Power supply module, low-power compression additional memory module and mainboard device

Abstract

This application provides a power supply module, a low-power compressed additional memory module, and a motherboard device. The power supply module, applied to the low-power compressed additional memory module to supply power to its memory chips, includes an input terminal, a conversion unit, and at least three output terminals. The input terminal is configured to receive an input voltage. The conversion unit is connected to the input terminal and configured to generate multiple different output voltages based on the input voltage. The at least three output terminals are connected to the conversion unit and configured to output at least three different output voltages. The power supply module provided by this application enables diverse designs for low-power compressed additional memory modules.

Description

Technical Field

[0001] This application relates to the field of storage technology, and in particular to a power supply module, a low-power compressed additional memory module, and a motherboard device. Background Technology

[0002] The Joint Electron Device Engineering Council (JEDEC) has released Low Power Double Data Rate SynchronousDRAM Compression-Attached Memory Modules (LPDDR5 / 5XSDRAM CAMM2s), which are known for their low power consumption and small size and are specifically designed for use in mobile electronic devices.

[0003] However, in the JESD318 standard developed by JEDEC, the LPDDR5 / 5X CAMM2 (LP5CAMM2) module can only support specific power supply chips, resulting in low flexibility in module design and difficulty in meeting the needs of diverse mobile devices. Utility Model Content

[0004] The purpose of this application is to provide a power supply module, a low-power compressed additional memory module, and a motherboard device, which can realize the diversified design of the low-power compressed additional memory module.

[0005] In a first aspect, this application provides a power supply module for use in a low-power compressed additional memory module to supply power to the memory chip of the low-power compressed additional memory module, comprising: an input terminal configured to receive an input voltage; a conversion unit connected to the input terminal, the conversion unit being configured to convert and generate multiple different output voltages based on the input voltage; and at least three output terminals connected to the conversion unit, the at least three output terminals being configured to output at least three different output voltages.

[0006] In some embodiments, the conversion unit includes a power management integrated circuit (PMIC) chip having three voltage output terminals and configured to output three different output voltages.

[0007] In some embodiments, the three voltage output terminals of the PMIC chip output voltages of 1.05V, 0.50V, and 1.80V, respectively.

[0008] In some embodiments, the output voltages output by the three voltage output terminals of the PMIC chip are a first voltage, a second voltage, and a third voltage, respectively, wherein the first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

[0009] In some embodiments, the conversion unit includes at least two power conversion chips, each of which is connected to the input terminal, and the at least two power conversion chips generate at least three output voltages based on the input voltage.

[0010] In some embodiments, the conversion unit includes three power conversion chips, each power conversion chip generating a corresponding output voltage. The output voltages of the three power conversion chips are a first voltage, a second voltage, and a third voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

[0011] In some embodiments, the conversion unit includes three power conversion chips. One of the three power conversion chips generates two output voltages, and the other two power conversion chips each generate a corresponding output voltage. The output voltages of the three power conversion chips are a first voltage, a second voltage, a third voltage, and a fourth voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, the third voltage is greater than or equal to 1.50V, and the fourth voltage is greater than or equal to 0.70V.

[0012] In some embodiments, the conversion unit includes four power conversion chips, each of which generates a corresponding output voltage. The output voltages of the four power conversion chips are a first voltage, a second voltage, a third voltage, and a fourth voltage, wherein the first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, the third voltage is greater than or equal to 1.50V, and the fourth voltage is greater than or equal to 0.70V.

[0013] In some embodiments, the conversion unit includes four power conversion chips, two of which generate an output voltage together, and the other two generate a corresponding output voltage. The output voltages of the four power conversion chips are a first voltage, a second voltage, and a third voltage, wherein the first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

[0014] In some embodiments, the conversion unit includes two power conversion chips, at least one of which generates two output voltages.

[0015] In some embodiments, one of the two power conversion chips generates two different output voltages, and the other power conversion chip generates one output voltage. The output voltages of the two power conversion chips are a first voltage, a second voltage, and a third voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

[0016] In some embodiments, each of the two power conversion chips generates two output voltages. One of the two power conversion chips generates two different output voltages, and the other power conversion chip generates two identical output voltages. The output voltages of the two power conversion chips are a first voltage, a second voltage, a third voltage, or any one of the first voltage, the second voltage, and the third voltage. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

[0017] In some embodiments, each of the two power conversion chips generates two output voltages, and each power conversion chip generates two different output voltages. The output voltages of the two power conversion chips are a first voltage, a second voltage, a third voltage, and a fourth voltage, wherein the first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, the third voltage is greater than or equal to 1.50V, and the fourth voltage is greater than or equal to 0.70V.

