Chuck unloading device, chuck unloading system and lithographic machine

Abstract

This invention provides a chuck unloading device, a chuck unloading system, and a lithography machine. The chuck unloading device is configured to be installed above a wafer carrier stage. The device includes multiple vacuum chucks and a drive assembly connected to the vacuum chucks. The drive assembly drives the vacuum chucks to move vertically. When the drive assembly drives the vacuum chucks to descend, the vacuum chucks contact the chuck on the wafer carrier stage to hold it in place. When the drive assembly drives the vacuum chucks to ascend, the vacuum chucks pull the chuck away from the wafer carrier stage. This invention can automatically unload the chuck from the wafer carrier stage without removing the entire wafer carrier stage from the machine, thus enabling rapid chuck cleaning, minimizing the maintenance cycle of the lithography machine, and ensuring continuous operation.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing and manufacturing technology, and in particular to a chuck unloading device, a chuck unloading system, and a photolithography machine. Background Technology

[0002] In ArF lithography, the cleanliness of the chuck on the wafer stage directly determines the exposure quality. Residual photoresist and particulate contamination on the chuck can lead to continuous hot spot defects in the product, necessitating chuck cleaning.

[0003] In existing technologies, the chuck is typically cleaned automatically first. If automatic cleaning is ineffective, the entire wafer carrier stage needs to be manually removed from the machine, and then the chuck on the wafer carrier stage is manually cleaned using a whetstone and cleaning solution. This method of manually removing the entire wafer carrier stage to clean the chuck takes about 30 hours, which not only affects production capacity but also causes production line downtime.

[0004] It should be noted that the information disclosed in the background section of this utility model is intended only to enhance the understanding of the general background of this utility model, and should not be regarded as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0005] The purpose of this invention is to provide a chuck unloading device, a chuck unloading system, and a lithography machine that can automatically unload the chuck from the wafer carrier without dragging the entire wafer carrier off the machine. This enables rapid cleaning of the chuck, minimizes the maintenance cycle of the lithography machine, and ensures continuous operation of the lithography machine.

[0006] To achieve the above objectives, this utility model provides a chuck unloading device, which is configured to be installed above a wafer carrier stage. The chuck unloading device includes multiple vacuum chucks and a drive assembly connected to the vacuum chucks. The drive assembly is used to drive the vacuum chucks to move up and down. When the drive assembly drives the vacuum chucks to move down, the vacuum chucks can contact the chuck located on the wafer carrier stage to attract and hold the chuck. When the drive assembly drives the vacuum chucks to move up, the vacuum chucks can move the chuck away from the wafer carrier stage.

[0007] Optionally, the drive assembly includes a connected mounting plate and a linear motor, the vacuum chuck is connected to the mounting plate, and the linear motor is configured to be fixed above the wafer carrier stage.

[0008] Optionally, the plurality of vacuum suction cups are evenly distributed along the circumference of the fixed plate.

[0009] Optionally, the bottom end of the vacuum suction cup is provided with a plurality of vacuum adsorption holes, all of which are connected to the vacuum channel inside the vacuum suction cup.

[0010] Optionally, the chuck unloading device provided by this utility model further includes a pressure sensor, which is installed at the bottom end of the vacuum suction cup and is configured to monitor the contact force between the vacuum suction cup and the chuck.

[0011] Optionally, the chuck unloading device provided by this utility model further includes a vacuum sensor, which is disposed on a vacuum pipeline connected to the vacuum channel of the vacuum suction cup, and is configured to monitor the vacuum level inside the vacuum suction cup.

[0012] Optionally, the vacuum suction cup is made of ceramic.

[0013] To achieve the above objectives, the present invention also provides a chuck unloading system, which includes a robotic arm and a chuck unloading device as described in any of the above embodiments. The robotic arm is configured to receive the chuck after the vacuum chuck pulls the chuck away from the wafer carrier stage, so as to move the chuck away from the lithography machine.

[0014] To achieve the above objectives, this utility model also provides a lithography machine, which includes a wafer carrier stage and a chuck unloading device as described in any of the above descriptions. A chuck is mounted on the top of the wafer carrier stage, and the chuck unloading device is mounted above the wafer carrier stage.

[0015] Optionally, the top of the wafer carrier stage is provided with a mounting groove, the inner contour of which matches the outer contour of the chuck.

