Electronic device

Abstract

This application discloses an electronic device, belonging to the field of electronic devices. The electronic device includes: a housing and a display module; the display module includes a display component and a metal carrier plate, the display component and the carrier plate are stacked and distributed, and the display component is supported on the carrier plate, the side wall of the housing is provided with a slot, the edge of the carrier plate is embedded in the slot, and at least a portion of the side of the display component is bonded to the side wall of the housing.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment, and specifically relates to an electronic device. Background Technology

[0002] With the development of technology, electronic devices are becoming increasingly widely used, enabling functions such as watching videos, capturing images, and remote communication. In related technologies, electronic devices include a housing and a display module. The display module is housed within the housing, allowing the electronic device to display information. The display module includes a display panel and a metal frame. At least part of the metal frame is positioned between the side of the display module and the side wall of the housing, resulting in a relatively large gap between them. This necessitates the use of numerous light-shielding devices to block this gap, leading to a large black border on the electronic device and hindering the achievement of narrow bezels to increase screen-to-body ratio. Utility Model Content

[0003] The purpose of this application is to provide an electronic device that at least solves the problem that a large black border on the electronic device is not conducive to achieving a narrow bezel and increasing the screen ratio.

[0004] This application provides an electronic device, which includes: a housing and a display module;

[0005] The display module includes a display component and a metal carrier plate. The display component and the carrier plate are stacked and distributed, and the display component is supported on the carrier plate. The side wall of the housing is provided with a slot, and the edge of the carrier plate is embedded in the slot. At least a portion of the side of the display component is bonded to the side wall of the housing.

[0006] In this embodiment, the display module includes a display component and a metal support plate. The display component and the support plate are stacked and the display component is supported by the support plate, with the edge of the support plate embedded in a slot. Therefore, it is equivalent to eliminating other components between the side of the display component and the side wall of the housing. This reduces the distance between the side of the display component and the side wall of the housing, effectively eliminating the metal side plate of the metal frame in related technologies. The support plate supports the display component, allowing it to be effectively supported. Furthermore, at least a portion of the side of the display component is bonded to the side wall of the housing, ensuring a secure connection between the display component and the housing and preventing easy detachment. In other words, by providing a support plate, the distance between the display component and the side wall of the housing can be effectively reduced, which helps to reduce the black border of the electronic device and thus facilitates narrow bezels to increase the screen-to-body ratio. Attached Figure Description

[0007] Figure 1 This is a schematic diagram illustrating an electronic device provided in an embodiment of this application.

[0008] Figure label:

[0009] 10: Housing; 101: Card slot; 20: Display module; 21: Display assembly; 22: Carrier sheet; 2101: Display layer assembly; 211: Cover plate; 212: Display panel; 2102: Light source layer assembly; 213: Backlight panel; 214: Light guide plate; 2141: Reflective layer; 30: Light-emitting element; 40: First light-shielding adhesive layer; 50: Second light-shielding adhesive layer; 60: Flexible circuit board; 100: Black light-shielding adhesive; 200: Battery; 300: Optical adhesive. Detailed Implementation

[0010] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0011] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0012] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0013] Before explaining the electronic device provided in the embodiments of this application, the application scenario of the electronic device provided in the embodiments of this application will be specifically described: In related technologies, electronic devices include a display module and a housing, with the display module disposed in the housing. The display module includes a cover plate, a display panel, a backlight plate, a light guide plate, and a reflector. The cover plate, display panel, backlight plate, light guide plate, and reflector are stacked. The side wall of the housing is provided with a stepped structure. The cover plate is bonded to the stepped structure with structural adhesive. The display panel is bonded to the cover plate with optical adhesive. The edge of the backlight plate is bonded to the display panel with adhesive. The light guide plate is connected to the backlight plate, and the reflector is connected to the light guide plate. Additionally, a metal frame is installed within the housing, comprising a connected metal base plate and metal side plates. The metal base plate is parallel to the light guide plate. Along the stacking direction of the light guide plate and backlight plate, the sides of the display panel, backlight plate, and light guide plate are all located on one side of the metal side plates, while the side wall of the housing is located on the other side. An edge-sealing adhesive is applied to the outer side of the metal side plates, connecting them to the display panel. The metal frame supports the light-emitting components and reflector, with the light-emitting surface of the components facing the light guide plate. However, this arrangement effectively places the metal side plates between the side of the display panel and the side wall of the housing. Furthermore, gaps exist between the metal side plates and the side wall of the housing during metal frame installation, resulting in a relatively large gap between the display panel and the side wall of the housing. Consequently, when the display module is installed in the housing, numerous light-shielding devices are required to cover this gap, leading to a larger black bezel on the electronic device, which is detrimental to achieving a narrow bezel and increasing the screen-to-body ratio. In this context, the black frame of an electronic device refers to the distance between the side of the display panel and the side wall of the casing, which is covered by a light-shielding device.

