Circuit board, stylus and electronic device

Abstract

This application provides a circuit board, a stylus, and an electronic device, belonging to the field of electronic technology. A touch layer is disposed on at least one of the first and second surfaces of the circuit board substrate. The touch layer includes a plurality of spaced first conductive elements. When the circuit board is rolled up and placed inside the stylus shell, the two ends of the circuit board along the rolling direction are the beginning and end, respectively, and the touch layer can cover the beginning and end of the circuit board. Through slots are formed on the first conductive elements at the beginning and end. These slots can cut off the first conductive elements and reduce their area, thereby reducing the stress at the beginning and end of the circuit board and the rebound force after rolling and wrapping the pen refill. This allows the beginning and end of the circuit board to better fit close to the inner surface of the pen refill and the pen shell, and the entire circuit board can also fit tightly against the inner surface of the pen shell, improving the quality of the detection signal and resulting in a better user experience and touch consistency for the stylus.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a circuit board, a stylus, and an electronic device. Background Technology

[0002] With the explosive growth of smartphones and tablets, more and more applications require higher precision touch, such as drawing software. As a result, the use of styluses has become more and more widespread, and the performance requirements for styluses are also getting higher and higher.

[0003] The stylus itself can perform touch functions. The stylus may include a flexible circuit board, which can be rolled up and housed within the stylus's casing. This flexible circuit board may have a touch layer, for example, capable of recognizing double-clicks and pinches. When the user double-clicks or pinches the surface of the stylus casing, the touch layer detects and recognizes these actions, thus enabling double-click and pinch-based touch control. However, because the flexible circuit board is rolled up within the casing, the gap between the flexible circuit board and the inner surface of the casing is relatively large and uneven, which reduces the quality of the detection signals for double-clicks and pinches, affecting the user experience. Utility Model Content

[0004] This application provides a circuit board, a stylus, and an electronic device, which achieves good contact between the circuit board and the inner surface of the pen shell, improves the quality of touch detection signals, and enhances the user experience and touch consistency of the stylus.

[0005] A first aspect of this application provides a circuit board including a substrate and a touch layer. The substrate includes a first surface and a second surface that are opposite to each other. The touch layer is disposed on at least one of the first surface and the second surface. The touch layer includes a plurality of spaced-apart first conductors. The touch layer can detect user input operations (such as double-clicking, pinching, etc.). The touch layer as a whole can be regarded as an electrode layer.

[0006] The circuit board is used for a curled arrangement. For example, the circuit board can be curled and arranged inside the stylus shell. The two ends of the circuit board along the curling direction are the beginning and end, respectively. The touch layer can cover the beginning and end of the circuit board, so that both the beginning and end of the circuit board have a first conductor. The first conductor at the beginning and end of the circuit board each have a through slot. That is, through slots are formed on the first conductors at the beginning and end of the circuit board. The through slots can cut off the first conductors, and the opening of the through slots can reduce the area of ​​the first conductors, thereby reducing the stress at the beginning and end of the circuit board and the rebound force after curling and wrapping the pen refill. When the circuit board is curled and arranged inside the pen shell, the beginning and end of the circuit board can better fit close to the inner surface of the pen refill and the pen shell, improving the uniformity of the gap between the circuit board and the pen shell, allowing the circuit board as a whole to fit tightly against the inner surface of the pen shell, improving the quality of the detection signal, and making the stylus user experience and touch consistency better.

[0007] In one possible implementation, the touch layer includes a first layer and a second layer, and the first conductor includes a first conductor and a second conductor. The first layer is disposed on a first surface and includes multiple first conductors, while the second layer is disposed on a second surface and includes multiple second conductors. The touch detection functions that the first layer and the second layer can implement can be different, thus enabling touch layers on both opposite sides of the substrate, achieving multiple touch detection functions, enriching the functionality of the stylus, and improving the performance and user experience of the stylus.

[0008] At least one of the first conductor at the beginning end, the first conductor at the end end, the second conductor at the beginning end, and the second conductor at the end end has a through slot. While ensuring good contact between the circuit board and the inner surface of the pen casing, the rich layout design of the through slots allows for customized design based on actual needs, resulting in a wide range of applications.

[0009] In one possible implementation, when the circuit board is rolled up, the first layer is located on the outside of the circuit board. For example, when the circuit board is rolled up inside the stylus shell, the first layer can be closer to the shell and the second layer can be closer to the pen tip, so that functions such as double-tap touch and pinch touch can be implemented through the first and second layers respectively.

[0010] Both the second conductor at the beginning and the second conductor at the end have through slots, so that the second layer located on the inside of the circuit board has through slots. Compared with opening through slots on the first conductor of the first layer, this can reduce the coupling capacitance formed between the finger and the second layer when the finger touches the pen shell at the position corresponding to the through slot of the first conductor (e.g., in the thickness direction, the vertical projection of the touch position is located at the through slot position of the first conductor). This reduces or avoids the impact of signal changes caused by the coupling capacitance on touch detection and recognition, and ensures the quality of the detection signal of the second layer.

[0011] In one possible implementation, each second conductor has multiple through slots spaced apart. This allows the through slots to have a larger area, effectively reducing stress and rebound force at the beginning and end of the circuit board, and significantly reducing the gap between the circuit board and the inner surface of the pen housing. Furthermore, the spaced-apart through slot design ensures that the second conductor has a relatively large area, minimizing the impact of the through slots on the conductivity of the second layer and guaranteeing high-quality detection signals for the second layer.