[0016] Compared with the prior art, the chuck unloading device, chuck unloading system and lithography machine provided by this utility model have the following beneficial effects:

[0017] The chuck unloading device provided by this utility model includes multiple vacuum suction cups and a drive assembly connected to the vacuum suction cups. The drive assembly is used to drive the vacuum suction cups to perform lifting and lowering movements. When the drive assembly drives the vacuum suction cups to perform a lowering movement, the vacuum suction cups can contact the chuck located on the wafer carrier stage to adsorb the chuck. When the drive assembly drives the vacuum suction cups to perform an upward movement, the vacuum suction cups can move the chuck away from the wafer carrier stage together. Since the chuck unloading device provided by this utility model is installed above the wafer carrier stage, when the chuck needs to be cleaned, the drive assembly can first be controlled to drive the vacuum chuck to descend, so that the vacuum chuck gradually approaches the chuck located on the wafer carrier stage. After the vacuum chuck contacts the chuck, a vacuum is drawn on the vacuum chuck, so that the vacuum chuck can firmly adhere to the chuck under the generated negative pressure. After the vacuum chuck adheres to the chuck, the drive assembly is then controlled to drive the vacuum chuck to rise, so that the chuck can move away from the wafer carrier stage along with the vacuum chuck, thereby unloading the chuck from the wafer carrier stage for manual cleaning. As can be seen, by using the chuck unloading device provided by this utility model, the chuck on the wafer carrier stage can be automatically unloaded without dragging the entire wafer carrier stage out of the machine, thereby enabling rapid cleaning of the chuck (the total time is about 6 hours, which can save 80% of the time compared with the prior art), thus minimizing the maintenance cycle of the lithography machine and ensuring the continuous operation of the lithography machine.

[0018] Furthermore, the chuck unloading device provided by this utility model, by employing a ceramic vacuum suction cup, ensures that the vacuum suction cup can tightly adhere to the entire area of ​​the chuck after contacting it. This effectively avoids suction leakage caused by uneven contact surfaces between the vacuum suction cup and the chuck, thereby ensuring that the vacuum suction cup can firmly hold the chuck and smoothly unload it from the wafer carrier stage. In addition, by using a ceramic vacuum suction cup, the overall service life of the chuck unloading device provided by this utility model can also be effectively extended.

[0019] Furthermore, the chuck unloading device provided by this utility model uses a linear motor to drive the vacuum suction cup to perform lifting and lowering movements, which not only helps to achieve precise control of the lifting and lowering movements of the vacuum suction cup, but also further simplifies the overall structure of the chuck unloading device provided by this utility model.

[0020] Furthermore, the chuck unloading device provided by this utility model, by installing a pressure sensor at the bottom end of the vacuum suction cup, can monitor the contact force between the vacuum suction cup and the chuck in real time. This allows the drive assembly to promptly stop driving the vacuum suction cup to continue its descent when the vacuum suction cup contacts the chuck, effectively preventing damage to the chuck due to continued descent. Simultaneously, when the vacuum suction cup contacts the chuck, a vacuum can be drawn into the vacuum suction cup, allowing it to adhere to the chuck under the generated negative pressure.

[0021] Furthermore, the chuck unloading device provided by this utility model, by setting a vacuum sensor in the vacuum channel of the vacuum chuck, can monitor the vacuum level in the vacuum chuck in real time. Therefore, when the vacuum level in the vacuum chuck reaches a preset threshold, the drive component is controlled to drive the vacuum chuck to move the chuck away from the wafer carrier stage. This effectively prevents the vacuum chuck from failing to hold the chuck during the ascent due to insufficient negative pressure, thus effectively avoiding the risk of the chuck falling during the ascent. It further ensures that multiple vacuum chucks can firmly hold the chuck, so as to smoothly unload the chuck from the wafer carrier stage.

[0022] Since the chuck unloading system and lithography machine provided by this utility model include the chuck unloading device provided by this utility model, the chuck unloading system and lithography machine provided by this utility model have at least all the beneficial effects of the chuck unloading device provided by this utility model. For details, please refer to the relevant descriptions of the beneficial effects of the chuck unloading device provided by this utility model above. Therefore, the beneficial effects of the chuck unloading system and lithography machine provided by this utility model will not be described in detail here. Attached Figure Description

[0023] Figure 1 A schematic diagram of the original state of the chuck unloading device provided in one embodiment of this utility model;

[0024] Figure 2 A schematic diagram showing the state of the chuck unloading device in contact with the chuck according to one embodiment of the present invention;

[0025] Figure 3 A schematic diagram of the state when the chuck unloading device provided in one embodiment of the present invention drives the chuck away from the wafer carrier stage;

[0026] Figure 4 A bottom view of a chuck unloading device provided in one embodiment of this utility model;

[0027] Figure 5A cross-sectional view of a vacuum suction cup provided in one embodiment of this utility model.