[0014] Reference Figure 1 The diagram illustrates an electronic device provided in an embodiment of this application, such as... Figure 1 As shown, the electronic device includes a housing 10 and a display module 20.

[0015] The display module 20 includes a display component 21 and a metal support plate 22. The display component 21 and the support plate 22 are stacked and distributed, and the display component 21 is supported on the support plate 22. The side wall of the housing 10 is provided with a slot 101, and the edge of the support plate 22 is embedded in the slot 101. At least a portion of the side of the display component 21 is bonded to the side wall of the housing 10.

[0016] In this embodiment, the display module 20 includes a display component 21 and a metal support plate 22. The display component 21 and the support plate 22 are stacked and distributed, with the display component 21 supported on the support plate 22. The edge of the support plate 22 is embedded in the slot 101. Therefore, it is equivalent to eliminating other components between the side of the display component 21 and the side wall of the housing 10, thereby reducing the distance between the side of the display component 21 and the side wall of the housing 10. This is equivalent to eliminating the metal side plate of the metal frame in related technologies. The support plate 22 supports the display component 21, allowing the display component 21 to be effectively supported. In addition, at least a portion of the side of the display component 21 is bonded to the side wall of the housing 10, thereby connecting the display component 21 to the housing 10 and making the display component 21 more firmly connected to the side wall of the housing 10, avoiding the problem of the display component 21 easily detaching from the housing 10. That is, by setting the support plate 22, the distance between the display component 21 and the side wall of the housing 10 can be effectively reduced, which is beneficial to reducing the black frame of the electronic device and thus helping the electronic device to achieve a narrow bezel to improve the screen ratio.

[0017] It should be noted that, in this embodiment, the shell 10 can be made of metal, for example, a magnesium-aluminum alloy, or aluminum. The specific material of the shell 10 is not limited in this embodiment.

[0018] Furthermore, the material of the support piece 22 can be metal, for example, a magnesium-aluminum alloy, aluminum, or an aluminum alloy. The specific material of the support piece 22 is not limited in this embodiment.

[0019] In addition, in this embodiment, the sidewall of the housing 10 is flat, that is, the sidewall of the housing 10 is no longer provided with a stepped structure, and at least part of the side of the display component 21 can be directly bonded to the sidewall of the housing 10, so that the display component 21 and the housing 10 are more firmly connected.

[0020] In addition, in this embodiment, adhesive can be provided in the slot 101, so that when the carrier piece 22 is embedded in the slot 101, the edge of the carrier piece 22 will be bonded by the adhesive, thereby further ensuring that the carrier piece 22 is firmly connected to the housing 10. Of course, in this embodiment, the carrier piece 22 and the slot 101 can also be interference-fitted, so that the carrier piece 22 is not easy to detach from the slot 101.

[0021] In some embodiments, the display component 21 may include a display layer component 2101 and a light source layer component 2102 stacked sequentially, with the light source layer component 2102 supported on a carrier sheet 22; wherein at least a portion of the side surface of the display layer component 2101 is bonded to the side wall of the housing 10 by a black light-shielding adhesive 100.

[0022] Since the light source layer assembly 2102 is supported by the support plate 22, the support plate 22 can support the light source layer assembly 2102, so that the display assembly 21 can be effectively supported. In addition, at least a portion of the side of the display layer assembly 2101 is bonded to the side wall of the housing 10 by black light-shielding adhesive 100, which can effectively prevent light inside the electronic device from being transmitted to the outside of the housing 10, thus preventing light leakage and improving the user experience of the electronic device.

