A rapid heating device and a mobile terminal
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-20
- Publication Date
- 2026-08-11
AI Technical Summary
[0003]本申请的主要目的在于提供一种快速加热装置及移动终端，旨在解决低温情况下移动终端无法开机的技术问题
[0020]本申请通过对设置环境温度检测电路来对内存器件的环境温度进行检测并输出环境温度检测信号至加热控制电路，以使加热控制电路在检测到移动终端所处环境温度较低，无法正常启动时，控制加热器件工作，从而通过加热器件快速加热内存器件，使内存器件的温度到达正常工作的温度范围内，解决了在低温环境下移动终端无法启动的问题，与现有技术相比，本申请的电路结构简单稳定，可靠性强，且成本较低。
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Figure CN224624952U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of memory heating device technology, and in particular to a rapid heating device and a mobile terminal. Background Technology
[0002] With the development of modern society, the reliance on various mobile terminals is increasing. Even in low-temperature environments, such as the frigid outdoors in northern regions where temperatures can drop to tens of degrees below zero, people still use mobile phones, tablets, and other devices for payments, communication, and other activities. However, in excessively low temperatures, the stability of mobile terminals can be affected, leading to abnormal situations such as the inability to power on. Utility Model Content
[0003] The main purpose of this application is to provide a rapid heating device and a mobile terminal, which aims to solve the technical problem that the mobile terminal cannot be turned on under low temperature conditions.
[0004] To achieve the above objectives, this application proposes a rapid heating device for use in a mobile terminal, the mobile terminal including a central processing unit, a power-on circuit, and a memory device, the rapid heating device being used to heat the memory device, the rapid heating device comprising:
[0005] An ambient temperature detection circuit is used to detect the ambient temperature where the mobile terminal is located and output a corresponding ambient temperature detection signal.
[0006] A heating control circuit, connected to an ambient temperature detection circuit and a power-on circuit, is used to receive a power-on signal output by the power-on circuit and output a corresponding heating control signal according to the power-on signal and the ambient temperature detection signal.
[0007] A heating device is disposed close to the memory device. The controlled end of the heating device is connected to the control signal output end of the heating control circuit. The heating device is used to operate / stop operating according to the received heating control signal, and to heat the memory device when operating.
[0008] In one embodiment, the rapid heating device further includes a memory device temperature detection circuit, which is disposed close to the memory device and is used to detect the temperature of the memory device and output a memory device temperature detection signal.
[0009] The heating control circuit is also connected to the memory device temperature detection circuit, and the heating control circuit is also used to control the heating device to stop working / continue working according to the memory device temperature detection signal when the heating device is working.
[0010] In one embodiment, the rapid heating device further includes a timer connected to the heating control circuit and the central processing unit. The timer is used to start timing when the power-on signal is received, and to output a trigger signal to the heating control circuit when the timing time is reached.
[0011] The heating control circuit is also used to control the heating device to stop working when the trigger signal is received while the heating device is working.
[0012] In one embodiment, the heating control circuit includes a heating controller and a power switch. The control terminal of the heating controller is connected to the controlled terminal of the power switch. The input terminal of the power switch is used to connect to a power source, and the output terminal of the power switch is connected to the heating device.
[0013] In one embodiment, the heating control circuit further includes a power chip, the input terminal of which is used to connect to a power source, and the output terminal of which is connected to the input terminal of the power switch.
[0014] In one embodiment, the heating controller is an embedded controller.
[0015] In one embodiment, the heating device includes one or more of the following: a ceramic heating element, a thermistor, and a resistance heating wire.
[0016] In one embodiment, the ambient temperature detection circuit includes a resistance temperature detector (RTD) and a connector, wherein the RTD is connected to the heating control circuit via the connector.
[0017] This application also proposes a mobile terminal, including a power-on circuit, a memory device, and a rapid heating device as described above;
[0018] The central processing unit is connected to the rapid heating device.
[0019] One or more technical solutions proposed in this application have at least the following technical effects:
[0020] This application uses an ambient temperature detection circuit to detect the ambient temperature of the memory device and outputs the ambient temperature detection signal to the heating control circuit. When the heating control circuit detects that the ambient temperature of the mobile terminal is too low and it cannot start normally, it controls the heating device to work, thereby quickly heating the memory device and bringing its temperature to the normal operating temperature range. This solves the problem of the mobile terminal failing to start in low-temperature environments. Compared with the prior art, the circuit structure of this application is simple, stable, reliable, and low in cost. Attached Figure Description
[0021] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.