[0012] In one possible implementation, the through-slot includes a slit-like elongated shape, and the length of the through-slot can be greater than its width. The length direction of the through-slot is consistent with a first direction, which is perpendicular to the curling direction of the circuit board. That is, the length direction of the through-slot is perpendicular to the curling direction of the circuit board, which is more conducive to reducing the stress and rebound force at the beginning and end of the circuit board, allowing the circuit board to fit more tightly with the pen holder.

[0013] In one possible implementation, each second conductor has multiple through-slot groups, which are sequentially distributed along the curling direction of the circuit board. Each through-slot group includes multiple through slots, which are sequentially distributed in a first direction.

[0014] Furthermore, in the curling direction, the positions of the through slots in the multiple through slot groups correspond one-to-one, so that the through slots on the second conductor are arranged in a matrix of multiple rows and columns, which is more conducive to reducing the stress and rebound force at the beginning and end of the circuit board, making the gap between the circuit board and the inner surface of the pen shell smaller, and achieving good contact between the circuit board and the inner surface of the pen shell.

[0015] In one possible implementation, the slot groups on multiple second conductors are identical. That is, the number of slot groups on each second conductor, the size of the slots in the slot groups, the distribution and position of the slots on the second conductors can be the same, which is more conducive to the bonding of the circuit board to the inner surface of the pen shell, and also facilitates the design and molding of the slots on the second conductors, making it easier to implement in industry.

[0016] In one possible implementation, the ratio of the total area of ​​the multiple through slots on each second conductor to the area of ​​the second conductor is less than or equal to 20%. That is, the total area of ​​all through slots on the second conductor does not exceed 20% of the area of ​​the second conductor. This ensures good contact between the circuit board and the inner surface of the pen shell, thereby guaranteeing the performance of the second conductor and improving the quality of the detection signal.

[0017] In one possible implementation, a plurality of first conductor arrays are arranged on a first surface, with a first gap between two adjacent first conductors.

[0018] The second layer also includes a plurality of second conductors, a plurality of second conductors, and an array of the plurality of second conductors arranged on the second surface, with a second conductor between two adjacent second conductors and a second gap between the second conductors.

[0019] Furthermore, the vertical projection of the second conductor on the first layer is at least partially located within the first gap. For example, in the thickness direction of the circuit board, the vertical projection of the second conductor on the first layer at least partially covers the first gap. This can increase the stress on the circuit board at the location of the first gap, reduce the stress concentration after the circuit board surrounds the pen refill (e.g., low stress at the first gap, high stress at the first conductor, etc.), make the overall stress distribution of the circuit board more uniform, and allow the circuit board to better surround and wrap the pen refill. This also allows the circuit board to make closer contact with the inner surface of the pen shell, further improving the quality of the detection signal, enhancing the user experience and touch consistency of the stylus.

[0020] In one possible implementation, the vertical projection of the second conductor on the first touch layer completely covers the first gap, further reducing the stress concentration problem behind the circuit board surrounding the pen refill, making the gap between the circuit board and the inner surface of the pen shell smaller, and improving the quality of the touch detection signal.

[0021] In one possible implementation, the first conductor, the second conductor, and the second conductive body are made of copper, which has high conductivity and low cost. This helps to reduce the processing cost of the circuit board and the stylus while ensuring the performance of the circuit board.

[0022] In one possible implementation, the circuit board is used in the stylus, and the circuit board is rolled up inside the stylus shell to ensure that the circuit board can fit tightly against the inner surface of the shell, thereby improving the quality of the detection signal and enhancing the user experience and touch consistency of the stylus.

[0023] A second aspect of this application provides a stylus, including a pen shell, a pen core, and any one of the aforementioned circuit boards. The circuit board is rolled up and disposed around the periphery of the pen core, and the circuit board and the pen core are respectively disposed inside the pen shell.

[0024] A third aspect of this application provides an electronic device, including a touch device and the aforementioned stylus, wherein the stylus is communicatively connected to the touch device.

[0025] It should be understood that the second and third aspects of this application correspond to the technical solutions of the first aspect of this application, and the beneficial effects achieved by each aspect and the corresponding feasible implementation are similar, and will not be repeated here. Attached Figure Description

[0026] Figure 1 A schematic diagram of an electronic device provided in an embodiment of this application;

[0027] Figure 2 This is a schematic diagram of the structure of a stylus provided in an embodiment of this application;

[0028] Figure 3 for Figure 2 A schematic diagram of the circuit board assembly process;

[0029] Figure 4 for Figure 2 A cross-sectional schematic diagram of the assembly structure of the circuit board, pen refill, and pen holder;

[0030] Figure 5 This application provides a schematic diagram illustrating the connection between a circuit board and a control unit in a stylus.

[0031] Figure 6 This application provides a schematic diagram of touch detection for a stylus.

[0032] Figure 7 A schematic cross-sectional view of a circuit board provided in an embodiment of this application;

[0033] Figure 8 for Figure 7 A top view of the second layer of the circuit board when it is laid flat.

[0034] Figure 9 for Figure 8 A magnified view of part A in the middle;

[0035] Figure 10 for Figure 7 A top view of the first layer of the circuit board when it is laid flat.

[0036] Figure 11 for Figure 8 A magnified view of part B in the middle section;

[0037] Figure 12 for Figure 7 A magnified view of part C in the diagram.