[0023] In some embodiments, the display layer assembly 2101 includes a cover plate 211 and a display panel 212 stacked together, with the display panel 212 close to the light source layer assembly 2102 relative to the cover plate 211; wherein the side of the cover plate 211 is bonded to the side wall of the housing 10 by black light-shielding adhesive 100.

[0024] Because the cover plate 211 and the display panel 212 are stacked, with the display panel 212 closer to the light source layer assembly 2102 relative to the cover plate 211, the cover plate 211 can protect the display panel 212, preventing it from being easily damaged by objects outside the electronic device. Furthermore, the side of the cover plate 211 is bonded to the side wall of the housing 10 using black light-shielding adhesive 100. This fills the gap between the cover plate 211 and the side wall of the housing 10, preventing light from the backlight panel 213 of the display assembly 21 from leaking to the outside of the housing 10 and causing light leakage in the electronic device. It also ensures a secure connection between the cover plate 211 and the housing 10. In short, by bonding the side of the cover plate 211 to the side wall of the housing 10 using black light-shielding adhesive 100, the sealing of the electronic device is improved, preventing light leakage.

[0025] In addition, when the display module 20 is installed on the housing 10, there is a gap between the side of the cover plate 211 and the side wall of the housing 10. Light-shielding adhesive 100 can be applied into the gap between the side of the cover plate 211 and the side wall of the housing 10 by dispensing. The light-shielding adhesive 100 can bond the side of the cover plate 211 to the side wall of the housing 10, ensuring that the cover plate 211 is relatively stable. The presence of the light-shielding adhesive 100 can also prevent light inside the housing 10 from being transmitted to the outside of the housing 10 through the gap, which would cause light leakage in the electronic device and improve the user experience of the electronic device.

[0026] It should be noted that when applying adhesive to the gap between the side of the cover plate 211 and the side wall of the housing 10 using the dispensing process, the light-shielding adhesive 100 may flow along the side wall of the housing 10, causing the side of the display panel 212 to bond with the side wall of the housing 10, thereby allowing the display panel 212 to be further fixed.

[0027] Furthermore, in this embodiment, the display panel 212 can be of various types, and can be selected according to actual needs. For example, the display panel 212 can be an electroluminescent display panel 212, such as an organic light-emitting diode (OLED) display panel 212, a quantum dot light-emitting diode (QLED) display panel 212, etc. The specific type of display panel 212 is not limited in this embodiment.

[0028] In addition, in this embodiment of the application, the cover plate 211 can be formed of glass, that is, the cover plate 211 is a glass cover plate 211, which allows the user to see the content displayed on the display panel 212 through the cover plate 211, and the cover plate 211 can protect the display panel 212 and avoid the problem of the display panel 212 being easily damaged.

[0029] In addition, in this embodiment, the display panel 212 and the cover plate 211 can be bonded together using optical adhesive 300. That is, optical adhesive 300 is placed between the display panel 212 and the cover plate 211, connecting them together. The optical adhesive 300 is light-transmitting, ensuring that light from the display panel 212 can pass through it and reach the cover plate 211, allowing the user to see the content displayed on the display panel 212. Furthermore, the optical adhesive 300 is evenly distributed between the display panel 212 and the cover plate 211, meaning its thickness remains consistent between them, preventing the display panel 212 from tilting due to uneven thickness of the optical adhesive 300.

[0030] In some embodiments, the light source layer assembly 2102 includes a backlight plate 213 and a light guide plate 214 stacked together. The backlight plate 213 is close to the display layer assembly 2101 relative to the light guide plate 214. The light guide plate 214 is stacked with the carrier sheet 22 and is supported on the carrier sheet 22.

[0031] Because the backlight plate 213 is closer to the display layer assembly 2101 than the light guide plate 214, the light guide plate 214 can transmit light to the backlight plate 213, thus providing light to the backlight plate 213. This allows the display layer assembly 2101 to have backlighting, enabling the user to see the content displayed on the display assembly 2101. Furthermore, the light guide plate 214 is supported by the carrier plate 22, which effectively supports the light guide plate 214, thereby supporting the display assembly 2101.

