real time and accurately, and the controller controls the alarm to alarm when the ammonia concentration in process cavity is greater than or equal to the set ammonia concentration threshold, to prompt operator to maintain photoetching machine and / or other equipment cooperating with photoetching machine in time, to avoid the problem that the key size of wafer is abnormal when photoetching is carried out when the ammonia concentration in process cavity is too high.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment technology, and specifically relates to a photolithography machine. Background Technology

[0002] In photolithography, excessive ammonia (NH3) concentration in the process chamber can lead to critical dimension anomalies in the wafer, resulting in rework. The ammonia in the process chamber primarily originates from process gases and the coating and developing equipment. When the environment of the coating and developing equipment deteriorates, or when the filters used to filter process gases malfunction, the ammonia concentration in the process chamber can easily become too high. Therefore, monitoring the ammonia concentration in the process chamber is essential to improve the photolithography quality of the wafer.

[0003] One existing method for detecting the concentration of ammonia gas in a process chamber involves first stopping the lithography machine, then opening the process chamber, and finally inserting the sampling tube of an ammonia analyzer into the process chamber to introduce the ammonia gas into the analyzer. This method, because it requires opening the process chamber, results in low accuracy in detecting the ammonia concentration. Utility Model Content

[0004] The purpose of this invention is to provide a lithography machine that can achieve real-time and accurate detection of ammonia concentration in the process chamber.

[0005] To achieve the above objectives, this utility model provides a lithography machine, including a process cavity and a sampling tube. One end of the sampling tube is disposed inside the process cavity, and the other end extends outside the process cavity. The tube wall of the sampling tube is sealed to the cavity wall of the process cavity.

[0006] Optionally, the lithography machine further includes an alignment unit disposed within the process cavity and includes an adsorption chuck.

[0007] The sampling tube is connected to the adsorption chuck.

[0008] Optionally, the adsorption chuck has an adsorption surface; the adsorption chuck is provided with an alignment through hole extending through in a direction perpendicular to the adsorption surface, and the end of the sampling tube located in the process chamber is inserted into the alignment through hole from the end of the adsorption chuck away from the adsorption surface, and the tube wall of the sampling tube is connected to the hole wall of the alignment through hole.

[0009] Optionally, the lithography machine further includes an emission mechanism, which includes an emission pipe and a valve. One end of the emission pipe is disposed inside the process chamber, and the other end extends outside the process chamber. The pipe wall of the emission pipe is sealed to the cavity wall of the process chamber. The valve is disposed on the emission pipe.

[0010] Optionally, the lithography machine further includes an alignment unit disposed within the process cavity and includes an adsorption chuck.

[0011] The discharge pipe is connected to the adsorption chuck.

[0012] Optionally, the adsorption chuck has an adsorption surface; the adsorption chuck is provided with an alignment through hole extending through in a direction perpendicular to the adsorption surface, and the end of the discharge pipe located in the process chamber is inserted into the alignment through hole from the end of the adsorption chuck away from the adsorption surface, and the pipe wall of the discharge pipe is connected to the hole wall of the alignment through hole.

[0013] Optionally, the lithography machine further includes an ammonia analyzer, which is located outside the process chamber and connected to the sampling tube.

[0014] Optionally, the lithography machine also includes an alarm and a controller connected in communication. Both the alarm and the controller are located outside the process chamber, and the controller is connected in communication with the ammonia analyzer.

[0015] Optionally, the lithography machine further includes a controller, which is located outside the process chamber and is communicatively connected to the ammonia analyzer and the valve.

[0016] Optionally, the valve is located on the portion of the discharge pipe outside the process chamber.

[0017] Compared with existing technologies, the lithography machine of this invention has the following advantages:

[0018] The aforementioned lithography machine includes a process chamber and a sampling tube. One end of the sampling tube is disposed inside the process chamber, and the other end extends outside the process chamber. The wall of the sampling tube is sealed to the wall of the process chamber. During normal operation, the end of the sampling tube outside the process chamber is connected to an ammonia analyzer. The ammonia analyzer is also connected to an alarm via a controller. Thus, the ammonia analyzer can collect gas samples from the process chamber in real time through the sampling tube, thereby accurately detecting the ammonia concentration within the process chamber. When the ammonia concentration in the process chamber is greater than or equal to a set ammonia concentration threshold, the controller activates the alarm to alert the operator to promptly maintain the lithography machine and / or other equipment working with it, preventing lithography operations performed when the ammonia concentration in the process chamber is too high, which could lead to abnormalities in critical wafer dimensions. Attached Figure Description

[0019] The accompanying drawings are provided to better understand this utility model and do not constitute an undue limitation thereof. Wherein:

[0020] Figure 1 This is a partial structural schematic diagram of a lithography machine provided according to an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram showing the positional relationship between the adsorption chuck, sampling tube, and discharge tube of a lithography machine according to an embodiment of the present invention.