[0018] In some embodiments, the conversion unit further includes a logic control unit, wherein each power conversion chip is connected to the logic control unit to determine the power-on and power-off sequence of the corresponding output voltage based on the logic control signal output by the logic control unit.

[0019] In some embodiments, the power conversion chip includes a DC-DC conversion chip.

[0020] Secondly, this application provides a low-power compressed additional memory module, comprising: a circuit board; at least one memory chip disposed on the circuit board; and a power supply module as described in any of the above embodiments disposed on the circuit board and connected to the memory chip to provide at least three output voltages to the memory chip.

[0021] Thirdly, this application provides a motherboard device, including: a motherboard; a connector; and a low-power compressed additional memory module as described in the above embodiments, wherein the low-power compressed additional memory module is connected and installed on the motherboard through the connector to constitute the motherboard device.

[0022] This application provides a power supply module, a low-power compressed additional memory module, and a motherboard device. The power supply module is applied to the low-power compressed additional memory module to power its memory chips. The power supply module includes an input terminal, a conversion unit, and at least three output terminals. The input terminal is configured to receive an input voltage. The conversion unit is connected to the input terminal and is configured to generate multiple different output voltages based on the input voltage. The at least three output terminals are connected to the conversion unit and are configured to output at least three different output voltages. The power supply module can adjust the number of output terminals and the content of the conversion unit according to actual needs, thereby realizing diversified designs of the low-power compressed additional memory module. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the low-power compression additional memory module provided in an embodiment of this application.

[0025] Figure 2 This is a schematic diagram of the power supply module provided in an embodiment of this application.

[0026] Figure 3 for Figure 2 The diagram shows the structure of the conversion unit in the power supply module, which includes a PMIC chip.

[0027] Figure 4 for Figure 2 The diagram shows a power supply module with a conversion unit comprising three power conversion chips.

[0028] Figure 5 for Figure 2 The diagram shows another structural schematic of the power supply module, where the conversion unit includes three power conversion chips.

[0029] Figure 6 for Figure 2 The diagram shows a power supply module with a conversion unit comprising four power conversion chips.

[0030] Figure 7 for Figure 2 The diagram shows another structural schematic of the power supply module, where the conversion unit includes four power conversion chips.

[0031] Figure 8 for Figure 2 The diagram shows a power supply module with a conversion unit comprising two power conversion chips.

[0032] Figure 9 for Figure 2 The diagram shows another structural schematic of the power supply module, where the conversion unit includes two power conversion chips.

[0033] Figure 10 This is an exploded view of the motherboard device provided in an embodiment of this application. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0036] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0037] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0038] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0039] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0040] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0041] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the structure of the low-power compression additional memory module provided in an embodiment of this application. Figure 2 This is a schematic diagram of the power supply module provided in an embodiment of this application. This application provides a power supply module 10, applied to a low-power compression additional memory module 1, to power the memory chip 30 of the low-power compression additional memory module 1. The power supply module 10 includes an input terminal 11, a conversion unit 12, and at least three output terminals 13. The input terminal 11 is configured to receive an input voltage. The conversion unit 12 is connected to the input terminal 11 and is configured to generate multiple different output voltages based on the input voltage. The at least three output terminals 13 are connected to the conversion unit 12 and are configured to output at least three different output voltages.

[0042] The power supply module 10 is applied to the low-power compression additional memory module 1 to provide at least three output voltages to the memory chip 30 of the low-power compression additional memory module 1.

[0043] The power supply module 10 includes an input terminal 11, a conversion unit 12, and at least three output terminals 13. One end of the conversion unit 12 is connected to the input terminal 11, and the other end of the conversion unit 12 is connected to the at least three output terminals 13. The input terminal 11 receives an input voltage. Based on the input voltage received from the input terminal 11, the conversion unit 12 converts the input voltage to generate multiple different output voltages, and outputs at least three different output voltages through the at least three output terminals 13. Each output terminal 13 outputs one output voltage.

