A touchscreen module with excellent stability and performance

Abstract

This application discloses a touchscreen module with excellent stability and performance, relating to the field of touchscreen module technology. The application includes a base shell, with a heat exchange plate fixedly connected to the bottom inner part of the base shell. A backlight module is mounted on top of the heat exchange plate, and a display panel is mounted on top of the backlight module. A flexible circuit board is fixedly connected to one end of the display panel, and a driver chip is fixedly connected to the other end of the flexible circuit board. A touch-sensing glass is mounted on top of the display panel. This application utilizes a circulating fan to drive air to circulate along the interior of an annular heat exchange channel, achieving heat exchange and cooling between the heat exchange plate and the internal environment of the base shell. Simultaneously, the heat absorption end of a semiconductor cooler absorbs and cools the air circulating within the annular heat exchange channel, and then dissipates the heat through the heat release end of the semiconductor cooler. This effectively improves the heat dissipation efficiency of the device and enhances the operational stability of the touchscreen.

Description

Technical Field

[0001] This application relates to the field of touch screen module technology, and in particular to a touch screen module with excellent stability performance. Background Technology

[0002] Touchscreen modules, as a core component of modern electronic devices, are widely used in smartphones, tablets, automotive displays, industrial control equipment, and other fields. With users' increasing demands for device performance and user experience, the stability, response speed, and durability of touchscreen modules have become key indicators. However, in practical applications, touchscreen modules often face problems such as poor heat dissipation, poor environmental adaptability, and performance degradation after long-term use. These problems seriously affect the reliability of the device and the user experience.

[0003] Currently, touchscreen modules mainly consist of touch sensors, display panels, cover glass, optical adhesive, and driving circuits. To improve touchscreen performance, existing technologies primarily focus on the following aspects: first, using high-sensitivity touch sensors (such as capacitive or resistive sensors) to enhance touch accuracy; second, reducing air gaps through full lamination technology to improve optical performance; and third, using high-hardness cover glass to enhance scratch resistance. In addition, some high-end devices have introduced pressure-sensing technology and anti-interference circuit designs to further enhance the user experience. However, these technologies largely focus on improving the functionality of the touchscreen, while improvements in heat dissipation design and environmental adaptability are relatively limited.

[0004] Traditional touchscreen modules have significant shortcomings in heat dissipation design, especially under high load or long-term use. The heat generated by the touch sensor and driving circuit is difficult to dissipate effectively, causing the module temperature to rise and affecting the stability of the touchscreen operation. Utility Model Content

[0005] The purpose of this application is to solve the problem that the heat generated by the touch sensor and driving circuit is difficult to dissipate effectively under high load or long-term use, which leads to the module temperature rising and affects the operation stability of the touch screen. This application provides a touch screen module with excellent stability performance.

[0006] To achieve the above objectives, this application specifically adopts the following technical solution: A high-performance touchscreen module includes a base shell, a heat exchange plate fixedly connected to the bottom inner part of the base shell, a backlight module mounted on the top of the heat exchange plate, a display panel mounted on the top of the backlight module, a flexible circuit board fixedly connected to one end of the display panel, a driver chip fixedly connected to the other end of the flexible circuit board, and a touch sensing glass mounted on the top of the display panel. The backlight module, display panel, and touch sensing glass are all inserted inside the base shell. A top shell covers the top of the base shell. An annular heat exchange duct is formed at the bottom inner part of the base shell. Mounting slots are symmetrically formed in the middle section of the annular heat exchange duct. A semiconductor cooler is fixedly connected inside one mounting slot, and a circulating fan is fixedly connected inside the other mounting slot.

[0007] By adopting the above technical solution, and by setting up the combination of a circulating fan, a semiconductor cooler, and an annular heat exchange duct, it is convenient to drive the air to circulate along the inside of the annular heat exchange duct by starting the circulating fan. The air then exchanges heat with the internal environment of the bottom shell through the heat exchange plate, thus achieving heat exchange and cooling. At the same time, the heat absorption end of the semiconductor cooler absorbs heat and cools the air after it has exchanged heat inside the annular heat exchange duct, and then the heat is discharged through the heat release end of the semiconductor cooler. This effectively improves the heat dissipation efficiency of the device and enhances the operational stability of the touch screen.