[0032] In addition, in this embodiment of the application, the light guide plate 214 can directly abut against the carrier plate 22. Of course, other components can also be provided between the light guide plate 214 and the carrier plate 22, so that the light guide plate 214 is supported on the carrier plate 22 by the components.

[0033] In addition, in this embodiment, the electronic device may also include a battery 200, which is disposed in the housing 10. The battery 200 is located on one side of the carrier plate 22, and the display component 21 is located on the other side of the carrier plate 22, which means that the carrier plate 22 separates the battery 200 from the display component 21. The battery 200 can provide power to the electronic device to ensure its effective operation and to ensure that the display component 21 can display normally.

[0034] In addition, in some embodiments, the electronic device may also include a light-emitting element 30 and a first light-shielding adhesive layer 40; the light-emitting element 30 is disposed in the housing 10, and the light-emitting surface of the light-emitting element 30 faces the side of the light guide plate 214; the first light-shielding adhesive layer 40 is bonded to the inner wall of the housing 10, and a portion of the first light-shielding adhesive layer 40 is located between the display layer assembly 2101 and the light source layer assembly 2102 to connect the display layer assembly 2101 and the light source layer assembly 2102; wherein, along the direction from the light source layer assembly 2102 to the display layer assembly 2101, the projection of the light-emitting element 30 is located inside the projection of the first light-shielding adhesive layer 40, so that the first light-shielding adhesive layer 40 blocks the light from the light-emitting element 30 in the direction from the light source layer assembly 2102 to the display layer assembly 2101.

[0035] Since the light-emitting element 30 is disposed in the housing 10, and the light-emitting surface of the light-emitting element 30 faces the side of the light guide plate 214, once the light-emitting element 30 emits light, the light can be transmitted to the side of the light guide plate 214, allowing the light to enter the light guide plate 214. The light guide plate 214 can then conduct the light, allowing the light to be transmitted to the backlight plate 213, thus giving the display assembly 21 backlight, making it easier for the user to see the content displayed on the display panel 212. In addition, the first light-shielding adhesive layer 40 is bonded to the side wall of the housing 10, and part of the first light-shielding adhesive layer 40 is located between the display layer assembly 2101 and the light source layer assembly 2102. Therefore, the display layer assembly 2101 and the light source layer assembly 2102 can be connected through the first light-shielding adhesive layer 40, making the light source layer assembly 2102 less prone to shaking relative to the display layer assembly 2101. Furthermore, along the direction from the light source layer assembly 2102 to the display layer assembly 2101, the projection of the light-emitting element 30 is located inside the projection of the first light-shielding adhesive layer 40. Therefore, once the light-emitting element 30 emits light, the light from the light-emitting element 30 is blocked by the first light-shielding adhesive layer 40 along the direction from the light source layer assembly 2102 to the display layer assembly 2101. This prevents the light from the light-emitting element 30 from being transmitted to the cover plate 211 along the direction from the light source layer assembly 2102 to the display layer assembly 2101, and subsequently to the outside of the electronic device, thus preventing light leakage. In other words, by setting the first light-shielding adhesive layer 40, the light from the light-emitting element 30 can be blocked, preventing light leakage from the electronic device and improving the user experience.

[0036] It should be noted that there can be multiple light-emitting elements 30, and these multiple light-emitting elements 30 can be arranged along the circumferential direction of the housing 10. In addition, the light-emitting element 30 can be a light-emitting diode (LED).

[0037] In addition, in this embodiment of the application, when the display layer assembly 2101 includes a display panel 212 and the light source layer assembly 2102 includes a backlight panel 213, a portion of the first light-shielding adhesive layer 40 may be located between the display panel 212 and the backlight panel 213.

[0038] In addition, in this embodiment, the first light-shielding adhesive layer 40 can be in the form of a film. In this case, the two opposing surfaces of the first light-shielding adhesive layer 40 can be coated with adhesive, allowing the first light-shielding adhesive layer 40 to connect the display panel 212 and the backlight panel 213. Of course, adhesive can also be applied only to the portion of the first light-shielding adhesive layer 40 located between the display panel 212 and the backlight panel 213. Furthermore, when the first light-shielding adhesive layer 40 is in the form of a film, when the cover plate 211 is bonded to the side wall of the housing 10 using a dispensing process, the adhesive may flow along the side wall of the housing 10. The presence of the first light-shielding adhesive layer 40 can effectively prevent the adhesive from flowing to the light-emitting element 30, thereby preventing the adhesive from affecting the light-emitting element 30. That is, the first light-shielding adhesive layer 40 can also protect the light-emitting element 30, allowing the light-emitting element 30 to emit light effectively and preventing the adhesive from flowing to the light-emitting element 30 and covering it, thus avoiding the problem of the light from the light-emitting element 30 being affected when it is transmitted to the light guide plate 214.