[0044] The power supply module 10 provided in this embodiment includes an input terminal 11, a conversion unit 12, and at least three output terminals 13. The input terminal 11 is configured to receive an input voltage. The conversion unit 12 is connected to the input terminal 11 and is configured to generate multiple different output voltages based on the input voltage. The at least three output terminals 13 are connected to the conversion unit 12 and are configured to output at least three different output voltages. The power supply module can adjust the number of output terminals and the contents of the conversion unit according to actual needs, thereby achieving a diversified design of the low-power compressed additional memory module 1.

[0045] Please refer to Figure 3 , Figure 3 for Figure 1 The diagram shows a power supply module with a conversion unit including a PMIC chip. In some embodiments, the conversion unit 12 includes a power management integrated circuit (PMIC) chip 121, which has three voltage output terminals 1210 and is configured to output three different output voltages.

[0046] The conversion unit 12 includes a PMIC (Power Management IC) chip 121, which has three voltage output terminals 1210, each configured to output a single output voltage. The three voltage output terminals 1210 are configured to output three different output voltages, meaning the output voltages from the three voltage output terminals 1210 are not identical. Correspondingly, the power supply module 10 includes three output terminals 13, each output terminal 13 connected to one voltage output terminal 1210, so that the three output terminals 13 output three different output voltages.

[0047] In some embodiments, the three voltage output terminals 1210 of the PMIC chip 121 output voltages respectively as a first voltage, a second voltage, and a third voltage. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

[0048] The three voltage output terminals 1210 of the PMIC chip 121 output the first voltage, the second voltage, and the third voltage through the three output terminals 13, respectively.

[0049] In some embodiments, the first voltage can be any value from 0.80V to 1.15V, such as 0.80V, 0.85V, 0.90V, 0.95V, 1.0V, 1.05V, 1.10V, or 1.15V; the second voltage can be any value from 0.25V to 0.60V, such as 0.25V, 0.30V, 0.35V, 0.40V, 0.45V, 0.50V, 0.55V, or 0.60V; and the third voltage can be any value from 1.50V to 2.0V, such as 1.50V, 1.55V, 1.60V, 1.65V, 1.70V, 1.75V, 1.80V, 1.85V, 1.90V, 1.95V, or 2.0V.

[0050] In some embodiments, the first voltage is 1.05V, the second voltage is 0.50V, and the third voltage is 1.80V.

[0051] The PMIC chip 121 has three voltage output terminals 1210 that output 1.05V, 0.50V, and 1.80V respectively through three output terminals 13. The PMIC chip 121 can be a PMIC 5100 chip.

[0052] The conversion unit 12 can be powered by a single PMIC chip 121, namely the PMIC 5100 chip, which simplifies the layout design of the power supply module 10, reduces the space occupied by the power supply module 10, and thus reduces the cost of the power supply module 10.

[0053] Please refer to the following: Figures 4 to 9 , Figure 4 for Figure 2 The diagram shown illustrates the structure of the power supply module, which includes a conversion unit comprising three power conversion chips. Figure 5 for Figure 2 The diagram shown illustrates another structural design of the power supply module, where the conversion unit includes three power conversion chips. Figure 6 for Figure 2 The diagram shown illustrates the structure of the power supply module, where the conversion unit includes four power conversion chips. Figure 7 for Figure 2 The diagram shown illustrates another structural design of the power supply module, where the conversion unit includes four power conversion chips. Figure 8 for Figure 2 The diagram shown illustrates the structure of the power supply module, where the conversion unit includes two power conversion chips. Figure 9 for Figure 2The diagram shows another structural schematic of the power supply module, in which the conversion unit includes two power conversion chips. In some embodiments, the conversion unit 12 includes at least two power conversion chips 122, each power conversion chip 122 being connected to the input terminal 11, and the at least two power conversion chips 122 generating at least three output voltages based on the input voltage.

[0054] The conversion unit 12 includes at least two power conversion chips 122, one end of each power conversion chip 122 is connected to the input terminal 11, and the other end of each power conversion chip 122 is connected to the output terminal 13. Based on the input voltage input from the input terminal 11, the power conversion chip 122 converts the input voltage to generate a corresponding output voltage, and outputs the output voltage through the corresponding output terminal 13.