[0008] Furthermore, a silver-plated heat sink is fixedly connected to the heat dissipation end of the semiconductor cooler, with one end of the silver-plated heat sink passing through the mounting groove and extending to the outside of the bottom shell.

[0009] By adopting the above technical solution and using the silver-plated heat sink in conjunction with the semiconductor cooler, the heat from the heat-dissipating end of the semiconductor cooler is easily conducted to the outside of the bottom shell, effectively improving the practicality of the device.

[0010] Furthermore, multiple flow guide plates are uniformly fixedly connected to the bottom of the heat exchange plate. The multiple flow guide plates are installed above the semiconductor cooler, and adjacent two flow guide plates are arranged alternately to form an S-shaped flow duct.

[0011] By adopting the above technical solution, and by using the combination of the diversion plate and the S-shaped diversion air duct, the travel distance of air through the heat absorption end of the semiconductor cooler is effectively extended, thereby improving the heat absorption efficiency of the semiconductor cooler and enhancing the practicality of the device.

[0012] Furthermore, a rubber ring is fixedly connected to the inner side of the bottom shell, and the heat exchange plate, backlight module, display panel, and touch sensing glass are all installed inside the rubber ring. A rubber ring is fixedly connected to the bottom of the top shell, which abuts against the touch sensing glass, and a locking component is installed at one end of the bottom shell.

[0013] By adopting the above technical solution, and by setting the use of rubber ring one and rubber ring two together, when the top shell is fixed to the top of the bottom shell with the locking component, the top shell can drive rubber ring one and the driving chip to form a flexible wrap around the backlight module, display panel and touch sensing glass, which effectively improves the safety of the device.

[0014] Furthermore, the locking assembly includes a pair of slots symmetrically opened at one end of the bottom shell, and a pair of elastic buckles symmetrically fixedly connected to one end of the top shell. The slots are symmetrically provided with slots inside, and one end of the elastic buckle passes through the slot and is embedded inside the slot.

[0015] By adopting the above technical solution and using the combination of elastic buckle and slot, the elastic characteristics of the elastic buckle are utilized so that when the top shell is pulled to insert the elastic buckle into the slot, the elastic buckle rebounds and embeds itself into the slot, thereby causing the top shell and bottom shell to form a snap-fit ​​fixation, which effectively improves the practicality of the device.

[0016] Furthermore, a support strip is symmetrically fixedly connected to the inner side of the bottom shell, and the display panel is mounted on top of the support strip.

[0017] By adopting the above technical solution, and by setting up the support strip in conjunction with the bottom shell, it is easy to form support for the bottom of the display panel, which effectively reduces the damage caused by the pressure on the backlight module of the display panel and further improves the stability of the device.

[0018] Furthermore, a high-transmittance optical adhesive is used to fill the space between the backlight module and the display panel.

[0019] By adopting the above technical solution, and by using high-transmittance optical adhesive in conjunction with the backlight module and the display panel, a light-transmitting flexible contact is formed between the backlight module and the display panel, which effectively reduces wear and contact between the backlight module and the display panel and improves the safety of the device.

[0020] Furthermore, the surface of the touch-sensing glass is coated with a nano-silica coating.

[0021] By adopting the above technical solution and applying a silica coating, the anti-fouling properties of the touch-sensing glass surface are effectively improved.

[0022] In summary, this application includes at least one of the following beneficial effects: 1. By using a circulating fan in conjunction with a semiconductor cooler and an annular heat exchange duct, the air can be easily circulated along the inside of the annular heat exchange duct by starting the circulating fan. The air then exchanges heat with the internal environment of the bottom shell through the heat exchange plate, resulting in cooling. At the same time, the heat absorption end of the semiconductor cooler absorbs heat and cools the air after it has exchanged heat inside the annular heat exchange duct. The heat is then discharged through the heat release end of the semiconductor cooler. This effectively improves the heat dissipation efficiency of the device and enhances the operational stability of the touch screen.