[0038] Explanation of reference numerals in the attached figures:

[0039] 100 - Electronic devices;

[0040] 101 - Stylus;

[0041] 110 - Circuit board; 110a - Head end; 110b - Tail end;

[0042] 10-Substrate; 11-First surface; 12-Second surface; 13-Connection trace;

[0043] 20 - Touch layer; 20a - First conductor; 201 - First gap;

[0044] 21-First layer; 211-First conductor; 22-Second layer; 221-Second conductor;

[0045] 23-Through slot; 230-Through slot group; 20b-Second conductor; 202-Second gap;

[0046] 120 - Pen casing; 120a - Hollow structure; 121 - Pen tip; 122 - Pen barrel; 123 - Back cover;

[0047] 130 - Pen refill; 131 - Grounding layer; 140 - Support layer; 150 - Connector; 160 - Control unit;

[0048] 102 - Touch device; 170 - Touch screen. Detailed Implementation

[0049] The terminology used in the implementation section of this application is for the purpose of explaining specific embodiments of this application only, and is not intended to limit this application.

[0050] This application provides a circuit board that can be rolled up, for example, rolled into a columnar structure. Exemplarily, this circuit board can be used in a stylus. Of course, in some other examples, this circuit board can also be applied to other electronic devices that require circuit board rolling.

[0051] A stylus is a pen-shaped tool used to input commands to a touch device. Styluses are usually paired with touch devices to form electronic devices, and can be used as input devices.

[0052] Among them, the touch device can be any electronic terminal device with a touch screen, such as a mobile phone, tablet, 2-in-1 tablet, drawing tablet, etc.

[0053] Figure 1 This is a schematic diagram of an electronic device provided in an embodiment of this application.

[0054] Taking the touch device 102 as an example (as a tablet), see... Figure 1As shown, the electronic device 100 includes a touch device 102 and a stylus 101. The touch device 102 may have a touch screen 170, and the user can use the stylus 101 to click on the touch screen 170 to perform operations such as file selection, writing, and drawing.

[0055] For example, the stylus 101 and the touch device 102 can establish a communication connection. For instance, the stylus 101 and the touch device 102 can interconnect via a communication network to achieve wireless signal interaction. This communication network can include, but is not limited to, short-range communication networks such as Wi-Fi hotspot networks, Wi-Fi peer-to-peer (P2P) networks, Bluetooth networks, Zigbee networks, or near-field communication (NFC) networks.

[0056] Figure 2 This is a schematic diagram of the structure of a stylus provided in an embodiment of this application.

[0057] See Figure 2 As shown, the stylus 101 may include a pen shell 120, and the pen shell 120 may have a hollow structure 120a inside. The structural components of the stylus 101 may be housed and assembled in the hollow structure 120a of the pen shell 120.

[0058] For example, the pen casing 120 may include a pen tip 121, a pen barrel 122, and a back cover 123. The pen barrel 122 may have the hollow structure 120a described above. For example, the pen barrel 122 may be a columnar structure, and the outer contour shape of the pen barrel 122 may be a cylindrical, square, or triangular column, etc. The outer contour shape of the hollow structure 120a inside the pen barrel 122 may also be columnar.

[0059] The pen tip 121 and the back cover 123 can be respectively set at both ends of the pen barrel 122. The pen tip 121 can be used to contact the touch device 102, and the back cover 123 can close the hollow structure 120a of the pen barrel 122.

[0060] The back cover 123 can be easily detached and fixed to one end of the pen barrel 122, allowing for convenient assembly and disassembly of the back cover 123 and the pen barrel 122. This facilitates the assembly of the structural components of the stylus 101 into the hollow structure 120a of the pen barrel 122. For example, the back cover 123 and the pen barrel 122 can be fixed together by means of plug-in connection, snap-fit ​​connection, interference fit, etc.

[0061] The stylus 101 can be a passive capacitive pen, an electromagnetic pen, or an active capacitive pen.

[0062] The stylus 101 may also include a circuit board 110, which may be disposed within the hollow structure 120a of the pen barrel 122. The circuit board 110 may be used to detect and recognize the user's input operations on the pen shell 120 (pen barrel 122), such as double-clicking or pinching the pen shell 120 (pen barrel 122), thereby realizing the touch function and enabling the user to control the touch device 102 by double-clicking or pinching the stylus 101 (pen barrel 122).

[0063] The circuit board 110 inside the pen barrel 122 can be in a rolled-up state. For example, the circuit board 110 can be rolled into a columnar structure to facilitate assembly and housing of the circuit board 110 within the hollow structure 120a. For example, the circuit board 110 can be a flexible printed circuit board (FPCB).

[0064] Figure 3 for Figure 2 A schematic diagram of the circuit board assembly process. Figure 4 for Figure 2 A cross-sectional schematic diagram of the assembly structure of the circuit board, pen refill, and pen holder.

[0065] For example, see Figure 3 As shown, before curling, the shape of the circuit board 110 when it is laid flat can be a kind of flat plate. The width direction of the circuit board 110 can be the x direction shown in the figure, and the length direction of the circuit board 110 can be the y direction shown in the figure. The length direction (such as the y direction) and the width direction (such as the x direction) of the circuit board 110 can be perpendicular to each other.

[0066] The stylus 101 may also include a pen tip 130. For example, the pen tip 130 may be a columnar structure. Based on a flat circuit board 110, the circuit board 110 can be rolled along its width direction (e.g., the x-direction) to make the circuit board 110 as a whole columnar shape, surrounding the pen tip 130. The circuit board 110 and the pen tip 130 are fixed together. Figure 4 As shown, with the curling direction of circuit board 110 as the xˊ direction in the figure, the two ends of circuit board 110 along the curling direction can be the first end 110a and the last end 110b of circuit board 110, respectively, and the first end 110a and the last end 110b are adjacent to each other. Figure 3 As shown, when the circuit board 110 is laid flat without being curled, the two opposite ends of the circuit board 110 along the width direction (such as the x direction) can be respectively used as the first end 110a and the last end 110b of the circuit board 110 after it is curled.