[0055] like Figure 4 As shown, in some embodiments, the conversion unit 12 includes three power conversion chips 122, each power conversion chip 122 generating a corresponding output voltage. The output voltages of the three power conversion chips 122 are a first voltage, a second voltage, and a third voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

[0056] The conversion unit 12 includes three power conversion chips 122, and correspondingly, the power supply module 10 includes three output terminals 13. Each power conversion chip 122 is connected to one output terminal 13, and the three power conversion chips 122 generate three different output voltages based on the input voltage, so that the three output terminals 13 output three different output voltages.

[0057] In some embodiments, the first voltage is 1.05V, the second voltage is 0.50V, and the third voltage is 1.80V. The output voltages generated by the three power conversion chips 122 are 1.05V, 0.50V, and 1.80V, respectively.

[0058] like Figure 5 As shown, in some embodiments, the conversion unit 12 includes three power conversion chips 122. One of the power conversion chips 122 outputs two different output voltages, while the other two power conversion chips 122 each generate a corresponding output voltage. That is, the three power conversion chips 122 collectively generate four different output voltages. The output voltages of the three power conversion chips 122 are a first voltage, a second voltage, a third voltage, and a fourth voltage. Specifically, the first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, the third voltage is greater than or equal to 1.50V, and the fourth voltage is greater than or equal to 0.70V.

[0059] The conversion unit 12 includes three power conversion chips 122, and the power supply module 10 includes four output terminals 13. Two power conversion chips 122, each outputting a different output voltage, are connected to two output terminals 13, each generating a corresponding output voltage. The three power conversion chips 122 generate four different output voltages based on the input voltage, so that the four output terminals 13 output four different output voltages.

[0060] In some embodiments, the fourth voltage is any value from 0.70V to 1.0V, such as 0.70V, 0.75V, 0.80V, 0.85V, 0.90V, 0.95V, or 1.0V.

[0061] In some embodiments, the first voltage is 1.05V, the second voltage is 0.50V, the third voltage is 1.80V, and the fourth voltage is 0.90V. The output voltages generated by the three power conversion chips 122 are 1.05V, 0.50V, 1.80V, and 0.90V, respectively.

[0062] like Figure 6 As shown, in some embodiments, the conversion unit 12 includes four power conversion chips 122, each power conversion chip 122 generating a corresponding output voltage. The output voltages of the four power conversion chips 122 are a first voltage, a second voltage, a third voltage, and a fourth voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, the third voltage is greater than or equal to 1.50V, and the fourth voltage is greater than or equal to 0.70V.

[0063] The conversion unit 12 includes four power conversion chips 122, and correspondingly, the power supply module 10 includes four output terminals 13. Each power conversion chip 122 is connected to a corresponding output terminal 13, and the four power conversion chips 122 generate four different output voltages based on the input voltage, so that the four output terminals 13 output four different output voltages.

[0064] In some embodiments, the first voltage is 1.05V, the second voltage is 0.50V, the third voltage is 1.80V, and the fourth voltage is 0.90V. The output voltages generated by the four power conversion chips 122 are 1.05V, 0.50V, 1.80V, and 0.90V, respectively.

[0065] In some embodiments, the four power conversion chips 122 can generate two different output voltages and two identical output voltages based on the input voltage. The two identical output voltages and the two different output voltages are all different; that is, the four power conversion chips 122 collectively generate three different output voltages. The output voltages generated by the four power conversion chips 122 can be a first voltage, a second voltage, a third voltage, or any one of the first voltage, second voltage, and third voltage. For example, the four power conversion chips 122 can generate the first voltage, the first voltage, the second voltage, and the third voltage, or the first voltage, the second voltage, the second voltage, and the third voltage, or the first voltage, the second voltage, the third voltage, and the third voltage; no limitation is made here.