[0022] [The following are explanations of the reference numerals in the attached drawings]: 110-process chamber, 120-sampling tube, 130-ammonia analyzer, 140-controller, 150-alarm, 160-alignment unit, 1611-adsorption surface, 1612-alignment through hole, 170-discharge mechanism, 171-discharge pipe, 172-valve, 180-process gas spray device. Detailed Implementation

[0023] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show components related to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the type, quantity, and proportion of each component can be arbitrarily changed, and the component layout may also be more complex.

[0024] Furthermore, while each embodiment described below possesses one or more technical features, this does not imply that users of this utility model must simultaneously implement all technical features in any embodiment, or can only separately implement some or all technical features in different embodiments. In other words, provided it is feasible, those skilled in the art can selectively implement some or all technical features in any embodiment, or selectively implement a combination of some or all technical features in multiple embodiments, based on the disclosure of this utility model and depending on design specifications or implementation requirements, thereby increasing the flexibility in implementing this utility model.

[0025] As used herein, the singular forms “a,” “an,” and “the” include plural objects, and the plural form “a plurality” includes two or more objects, unless otherwise expressly indicated. As used herein, the term “or” is generally used to include the meaning of “and / or,” unless otherwise expressly indicated, and the terms “install,” “connect,” and “join” should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection. Connections can be mechanical or electrical. Connections can be direct or indirect through an intermediate medium, and can represent internal communication between two elements or an interaction between two elements. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0026] To make the objectives, advantages, and features of this utility model clearer, the following detailed description is provided in conjunction with the accompanying drawings. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to conveniently and clearly illustrate the objectives of the embodiments of this utility model. The same or similar reference numerals in the drawings represent the same or similar parts.

[0027] Figure 1 The diagram shows a schematic representation of the lithography machine provided in some embodiments of the present invention. For example... Figure 1 As shown, the lithography machine includes a process cavity 110 and a sampling tube 120. One end of the sampling tube 120 is disposed inside the process cavity 110, and the other end extends outside the process cavity 110. The tube wall of the sampling tube 120 is also sealed to the cavity wall of the process cavity 110.

[0028] The sampling tube 120, located outside the process chamber 110, is connected to an ammonia analyzer 130. The ammonia analyzer 130 is also communicatively connected to an alarm 150 via a controller 140. The ammonia analyzer 130, the controller, and the alarm 150 are all located outside the process chamber 110. Thus, during the operation of the lithography machine, the gas inside the process chamber 110 can reach the ammonia analyzer 130 through the sampling tube 120, allowing the ammonia analyzer 130 to accurately detect the ammonia concentration in the process chamber 110 in real time without opening the process chamber 110. The controller 140 receives the detection results from the ammonia analyzer 130 and, when the ammonia concentration detected by the ammonia analyzer 130 is too high, controls the alarm 150 to sound, prompting the operator to promptly maintain the lithography machine and / or other equipment working with it to reduce the ammonia concentration in the process chamber 110. This can reduce or even avoid the problem of abnormal critical dimensions of the wafer caused by the lithography machine performing lithography operations when the ammonia concentration in the process chamber 110 is too high.

[0029] In practice, an ammonia concentration threshold is preset. When the ammonia concentration detected by the ammonia analyzer 130 is greater than or equal to the ammonia concentration threshold, the ammonia concentration in the process chamber 110 is considered too high. The ammonia concentration threshold can be set as needed. For example, if the ammonia concentration in the process chamber 110 reaches 25 pptv, it can cause critical dimension anomalies in the wafer, so the ammonia concentration threshold can be set to 20 pptv. Furthermore, the alarm 150 can trigger an alarm in any suitable form, such as an audible and visual alarm. The ammonia analyzer 130 can be a commercially available product.

[0030] In an optional embodiment, the lithography machine further includes the ammonia analyzer 130. Further, the lithography machine also includes the controller 140 and the alarm 150.

[0031] The portion of the sampling tube 120 located within the process cavity 110 can be positioned at any suitable location, but preferably, the portion of the sampling tube 120 located within the process cavity 110 is at least partially fixed within the process cavity 110 and does not move, in order to reduce the possibility of the sampling tube 120 rubbing against other components within the process cavity 110 and causing damage due to movement.