[0039] Furthermore, when the first light-shielding adhesive layer 40 is in the form of a film, adhesive can be applied to the side surface of the first light-shielding adhesive layer 40, and the first light-shielding adhesive layer 40 can be bonded to the side wall of the housing 10 through the adhesive. Of course, in this embodiment, the first light-shielding adhesive layer 40 can also be an adhesive layer directly formed from adhesive. The specific form of the first light-shielding adhesive layer 40 is not limited in this embodiment.

[0040] It should be noted that, in this embodiment, the color of the first light-shielding adhesive layer 40 can be black.

[0041] Furthermore, in this embodiment, the dimensions of the display panel 212, the backlight panel 213, and the light guide plate 214 are equal, meaning the sides of the display panel 212, the backlight panel 213, and the light guide plate 214 are coplanar. Additionally, the light-emitting element 30 can contact the side wall of the housing 10, thereby avoiding a gap between the light-emitting element 30 and the side wall of the housing 10, which would otherwise result in a large gap between the side of the display panel 212 and the side wall of the housing 10. In other words, by setting the light-emitting element 30 to contact the side wall of the housing 10, the gap between the display panel 212 and the side wall of the housing 10 can be reduced, thus contributing to a narrower bezel for the electronic device.

[0042] In addition, in some embodiments, the electronic device may also include a second light-shielding adhesive layer 50; the second light-shielding adhesive layer 50 is bonded to the side wall of the housing 10, and a portion of the second light-shielding adhesive layer 50 is located between the light source layer assembly 2102 and the carrier sheet 22 to connect the light source layer assembly 2102 and the carrier sheet 22, so that the light source layer assembly 2102 is supported on the carrier sheet 22; wherein, along the direction from the light source layer assembly 2102 to the carrier sheet 22, the projection of the light-emitting element 30 is located inside the projection of the second light-shielding adhesive layer 50, so that the second light-shielding adhesive layer 50 blocks the light from the light-emitting element 30 in the direction from the light source layer assembly 2102 to the carrier sheet 22.

[0043] Since the second light-shielding adhesive layer 50 is bonded to the side wall of the housing 10, and part of the second light-shielding adhesive layer 50 is located between the light source layer assembly 2102 and the carrier sheet 22, the light source layer assembly 2102 and the carrier sheet 22 can be connected through the second light-shielding adhesive layer 50, so that the light source layer assembly 2102 is connected to the carrier sheet 22 through the second light-shielding adhesive layer 50, thereby the light source layer assembly 2102 is supported on the carrier sheet 22, and thus the display assembly 21 is supported on the carrier sheet 22. Furthermore, the light-emitting element 30 is located between the first light-shielding adhesive layer 40 and the second light-shielding adhesive layer 50. Along the direction from the light guide plate 214 to the carrier sheet 22, the projection of the light-emitting element 30 is located inside the projection of the second light-shielding adhesive layer 50. Thus, once the light-emitting element 30 emits light, the light from the light-emitting element 30 will be blocked by the first light-shielding adhesive layer 40 in the direction from the backlight plate 213 to the display panel 212. This prevents the light from the light-emitting element 30 from being transmitted to the cover plate 211 along the direction from the light source layer assembly 2102 to the display layer assembly 2101, and then to the outside of the electronic device, causing light leakage problems in the electronic device. In addition, along the direction from the light source layer assembly 2102 to the carrier sheet 22, the light from the light-emitting element 30 is blocked by the second light-shielding adhesive layer 50, preventing the light from the light-emitting element 30 from being transmitted to the inside of the electronic device, ensuring that the light from the light-emitting element 30 is only transmitted to the side of the light guide plate 214. That is, by setting a second light-shielding adhesive layer 50, the light from the light-emitting component 30 can be further blocked, preventing the light from the light-emitting component 30 from being transmitted to the outside and inside of the electronic device, thereby improving the user experience of the electronic device.