[0067] It should be noted that the beginning 110a and the end 110b of the circuit board 110 do not overlap. In some embodiments, such as... Figure 4As shown, there may be a gap between the first end 110a and the last end 110b of the circuit board 110. Alternatively, in some embodiments, the first end 110a and the last end 110b of the circuit board 110 may be aligned side by side in the curling direction, and there may be no gap between the first end 110a and the last end 110b.

[0068] See Figure 4 As shown, there is also a support layer 140 between the circuit board 110 and the pen refill 130. The support layer 140 can support the circuit board 110, so that the circuit board 110 can be closer to the pen shell 120 (pen barrel), making it easier to identify and detect the user's input operation (such as double-click, pinch, etc.) on the pen shell 120 (pen barrel) through the circuit board 110.

[0069] The circuit board 110 and the support layer 140, and the support layer 140 and the pen refill 130, can be assembled and fixed by means such as screw connection, adhesive connection, or snap-fit ​​fixation. For example, the support layer 140 can be an adhesive layer with adhesive properties, so that the pen refill 130, the support layer 140 and the circuit board 110 can be fixed together by adhesive connection.

[0070] After the circuit board 110 and the pen refill 130 are fixed together, they can be installed together into the hollow structure 120a of the pen shell 120 (pen barrel 122). The pen refill 130 can be fixed with the pen shell 120, thereby making the circuit board 110 and the pen refill 130 stably assembled in the pen shell 120.

[0071] The support layer 140 can also have a certain degree of elasticity, allowing it to be compressed, which facilitates the assembly of the support layer 140, the pen refill 130, and the circuit board 110 into the mid-frame structure of the pen shell 120. Furthermore, the support layer 140 can also act as a buffer, reducing damage to the pen refill 130 and the circuit board 110 during assembly, transportation, and use, thus improving the stability and reliability of the stylus 101. For example, the support layer 140 may include foam adhesive, and the circuit board 110 is fixed to the outer periphery of the pen refill 130 by the foam adhesive.

[0072] The circuit board 110 may also have a connector 150 (see reference). Figure 3 As shown in the figure, the hollow structure 120a of the pen shell 120 may also contain a control unit (not shown in the figure, such as a control chip, referred to as a control IC), and the connector 150 of the circuit board 110 can be electrically connected to the control unit. The control unit can communicate with the touch device 102 in the manner described above, so that the signals detected and identified by the circuit board 110 can be transmitted to the touch device 102, thereby realizing the control of the touch device 102.

[0073] The circuit board may have a touch layer (not shown in the figure), which can detect user input operations (such as double-click, pinch, etc.). The touch layer may include multiple conductors (such as the first conductor in the following text), and the multiple conductors may be arranged in an array to form a sensor pattern, thereby forming a touch sensing layer. The touch layer as a whole can be regarded as an electrode layer.

[0074] Figure 5 This is a schematic diagram illustrating the connection between the circuit board and the control unit in a stylus provided in an embodiment of this application. Figure 5 As shown, taking a circuit board 110 with two touch layers 20 as an example, such as the first layer 21 and the second layer 22 respectively, the circuit board 110 may also include a substrate 10. The first layer 21 and the second layer 22 may be located on opposite sides of the substrate 10. For example, the first layer 21 may be closer to the pen shell 120, and the second layer 22 may be closer to the pen core 130.

[0075] The first layer 21 and the second layer 22 can be electrically connected to the control unit 160 via the aforementioned connector 150 (not shown in the figure). For example, the first layer 21 can be used to detect and recognize a user's double-click operation. For instance, when a user double-clicks the pen shell 120, the coupling capacitance between the finger and the first layer 21 changes. The first layer 21 can detect and recognize this change and transmit the detection data (detection signal) to the control unit 160. The control unit 160 then controls the touch device 102 to achieve the double-click touch function.

[0076] The second layer 22 can be used to detect and identify the user's pinching action. Figure 6 This is a schematic diagram of touch detection for a stylus provided in an embodiment of this application. Figure 6 As shown, the pen core 130 of the stylus 101 may include a ground layer 131, such as a grounded D-shaped tube, and the support layer 140 is located between the ground layer 131 and the second layer 22.

[0077] When a user lightly pinches the pen shell 120, the finger 200 presses down on the pen shell 120, causing it to deform. At the point where the finger 200 presses, the pen shell 120 is concave towards the pen tip 130. The pressure from the finger 200 is also transmitted to the circuit board 110 and the support layer 140, causing them to deform inward towards the pen tip 130. This changes the distance between the second layer 22 and the ground layer 131, thus changing the capacitance between them. The second layer 22 can detect and recognize this change and transmit the detection data (detection signal) to the control unit 160. The control unit 160 then controls the touch device 102 to achieve the pinch-to-touch function.

[0078] However, the conductors in the touch layer are mostly metal layers, such as copper, which have a high elastic modulus. This makes it difficult for the circuit board to completely wrap around the pen refill. The gap between the circuit board and the inner surface of the pen shell (the side facing the hollow structure) is large and uneven, especially at the beginning and end of the circuit board where stress is concentrated. The rebound force generated by the circuit board after wrapping around the pen refill is large, making the gap between the circuit board and the pen shell even more uneven at the beginning and end. After the circuit board is rolled up, it is difficult to form a regular columnar structure, and the circuit board is difficult to fit well with the pen refill and the inner surface of the pen shell. The gap between the circuit board and the pen shell affects the quality of the detection signal for user input operations. For example, in the double-tap touch function, the uneven gap between the circuit board and the pen shell is an air gap with a low dielectric constant, resulting in a weaker detection signal. In the pinch touch function, the gap between the circuit board and the pen shell may make it difficult for the deformation of the pen shell to be transmitted to the circuit board, reducing the deformation of the circuit board, which also leads to a weaker detection signal and affects the user experience.