[0023] 2. By using a diversion plate in conjunction with an S-shaped air duct, the travel distance of air through the heat absorption end of the semiconductor cooler is effectively extended, improving the heat absorption efficiency of the semiconductor cooler and enhancing the practicality of the device. Attached Figure Description

[0024] Figure 1 This is a three-dimensional structural diagram of the main body of the device in this application.

[0025] Figure 2 This is an exploded view of the main body of the device in this application.

[0026] Figure 3 This is a schematic diagram of the inner bottom structure of the bottom shell in this application.

[0027] Figure 4 This is a side sectional view of the main body of the device in this application.

[0028] Explanation of reference numerals in the attached figures: 1. Bottom shell; 2. Heat exchange plate; 3. Backlight module; 4. Display panel; 5. Flexible circuit board; 6. Driver chip; 7. Touch sensor glass; 8. Top shell; 9. Annular heat exchange air duct; 10. Mounting slot; 11. Semiconductor cooler; 12. Circulating fan; 13. Silver-plated heat sink; 14. Airflow guide plate; 15. Rubber ring one; 16. Rubber ring two; 17. Slot; 18. Elastic buckle; 19. Slot; 20. Support bar; 21. High-transparency optical adhesive. Detailed Implementation

[0029] The following is in conjunction with the appendix Figure 1 —4 provides further detailed description of this application.

[0030] This application discloses a touch screen module with excellent stability.

[0031] Reference Figure 1 - Figure 3A high-performance touchscreen module includes a bottom shell 1, a heat exchange plate 2 fixedly connected to the bottom inner part of the bottom shell 1, a backlight module 3 mounted on the top of the heat exchange plate 2, a display panel 4 mounted on the top of the backlight module 3, a flexible circuit board 5 fixedly connected to one end of the display panel 4, a driver chip 6 fixedly connected to one end of the flexible circuit board 5, a touch sensing glass 7 mounted on the top of the display panel 4, the backlight module 3, the display panel 4, and the touch sensing glass 7 are all inserted inside the bottom shell 1, a top shell 8 is provided on the top of the bottom shell 1, an annular heat exchange air duct 9 is opened in the bottom inner part of the bottom shell 1, mounting slots 10 are symmetrically opened in the middle section of the annular heat exchange air duct 9, a semiconductor cooler 11 is fixedly connected inside one mounting slot 10, and a circulating fan 12 is fixedly connected inside the other mounting slot 10. Among them, the heat dissipation end of the semiconductor cooler 11 is fixedly connected to a silver-plated heat sink 13, one end of the silver-plated heat sink 13 passes through the mounting groove 10 and extends to the outside of the bottom shell 1. Furthermore, multiple guide plates 14 are uniformly fixedly connected to the bottom of the heat exchange plate 2. The multiple guide plates 14 are installed above the semiconductor cooler 11, and adjacent guide plates 14 are staggered to form an S-shaped airflow channel.

[0032] In use, the circulating fan 12 is first started to drive the air to rotate and flow along the annular heat exchange duct 9 and the interior of the two mounting slots 10. The air flowing inside the annular heat exchange duct 9 exchanges heat with the internal environment of the bottom shell 1 through the heat exchange plate 2 and is cooled down. At the same time, after the air passes through the interior of the mounting slot 10 and comes into contact with the heat absorption end of the semiconductor cooler 11, the air temperature is reduced, which improves the efficiency of the air exchanging heat with the internal environment of the bottom shell 1 through the heat exchange plate 2. Meanwhile, when the air is driven through the top of the semiconductor cooler 11, the air flows along the S-shaped airflow duct formed between multiple guide plates 14, which prolongs the contact between the air and the semiconductor cooler 11, further reducing the air temperature and improving the heat dissipation efficiency of the device. The silver-plated heat sink 13 is connected to the outside, which quickly dissipates the heat accumulated at the heat dissipation end of the semiconductor cooler 11, improving the practicality of the device.