[0066] like Figure 7 As shown, in some embodiments, the conversion unit 12 includes four power conversion chips 122. Two of the four power conversion chips 122 jointly generate one output voltage, while the other two power conversion chips 122 each generate a corresponding output voltage. That is, the four power conversion chips 122 jointly generate three different output voltages. The output voltages of the four power conversion chips 122 are a first voltage, a second voltage, and a third voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

[0067] The conversion unit 12 includes four power conversion chips 122, and the power supply module 10 includes three output terminals 13. Two power conversion chips 122 that generate a common output voltage are connected to the same output terminal 13, and two power conversion chips 122 that generate a corresponding output voltage are each connected to a separate output terminal 13. The four power conversion chips 122 generate three different output voltages based on the input voltage, so that the three output terminals 13 output three different output voltages.

[0068] In some embodiments, the first voltage is 1.05V, the second voltage is 0.50V, and the third voltage is 1.80V. The output voltages generated by the four power conversion chips 122 are 1.05V, 0.50V, and 1.80V, respectively.

[0069] like Figure 8 and Figure 9 As shown, in some embodiments, the conversion unit 12 includes two power conversion chips 122, at least one of which generates two output voltages.

[0070] like Figure 8As shown, in some embodiments, one of the two power conversion chips 122 generates two different output voltages, while the other power conversion chip 122 generates one output voltage; that is, the two power conversion chips 122 together generate three different output voltages. The output voltages of the two power conversion chips 122 are a first voltage, a second voltage, and a third voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

[0071] The conversion unit 12 includes two power conversion chips 122, and the power supply module 10 includes three output terminals 13. Power conversion chips 122 that generate two different output voltages are connected to the two output terminals 13, and power conversion chips 122 that generate one output voltage are connected to the one output terminal 13. The two power conversion chips 122 generate three different output voltages based on the output voltage conversion, so that the three output terminals 13 output three different output voltages.

[0072] In some embodiments, the first voltage is 1.05V, the second voltage is 0.50V, and the third voltage is 1.80V. The output voltages generated by the two power conversion chips 122 are 1.05V, 0.50V, and 1.80V, respectively.

[0073] like Figure 9 As shown, in some embodiments, both power conversion chips 122 generate two output voltages; one power conversion chip 122 generates two different output voltages; and the other power conversion chip 122 generates two identical output voltages. That is, the two power conversion chips 122 jointly generate three different output voltages. The output voltages of the two power conversion chips 122 are a first voltage, a second voltage, a third voltage, or any one of the first, second, and third voltages. Specifically, the first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

[0074] The conversion unit 12 includes two power conversion chips 122, and the power supply module 10 includes four output terminals 13. Each power conversion chip 122 is connected to two output terminals 13 respectively. The output voltages generated by the two power conversion chips 122 are a first voltage, a first voltage, a second voltage, and a third voltage, or a first voltage, a second voltage, a second voltage, and a third voltage, or a first voltage, a second voltage, a third voltage, and a third voltage, which are not limited here.

[0075] In some embodiments, the first voltage is 1.05V, the second voltage is 0.50V, and the third voltage is 1.80V.

[0076] In some embodiments, both power conversion chips 122 generate two output voltages, with each power conversion chip 122 generating two different output voltages, meaning the two power conversion chips 122 collectively generate four different output voltages. The output voltages of the two power conversion chips 122 are a first voltage, a second voltage, a third voltage, and a fourth voltage. Specifically, the first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, the third voltage is greater than or equal to 1.50V, and the fourth voltage is greater than or equal to 0.70V.

[0077] The conversion unit 12 includes two power conversion chips 122, and the power supply module 10 includes four output terminals 13. Each power conversion chip 122 is connected to two output terminals 13 respectively. The two power conversion chips 122 generate four different output voltages based on the output voltage conversion, so that the four output terminals 13 output four different output voltages.

[0078] In some embodiments, the first voltage is 1.05V, the second voltage is 0.50V, the third voltage is 1.80V, and the fourth voltage is 0.90V. The output voltages generated by the two power conversion chips 122 are 1.05V, 0.50V, 1.80V, and 0.90V, respectively.