[0028] The reference numerals in the attached figures are explained as follows:

[0029] Chuck unloading device-100; Vacuum suction cup-110; Vacuum suction hole-111; Vacuum channel-112; Drive assembly-120; Fixing plate-121; Linear motor-122; Pressure sensor-130; Vacuum sensor-140;

[0030] Wafer carrier stage-200; Mounting slot-210;

[0031] Chuck-300;

[0032] Vacuum tubing - 400. Detailed Implementation

[0033] The chuck unloading device, chuck unloading system, and lithography machine proposed in this utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this utility model will become clearer from the following description. Please refer to the accompanying drawings for clarity regarding the purpose, features, and advantages of this utility model. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes and to enable those skilled in the art to understand and read the material, and are not intended to limit the implementation conditions of this utility model. Any modifications to the structure, changes in proportions, or adjustments to the size, provided they produce the same or similar effects and achieve the same purpose as this utility model, should still fall within the scope of the technical content disclosed in this utility model. Specific design features of this utility model disclosed herein, including, for example, specific dimensions, orientations, positions, and shapes, will be determined in part by the specific application and usage environment. Furthermore, in the embodiments described below, the same reference numerals are sometimes used across different drawings to denote the same parts or parts having the same function, omitting repeated descriptions. In this specification, similar reference numerals and letters are used to denote similar items; therefore, once an item is defined in one figure, it need not be discussed further in subsequent figures.

[0034] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor should they be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The singular forms “a,” “one,” and “the” include plural objects. The term “or” is generally used to mean “and / or.” The term “several” is generally used to mean “at least one.” The term “at least two” is generally used to mean “two or more.” The term “multiple” is generally used to mean “at least two.”

[0035] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, in this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Moreover, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] The core idea of ​​this utility model is to provide a chuck unloading device, a chuck unloading system, and a lithography machine, which can automatically unload the chuck from the wafer carrier stage without having to drag the entire wafer carrier stage off the machine. This enables rapid cleaning of the chuck, minimizes the maintenance cycle of the lithography machine, and ensures continuous operation of the lithography machine.

[0037] To achieve the above-mentioned goals, this utility model provides a chuck unloading device, which is configured to be installed above the wafer carrier stage. Please refer to [reference needed]. Figures 1 to 3 ,in, Figure 1 A schematic diagram of the original state of the chuck unloading device provided in one embodiment of this utility model; Figure 2 A schematic diagram showing the state of the chuck unloading device in contact with the chuck according to one embodiment of the present invention;

[0038] Figure 3This is a schematic diagram illustrating the state of the chuck unloading device according to one embodiment of the present invention when it moves the chuck away from the wafer carrier stage. Figures 1 to 3 As shown, the chuck unloading device 100 provided by this utility model includes a plurality of vacuum suction cups 110 and a drive assembly 120 connected to the vacuum suction cups 110. The drive assembly 120 is used to drive the vacuum suction cups 110 to perform lifting and lowering movements. When the drive assembly 120 drives the vacuum suction cups 110 to perform a lowering movement, the vacuum suction cups 110 can contact the chuck 300 located on the wafer carrier stage 200 to adsorb the chuck 300. When the drive assembly 120 drives the vacuum suction cups 110 to perform an upward movement, the vacuum suction cups 110 can drive the chuck 300 away from the wafer carrier stage 200 together.

