A connection structure between a light panel and an outer casing, and an indoor LED display screen.

Abstract

This utility model provides a connection structure between a lamp board and an outer casing, as well as an indoor LED display screen, relating to the field of LED display screen technology. It includes a lamp board and a casing, with a copper foil layer disposed between the lamp board and the casing. The lamp board has several conductive holes protruding from its surface. The copper foil layer has through holes at the locations of the conductive holes, and its surface is higher than the height of the conductive holes so that the connection between the lamp board and the casing is solely through the copper foil layer, thus preventing short circuits. This solution addresses the problem of lamp boards being prone to short circuits.

Description

Technical Field

[0001] This utility model relates to the field of LED display technology, and more specifically, to a connection structure between a lamp board and an outer casing, and an indoor LED display screen. Background Technology

[0002] As LED indoor displays become thinner and lighter, module designs are gradually eliminating the bottom shell, with the module's lamp panel directly attached to the cabinet frame for installation. While this design achieves thinner and lighter designs, it also introduces new technical challenges. To prevent surface damage caused by friction between the lamp panel and the cabinet frame, the portion of the lamp panel that contacts the cabinet frame is typically designed with copper foil (e.g., ...). Figure 1 However, the cabinet frame is generally made of die-cast aluminum or die-cast magnesium, and the contact surface formed after machining is conductive. Meanwhile, vias are designed into the copper area of ​​the LED board, and these vias are conductive. When the vias and copper simultaneously contact the cabinet frame, a short circuit can easily occur, affecting the normal operation of the LED display. Currently, a common solution is to screen-print a layer of white ink as an insulating layer on the copper surface and the vias (e.g., ...). Figure 2 However, this solution has significant drawbacks. The white oil has poor abrasion resistance and is prone to damage due to friction during repeated disassembly and reassembly of the LED board, leading to short circuits between the copper foil and vias or between vias themselves. This short circuit can cause dead LEDs or multiple LEDs to light up simultaneously, severely affecting the display effect and reliability of the LED display screen. Therefore, how to effectively avoid short circuits and improve product reliability has become a pressing technical challenge that needs to be addressed. Utility Model Content

[0003] This utility model discloses a connection structure between the lamp panel and the outer casing, which aims to solve the problems mentioned above.

[0004] The present invention adopts the following solution:

[0005] A connection structure between a lamp board and an outer casing includes a lamp board and a casing. A copper foil layer is disposed between the lamp board and the casing. The lamp board has a plurality of conductive holes that protrude from the surface of the lamp board. The copper foil layer has through holes at the locations of the conductive holes, and the surface of the copper foil layer is higher than the height of the conductive holes so that when the lamp board and the casing are connected, they are only connected through the copper foil layer, thereby avoiding short circuits.

[0006] Furthermore, the lamp panel is a multi-layered board, formed by pressing several glass fiber boards and copper sheets alternately, with the outermost layer being a copper sheet layer.

[0007] Furthermore, the lamp panel includes a fiberglass board and copper foil layers disposed on the upper and lower surfaces of the glass limiting plate.

[0008] Furthermore, the copper layer is formed on the fiberglass board by an electroplating process.

[0009] Furthermore, an electroplated layer is formed inside the conductive hole, and the electroplated layer protrudes from the surface of the glass limiting plate so that the conductive hole protrudes from the surface of the lamp plate.

[0010] Furthermore, the outermost copper layer has a thickness of 18±3μm; the electroplated layer inside the conductive hole has a thickness of 10±3μm.

[0011] Furthermore, the housing has a boss structure that connects to the lamp panel.

[0012] This utility model also provides an indoor LED display screen, including the connection structure between the lamp panel and the outer casing.

[0013] Beneficial effects:

[0014] This solution precisely controls the thickness of the copper layer on the lamp board and the exposed height of the conductive holes, thus avoiding short circuits when the lamp board contacts the cabinet frame. It abandons the traditional white oil insulation layer design and adopts a more reliable physical isolation method, fundamentally solving the short circuit problem caused by insulation layer wear. This technical solution is highly practical and economical, and can be widely applied in the production and manufacturing of LED display modules. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the connection structure between the lamp panel and the outer casing according to an embodiment of the present utility model;

[0016] Figure 2 This is a structural diagram of the connection structure between the lamp panel and the outer casing in the prior art;

[0017] Figure 3 This is a schematic diagram of the planar structure of a lamp panel connecting the lamp panel and the outer casing according to an embodiment of the present utility model;

[0018] Figure 4 This is a schematic diagram of the cross-sectional structure of a lamp panel connecting the lamp panel and the outer casing according to an embodiment of the present utility model.

[0019] Figure 5 This is a schematic diagram of the structure of a double-layer lamp panel, which is a connection structure between the lamp panel and the outer casing according to an embodiment of this utility model.

[0020] Figure 6 This is a schematic diagram of the structure of a four-layer lamp panel, which is a connection structure between the lamp panel and the outer casing according to an embodiment of this utility model.

[0021] Figure 7 This is a schematic diagram of the conductive hole structure of a four-layer lamp board in an embodiment of the present invention, showing the connection structure between the lamp board and the outer casing.