[0079] Based on this, this application provides a circuit board comprising a substrate and a touch layer. The touch layer is disposed on at least one of a first surface and a second surface of the substrate, and the touch layer includes a plurality of spaced-apart first conductors. When the circuit board is rolled up, the two ends of the circuit board along the rolling direction are the beginning and the end, respectively, and the touch layer can cover the beginning and end of the circuit board. Through slots are formed on the first conductors located at the beginning and end, which can cut off the first conductors and reduce the area of ​​the first conductors, thereby reducing the stress at the beginning and end of the circuit board and the rebound force after rolling and wrapping the pen refill. When the circuit board is rolled up and disposed inside the pen shell of the stylus, the beginning and end of the circuit board can better fit close to the inner surface of the pen refill and the pen shell, improving the uniformity of the gap between the circuit board and the pen shell, and allowing the circuit board as a whole to fit tightly against the inner surface of the pen shell, improving the quality of the detection signal, and making the stylus user experience and touch consistency better.

[0080] Figure 7 This is a cross-sectional structural diagram of a circuit board provided in an embodiment of this application.

[0081] See Figure 7 As shown, the circuit board 110 includes a substrate 10, which can serve as a supporting structure for the entire circuit board 110. For example, the substrate 10 can be a plate-like structure, with the thickness direction of the substrate 10 as the z-direction shown in the figure. The thickness direction of the circuit board 110 can be consistent with the thickness direction of the substrate 10, and the thickness direction (e.g., z-direction), length direction (e.g., y-direction), and width direction (e.g., x-direction) of the circuit board 110 can be perpendicular to each other.

[0082] The substrate 10 may include a first surface 11 and a second surface 12 that are opposite to each other. For example, the two opposite sides of the substrate 10 in the thickness direction (such as the z direction) may be the first surface 11 and the second surface 12, respectively, and the first surface 11 and the second surface 12 are opposite to each other in the thickness direction (such as the z direction).

[0083] The circuit board 110 also includes a touch layer 20, which may be disposed on at least one of the first surface 11 and the second surface 12 of the substrate 10, for example, Figure 7 The illustration shows an example in which a touch layer 20 is provided on both the first surface 11 and the second surface 12 of the substrate 10. Each touch layer 20 may include a plurality of spaced first conductors 20a. For example, the first conductors 20a on the first surface 11 and / or the second surface 12 may be arranged in an array to form a sensor pattern, thereby enabling touch functions such as double-tap and pinch.

[0084] Of course, in some other examples, the touch layer 20 can be provided only on the first surface 11 of the substrate 10, such as to implement a double-touch function. Alternatively, the touch layer 20 can be provided only on the second surface 12 of the substrate 10, such as to implement a pinch function.

[0085] The substrate 10 may include a connection trace 13, which can be electrically connected to the touch layer 20 on the substrate 10. The connection trace 13 can also be electrically connected to the control unit 160 mentioned above through a connector or the like, so as to realize the electrical connection between the touch layer 20 and the control unit 160.

[0086] The touch layer 20 can cover the first end 110a and the last end 110b of the circuit board 110, so that both the first end 110a and the last end 110b of the circuit board 110 have a first conductor 20a. The first conductor 20a located at the first end 110a and the first conductor 20a located at the last end 110b of the circuit board 110 each have a through slot 23. For example, the through slot 23 can be a through-slot, and the through slot 23 can penetrate the first conductor 20a in the thickness direction (e.g., the z-direction). Figure 7 An example is shown with a portion of the first conductor 20a located at the beginning 110a of the circuit board 110 and a portion of the first conductor 20a located at the end 110b of the circuit board 110 having a through slot 23.

[0087] Specifically, a through groove 23 is formed on the first conductor 20a located at the first end 110a and the last end 110b of the circuit board 110. The through groove 23 can cut off the first conductor 20a, and the opening of the through groove 23 can reduce the area of ​​the first conductor 20a, thereby reducing the stress at the first end 110a and the last end 110b of the circuit board 110 and the rebound force after curling and wrapping the pen refill 130. When the circuit board 110 is curled and placed inside the pen shell 120 of the stylus 101, the first end 110a and the last end 110b of the circuit board 110 can better fit close to the pen refill 130 and the inner surface of the pen shell 120, improve the uniformity of the gap between the circuit board 110 and the pen shell 120, and enable the circuit board 110 as a whole to fit tightly with the inner surface of the pen shell 120, improve the quality of the detection signal, and make the user experience and touch consistency of the stylus 101 better.

[0088] It should be noted that some or all of the first conductors 20a located at the first end 110a of the circuit board 110 may have through slots 23, and some or all of the first conductors 20a located at the tail end 110b of the circuit board 110 may have through slots 23.

[0089] For example, in some embodiments, a touch layer 20 is provided on both the first surface 11 and the second surface 12 of the substrate 10. See [reference needed]. Figure 7 As shown, the touch layer 20 may include a first layer 21 and a second layer 22. The first layer 21 may be disposed on the first surface 11, and the second layer 22 may be disposed on the second surface 12. The touch detection functions that the first layer 21 and the second layer 22 can implement may be different. For example, the first layer 21 may be used to implement a double-touch function, and the second layer 22 may be used to implement a pinch-touch function. This allows the substrate 10 to have touch layers 20 on both opposite sides, enabling multiple touch detection functions, enriching the functionality of the stylus 101, and improving the performance and user experience of the stylus 101.