[0039] Since the chuck unloading device 100 provided by this utility model is installed above the wafer carrier stage 200, when the chuck 300 needs to be cleaned, the drive assembly 120 can be controlled to drive the vacuum suction cup 110 to descend, so that the vacuum suction cup 110 gradually approaches the chuck 300 located on the wafer carrier stage 200. After the vacuum suction cup 110 contacts the chuck 300, a vacuum is drawn on the vacuum suction cup 110 so that the vacuum suction cup 110 can firmly adhere to the chuck 300 under the generated negative pressure. After the vacuum suction cup 110 adheres to the chuck 300, the drive assembly 120 is then controlled to drive the vacuum suction cup 110 to rise, so that the chuck 300 can move away from the wafer carrier stage 200 along with the vacuum suction cup 110, thereby unloading the chuck 300 from the wafer carrier stage 200 for manual cleaning. As can be seen, by using the chuck unloading device 100 provided by this utility model, the chuck 300 on the wafer carrier stage 200 can be automatically unloaded without dragging the entire wafer carrier stage 200 out of the machine, thereby enabling rapid cleaning of the chuck 300 (total time is about 6 hours, which can save 80% of the time compared with the prior art), thus minimizing the maintenance cycle of the lithography machine and ensuring the continuous operation of the lithography machine.

[0040] It should be noted that, as those skilled in the art will understand, the present invention does not limit the specific number of the vacuum suction cups 110. The specific number of the vacuum suction cups 110 can be set according to actual needs. For example, the number of the vacuum suction cups 110 can be two, three, four or more.

[0041] It should also be noted that, as those skilled in the art can understand, the chuck unloading device 100 provided by this utility model can work in conjunction with the main control of the lithography machine. When the main control detects an alarm in the lithography machine, it will control the chuck unloading device 100 to immediately stop unloading the chuck 300.

[0042] In some exemplary embodiments, the vacuum chuck 110 is made of ceramic. Due to the high flatness of the ceramic surface, using a ceramic vacuum chuck 110 ensures that the vacuum chuck 110 can tightly adhere to the entire area of ​​the chuck 300 after contact, effectively preventing suction leakage caused by uneven contact surfaces between the vacuum chuck 110 and the chuck 300. This ensures that the vacuum chuck 110 can firmly hold the chuck 300, allowing for smooth unloading of the chuck 300 from the wafer carrier stage 200. Furthermore, since ceramic has the advantages of zero magnetism and low static electricity, using a ceramic vacuum chuck 110 can also eliminate magnetic field interference. Additionally, since ceramic does not release metal ions in a vacuum environment, using a ceramic vacuum chuck 110 can also avoid metal contamination. Meanwhile, since ceramics have a high rigidity modulus, the use of a ceramic vacuum chuck 110 can effectively extend the overall service life of the chuck unloading device 100 provided by this utility model.

[0043] Please continue to refer to this. Figures 1 to 3 ,like Figures 1 to 3 As shown, in some exemplary embodiments, the drive assembly 120 includes a connected fixing plate 121 and a linear motor 122. The vacuum chucks 110 are connected to the fixing plate 121, and the linear motor 122 is configured to be fixed above the wafer carrier stage 200. Therefore, by configuring the drive assembly 120 to include the connected fixing plate 121 and the linear motor 122, and connecting all the vacuum chucks 110 to the fixing plate 121, all the vacuum chucks 110 can be driven simultaneously for lifting and lowering movements by the same linear motor 122. This not only effectively simplifies the overall structure of the chuck unloading device 100 provided by this invention, but also ensures that all the vacuum chucks 110 can move up and down synchronously, thereby effectively improving the stability of the chuck 300 during unloading. Furthermore, since the linear motor 122 can directly convert electrical energy into linear kinetic energy, using the linear motor 122 to drive the vacuum chuck 110 to perform lifting and lowering movements not only helps to achieve precise control of the lifting and lowering movements of the vacuum chuck 110, but also further simplifies the overall structure of the chuck unloading device 100 provided by this utility model.

[0044] Please continue to refer to this. Figure 4This is a bottom view of the chuck unloading device 100 provided in one embodiment of the present invention. Figure 4 As shown, in some exemplary embodiments, the plurality of vacuum chucks 110 are evenly distributed circumferentially along the fixing plate 121. Therefore, by arranging the plurality of vacuum chucks 110 evenly distributed circumferentially along the fixing plate 121, it can be ensured that the plurality of vacuum chucks 110 can uniformly contact the chuck 300, thereby effectively ensuring that the plurality of vacuum chucks 110 can firmly adhere to the chuck 300, so as to smoothly unload the chuck 300 from the wafer carrier stage 200.