[0022] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 This is a functional module diagram of an embodiment of the rapid heating device of this application;
[0024] Figure 2 This is a schematic diagram of the circuit structure of an embodiment of the rapid heating device of this application.
[0025] Label:
[0026] Explanation of icon numbers:
[0027] 100. Ambient temperature detection circuit; 200. Heating control circuit; 300. Heating device; 400. Memory device temperature detection circuit; 500. Timer; 600. Power-on circuit; 700. Memory device
[0028] U1, heating controller; U2, power switch; U3, power chip; R1, temperature sensing device;
[0029] C1, the first capacitor; C2, the second capacitor; C3, the third capacitor; C4, the fourth capacitor; C5, the fifth capacitor.
[0030] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0031] It should be understood that the specific embodiments described herein are merely illustrative of the technical solutions of this application and are not intended to limit this application.
[0032] To better understand the technical solution of this application, a detailed description will be provided below in conjunction with the accompanying drawings and specific implementation methods.
[0033] The main solution of this application is as follows: This application uses an ambient temperature detection circuit to detect the ambient temperature of the memory device and outputs the ambient temperature detection signal to the heating control circuit. When the heating control circuit detects that the ambient temperature of the mobile terminal is too low and it cannot start normally, it controls the heating device to work, thereby quickly heating the memory device and bringing the temperature of the memory device to the normal operating temperature range. This solves the problem that the mobile terminal cannot start in a low-temperature environment. Compared with the prior art, the circuit structure of this application is simple and stable, highly reliable, and low in cost.
[0034] Mobile terminals are equipped with a central processing unit (CPU) and memory devices. The CPU is one of the main components of an electronic computer, a core part of the computer. Its main functions are to interpret computer instructions and process data in computer software. The CPU is the core component of the computer responsible for reading instructions, decoding instructions, and executing instructions. The CPU mainly consists of two parts: the control unit and the arithmetic logic unit (ALU), including high-speed cache memory and the data and control buses that connect them. The three core components of an electronic computer are the CPU, internal memory, and input / output devices. The CPU's main functions are processing instructions, executing operations, controlling timing, and processing data. Memory devices are based on electronic storage technology and consist of a series of storage circuits. Each storage circuit has a unique address and can store binary data, including instructions and data. Its operation mainly includes read and write operations. When the processor needs to read data from memory, it sends a read request to the memory controller based on the data address. The memory controller finds the corresponding storage circuit, reads the data into the controller, and then transmits it to the processor. When writing data, the processor sends the data to be written and the address to the memory controller, which then writes the data to the designated storage circuit. Mobile devices, such as tablets, fail to boot in environments as low as -40°C because the extremely low temperature causes memory device errors, preventing the device from starting. This is likely because low temperatures alter the physical and electrical properties of memory devices. Low temperatures cause various materials within memory devices, such as circuit boards and chip packaging materials, to shrink. Different materials shrink at different rates, potentially leading to loose connections and poor contact. Furthermore, it increases the resistance of metallic materials. The increased resistance of metal wires in memory at low temperatures leads to increased signal transmission losses and decreased signal quality. Simultaneously, low temperatures cause changes in the capacitance and inductance values of capacitors and inductors. In memory circuits, capacitors and inductors are crucial components in various filtering and coupling circuits; changes in their characteristics affect the circuit's frequency response and signal filtering effectiveness. In memory chips, semiconductor devices, such as transistors, experience reduced carrier mobility and changes in threshold voltage at low temperatures. This results in slower transistor switching speeds, slower signal rise and fall times, and unclear logic level transitions. When the timing relationship between multiple signals deviates, memory read and write operations may fail, resulting in a boot error.
[0035] It should be noted that the execution subject in this embodiment can be a mobile terminal, such as a tablet computer, mobile phone, or personal computer, or other devices with memory devices. In this embodiment, for ease of description, a tablet computer will be used as the execution subject in the following description.
[0036] With the development of modern society, the reliance on various mobile terminals is increasing. Even in low-temperature environments, such as the frigid outdoors in northern regions where temperatures can drop to tens of degrees below zero, people still use mobile phones, tablets, and other devices for payments, communication, and other activities. However, in excessively low temperatures, the stability of mobile terminals can be affected, leading to abnormal situations such as the inability to power on.
