A clamped solid state transformer

Abstract

This application discloses a double-lobed solid-state transformer to solve the problem that existing solid-state transformers cannot simultaneously meet the requirements of heat dissipation and sealing performance. This application includes: a middle frame, a first heat dissipation shell, and a second heat dissipation shell; a first control circuit board and a second control circuit board are respectively disposed on both sides of the middle frame, and a first power board and a second power board are respectively disposed on the inner walls of the first and second heat dissipation shells; the overall structural design of this application is reasonable, adopting a three-body, two-lobed structure, which improves heat dissipation efficiency; it achieves modular design, keeping the cast shell and middle frame structure unchanged, and only replacing the PCB control board and the two power boards can cover different power levels, allowing for flexible model switching, convenient production, and easy application; simultaneously, the middle frame houses the low-heat-generating and shielded control circuit components, while the two side heat dissipation shells, as a double-lobed structure, house the power components, utilizing their walls for efficient heat dissipation.

Description

Technical Field

[0001] This application relates to the field of transformer technology, specifically to a double-lobe solid-state transformer. Background Technology

[0002] Transformers include iron-core transformers and solid-state transformers. Iron-core transformers generally consist only of an iron core and coils, and operate on the simple principle of electromagnetism and magnetism generating electricity.

[0003] Traditional solid-state transformers are power electronic transformers, typically employing rack-mount or enclosure-type structures. Solid-state transformers are transformer devices primarily composed of PCB circuit boards and electronic components. The power components generate significant heat during operation, requiring timely heat dissipation, with heat dissipation and waterproofing being particularly critical in variable outdoor environments. Traditional rack-mount or enclosure-type structures concentrate power devices, control boards, and other components within a single cavity, resulting in concentrated heat sources and low heat dissipation efficiency. Adding active cooling methods, such as aluminum heat sinks equipped with fans, necessitates openings in the enclosure, compromising waterproofing. Passive cooling, due to limited internal space, requires significantly larger heat sinks or plates to dissipate the same heat load, making it unsuitable. Utility Model Content

[0004] Therefore, this application provides a double-lobe solid-state transformer to solve the problem that existing solid-state transformers cannot simultaneously meet the requirements of heat dissipation performance and sealing performance.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] A double-lobe solid-state transformer includes: a middle frame and a first heat dissipation shell and a second heat dissipation shell disposed on both sides of the middle frame, wherein the first heat dissipation shell and the left side of the middle frame form a left half cavity, and the second heat dissipation shell and the right side of the middle frame form a right half cavity.

[0007] A first sealing ring is provided between the first heat dissipation shell and the left side of the middle frame, and a second sealing ring is provided between the second heat dissipation shell and the right side of the middle frame;

[0008] The left and right sides of the middle frame are respectively provided with a first control circuit board and a second control circuit board, and the inner walls of the first heat dissipation shell and the second heat dissipation shell are respectively provided with a first power board and a second power board. The first power board and the second power board are each equipped with multiple power components, and the multiple power components are respectively connected to the first control circuit board and the second control circuit board.

[0009] Optionally, the cross-section of the middle frame is an "I" shaped structure.

[0010] Optionally, both the first heat dissipation shell and the second heat dissipation shell have multiple heat dissipation ribs on their outer walls.

[0011] Optionally, a thin layer of thermally conductive silicone grease is applied between the left end face of the middle frame and the right end face of the first heat dissipation shell, and between the right end face of the middle frame and the left end face of the second heat dissipation shell.

[0012] Optionally, the first heat dissipation shell, the middle frame, and the second heat dissipation shell are connected sequentially at corresponding positions at the four corners by screws.

[0013] Optionally, the first control circuit board and the second control circuit board are respectively connected to the middle frame via studs.

[0014] Optionally, both the top surfaces of the first and second heat dissipation housings are provided with high-voltage terminals, which are used to connect to an external power grid or load.

[0015] Optionally, mounting feet are provided at the bottom of the middle frame, the first heat dissipation shell, and the second heat dissipation shell.

[0016] Optionally, a side pull ring is provided on the top surface of the middle frame. The side pull ring includes a column and a ring. The column is threaded to the middle frame, and the ring is rotatably connected to the column through a connector.

[0017] Compared with the prior art, this application has at least the following beneficial effects:

[0018] 1. Based on further analysis and research of existing technical problems, this application provides a two-lobed solid-state transformer. The overall structure of this application is reasonably designed, adopting a three-body, two-lobed structure, dividing the solid-state transformer into three main parts: a central frame and two heat dissipation shells located on both sides. The three parts are independently formed and dissipate heat, and active heat dissipation is achieved through a larger outer surface, which improves heat dissipation efficiency and effectively solves the heat dissipation and sealing problems of traditional solid-state transformers. It is more suitable for complex environments and the equipment has higher reliability. It realizes modular design, keeping the cast shell and frame structure unchanged, and only replacing the PCB control board and two power boards can cover different power levels. The model switching is flexible, production is convenient, and application is convenient. At the same time, the control circuit part with low heat generation and shielding is arranged in the central frame, and the power part is arranged in the two-lobed shells, which utilize their walls for efficient heat dissipation.