[0079] In some embodiments, the conversion unit 12 may include five power conversion chips 122, and correspondingly, the power supply module 10 may include five output terminals 13. Each power conversion chip 122 generates a corresponding output voltage based on the input voltage, and each power conversion chip 122 is connected to a corresponding output terminal 13. Two of the five power conversion chips 122 generate two identical output voltages, and the remaining three power conversion chips 122 generate three different output voltages. The two identical output voltages and any one of the three different output voltages are different; that is, the five power conversion chips 122 collectively generate four different output voltages. The output voltages generated by the five power conversion chips 122 based on the input voltage are a first voltage, a second voltage, a third voltage, a fourth voltage, and any one of the first voltage, second voltage, third voltage, and fourth voltage. For example, the output voltages generated by the five power conversion chips 1153 can be a first voltage, a second voltage, a third voltage, and a fourth voltage; or they can be the same voltage as above, without limitation. Specifically, the first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, the third voltage is greater than or equal to 1.50V, and the fourth voltage is greater than or equal to 0.70V.

[0080] In some embodiments, the conversion unit 12 may include five power conversion chips 122, with at least two of the five power conversion chips 122 jointly generating an output voltage. For example, two of the five power conversion chips 122 jointly generate an output voltage, while the remaining three power conversion chips 122 each generate a corresponding output voltage, meaning the five power conversion chips 122 jointly generate four different output voltages; the output voltages of the five power conversion chips 122 are a first voltage, a second voltage, a third voltage, and a fourth voltage, respectively. As another example, four of the five power conversion chips 122 jointly generate an output voltage in pairs, while the remaining power conversion chip 122 generates a corresponding output voltage, meaning the five power conversion chips 122 jointly generate three different output voltages; the output voltages of the five power conversion chips 122 are a first voltage, a second voltage, and a third voltage, respectively. For example, three of the five power conversion chips 122 generate a single output voltage, while the remaining two generate their own corresponding output voltages. In other words, the five power conversion chips 122 collectively generate three different output voltages: a first voltage, a second voltage, and a third voltage. Specifically, the first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, the third voltage is greater than or equal to 1.50V, and the fourth voltage is greater than or equal to 0.70V.

[0081] In some embodiments, the power conversion chip 122 includes a DC-DC conversion chip.

[0082] Each power conversion chip 122 includes a DC-DC converter chip.

[0083] The conversion unit 12 is powered by at least two power conversion chips 122. It can adapt the output capability of the power conversion chips 122 according to the actual situation, so as to adjust the number of power conversion chips 122, flexibly meet the diverse power supply needs, improve the scenario adaptability of the power supply module 10, and make the power supply module 10 have high compatibility, thereby realizing the diversified design of the low-power compression additional memory module 1.

[0084] Please refer to the following: Figures 4 to 9 In some embodiments, the conversion unit 12 further includes a logic control unit 123, and each power conversion chip 122 is connected to the logic control unit 123 to determine the power-on and power-off sequence of the corresponding output voltage based on the logic control signal output by the logic control unit 123.

[0085] The conversion unit 12 also includes a logic control unit 123. One end of each power conversion chip 122 connected to the input terminal 11 is also used to connect to the logic control unit 123. The logic control unit 123 outputs logic control signals to each power conversion chip 122, and each power conversion chip 122 determines the power-on and power-off sequence of the corresponding output voltage based on the logic control signals.

[0086] The conversion unit 12 also includes a control logic control unit 123 for power-on and power-off timing. It is powered by discrete power supply and logic control, and can precisely control the power-on and power-off timing of multiple power conversion chips 122 to ensure the normal operation of each power conversion chip 122 and the stability of the power supply module 10.

[0087] The power supply module 10 can provide output voltage independently through the PMIC chip 121, or it can provide output voltage jointly through multiple power conversion chips 122. The multiple power supply forms provide output voltage to the memory chip 30, so that it can be finely configured according to actual needs and scenarios, thereby realizing the diversified design of the low-power compression additional memory module 1.

[0088] Please refer to Figure 1 This application also provides a low-power compressed additional memory module 1. The low-power compressed additional memory module 1 includes a circuit board 20, at least one memory chip 30, and a power supply module 10 as described in any of the above embodiments. The power supply module 10 is disposed on the circuit board 20 and connected to the memory chip 30 to provide at least three output voltages to the memory chip 30.

[0089] The low-power compression additional memory module 1 includes a power supply module 10, a circuit board 20, and at least one memory chip 30. Both the power supply module 10 and the at least one memory chip 30 are mounted on the circuit board 20. The power supply module 10 is connected to the memory chip 30 to provide at least three output voltages to the memory chip 30. Each output terminal 13 of the power supply module 10 is connected to each memory chip 30.