[0090] For example, when the circuit board 110 is in a curled state, the first layer 21 may be located on the outer side of the circuit board 110 (the side facing away from the center of curling), and the second layer 22 may be located on the inner side of the circuit board 110 (the side facing the center of curling). For example, when the circuit board 110 is curled into a column shape and assembled into the hollow structure 120a of the pen casing 120 (see reference...). Figure 5 As shown, in the first layer 21 and the second layer 22 of the circuit board 110, the first layer 21 can be closer to the inner surface of the pen shell 120, and the second layer 22 can be closer to the pen core 130, so that functions such as double-touch and pinch-touch can be realized through the first layer 21 and the second layer 22 respectively.

[0091] The first conductor 20a may include a first conductor 211 and a second conductor 221. The first layer 21 may include a plurality of first conductors 211, which are spaced apart on the first surface 11. For example, the plurality of first conductors 211 may be arranged in an array on the first surface 11 to form a sensor pattern, thereby enabling double-touch functionality.

[0092] The second layer 22 may include a plurality of second conductors 221, which are spaced apart on the second surface 12. For example, the plurality of second conductors 221 may be arranged in an array on the second surface 12 to form a sensor pattern, thereby enabling a pinch touch function.

[0093] At least one of the first conductor 211 located at the beginning 110a of the circuit board 110, the first conductor 211 located at the end 110b of the circuit board 110, the second conductor 221 located at the beginning 110a of the circuit board 110, and the second conductor 221 located at the end 110b of the circuit board 110 may have a through slot 23. Under the condition of achieving good contact between the circuit board 110 and the inner surface of the pen shell 120, the layout design of the through slot 23 is enriched, and the through slot 23 can be designed according to actual needs, thus having a wide range of applications.

[0094] In some embodiments, such as Figure 7 As shown, the through slot 23 is located on the second layer 22 closer to the pen refill 130 (not shown in the figure). The second conductor 221 located at the first end 110a of the circuit board 110 and the second conductor 221 located at the tail end 110b of the circuit board 110 may have the aforementioned through slot 23.

[0095] Figure 8 for Figure 7 A top view of the second layer 22 of the circuit board 110 when it is laid flat, combined with Figure 8 As shown, the second conductor 221 located at the first end 110a of the circuit board 110 and the second conductor 221 located at the tail end 110b of the circuit board 110 can both have through slots 23.

[0096] Of course, in some other embodiments, the second conductor 221 located at the first end 110a of the circuit board 110 may have a through slot 23, and the second conductor 221 located at the tail end 110b of the circuit board 110 may also have a through slot 23.

[0097] Compared with opening a through slot on the first conductor, the coupling capacitance formed between the finger and the second layer 22 when the finger touches the pen shell at the position corresponding to the through slot of the first conductor (e.g., in the thickness direction (e.g., the vertical projection of the touch position is located at the through slot position of the first conductor) can be reduced, thereby reducing or avoiding the influence of the signal change generated by the coupling capacitance on touch detection and recognition, and ensuring the quality of the detection signal of the second layer 22.

[0098] Of course, in some other embodiments, the first conductor 211 located at the beginning end 110a of the circuit board 110 and the second conductor 221 located at the end end 110b of the circuit board 110 may have through slots 23. Alternatively, the first conductor 211 and the second conductor 221 located at the beginning end 110a of the circuit board 110 and the first conductor 211 and the second conductor 221 located at the end end 110b of the circuit board 110 may both have through slots 23.

[0099] Alternatively, in some other embodiments, the first conductor 211 (or the second conductor 221) located at the beginning end 110a of the circuit board 110 and the second conductor 221 (or the first conductor 211) located at the end end 110b of the circuit board 110 may have through slots 23.

[0100] The following example illustrates the layout of the through slots 23 on the second conductor 221 located at both the beginning 110a and the end 110b of the circuit board 110. In the example where the first conductor 211 at both the beginning 110a and the end 110b of the circuit board 110 has through slots 23, the layout of the through slots 23 on the first conductor 211 can be found in the layout of the through slots 23 on the second conductor 221.

[0101] Figure 9 for Figure 8 A magnified view of part A in the diagram.

[0102] For example, see Figure 9 As shown, each second conductor 221 can have multiple through slots 23, which can be spaced apart. This allows the through slots 23 to have a larger area, effectively reducing the stress and rebound force at the beginning 110a and end 110b of the circuit board, and significantly reducing the gap between the circuit board 110 and the inner surface of the pen shell 120. Furthermore, the design of multiple spaced through slots 23 also ensures that the second conductor 221 has a relatively large area, reducing the impact of the through slots 23 on the conductivity of the second layer 22, and ensuring the high quality of the detection signal of the second layer 22.

[0103] For example, the ratio of the total area of ​​the plurality of through slots 23 on each second conductor 221 to the area of ​​the second conductor 221 can be less than or equal to 20%, that is, the total area of ​​all the through slots 23 opened on the second conductor 221 does not exceed 20% of the area of ​​the second conductor 221. Under the condition of good contact between the circuit board 110 and the inner surface of the pen shell 120, the performance of the second conductor 221 is guaranteed and the quality of the detection signal is improved.

[0104] The ratio of the total area of ​​the multiple through slots 23 on each second conductor 221 to the area of ​​the second conductor 221 can be less than or equal to 10%. This allows the circuit board 110 to be rolled up and tightly fitted to the inner surface of the pen shell 120, while avoiding the impact of the through slots 23 on the performance of the second conductor 221 and ensuring the high quality of the detection signal.