[0032] Those skilled in the art will understand that the lithography machine further includes an alignment unit 160, which is immovably disposed within the process cavity 110. In an optional embodiment, the portion of the sampling tube 120 located within the process cavity 110 is connected to the alignment unit 160, thereby achieving the effect that the portion of the sampling tube 120 located within the process cavity 110 is at least partially fixed within the process cavity 110 and does not move.

[0033] For details, please refer to Figure 2 The alignment unit 160 includes an adsorption chuck 161 with an adsorption surface 1611 for contacting the wafer when the adsorption chuck 161 adsorbs the wafer. The adsorption chuck 161 also has an alignment through-hole 1612 extending through the wafer in a direction perpendicular to the adsorption surface 1611. The alignment through-hole 1612 is used to align with the notch groove on the wafer when the adsorption chuck 161 adsorbs the wafer, for positioning the wafer. The sampling tube 120, located within the process cavity 110, has its end inserted into the alignment through-hole 1612 from the end away from the adsorption surface 1611, and the wall of the sampling tube 120 is connected to the wall of the alignment through-hole 1612. It should be understood that the end of the sampling tube 120 located within the process cavity 110 does not extend from the alignment through hole 1612, and therefore the sampling tube 120 does not protrude from the adsorption surface 1611.

[0034] It should be noted that the process chamber 110 has a first clearance hole (not shown in the figure) on its wall. One end of the sampling tube 120 is located inside the process chamber 110, and the other end passes through the first clearance hole and extends outside the process chamber 110. The description above that "the wall of the sampling tube 120 is also sealed to the wall of the process chamber 110" means that the wall of the sampling tube 120 is sealed to the wall of the first clearance hole, thereby preventing gas outside the process chamber 110 from entering the process chamber 110 through the first clearance hole.

[0035] Optionally, the lithography machine further includes an emission mechanism 170, which includes an emission pipe 171 and a valve 172. One end of the emission pipe 171 is disposed inside the process chamber 110, and the other end extends outside the process chamber 110. The wall of the emission pipe 171 is sealed to the wall of the process chamber 110. The valve 172 is disposed on the emission pipe 171. It is easy to understand that when the valve 172 is closed, the process chamber 110 cannot communicate with the external space through the emission pipe 171, and the gas inside the process chamber 110 cannot be discharged to the external space through the emission pipe 171. When the valve 172 is open, the process chamber 110 can communicate with the external space through the emission pipe 171, and the gas inside the process chamber 110 can be discharged to the external space through the emission pipe 171.

[0036] Those skilled in the art will know that the lithography machine also includes a process gas spraying device 180 (e.g., Figure 1 As shown in the figure, the process gas spraying device 180 is at least partially disposed within the process chamber 110 and is used to spray process gas into the process chamber 110. The process gas comes from an external gas source (not shown in the figure), and a filter (not shown in the figure) is disposed between the gas source and the process gas spraying device 180. The filter can be located outside the lithography machine or can be part of the lithography machine; this utility model does not limit this. One possible operation for the aforementioned "maintenance of the lithography machine and / or other equipment cooperating with the lithography machine" is: to shut down the lithography machine and open the valve 172, and also check whether the filter is abnormal. If not, the process gas spraying device 180 sprays the process gas filtered by the filter into the process chamber 110; if so, the filter is replaced first, and then the process gas spraying device 180 sprays the process gas filtered by the filter into the process chamber 110. During maintenance, the ammonia analyzer 130 monitors the ammonia concentration in the process chamber 110 in real time. Maintenance can be terminated when the ammonia concentration in the process chamber 110 falls below the ammonia concentration threshold. It should be understood that during maintenance, the gas in the process chamber 110 is discharged outside the process chamber 110 via the discharge pipe 171. Furthermore, the valve 172 should be closed after maintenance is completed.

[0037] In some alternative embodiments, the valve 172 is disposed on the portion of the discharge pipe 171 located outside the process chamber 110, so that an operator can manually open or close the valve 172.

[0038] In some alternative embodiments, the valve 172 is disposed at any suitable location on the discharge pipe 171, and the valve 172 is communicatively connected to the controller 140 and can be opened or closed under the control of the controller 140.