[0045] Please continue to refer to this. Figure 4 and 5 ,in, Figure 5 This is a cross-sectional view of a vacuum suction cup 110 provided according to one embodiment of the present invention. Figure 4 and Figure 5 As shown, in some exemplary embodiments, the bottom end of the vacuum chuck 110 is uniformly provided with a plurality of vacuum adsorption holes 111, all of which are connected to the vacuum channel 112 within the vacuum chuck 110. Therefore, by uniformly providing a plurality of vacuum adsorption holes 111 at the bottom end of the vacuum chuck 110, it can be effectively ensured that the adsorption force generated by the vacuum chuck 110 is evenly distributed, thereby ensuring that the vacuum chuck 110 can uniformly adsorb the chuck 300, eliminating localized stress, and further ensuring that the vacuum chuck 110 can firmly adsorb the chuck 300, so as to more smoothly unload the chuck 300 from the wafer carrier stage 200. Furthermore, since the plurality of vacuum suction holes 111 are all connected to the vacuum channel 112 in the vacuum suction cup 110, negative pressure can be provided to the plurality of vacuum suction holes 111 simultaneously through the same vacuum pipeline 400, thereby effectively reducing the number of vacuum pipelines 400 and further reducing the cost of the chuck unloading device 100 provided by this utility model.

[0046] It should be noted that, as those skilled in the art will understand, the vacuum channel 112 is sealed to the vacuum line 400. Furthermore, it should be noted that, as those skilled in the art will understand, the vacuum line 400 is connected to a vacuum pump.

[0047] Please continue to refer to this. Figure 4 ,like Figure 4As shown, in some exemplary embodiments, the chuck unloading device 100 provided by this utility model further includes a pressure sensor 130, which is installed at the bottom end of the vacuum suction cup 110. The pressure sensor 130 is configured to monitor the contact force between the vacuum suction cup 110 and the chuck 300. Therefore, by setting the pressure sensor 130 at the bottom end of the vacuum suction cup 110, the contact force between the vacuum suction cup 110 and the chuck 300 can be monitored in real time. This allows the drive assembly 120 to be controlled to stop driving the vacuum suction cup 110 to continue its downward movement when the vacuum suction cup 110 comes into contact with the chuck 300, effectively preventing damage to the chuck 300 due to the continued descent of the vacuum suction cup 110. Simultaneously, when the vacuum suction cup 110 comes into contact with the chuck 300, a vacuum can be drawn into the vacuum suction cup 110, allowing the vacuum suction cup 110 to adhere to the chuck 300 under the generated negative pressure.

[0048] It should be noted that, as those skilled in the art will understand, the present invention does not limit the specific type of the pressure sensor 130, and the pressure sensor 130 may be, but is not limited to, a strain gauge piezoelectric sensor.

[0049] In some exemplary embodiments, the bottom end of the vacuum suction cup 110 is provided with a mounting hole (not shown in the figure) for mounting the pressure sensor 130. Therefore, by providing a mounting hole at the bottom end of the vacuum suction cup 110, not only is it easier to install the pressure sensor 130, but it also effectively saves space.

[0050] Please continue to refer to this. Figure 5 ,like Figure 5As shown, in some exemplary embodiments, the chuck unloading device 100 provided by this utility model further includes a vacuum sensor 140, which is disposed on a vacuum pipeline 400 connected to the vacuum channel 112 of the vacuum suction cup 110, and is configured to monitor the vacuum level inside the vacuum suction cup 110. Therefore, by installing a vacuum sensor 140 on the vacuum pipeline 400 connected to the vacuum channel 112 of the vacuum chuck 110, the vacuum level inside the vacuum chuck 110 can be monitored in real time. When the vacuum level inside the vacuum chuck 110 reaches a preset threshold, the drive assembly 120 can be controlled to drive the vacuum chuck 110 to move the chuck 300 away from the wafer carrier stage 200. This effectively prevents the vacuum chuck 110 from failing to hold the chuck 300 during the ascent due to insufficient negative pressure, thus effectively avoiding the risk of the chuck 300 falling during the ascent. Furthermore, it ensures that multiple vacuum chucks 110 can firmly hold the chuck 300, smoothly unloading the chuck 300 from the wafer carrier stage 200.

[0051] To achieve the above-mentioned goals, this utility model also provides a chuck unloading system. The chuck unloading system includes a robotic arm and the aforementioned chuck unloading device 100. The robotic arm is configured to receive the chuck 300 after the vacuum chuck 110 pulls the chuck 300 away from the wafer carrier stage 200, thereby removing the chuck 300 from the lithography machine. Since the chuck unloading system provided by this utility model includes the chuck unloading device 100, it possesses at least all the beneficial effects of the chuck unloading device 100. For details, please refer to the above description of the beneficial effects of the chuck unloading device 100; therefore, the beneficial effects of the chuck unloading system will not be elaborated upon here.