[0033] Reference Figure 1 - Figure 3 A rubber ring 15 is fixedly connected to the inner side of the bottom shell 1. The heat exchange plate 2, backlight module 3, display panel 4, and touch sensor glass 7 are all installed inside the rubber ring 15. A rubber ring 16 that abuts against the touch sensor glass 7 is fixedly connected to the bottom of the top shell 8. A locking component is installed at one end of the bottom shell 1. The locking assembly includes a pair of slots 17 symmetrically opened at one end of the bottom shell 1, and a pair of elastic buckles 18 symmetrically fixedly connected to one end of the top shell 8. The slots 17 are symmetrically provided with slots 19 on the inner side. One end of the elastic buckle 18 passes through the slot 17 and is embedded in the inside of the slot 19.

[0034] In use, when the backlight module 3, display panel 4, and touch sensing glass 7 are all placed inside the bottom shell 1, the rubber ring 15 wraps around the backlight module 3, display panel 4, and touch sensing glass 7. Then, the top shell 8 is pulled to move the rubber ring 16 to cover the top of the touch sensing glass 7. At the same time, the top shell 8 moves the elastic buckle 18 to insert into the slot 17. Utilizing the rebound characteristic of the elastic buckle 18, the elastic buckle 18 rebounds and embeds into the slot 19, thereby achieving a quick and secure connection between the top shell 8 and the bottom shell 1. At the same time, the elasticity of the rubber ring 15 and the rubber ring 16 forms a flexible wrap around the backlight module 3, display panel 4, and touch sensing glass 7, improving the safety of the device.

[0035] Reference Figure 2 - Figure 4 The bottom shell 1 is symmetrically fixedly connected to the inner side of the support strip 20, and the display panel 4 is mounted on the top of the support strip 20.

[0036] When in use, when the display panel 4 is inserted into the bottom shell 1, the bottom of the display panel 4 is placed on the top of the support bar 20, so that the support bar 20 lifts the display panel 4 away from the top of the backlight module 3, thereby effectively reducing the pressure transmission between the display panel 4 and the backlight module 3 and improving the operational stability of the device.

[0037] Reference Figure 2 - Figure 4 The space between the backlight module 3 and the display panel 4 is filled with high-transmittance optical adhesive 21.

[0038] In use, by filling the space between the backlight module 3 and the display panel 4 with high-transparency optical adhesive 21, a light-transmitting flexible contact is formed between the backlight module 3 and the display panel 4 through the high-transparency optical adhesive 21, which effectively reduces the contact wear between the backlight module 3 and the display panel 4 and extends the service life of the device.

[0039] Reference Figure 1 and Figure 2 The surface of the touch-sensing glass 7 is coated with a nano-silica coating.

[0040] During use, by coating the surface of the touch sensing glass 7 with a silicon dioxide coating, a dirt-resistant protective layer is formed on the surface of the touch sensing glass 7, which effectively improves the dirt-resistant and fingerprint-resistant effect of the touch sensing glass 7 surface and improves the practicality of the device.