[0039] The portion of the discharge pipe 171 located within the process chamber 110 can be positioned at any suitable location, but preferably, the portion of the discharge pipe 171 located within the process chamber 110 is at least partially fixed within the process chamber 110 and does not move, to reduce the possibility of the discharge pipe 171 rubbing against other components within the process chamber 110 and causing damage due to movement. In a specific example, the discharge pipe 171 is connected to the alignment unit 160. For example, the end of the discharge pipe 171 located within the process chamber 110 is also inserted into the alignment through hole 1612 from the end away from the adsorption surface 1611, and the wall of the discharge pipe 171 is connected to the wall of the alignment through hole 1612. It should be understood that the end of the discharge pipe 171 located within the process chamber 110 does not protrude from the alignment through hole 1612, so that the discharge pipe 171 does not protrude from the adsorption surface 1611.

[0040] It is understood that the process chamber 110 has a second clearance hole (not shown in the figure) on its wall. One end of the discharge pipe 171 is located inside the process chamber 110, and the other end passes through the second clearance hole and extends to the outside of the process chamber 110. The "sealed connection between the pipe wall of the discharge pipe 171 and the wall of the process chamber 110" described above means that the pipe wall of the discharge pipe 171 is sealed to the wall of the second clearance hole, thereby preventing gas from outside the process chamber 110 from entering the process chamber 110 through the second clearance hole.

[0041] In some examples, the first clearance hole and the second clearance hole are connected (e.g., Figure 1 As shown in the figure, in other examples, the first clearance hole and the second clearance hole are independent of each other.

[0042] Furthermore, it should be noted that the lithography machine provided in this embodiment of the present invention also includes various other components, such as an exposure unit and an external delivery unit, the structures of which can be referenced from the prior art. In other words, the difference between the lithography machine provided in this embodiment of the present invention and the lithography machine in the prior art is that the sampling tube 120 is additionally added, and the ammonia analyzer 130 can also be added, and / or the controller 140 and the alarm 150 can be added, and / or the emission mechanism 170 can be added.

[0043] While the present invention has been disclosed above, it is not limited thereto. Those skilled in the art can make various modifications and variations to the present invention without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and variations.

Claims

1. A lithography machine, characterized in that, It includes a process chamber and a sampling tube, one end of which is disposed inside the process chamber and the other end extends outside the process chamber, and the wall of the sampling tube is sealed to the wall of the process chamber.

2. The lithography machine according to claim 1, characterized in that, The lithography machine also includes an alignment unit, which is disposed within the process cavity and includes an adsorption chuck. The sampling tube is connected to the adsorption chuck.

3. The lithography machine according to claim 2, characterized in that, The adsorption chuck has an adsorption surface; the adsorption chuck is provided with an alignment through hole extending through in a direction perpendicular to the adsorption surface, and the end of the sampling tube located in the process chamber is inserted into the alignment through hole from the end of the adsorption chuck away from the adsorption surface, and the tube wall of the sampling tube is connected to the hole wall of the alignment through hole.

4. The lithography machine according to claim 1, characterized in that, The lithography machine also includes an emission mechanism, which includes an emission pipe and a valve. One end of the emission pipe is disposed inside the process chamber, and the other end extends outside the process chamber. The pipe wall of the emission pipe is sealed to the cavity wall of the process chamber. The valve is disposed on the emission pipe.

5. The lithography machine according to claim 4, characterized in that, The lithography machine also includes an alignment unit, which is disposed within the process cavity and includes an adsorption chuck. The discharge pipe is connected to the adsorption chuck.

6. The lithography machine according to claim 5, characterized in that, The adsorption chuck has an adsorption surface; the adsorption chuck is provided with an alignment through hole extending through in a direction perpendicular to the adsorption surface, and the end of the discharge pipe located in the process chamber is inserted into the alignment through hole from the end of the adsorption chuck away from the adsorption surface, and the pipe wall of the discharge pipe is connected to the hole wall of the alignment through hole.

7. The lithography machine according to claim 4, characterized in that, The lithography machine also includes an ammonia analyzer, which is located outside the process chamber and connected to the sampling tube.

8. The lithography machine according to claim 7, characterized in that, The lithography machine also includes an alarm and a controller connected by communication. Both the alarm and the controller are located outside the process chamber, and the controller is connected by communication with the ammonia analyzer.

9. The lithography machine according to claim 7, characterized in that, The lithography machine also includes a controller, which is located outside the process chamber and is communicatively connected to the ammonia analyzer and the valve.

10. The lithography machine according to claim 4, characterized in that, The valve is located on the portion of the discharge pipe outside the process chamber.

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