[0044] It should be noted that, in this embodiment, the second light-shielding adhesive layer 50 can be in the form of a film. In this case, the two opposing surfaces of the second light-shielding adhesive layer 50 can be coated with adhesive, so that the second light-shielding adhesive layer 50 can connect the light guide plate 214 and the carrier sheet 22. Of course, adhesive can also be applied only to the portion of the second light-shielding adhesive layer 50 located between the light guide plate 214 and the carrier sheet 22.

[0045] Additionally, when the second light-shielding adhesive layer 50 is in the form of a film, adhesive can be applied to the side of the second light-shielding adhesive layer 50, and the second light-shielding adhesive layer 50 can be bonded to the side wall of the housing 10 through the adhesive. Of course, in this embodiment, the second light-shielding adhesive layer 50 can also be an adhesive layer directly formed from adhesive. The specific form of the second light-shielding adhesive layer 50 is not limited in this embodiment.

[0046] It should be noted that, in this embodiment, the second light-shielding adhesive layer 50 can be black.

[0047] Furthermore, in this embodiment, the thickness of the first light-shielding adhesive layer 40 and the thickness of the second light-shielding adhesive layer 50 can be set according to actual needs. For example, the thickness of both the first light-shielding adhesive layer 40 and the second light-shielding adhesive layer 50 is 0.5 mm, or, for another example, the thickness of both is 1 mm. This embodiment does not limit the specific values ​​of the thickness of the first light-shielding adhesive layer 40 and the second light-shielding adhesive layer 50.

[0048] In addition, in this embodiment, when the light source layer assembly 2102 includes a light guide plate 214, a portion of the second light-shielding adhesive layer 50 is located between the light guide plate 214 and the carrier sheet 22 to connect the light guide plate 214 and the carrier sheet 22.

[0049] In some embodiments, the electronic device may also include a flexible circuit board 60, with the light-emitting element 30 disposed on the flexible circuit board 60, and the flexible circuit board 60 bonded to the second light-shielding adhesive layer 50. This arrangement effectively fixes the flexible circuit board 60 to the second light-shielding adhesive layer 50, thereby fixing the light-emitting element 30. This ensures that the position of the light-emitting element 30 within the housing 10 is relatively fixed, preventing the light-emitting element 30 from easily wobbling.

[0050] Furthermore, the light-emitting element 30 is disposed on the flexible circuit board 60, which is capable of communication, thereby enabling the light-emitting element 30 to be controlled. Specifically, the electronic device includes a controller, and the flexible circuit board 60 is electrically connected to the controller. The controller can then send control signals to the light-emitting element 30 through the flexible circuit board 60, thereby controlling the light-emitting element 30 to emit different colors. In other words, by using the flexible circuit board 60, the light-emitting element 30 can be easily controlled.

[0051] It should be noted that the flexible circuit board 60 may have a first surface and a second surface facing away from each other. The light-emitting element 30 can be soldered to the first surface, and the second surface can be bonded to the second light-shielding adhesive layer 50. This allows the position of the light-emitting element 30 within the housing 10 to be fixed, preventing the light-emitting element 30 from shaking within the housing 10 and affecting the display of the display module 20. The first surface has pads to which the light-emitting element 30 can be soldered, thus soldering the light-emitting element 30 to the first surface.

[0052] Furthermore, in this embodiment, the dimensions of the display panel 212, the backlight panel 213, and the light guide plate 214 are equal, meaning the sides of the display panel 212, the backlight panel 213, and the light guide plate 214 are coplanar. Additionally, the light-emitting element 30 and the flexible circuit board 60 can contact the sidewall of the housing 10, thus avoiding the problem of a large gap between the sidewall of the display panel 212 and the sidewall of the housing 10 due to gaps between the light-emitting element 30 and the sidewall of the housing 10, and between the flexible circuit board 60 and the sidewall of the housing 10. This helps to reduce the gap between the display panel 212 and the sidewall of the housing 10, resulting in a narrower bezel for the electronic device.