[0022] Reference numerals in the attached drawings: 1. Box body, 11. Boss structure, 2. Lamp panel, 21. Glass limiting plate, 22. Copper layer, 23. Conductive hole, 24. Electroplating layer, 3. White oil layer. Detailed Implementation

[0023] Combination Figure 1 , Figures 3 to 7 As shown, this embodiment provides an indoor LED display screen, including the connection structure between the lamp board 2 and the outer casing 1. The connection structure between the lamp board and the outer casing includes the lamp board 2 and the casing 1. A copper foil layer 22 is provided between the lamp board 2 and the casing 1. The lamp board 2 is provided with a plurality of conductive holes 23, which protrude from the surface of the lamp board 2. The copper foil layer 22 is provided with through holes at the positions of the conductive holes 23, and the surface of the copper foil layer 22 is higher than the height of the conductive holes 23 so that when the lamp board 2 and the casing 1 are connected, the contact connection is only through the copper foil layer 22, thereby avoiding short circuits.

[0024] In one embodiment, the housing 1 has a boss structure 11 that connects to the lamp panel 2. The boss structure 11 on the housing 1 enables connection to a portion of the lamp panel 2.

[0025] Combination Figures 4 to 7 As shown, the lamp panel 2 is a multi-layer board, formed by pressing several fiberglass boards and copper sheets alternately, with the outermost layer being a copper sheet layer 22. For example, an even number of layers, such as two-layer or four-layer boards, can be used. Taking a two-layer board as an example, the lamp panel 2 includes a single layer of fiberglass board and copper sheets 22 disposed on the upper and lower surfaces of the glass limiting plate 21. For a four-layer board, copper sheets are electroplated onto the upper and lower layers of fiberglass boards simultaneously, with an additional fiberglass board in the middle, and then pressed together. It should be noted that in this embodiment, the copper sheet layer 22 is formed on the glass limiting plate 21 using existing electroplating processes. Since the copper sheet is formed by electroplating on the fiberglass board, the thickness of the copper sheet layer 22 can be precisely controlled by the electroplating time and current, reaching ±3μm. In a preferred embodiment, the thickness of the outermost copper sheet layer 22 is 18±3μm.

[0026] Several conductive holes 23 can be formed on the lamp board 2. The conductive holes 23 are formed by drilling holes in the lamp board 2, followed by electroplating the interior and end faces of the conductive holes 23. The thickness of the copper layer is controlled by the electroplating time and current, and can be ±3μm. An electroplated layer 24 is formed inside the conductive holes 23, protruding from the surface of the glass limiting plate 21 so that the conductive holes 23 protrude from the surface of the lamp board 2. The electroplated layer 24 can also be obtained by electroplating copper foil. In a preferred embodiment, the thickness of the electroplated layer 24 inside the conductive holes 23 is 10±3μm, so that the copper foil layer 22 on the surface of the lamp board 2 is thicker than the thickness of the electroplated layer 24 of the conductive holes 23.

[0027] This embodiment controls the thickness of the copper layer 22 and the exposed thickness of the conductive holes 23, ensuring that the copper layer thickness exceeds the height of the conductive holes 23 protruding from the surface of the lamp board 2. When the lamp board 2 contacts the frame of the housing 1, contact is only made through the copper layer 22, without contact through the conductive holes 23. This avoids short circuits caused by insufficient wear resistance of the white oil layer 3, ensuring product reliability. Furthermore, the production cost of the lamp board 2 is not increased, and the elimination of the white oil layer 3 reduces material usage and saves production costs.

[0028] It should be understood that the above are only preferred embodiments of the present utility model, and the protection scope of the present utility model is not limited to the above embodiments. All technical solutions that fall within the scope of the present utility model are protected by the present utility model.

[0029] The accompanying drawings used in the above description of the embodiments only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

Claims

1. A connection structure between a lamp panel and an outer casing, comprising a lamp panel and a casing, characterized in that, A copper foil layer is provided between the lamp board and the housing. The lamp board has a plurality of conductive holes that protrude from the surface of the lamp board. The copper foil layer has through holes at the locations of the conductive holes, and the surface of the copper foil layer is higher than the height of the conductive holes so that when the lamp board and the housing are connected, they are only connected through the copper foil layer, thereby avoiding short circuits.

2. The connection structure between the lamp panel and the outer casing according to claim 1, characterized in that, The lamp panel is an even-numbered panel, formed by pressing several fiberglass boards and copper sheets alternately, with the outermost layer being a copper sheet.

3. The connection structure between the lamp panel and the outer casing according to claim 1, characterized in that, The light panel is a multi-layer board, which includes a fiberglass board and copper foil layers disposed on the upper and lower surfaces of the fiberglass board.

4. The connection structure between the lamp panel and the outer casing according to claim 2 or 3, characterized in that, The copper layer is formed on the fiberglass board by an electroplating process.

5. The connection structure between the lamp panel and the outer casing according to claim 2 or 3, characterized in that, An electroplated layer is formed inside the conductive hole, and the electroplated layer protrudes from the surface of the glass limiting plate so that the conductive hole protrudes from the surface of the lamp plate.

6. The connection structure between the lamp panel and the outer casing according to claim 5, characterized in that, The outermost copper layer has a thickness of 18±3μm; the electroplated layer inside the conductive hole has a thickness of 10±3μm.

7. The connection structure between the lamp panel and the outer casing according to claim 1, characterized in that, The housing has a boss structure that connects to the lamp panel.

8. An indoor LED display screen, characterized in that, It includes the connection structure between the lamp panel and the outer casing as described in any one of claims 1-7.

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