[0090] In some embodiments, the circuit board 20 includes a rectangular region 21 and a trapezoidal region 22 connected to each other, the trapezoidal region 22 being an isosceles trapezoid. The longer base of the trapezoidal region 22 is connected to a longer side of the rectangular region 21. The circuit board 20 has a symmetrical structure with an axis of symmetry, and the axis of symmetry of the circuit board 20 coincides with the axis of symmetry of the trapezoidal region 22.

[0091] In some embodiments, the circuit board 20 has dimensions of 78mm * 34mm * 1.2mm. The rectangular region 21 has dimensions of 78mm * 23mm. That is, the longer side of the rectangular region 21 is 78mm, the shorter side is 23mm, and the height of the trapezoidal region 22 is 11mm. The thickness of the circuit board 20 is 1.2mm.

[0092] In some embodiments, the rectangular region 21 contains four memory regions (not shown), which are arranged sequentially at intervals along the length of the circuit board 20 and symmetrically arranged on both sides of the axis of symmetry of the circuit board 20. The length of the circuit board 20 is the direction of the long side of the rectangular region 21. At least one memory chip 30 is disposed in the four memory regions.

[0093] The low-power compression additional memory module 1 may include one memory chip 30, which can be located in any one of the four memory regions; the low-power compression additional memory module 1 may include two memory chips 30, which can be located in any two of the four memory regions; the low-power compression additional memory module 1 may include three memory chips 30, which can be located in any three of the four memory regions; the low-power compression additional memory module 1 may include four memory chips 30, which are located one-to-one in the four memory regions.

[0094] In some embodiments, the power supply module 10 is disposed in the trapezoidal region 22 and connected to each memory chip 30. The power supply module 10 provides at least three output voltages to each memory chip 30. When the power supply module 10 provides three output voltages to each memory chip 30, the three output voltages are all different. When the power supply module 10 provides four output voltages to each memory chip 30, the four output voltages are all different; or, of the four output voltages, three output voltages are all different, and the remaining output voltage is the same as one of the three output voltages, that is, the power supply module 10 provides three different output voltages to each memory chip 30.

[0095] In some embodiments, the memory chip 30 is a Low Power Double Data Rate (LPDDR) fifth-generation chip, including LPDDR5 and LPDDR5X chips. That is, the low-power compression attached memory module 1 can be an LPDDR5 CAMM2 (LPDDR5 Compression Attached Memory Module 2) module or an LPDDR5X CAMM2 (LPDDR5X Compression Attached Memory Module 2) module.

[0096] The low-power compressed additional memory module 1 can adjust the style of the power supply module 10 according to the number of memory chips 30. The diversity of the power supply module 10 can flexibly adapt to diverse power supply requirements, thereby realizing the diversified design of the low-power compressed additional memory module 1. At the same time, the memory capacity of the low-power compressed additional memory module 1 can be varied from 16GB to 128GB by changing the number of memory chips 30, thereby meeting different user needs.

[0097] Please refer to Figure 10 , Figure 10 This is an exploded view of the motherboard device provided in an embodiment of this application. This application also provides a motherboard device 9. The motherboard device 9 includes a motherboard 2, a connector 3, and a low-power compressed additional memory module 1 as described in any of the above embodiments. The low-power compressed additional memory module 1 is connected and installed on the motherboard 2 via the connector 3 to form the motherboard device 9.

[0098] One side of connector 3 is connected to the side of circuit board 20 away from memory chip 30, and the other side of connector 3 is connected to motherboard 2. The low-power compressed additional memory module 1 is electrically connected to motherboard 2 through connector 3.

[0099] The power supply module 10 features a versatile design, allowing for customization to meet specific needs and scenarios, thus enabling the motherboard component 9 to satisfy the diverse requirements of mobile devices. Furthermore, when the motherboard component 9 is used in portable electronic devices such as laptops, users can easily expand memory capacity by simply replacing the low-power compressed additional memory module 1, without needing to replace the entire motherboard component 9, greatly improving the maintainability and flexibility of portable electronic devices.

[0100] In some embodiments, the functions or modules of the apparatus provided in this application can be used to perform the methods described in the above method embodiments. The specific implementation can be referred to the description of the above method embodiments, and for the sake of brevity, it will not be repeated here.