[0037] Based on this, this application proposes a rapid heating device, referring to... Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the functional modules provided in Embodiment 1 of the rapid heating device of this application. Figure 2 This is a schematic diagram of the circuit structure provided in Embodiment 1 of the rapid heating device of this application. Applied to a mobile terminal, the mobile terminal includes a power-on circuit 600 and a memory device 700. The rapid heating device is used to heat the memory device 700. The rapid heating device includes:
[0038] The ambient temperature detection circuit 100 is used to detect the ambient temperature where the mobile terminal is located and output the corresponding ambient temperature detection signal.
[0039] The heating control circuit 200 is connected to the ambient temperature detection circuit 100 and the power-on circuit 600. It is used to receive the power-on signal output by the central processing unit and output a corresponding heating control signal according to the power-on signal and the ambient temperature detection signal.
[0040] A heating device 300 is disposed close to the memory device 700. The controlled end of the heating device 300 is connected to the control signal output end of the heating control circuit 200. The heating device 300 is used to work / stop working according to the received heating control signal, and to heat the memory device 700 when working.
[0041] In this embodiment, the ambient temperature detection circuit 100 can be installed on the casing of the mobile terminal or inside the mobile terminal. The ambient temperature detection circuit 100 can be implemented using a thermal resistor R1, a thermistor, a temperature sensor, etc., to obtain the ambient temperature of the mobile terminal and output the corresponding temperature detection signal.
[0042] The signal input terminal of the heating control circuit 200 is connected to the power-on circuit 600 to receive the power-on signal output by the power-on circuit 600. The signal output terminal of the heating control circuit 200 is connected to the heating device 300, and the heating control circuit 200 is used to control the working state of the heating device 300. For example, it controls the heating device 300 to work or to stop working. Specifically, the heating control circuit 200 can control the state of the heating device 300 by controlling the power supply to the heating device 300. For example, when it is necessary to heat the memory device 700, the heating device 300 is powered on to start working; when it is not necessary to heat the memory device 700, the power is turned off to stop working. The heating device 300 includes one or more of the following: a ceramic heating element, a thermistor, and a resistance heating wire. In this embodiment, a ceramic heating element can be selected. The heating device 300 is attached to the memory device 700, and the heating device 300 is used to operate the memory device 700.
[0043] In this embodiment, when the heating control circuit 200 receives the power-on signal from the central processing unit, it uses the ambient temperature detection signal output by the ambient temperature detection circuit 100 to control the heating device 300 to start working when the current ambient temperature is low, for example, below -40°C, in order to heat the memory device 700. Conversely, when the current ambient temperature is not low, for example, above -0°C, the mobile terminal can power on and start working normally, and heating is not required, so the heating device 300 is not activated. This design ensures that the mobile terminal can start normally in low-temperature environments.
[0044] Reference Figure 1 In one embodiment, the rapid heating device further includes a memory device 700 temperature detection circuit 400, which is disposed close to the memory device 700. The memory device 700 temperature detection circuit 400 is used to detect the temperature of the memory device 700 and output a memory device 700 temperature detection signal.
[0045] The heating control circuit 200 is also connected to the temperature detection circuit 400 of the memory device 700. The heating control circuit 200 is also used to control the heating device 300 to stop working / continue working according to the temperature detection signal of the memory device 700 when the heating device 300 is working.
[0046] In this embodiment, to ensure that the temperature of the memory device 700 does not become excessively high due to the continuous operation of the heating device 300, thus affecting the normal operation of the memory device 700, or to avoid energy waste caused by the continuous operation of the heating device 300 when the memory device 700 can start normally at a certain temperature, this embodiment can use a memory device 700 temperature detection circuit 400 to detect the temperature of the memory device 700. When the temperature of the memory device 700 is detected to have reached the normal operating temperature, the heating control circuit 200 can control the heating device 300 to stop working. When the temperature of the memory device 700 is detected to be too low and unable to work normally, the heating control circuit 200 can control the heating device 300 to continue working. In this way, it can be ensured that the memory device 700 will not fail to start working due to excessively low temperature, while also achieving energy saving and emission reduction.
[0047] Reference Figure 1 In one embodiment, the rapid heating device further includes a timer 500, which is connected to the heating control circuit 200 and the central processing unit. The timer 500 is used to start timing when the power-on signal is received, and to output a trigger signal to the heating control circuit 200 when the timing time is reached.
[0048] The heating control circuit 200 is also used to control the heating device 300 to stop working when it receives the trigger signal while the heating device 300 is working.