[0041] The implementation principle of a high-performance touch screen module in this embodiment is as follows: First, the backlight module 3, the display panel 4, and the touch sensing glass 7 are placed into the bottom shell 1 in sequence, so that the rubber ring 15 wraps around the backlight module 3, the display panel 4, and the touch sensing glass 7. Then, the top shell 8 is pulled to drive the rubber ring 16 to cover the top of the touch sensing glass 7. At the same time, the top shell 8 drives the elastic buckle 18 to insert into the slot 17. The elastic buckle 18 rebounds and embeds into the slot 19, thereby realizing a quick fixed connection between the top shell 8 and the bottom shell 1. At the same time, the elasticity of the rubber ring 15 and the rubber ring 16 forms a flexible wrap around the backlight module 3, the display panel 4, and the touch sensing glass 7. Then, the circulating fan 12 is started to drive the air to rotate and flow along the annular heat exchange duct 9 and the interior of the two mounting slots 10. The air flowing inside the annular heat exchange duct 9 exchanges heat with the internal environment of the bottom shell 1 through the heat exchange plate 2 and cools down. At the same time, after the air passes through the interior of the mounting slot 10 and comes into contact with the heat absorption end of the semiconductor cooler 11, the air temperature is reduced, and the efficiency of the air exchanging heat with the internal environment of the bottom shell 1 through the heat exchange plate 2 is improved. Meanwhile, when the air is driven through the top of the semiconductor cooler 11, the air flows along the S-shaped airflow duct formed between the multiple airflow plates 14, and the contact between the air and the semiconductor cooler 11 is extended, further reducing the air temperature.

Claims

1. A touchscreen module with excellent stability and performance, comprising a bottom shell (1), characterized in that: A heat exchange plate (2) is fixedly connected to the bottom of the bottom shell (1). A backlight module (3) is mounted on the top of the heat exchange plate (2). A display panel (4) is mounted on the top of the backlight module (3). A flexible circuit board (5) is fixedly connected to one end of the display panel (4). A driver chip (6) is fixedly connected to one end of the flexible circuit board (5). A touch sensing glass (7) is mounted on the top of the display panel (4). The backlight module (3), the display panel (4), and the touch sensing glass (7) are all inserted inside the bottom shell (1). A top shell (8) is covered on the top of the bottom shell (1). An annular heat exchange duct (9) is opened at the bottom of the bottom shell (1). An installation slot (10) is symmetrically opened in the middle section of the annular heat exchange duct (9). A semiconductor cooler (11) is fixedly connected inside one of the installation slots (10), and a circulating fan (12) is fixedly connected inside the other installation slot (10).

2. The touchscreen module with superior stability according to claim 1, characterized in that: The heat-dissipating end of the semiconductor cooler (11) is fixedly connected to a silver-plated heat sink (13), one end of which passes through the mounting groove (10) and extends to the outside of the bottom shell (1).

3. The touchscreen module with superior stability according to claim 1, characterized in that: The bottom of the heat exchange plate (2) is uniformly fixedly connected with multiple flow guide plates (14). The multiple flow guide plates (14) are installed above the semiconductor cooler (11), and adjacent two flow guide plates (14) are staggered to form an S-shaped flow duct.

4. A touchscreen module with superior stability according to claim 1, characterized in that: A rubber ring (15) is fixedly connected to the inner side of the bottom shell (1). The heat exchange plate (2), backlight module (3), display panel (4), and touch sensor glass (7) are all installed inside the rubber ring (15). A rubber ring (16) that abuts against the touch sensor glass (7) is fixedly connected to the bottom of the top shell (8). A fastening assembly is installed at one end of the bottom shell (1).

5. A touchscreen module with superior stability according to claim 4, characterized in that: The locking assembly includes a pair of slots (17) symmetrically opened at one end of the bottom shell (1), and a pair of elastic buckles (18) symmetrically fixedly connected at one end of the top shell (8). The slots (17) are symmetrically provided with slots (19) on the inner side. One end of the elastic buckle (18) passes through the slot (17) and is embedded in the inside of the slot (19).

6. A touchscreen module with superior stability according to claim 1, characterized in that: The bottom shell (1) is symmetrically fixedly connected to the inner side of the support strip (20), and the display panel (4) is mounted on the top of the support strip (20).

7. A touchscreen module with superior stability according to claim 1, characterized in that: The backlight module (3) and the display panel (4) are filled with high-transmittance optical adhesive (21).

8. A touchscreen module with superior stability according to claim 1, characterized in that: The surface of the touch-sensing glass (7) is coated with a nano-silica coating.

Images