[0052] It should be noted that, as those skilled in the art will understand, after the robotic arm receives the chuck 300, the vacuum chuck 110 can be depressurized to eliminate the suction force of the vacuum chuck 110 on the chuck 300, thereby separating the vacuum chuck 110 from the chuck 300, and then the robotic arm can smoothly move the chuck 300 away from the lithography machine.

[0053] It should also be noted that, as those skilled in the art will understand, the present invention does not limit the specific structure of the robotic arm. More details about the robotic arm can be adapted by referring to relevant content known to those skilled in the art, and will not be elaborated here.

[0054] To achieve the above-mentioned ideas, this utility model also provides a lithography machine, which includes a wafer carrier stage 200 and the chuck unloading device 100 described above. A chuck 300 is mounted on the top of the wafer carrier stage 200, and the chuck unloading device 100 is mounted above the wafer carrier stage 200. Since the lithography machine provided by this utility model includes the chuck unloading device 100 provided by this utility model, the lithography machine provided by this utility model has at least all the beneficial effects of the chuck unloading device 100 provided by this utility model. For details, please refer to the relevant descriptions of the beneficial effects of the chuck unloading device 100 provided by this utility model above. Therefore, the beneficial effects of the lithography machine provided by this utility model will not be described in detail here.

[0055] It should be noted that, as those skilled in the art will understand, more details about the lithography machine provided by this utility model can be adapted by referring to relevant content known to those skilled in the art, and will not be elaborated further here.

[0056] Please continue to refer to this. Figure 3 ,like Figure 3 As shown, in some exemplary embodiments, the top of the wafer carrier stage 200 is provided with a mounting groove 210, the inner contour of which matches the outer contour of the chuck 300. Therefore, by providing a mounting groove 210 at the top of the wafer carrier stage 200 whose inner contour matches the outer contour of the chuck 300, the installation of the chuck 300 can be facilitated.

[0057] In summary, compared with the prior art, the chuck unloading device 100, chuck unloading system, and lithography machine provided by this utility model have the following beneficial effects:

[0058] (1) Since the chuck unloading device 100 provided by this utility model is installed above the wafer carrier stage 200, when the chuck 300 needs to be cleaned, the drive component 120 can be controlled to drive the vacuum suction cup 110 to move downward, so that the vacuum suction cup 110 gradually approaches the chuck 300 located on the wafer carrier stage 200. After the vacuum suction cup 110 contacts the chuck 300, the vacuum suction cup 110 is evacuated, so that the vacuum suction cup 110 can firmly adsorb the chuck 300 under the negative pressure generated. After the vacuum suction cup 110 adsorbs the chuck 300, the drive component 120 is controlled to drive the vacuum suction cup 110 to move upward, so that the chuck 300 can move away from the wafer carrier stage 200 along with the vacuum suction cup 110, so that the chuck 300 can be unloaded from the wafer carrier stage 200 for manual cleaning. As can be seen, by using the chuck unloading device 100 provided by this utility model, the chuck 300 on the wafer carrier stage 200 can be automatically unloaded without dragging the entire wafer carrier stage 200 out of the machine, thereby enabling rapid cleaning of the chuck 300 (total time is about 6 hours, which can save 80% of the time compared with the prior art), thus minimizing the maintenance cycle of the lithography machine and ensuring the continuous operation of the lithography machine.

[0059] (2) By employing a ceramic vacuum chuck 110, this invention ensures that the vacuum chuck 110 can tightly adhere to the entire area of ​​the chuck 300 after contacting it. This effectively prevents suction leakage caused by uneven contact surfaces between the vacuum chuck 110 and the chuck 300, thus ensuring that the vacuum chuck 110 can firmly hold the chuck 300, allowing for smooth unloading of the chuck 300 from the wafer carrier stage 200. Furthermore, by using a ceramic vacuum chuck 110, the overall service life of the chuck unloading device 100 provided by this invention can be effectively extended.

[0060] (3) By using a linear motor 122 to drive the vacuum suction cup 110 to perform lifting and lowering movements, this utility model can not only help to achieve precise control of the lifting and lowering movements of the vacuum suction cup 110, but also further simplify the overall structure of the chuck unloading device 100 provided by this utility model.