[0049] In this embodiment, the timing time of the timer 500 can be set to the time required for the mobile terminal to complete power-on. That is, in a low-temperature environment, when the mobile terminal is powered on, the heating control circuit 200 controls the heating device 300 to heat the memory device 700. After power-on is complete, i.e., when the timing time is reached, the heating control circuit 200 can control the heating device 300 to stop working. In some embodiments, the timer 500 can be set in the controller of the heating control circuit 200. When set in the controller of the heating control circuit 200, the controller starts timing when it receives the power-on signal output by the central processing unit. When the timing time is reached, it indicates that the mobile terminal has completed power-on, and the heating device 300 is controlled to stop heating. The timer 500 can also be embedded in the central processing unit of the mobile terminal. When set in the central processing unit, the central processing unit can output a power-on signal to the heating control circuit 200, and can also output a power-on completion trigger signal, so that the heating control circuit 200 controls the heating device 300 to stop heating when it receives the trigger signal indicating power-on completion.
[0050] Reference Figure 1 and Figure 2In one embodiment, the heating control circuit 200 includes a heating controller U1 and a power switch U2. The control terminal of the heating controller U1 is connected to the controlled terminal of the power switch U2. The input terminal of the power switch U2 is used to connect to a power source, and the output terminal of the power switch U2 is connected to the heating device 300.
[0051] In this embodiment, the heating controller U1 is an embedded controller. The power switch U2 can be implemented using an SGM2588CYN5G / TR type switch. The embedded controller can control the switching control angle of the power switch U2, and can also adjust the switching control angle according to the temperature change of the memory device 700, thereby adjusting the power output to the heating device 300, so that the power of the heating device 300 changes with the temperature change of the memory device 700. Specifically, when the temperature of the memory device 700 is low, a high-power power supply can be output to the heating device 300, and when the temperature of the memory device 700 is high, a low-power power supply can be output to the heating device 300, achieving energy saving and emission reduction.
[0052] In some embodiments, the rapid heating device further includes: a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, and a fifth capacitor C5. The signal output terminal of the heating controller U1 is connected to one end of the first capacitor C1, the power input terminal of the power switch U2 is connected to one end of the second capacitor C2, the first output terminal of the power switch U2 is connected to one end of the heating device 300, and the other end of the heating device 300 is connected to one end of the third capacitor C3, one end of the fourth capacitor C4, one end of the fifth capacitor C5, and one end of the first resistor R1. The ground terminal GND is connected to the ground terminal of the power switch U2 through the other ends of the first capacitor C1, the second capacitor C2, the third capacitor C3, the fourth capacitor C4, the fifth capacitor C5, and the first resistor R1.
[0053] Optionally, the heating control circuit 200 further includes a power chip U3, the input terminal of which is used to connect to a power source, and the output terminal of which is connected to the input terminal of the power switch U2.
[0054] The power chip U3 can be a heating power supply on the mobile terminal motherboard. The switching control angle of the heating power supply is controlled by the embedded controller. When the mobile terminal is powered on, the embedded controller turns on the power switch U2, which in turn enables the heating power supply to supply power to the heating device 300, so that the heating device 300 starts working to preheat the memory device 700. After the mobile terminal is powered off, the embedded controller turns off the power switch U2, which in turn enables the heating power supply to stop supplying power to the heating device 300, so that the heating device 300 stops working.
[0055] Reference Figure 1 and Figure 2 In one embodiment, the ambient temperature detection circuit 100 includes a thermal resistor R1 and a connector CONN1, wherein the thermal resistor R1 is connected to the heating control circuit 200 through the connector CONN1.
[0056] In this embodiment, the thermal resistor R1 can be installed on the casing of the mobile terminal or in other locations on the mobile terminal that can be used to measure ambient temperature. The heating control circuit 200 can be installed on the motherboard of the mobile terminal. The thermal resistor R1 can be connected to the heating control circuit 200 through the connector CONN1. The ambient temperature detection signal collected by the thermal resistor R1 can be output to the heating control circuit 200 through the connector CONN1. When the heating control circuit 200 receives the power-on signal output by the central processing unit, it controls the heating device 300 to start working to heat the memory device 700 when it detects that the current ambient temperature is low, for example, below -40°C, based on the ambient temperature detection signal output by the ambient temperature detection circuit 100.
[0057] This application also proposes a mobile terminal, including a power-on circuit 600, a memory device 700, and a rapid heating device as described above;
[0058] The central processing unit is connected to the rapid heating device.