[0101] The description of the various embodiments above tends to emphasize the differences between the various embodiments. The similarities or similarities between them can be referred to, and for the sake of brevity, they will not be repeated here.

[0102] In the several embodiments provided in this application, it should be understood that the disclosed methods and apparatus can be implemented in other ways. For example, the apparatus implementations described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms.

[0103] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0104] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods of various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A power supply module, applied to a low-power compressed additional memory module to supply power to the memory chips of the low-power compressed additional memory module, characterized in that, include: The input terminal is configured to receive input voltage; A conversion unit, connected to the input terminal, is configured to generate multiple different output voltages based on the input voltage; At least three output terminals are connected to the conversion unit, and the at least three output terminals are configured to output at least three different output voltages.

2. The power supply module according to claim 1, characterized in that, The conversion unit includes a power management integrated circuit (PMIC) chip, which has three voltage output terminals and is configured to output three different output voltages.

3. The power supply module according to claim 2, characterized in that, The PMIC chip outputs three voltage output terminals, namely a first voltage, a second voltage, and a third voltage, wherein the first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

4. The power supply module according to claim 1, characterized in that, The conversion unit includes at least two power conversion chips, each of which is connected to the input terminal. The at least two power conversion chips generate at least three output voltages based on the input voltage.

5. The power supply module according to claim 4, characterized in that, The conversion unit includes three power conversion chips, each generating a corresponding output voltage. The output voltages of the three power conversion chips are a first voltage, a second voltage, and a third voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V; or The conversion unit includes three power conversion chips. One of the three power conversion chips generates two output voltages, and the other two power conversion chips each generate a corresponding output voltage. The output voltages of the three power conversion chips are a first voltage, a second voltage, a third voltage, and a fourth voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, the third voltage is greater than or equal to 1.50V, and the fourth voltage is greater than or equal to 0.70V.

6. The power supply module according to claim 4, characterized in that, The conversion unit includes four power conversion chips, each generating a corresponding output voltage. The output voltages of the four power conversion chips are a first voltage, a second voltage, a third voltage, and a fourth voltage, wherein the first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, the third voltage is greater than or equal to 1.50V, and the fourth voltage is greater than or equal to 0.70V; or The conversion unit includes four power conversion chips. Two of the four power conversion chips jointly generate an output voltage, and the other two power conversion chips each generate a corresponding output voltage. The output voltages of the four power conversion chips are a first voltage, a second voltage, and a third voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V.

7. The power supply module according to claim 4, characterized in that, The conversion unit includes two power conversion chips, at least one of which generates two output voltages.

8. The power supply module according to claim 7, characterized in that, One of the two power conversion chips generates two different output voltages, and the other power conversion chip generates one output voltage. The output voltages of the two power conversion chips are a first voltage, a second voltage, and a third voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V; or Both power conversion chips generate two output voltages. One power conversion chip generates two different output voltages, while the other generates two identical output voltages. The output voltages of the two power conversion chips are a first voltage, a second voltage, a third voltage, or any one of the first, second, and third voltages. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, and the third voltage is greater than or equal to 1.50V; or The two power conversion chips each generate two output voltages, and each power conversion chip generates two different output voltages. The output voltages of the two power conversion chips are a first voltage, a second voltage, a third voltage, and a fourth voltage, respectively. The first voltage is greater than or equal to 0.80V, the second voltage is greater than or equal to 0.25V, the third voltage is greater than or equal to 1.50V, and the fourth voltage is greater than or equal to 0.70V.

9. The power supply module according to claim 4, characterized in that, The conversion unit further includes a logic control unit, and each power conversion chip is connected to the logic control unit to determine the power-on and power-off sequence of the corresponding output voltage based on the logic control signal output by the logic control unit.

10. The power supply module according to claim 4, characterized in that, The power conversion chip includes a DC-DC conversion chip.

11. A low-power compressed additional memory module, characterized in that, include: Circuit board; At least one memory chip is disposed on the circuit board; The power supply module as described in any one of claims 1-10 is disposed on the circuit board and connected to the memory chip to provide at least three output voltages to the memory chip.

12. A motherboard device, characterized in that, include: Motherboard; Connector; The low-power compressed additional memory module as described in claim 11 is connected and installed on the motherboard via the connector to form the motherboard device.

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