[0105] Combination Figure 8 and Figure 9 As shown, the through groove 23 may include a narrow, elongated slit. The through groove 23 can be a narrow gap, and its length can be greater than its width. Taking the length direction of the through groove 23 as the first direction, this first direction can be perpendicular to the curling direction of the circuit board 110, such as the length direction of the circuit board 110 (e.g., the y-direction). In other words, the length direction of the through groove 23 being perpendicular to the curling direction of the circuit board 110 is more conducive to reducing the stress and rebound force at the beginning 110a and end 110b of the circuit board 110, allowing the circuit board 110 to fit more tightly against the pen holder.

[0106] In this embodiment of the application, the outer contour shape of the through groove 23 is not limited. For example, the outer contour shape of the through groove 23 may include, but is not limited to, regular or irregular shapes such as rectangle, ellipse, trapezoid, etc.

[0107] Among them, see Figure 9 As shown, each second conductor 221 may have multiple through-slot groups 230, and the multiple through-slot groups 230 may be sequentially distributed along the curling direction of the circuit board 110. Each through-slot group 230 may include multiple through slots 23, and the multiple through slots 23 in each through-slot group 230 may be sequentially distributed in a first direction (such as the length direction of the circuit board 110 (such as the y direction)).

[0108] For example, with Figure 9 Taking the through-slot groups 230a and 230b shown as examples, the through-slot groups 230a and 230b can be spaced apart in the curling direction of the circuit board 110. The through-slot group 230a includes a plurality of through slots 23, and the through-slot group 230b includes a plurality of through slots 23. Taking the through-slot group 230a as an example, the plurality of through slots 23 in the through-slot group 230a are sequentially spaced apart in a first direction (such as the y direction).

[0109] In the curling direction of circuit board 110 (e.g., curling circuit board 110 along the x direction in the figure), the positions of the through slots 23 in the multiple through slot groups 230 correspond one-to-one. Taking through slot group 230a and through slot group 230b as examples, in the curling direction (e.g., curling circuit board 110 along the x direction in the figure), the positions of the multiple through slots 23 in through slot group 230a and the multiple through slots 23 in through slot group 230b correspond one-to-one, so that the through slots 23 on the second conductor 221 are arranged in a matrix of multiple rows and columns, which is more conducive to reducing the stress and rebound force at the beginning 110a and the end 110b of circuit board 110, making the gap between circuit board 110 and the inner surface of pen shell 120 smaller, and achieving good contact between circuit board 110 and the inner surface of pen shell 120.

[0110] In some embodiments, the through-slot groups 230 on the plurality of second conductors 221 are identical (see reference). Figure 8 As shown), the number of through slot groups 230 on each second conductor 221, the size of the through slots 23 in the through slot group 230, the distribution and position of the through slots 23 on the second conductor 221 can be the same, which is more conducive to the bonding of the circuit board 110 and the inner surface of the pen shell 120, and is also conducive to the design and forming of the through slots 23 on the second conductor 221, which is convenient for industrial implementation.

[0111] In some embodiments, Figure 10 for Figure 7 A top view of the first layer 21 of the circuit board 110 when it is laid flat. The first layer 21 of the circuit board 110 may include a plurality of first conductors 211, which may be arranged in an array on the first surface 11 of the substrate 10, for example, see Figure 10 As shown, the multiple first conductors 211 can be arranged in a matrix with multiple rows and columns, and there can be a first gap 201 between two adjacent first conductors 211.

[0112] For example, the first conductor 211 can be a metal layer disposed on the first surface 11 of the substrate 10. The first conductor 211 can be disposed on the first surface 11 by means of deposition, etching, coating or the like.

[0113] Figure 11 for Figure 8 A magnified view of part B in the diagram. Figure 12 for Figure 7 A magnified view of part C in the diagram.

[0114] See Figure 11 As shown, the second layer 22 of the circuit board 110 may include a plurality of second conductors 221, and the second layer 22 may also include a plurality of second conductors 20b. The plurality of second conductors 221 and the plurality of second conductors 20b may be arranged in an array on the second surface 12 of the substrate 10.

[0115] See also Figure 11 As shown, a second conductor 20b may be present between two adjacent second conductors 221, and a second gap 202 is present between the second conductor 20b and the second conductor 221. For example, with Figure 11 Taking the second conductors 221a, 221b, and 221c as an example, the second conductors 221a and 221b are adjacent to each other, and a second conductor 20b is provided between the second conductors 221a and 221b. A second gap 202 is provided between the second conductor 20b and both the second conductors 221a and 221b. The second conductor 221a is also adjacent to the second conductor 221c, and a second conductor 20b is also provided between the second conductors 221a and 221c. This second conductor 20b also provides a second gap 202 between the second conductors 221a and 221c.

[0116] For example, multiple first conductors 211 can be arranged in a matrix with multiple rows and columns (see reference). Figure 8 As shown in the figure, any two adjacent second conductors 221 have a second conductor 20b between them, so that the second conductor 20b as a whole constitutes a grid-like structure as shown in the figure.

[0117] See Figure 12 As shown, the vertical projection of the second conductor 20b on the first layer 21 is at least partially located within the first gap 201 between the first conductors 211. For example, in the thickness direction of the circuit board 110 (such as the z-direction), the vertical projection of the second conductor 20b on the first layer 21 at least partially covers the first gap 201. This can increase the stress of the circuit board 110 at the location of the first gap 201, reduce the stress concentration of the circuit board 110 around the pen refill 130 (such as low stress at the first gap 201 and high stress at the first conductor 211), make the overall stress distribution of the circuit board 110 more uniform, and allow the circuit board 110 to better wrap around the pen refill 130. This also allows the circuit board 110 to make closer contact with the inner surface of the pen shell 120, further improving the quality of the detection signal and enhancing the user experience and touch consistency of the stylus 101.