[0053] In some embodiments, a reflective layer 2141 is provided on the surface of the carrier sheet 22 facing the light guide plate 214. With this arrangement, once the light-emitting element 30 emits light, the light from the light-emitting element 30 is transmitted to the light guide plate 214. The surface of the light guide plate 214 facing the carrier sheet 22 transmits the light, but the reflective layer 2141 on the surface of the carrier sheet 22 facing the light guide plate 214 reflects the light emitted from the light guide plate 214 back to the light guide plate 214, ensuring that the light is only transmitted to the backlight plate 213. In other words, by providing a reflective layer 2141 on the surface of the carrier sheet 22 facing the light guide plate 214, it can be ensured that the light emitted by the light-emitting element 30 is only transmitted to the backlight plate 213 through the light guide plate 214, which is beneficial for the display assembly 21 to perform its display function.

[0054] Furthermore, by providing a reflective layer 2141 on the surface of the carrier sheet 22 facing the light guide plate 214, the use of a reflector can be avoided. Compared to the display module 20 in related technologies, the thickness of the display module 20 in this embodiment can be smaller, which is beneficial for achieving a thinner and lighter electronic device. In addition, by avoiding the use of a reflector in this embodiment, the cost of the display module 20 can also be reduced, thereby helping to reduce the cost of the electronic device.

[0055] It should be noted that, in this embodiment, the thickness of the reflective layer 2141 can be set according to actual needs. For example, the thickness of the reflective layer 2141 is 0.05 mm, 10 μm, or 100 μm. The specific value of the thickness of the reflective layer 2141 is not limited in this embodiment.

[0056] Alternatively, the reflective layer 2141 can be directly sprayed onto the carrier sheet 22 using a spraying process. Of course, the reflective layer 2141 can also be disposed on the carrier sheet 22 using other processes. For example, the reflective layer 2141 can also be formed by sputtering on the surface of the carrier sheet 22 using a sputtering process. The specific process type for forming the reflective layer 2141 on the carrier sheet 22 is not limited in this embodiment.

[0057] In some embodiments, the housing 10 and the support piece 22 are integrally formed. This arrangement results in a stronger integral structure formed by the housing 10 and the support piece 22, and makes it less likely for the support piece 22 to detach from the housing 10, thereby ensuring the stability of the electronic device.

[0058] It should be noted that both the shell 10 and the support plate 22 are made of metal, and can be directly formed by a one-piece molding process. For example, the shell 10 and the support plate 22 can be directly formed by die casting.

[0059] Of course, in this embodiment, the support piece 22 and the housing 10 can also be welded together, that is, the edge of the support piece 22 is welded to the side wall of the housing 10, so that the support piece 22 is fixed to the housing 10.

[0060] In addition, in some embodiments, the thickness of the carrier sheet 22 ranges from 0.1 mm to 0.15 mm. With this setting, the thickness of the carrier sheet 22 can be small, that is, the carrier sheet 22 has a small thickness while ensuring that it can support the display component 21. The space occupied by the carrier sheet 22 is reduced, thereby improving the space utilization rate inside the housing 10 of the electronic device.

[0061] In related technologies, the housing 10 has an internal metal frame with a metal base plate and metal side plates, both 0.2mm thick. This results in a significantly thicker metal base plate compared to the support plate 22 in this embodiment, occupying a large portion of the internal space of the housing 10. This is detrimental to the placement of other components within the housing 10 and hinders the achievement of a thinner and lighter electronic device. In contrast, the support plate 22 in this embodiment has a thickness ranging from 0.1mm to 0.15mm, occupying less space. This allows for better placement of other components within the housing 10, improving the utilization of the internal space and contributing to a thinner and lighter electronic device.

[0062] It should be noted that, in this embodiment, the thickness of the support sheet 22 can be any value between 0.1mm and 0.15mm. For example, the thickness of the support sheet 22 is 0.1mm, 0.12mm, 0.14mm, or 0.15mm. The specific value of the thickness of the support sheet 22 is not limited in this embodiment.

[0063] It should also be noted that, in the embodiments of this application, electronic devices include, but are not limited to, controllers, smart devices, terminal products, etc., wherein smart devices include, for example, smartphones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices, etc., and terminal products include personal computers, tablet computers, etc.