[0061] (4) By installing a pressure sensor 130 at the bottom of the vacuum suction cup 110, this utility model can monitor the contact force between the vacuum suction cup 110 and the chuck 300 in real time. Therefore, when the vacuum suction cup 110 contacts the chuck 300, the drive assembly 120 can be controlled to stop driving the vacuum suction cup 110 to continue its downward movement, thus effectively preventing the chuck 300 from being damaged due to the continued descent of the vacuum suction cup 110. Simultaneously, when the vacuum suction cup 110 contacts the chuck 300, a vacuum can be drawn into the vacuum suction cup 110, allowing it to adhere to the chuck 300 under the generated negative pressure.

[0062] (5) By setting a vacuum sensor 140 in the vacuum channel 112 of the vacuum chuck 110, the vacuum level in the vacuum chuck 110 can be monitored in real time. When the vacuum level in the vacuum chuck 110 reaches a preset threshold, the drive component 120 is controlled to drive the vacuum chuck 110 to move the chuck 300 away from the wafer carrier stage 200. This can effectively prevent the vacuum chuck 110 from failing to adsorb the chuck 300 during the rising process due to insufficient negative pressure. This can effectively avoid the risk of the chuck 300 falling during the rising process and further ensure that multiple vacuum chucks 110 can firmly adsorb the chuck 300 so as to smoothly unload the chuck 300 from the wafer carrier stage 200.

[0063] It should be noted that in the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0064] It should also be noted that the above description is only a description of the preferred embodiment of this utility model and is not intended to limit the scope of this utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure are within the protection scope of this utility model. Obviously, those skilled in the art can make various modifications and variations to the utility model without departing from the spirit and scope of this utility model. Therefore, if these modifications and variations fall within the scope of this utility model and its equivalents, this utility model also intends to include these modifications and variations.

Claims

1. A chuck unloading device, characterized in that, The chuck unloading device is configured to be installed above the wafer carrier stage; The chuck unloading device includes multiple vacuum suction cups and a drive assembly connected to the vacuum suction cups. The drive assembly is used to drive the vacuum suction cups to perform lifting and lowering movements. When the drive assembly drives the vacuum chuck to descend, the vacuum chuck can contact the chuck located on the wafer carrier stage to hold the chuck in place. When the drive assembly drives the vacuum chuck to move upward, the vacuum chuck can move the chuck away from the wafer carrier stage together.

2. The chuck unloading device according to claim 1, characterized in that, The drive assembly includes a connected mounting plate and a linear motor. The vacuum chuck is connected to the mounting plate, and the linear motor is configured to be fixed above the wafer carrier stage.

3. The chuck unloading device according to claim 2, characterized in that, The plurality of vacuum suction cups are evenly distributed along the circumference of the fixed plate.

4. The chuck unloading device according to claim 1, characterized in that, The bottom end of the vacuum suction cup is provided with a plurality of vacuum adsorption holes, all of which are connected to the vacuum channel inside the vacuum suction cup.

5. The chuck unloading device according to claim 1, characterized in that, It also includes a pressure sensor mounted at the bottom of the vacuum suction cup, the pressure sensor being configured to monitor the contact force between the vacuum suction cup and the chuck.

6. The chuck unloading device according to claim 1, characterized in that, It also includes a vacuum sensor, which is disposed on a vacuum pipeline connected to the vacuum channel of the vacuum suction cup, and is configured to monitor the vacuum level inside the vacuum suction cup.

7. The chuck unloading device according to claim 1, characterized in that, The vacuum suction cup is made of ceramic.

8. A chuck unloading system, characterized in that, The invention includes a robotic arm and a chuck unloading device according to any one of claims 1 to 7, wherein the robotic arm is configured to receive the chuck after the vacuum chuck pulls the chuck away from the wafer carrier stage, so as to remove the chuck from the lithography machine.

9. A lithography machine, characterized in that, The device includes a wafer carrier stage and a chuck unloading device according to any one of claims 1 to 7, wherein a chuck is mounted on the top of the wafer carrier stage and the chuck unloading device is mounted above the wafer carrier stage.

10. The lithography machine according to claim 9, characterized in that, The top of the wafer carrier stage is provided with a mounting groove, the inner contour of which matches the outer contour of the chuck.

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