[0118] For example, the vertical projection of the second conductor 20b on the first layer 21 can completely cover the first gap 201, further reducing the stress concentration problem after the circuit board 110 surrounds the pen refill 130, making the gap between the circuit board 110 and the inner surface of the pen shell 120 smaller, and the quality of the touch detection signal higher.

[0119] For example, the second conductor 221 and the second conductor 20b can be metal layers disposed on the second surface 12 of the substrate 10. The second conductor 221 and the second conductor 20b can be disposed on the second surface 12 by means of deposition, etching, coating, etc.

[0120] In some embodiments, the first conductor 211, the second conductor 221, and the second conductor 20b may be made of the same material. For example, the first conductor 211, the second conductor 221, and the second conductor 20b may be made of copper, which has high conductivity and low cost. Under the condition of ensuring the performance of the circuit board 110, it is beneficial to reduce the processing cost of the circuit board 110 and the stylus 101.

[0121] Of course, in some other embodiments, the materials of the first conductor 211, the second conductor 221 and the second conductor 20b can also be nickel, aluminum, silver and other types of metal materials.

[0122] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances. The terms "first," "second," "third," "fourth," etc. (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A circuit board (110), characterized in that, include: A substrate (10) comprising a first surface (11) and a second surface (12) facing away from each other; A touch layer (20) is provided on at least one of the first surface (11) and the second surface (12), the touch layer (20) comprising a plurality of spaced first conductors (20a); The circuit board (110) is used for a curling configuration, and the two ends of the circuit board (110) along the curling direction are the beginning end (110a) and the end end (110b), respectively. The first conductor (20a) located at the first end (110a) and the first conductor (20a) located at the tail end (110b) each have a through groove (23).

2. The circuit board (110) according to claim 1, characterized in that, The touch layer (20) includes a first layer (21) and a second layer (22), and the first conductor (20a) includes a first conductor (211) and a second conductor (221); The first layer (21) is disposed on the first surface (11), and the first layer (21) includes a plurality of the first conductors (211); The second layer (22) is disposed on the second surface (12), and the second layer (22) includes a plurality of the second conductors (221); The through slot (23) is present on at least one of the first conductor (211) located at the first end (110a), the first conductor (211) located at the tail end (110b), the second conductor (221) located at the first end (110a), and the second conductor (221) located at the tail end (110b).

3. The circuit board (110) according to claim 2, characterized in that, When the circuit board (110) is rolled up, the first layer (21) is located on the outside of the circuit board (110); The second conductor (221) located at the first end (110a) and the second conductor (221) located at the tail end (110b) both have the through groove (23).

4. The circuit board (110) according to claim 3, characterized in that, Each of the second conductors (221) has a plurality of said through slots (23), and the plurality of said through slots (23) are spaced apart.

5. The circuit board (110) according to claim 4, characterized in that, The through slot (23) includes a slit-like elongated shape. The length direction of the through slot (23) is consistent with a first direction, which is perpendicular to the curling direction of the circuit board (110).

6. The circuit board (110) according to claim 5, characterized in that, Each of the second conductors (221) has a plurality of through slot groups (230), and the plurality of through slot groups (230) are distributed sequentially along the curling direction of the circuit board (110); Each of the slot groups (230) includes a plurality of slots (23), which are distributed sequentially in the first direction, and the positions of the slots (23) in the plurality of slot groups (230) correspond one-to-one in the curling direction.

7. The circuit board (110) according to claim 6, characterized in that, The slot groups (230) on the plurality of second conductors (221) are identical.

8. The circuit board (110) according to claim 4, characterized in that, The ratio of the total area of ​​the plurality of through slots (23) on each of the second conductors (221) to the area of ​​the second conductor (221) is less than or equal to 20%.

9. The circuit board (110) according to any one of claims 2-8, characterized in that, A plurality of first conductors (211) are arranged in an array on the first surface (11), and a first gap (201) is provided between two adjacent first conductors (211); The second layer (22) also includes a plurality of second conductors (20b), and the plurality of second conductors (221) and the plurality of second conductors (20b) are arranged in an array on the second surface (12); There is a second conductor (20b) between two adjacent second conductors (221), there is a second gap (202) between the second conductor (20b) and the second conductor (221), and the vertical projection of the second conductor (20b) on the first layer (21) is at least partially located within the first gap (201).

10. The circuit board (110) according to claim 9, characterized in that, The vertical projection of the second conductor (20b) onto the first layer (21) completely covers the first gap (201).

11. The circuit board (110) according to claim 9, characterized in that, The first conductor (211), the second conductor (221), and the second conductor (20b) are made of copper.

12. The circuit board (110) according to any one of claims 1-8, characterized in that, The circuit board (110) is used in the stylus (101) and is curled up inside the pen shell (120) of the stylus (101).

13. A stylus (101), characterized in that, It includes a pen casing (120), a pen refill (130), and a circuit board (110) as described in any one of claims 1-12 above; The circuit board (110) is rolled up and surrounds the periphery of the pen refill (130), and the circuit board (110) and the pen refill (130) are respectively disposed inside the pen shell (120).

14. An electronic device (100), characterized in that, It includes a touch device (102) and a stylus (101) as described in claim 13, wherein the stylus (101) is communicatively connected to the touch device (102).

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