[0064] In this embodiment, the display module 20 includes a display component 21 and a metal support plate 22. The display component 21 and the support plate 22 are stacked and distributed, with the display component 21 supported on the support plate 22. The edge of the support plate 22 is embedded in the slot 101. Therefore, it is equivalent to eliminating other components between the side of the display component 21 and the side wall of the housing 10, thereby reducing the distance between the side of the display component 21 and the side wall of the housing 10. This is equivalent to eliminating the metal side plate of the metal frame in related technologies. The support plate 22 supports the display component 21, allowing the display component 21 to be effectively supported. In addition, at least a portion of the side of the display component 21 is bonded to the side wall of the housing 10, thereby connecting the display component 21 to the housing 10 and making the display component 21 more firmly connected to the side wall of the housing 10, avoiding the problem of the display component 21 easily detaching from the housing 10. That is, by setting the support plate 22, the distance between the display component 21 and the side wall of the housing 10 can be effectively reduced, which is beneficial to reducing the black frame of the electronic device and thus helping the electronic device to achieve a narrow bezel to improve the screen ratio.

[0065] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0066] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, The electronic device includes: a housing and a display module; The display module includes a display component and a metal carrier plate. The display component and the carrier plate are stacked and distributed, and the display component is supported on the carrier plate. The side wall of the housing is provided with a slot, and the edge of the carrier plate is embedded in the slot. At least a portion of the side of the display component is bonded to the side wall of the housing.

2. The electronic device according to claim 1, characterized in that, At least a portion of the side of the display component is bonded to the side wall of the housing using black light-shielding adhesive.

3. The electronic device according to claim 2, characterized in that, The display component includes a display layer component and a light source layer component stacked sequentially, with the light source layer component supported on the carrier sheet; At least a portion of the side surface of the display layer assembly is bonded to the side wall of the housing using black light-shielding adhesive.

4. The electronic device according to claim 3, characterized in that, The display layer assembly includes a cover plate and a display panel stacked together, with the display panel being closer to the light source layer assembly relative to the cover plate; The side of the cover plate is bonded to the side wall of the housing using the black light-shielding adhesive.

5. The electronic device according to claim 3, characterized in that, The light source layer assembly includes a backlight plate and a light guide plate stacked together. The backlight plate is close to the display layer assembly relative to the light guide plate. The light guide plate is stacked with the carrier sheet, and the light guide plate is supported on the carrier sheet.

6. The electronic device according to claim 5, characterized in that, The electronic device also includes a light-emitting element and a first light-shielding adhesive layer; The light-emitting element is disposed in the housing, and the light-emitting surface of the light-emitting element faces the side of the light guide plate. The first light-shielding adhesive layer is bonded to the inner wall of the housing, and a portion of the first light-shielding adhesive layer is located between the display layer assembly and the light source layer assembly to connect the display layer assembly and the light source layer assembly. Wherein, along the direction from the light source layer assembly to the display layer assembly, the projection of the light-emitting element is located inside the projection of the first light-shielding adhesive layer, so that the first light-shielding adhesive layer blocks the light-emitting element in the direction from the light source layer assembly to the display layer assembly.

7. The electronic device according to claim 6, characterized in that, The electronic device also includes a second light-shielding adhesive layer; The second light-shielding adhesive layer is bonded to the side wall of the housing, and a portion of the second light-shielding adhesive layer is located between the light source layer assembly and the carrier sheet to connect the light source layer assembly and the carrier sheet, so that the light source layer assembly is supported on the carrier sheet; Wherein, along the direction from the light source layer assembly to the carrier sheet, the projection of the light-emitting element is located inside the projection of the second light-shielding adhesive layer, so that the second light-shielding adhesive layer blocks the light-emitting element in the direction from the light source layer assembly to the carrier sheet.

8. The electronic device according to claim 7, characterized in that, The electronic device further includes a flexible circuit board, the light-emitting element is disposed on the flexible circuit board, and the flexible circuit board is bonded to the second light-shielding adhesive layer.

9. The electronic device according to claim 5, characterized in that, The surface of the carrier sheet facing the light guide plate is provided with a reflective layer.

10. The electronic device according to any one of claims 1-9, characterized in that, The thickness of the support sheet ranges from 0.1 mm to 0.15 mm.

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