[0059] Reference Figure 1In this embodiment, the power-on circuit 600 may include a trigger device and a power-on control circuit. The trigger device is connected to the power-on control circuit, which can output a power-on command when triggered by the user. The power-on control circuit performs power-on control based on the power-on command. For example, the power-on control circuit can control the connection and disconnection between the motherboard power supply module and the motherboard to achieve power-on control. Specifically, upon receiving a power-on command, the power-on control circuit controls the motherboard power supply module to supply power to the CPU, memory devices 700, etc. on the motherboard, thereby achieving power-on initialization of the mobile terminal and completing the power-on of the mobile terminal. In this process, the power-on command output by the trigger device can be used as a power-on signal to enable the rapid heating device to control the heating device to work according to the power-on command. Alternatively, the power-on control circuit can send a power-on signal to the rapid heating device to control the start of the heating device. Thus, when the power-on circuit 600 powers on, it can send a power-on signal to the rapid heating device. The ambient temperature detection circuit in the rapid heating device will detect the ambient temperature of the memory device 700 and output an ambient temperature detection signal to the heating control circuit. When the heating control circuit receives the power-on signal and detects that the ambient temperature of the mobile terminal is too low to start normally, it controls the heating device to work, thereby rapidly heating the memory device 700 so that the temperature of the memory device 700 reaches the normal operating temperature range. This solves the problem of the mobile terminal being unable to start in low-temperature environments. Compared with the prior art, the circuit structure of this application is simple and stable, highly reliable, and low in cost.
[0060] It is worth noting that since the mobile terminal of this application includes the aforementioned rapid heating device, the embodiments of the mobile terminal of this application include all the technical solutions of all embodiments of the aforementioned rapid heating device, and the technical effects achieved are exactly the same, so they will not be repeated here.
[0061] The above description is only a part of the embodiments of this application and does not limit the patent scope of this application. All equivalent structural transformations made under the technical concept of this application and using the contents of the specification and drawings of this application, or direct / indirect applications in other related technical fields, are included in the patent protection scope of this application.
Claims
1. A rapid heating device applied to a mobile terminal, the mobile terminal comprising a central processing unit, a start-up circuit and a memory device, the rapid heating device being used for heating the memory device, characterized in that, The rapid heating device includes: An ambient temperature detection circuit is used to detect the ambient temperature where the mobile terminal is located and output a corresponding ambient temperature detection signal. A heating control circuit, connected to an ambient temperature detection circuit and a power-on circuit, is used to receive a power-on signal output by the power-on circuit and output a corresponding heating control signal according to the power-on signal and the ambient temperature detection signal. A heating device is disposed close to the memory device. The controlled end of the heating device is connected to the control signal output end of the heating control circuit. The heating device is used to operate / stop operating according to the received heating control signal, and to heat the memory device when operating.
2. The rapid heating device of claim 1, wherein The rapid heating device also includes a memory device temperature detection circuit, which is located close to the memory device. The memory device temperature detection circuit is used to detect the temperature of the memory device and output a memory device temperature detection signal. The heating control circuit is also connected to the memory device temperature detection circuit, and the heating control circuit is also used to control the heating device to stop working / continue working according to the memory device temperature detection signal when the heating device is working.
3. The rapid heating device of claim 1, wherein, The rapid heating device also includes a timer, which is connected to the heating control circuit and the central processing unit. The timer is used to start timing when the power-on signal is received, and to output a trigger signal to the heating control circuit when the timing time is reached. The heating control circuit is also used to control the heating device to stop working when the trigger signal is received while the heating device is working.
4. The rapid heating device of claim 1, wherein The heating control circuit includes a heating controller and a power switch. The control terminal of the heating controller is connected to the controlled terminal of the power switch. The input terminal of the power switch is used to connect to a power source, and the output terminal of the power switch is connected to the heating device.
5. The rapid heating device as described in claim 4, characterized in that, The heating control circuit also includes a power chip, the input terminal of which is used to connect to a power source, and the output terminal of which is connected to the input terminal of the power switch.
6. The rapid heating device as described in claim 4, characterized in that, The heating controller is an embedded controller.
7. The rapid heating device according to any one of claims 1 to 6, characterized in that, The heating device includes one or more of the following: ceramic heating element, thermistor, and resistance heating wire.
8. The rapid heating device according to any one of claims 1 to 6, characterized in that, The ambient temperature detection circuit includes a resistance temperature detector (RTD) and a connector, and the RTD is connected to the heating control circuit through the connector.
9. A mobile terminal, characterized in that, Includes a power-on circuit, memory devices, and a rapid heating device as described in any one of claims 1-8; The central processing unit is connected to the rapid heating device.