[0019] 2. The outer walls of the first heat dissipation shell and the second heat dissipation shell of this application are provided with multiple heat dissipation ribs. The heat dissipation ribs can greatly increase the surface area in contact with the air, and quickly dissipate the heat generated by the power board and the control circuit board.

[0020] 3. The first heat dissipation shell, the first heat dissipation shell and the middle frame are provided with a first sealing ring and a second sealing ring to improve the sealing effect between the heat dissipation shell and the middle frame; a thin layer of thermally conductive silicone grease is also coated between the middle frame and the first heat dissipation shell and the second heat dissipation shell, which helps to improve the connection of the contact surface and can further improve the heat dissipation. Attached Figure Description

[0021] To more intuitively illustrate the prior art and this application, exemplary drawings are provided below. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing this application; for example, based on the technical concept disclosed in this application and the exemplary drawings, those skilled in the art are able to easily make conventional adjustments or further optimizations to the addition / reduction / classification, specific shapes, positional relationships, connection methods, size ratios, etc. of certain units (components).

[0022] Figure 1 A schematic diagram of the structure of a double-lobe solid-state transformer provided in one embodiment of this application. Figure 1 ;

[0023] Figure 2 A schematic diagram of the structure of a double-lobe solid-state transformer provided in one embodiment of this application. Figure 2 ;

[0024] Figure 3 for Figure 1 The sectional view shown;

[0025] Figure 4 for Figure 1 Exploded view of the first heat dissipation shell, the second heat dissipation shell, and the middle frame. Figure 1 ;

[0026] Figure 5 for Figure 1 Exploded view of the first heat dissipation shell, the second heat dissipation shell, and the middle frame. Figure 2 ;

[0027] Figure 6 for Figure 4 The sectional view shown;

[0028] Figure 7 for Figure 1 A partial schematic diagram showing a side-pull lifting ring installed on the top surface of a solid-state transformer.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Mid-frame; 2. First heat dissipation shell; 3. Second heat dissipation shell; 4. First control circuit board; 5. Second control circuit board; 6. First power board; 7. Second power board; 8. Mounting foot; 9. High voltage terminal; 10. Heat dissipation fin; 11. First sealing ring; 12. Second sealing ring; 13. Side pull ring; 131. Ring body; 132. Column body; 133. Connector. Detailed Implementation

[0031] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] In the description of this application: unless otherwise stated, "a plurality of" means two or more. The terms "first," "second," "third," etc., in this application are intended to distinguish the objects referred to and do not have any special meaning in terms of technical connotation (e.g., they should not be construed as an emphasis on importance or order). Expressions such as "comprising," "including," and "having" also mean "not limited to" (certain units, components, materials, steps, etc.).

[0033] The terms used in this application, such as "upper," "lower," "left," "right," and "middle," are generally used to indicate the general relative positional relationship for the purpose of intuitive understanding by referring to the accompanying drawings, and are not absolute limitations on the positional relationship in the actual product.

[0034] One embodiment of this application, such as Figures 1-6 As shown, a double-lobe solid-state transformer includes: a middle frame 1 and a first heat dissipation shell 2 and a second heat dissipation shell 3 disposed on both sides of the middle frame 1, wherein the first heat dissipation shell 2 and the left side of the middle frame 1 form a left half cavity, and the second heat dissipation shell 3 and the right side of the middle frame 1 form a right half cavity.

[0035] A first sealing ring 11 is provided between the first heat dissipation shell 2 and the left side of the middle frame 1, and a second sealing ring 12 is provided between the second heat dissipation shell 3 and the right side of the middle frame 1.

[0036] The left and right sides of the middle frame 1 are respectively provided with a first control circuit board 4 and a second control circuit board 5, and the inner walls of the first heat dissipation shell 2 and the second heat dissipation shell 3 are respectively provided with a first power board 6 and a second power board 7. The first power board 6 and the second power board 7 are each equipped with multiple power components, and the multiple power components can be connected to the first control circuit board 4 and the second control circuit board 5 respectively through signal lines.

[0037] Preferably, the cross-section of the middle frame 1 is an "I" shaped structure, the first control circuit board 4 is located in the left half cavity and is disposed on the left side of the middle frame 1, and the second control circuit board 5 is located in the right half cavity and is disposed on the right side of the middle frame 1; the top surfaces of the first heat dissipation shell 2 and the second heat dissipation shell 3 are respectively provided with high voltage terminals 9 for connecting to the external power grid or load.

[0038] Preferably, the outer walls of the first heat dissipation shell 2 and the second heat dissipation shell 3 are provided with multiple heat dissipation ribs 10. The heat dissipation ribs 10 can greatly increase the surface area in contact with the air, and quickly dissipate the heat generated by the power board and the control circuit board.

[0039] More preferably, the end faces of the first heat dissipation shell 2 and the middle frame 1 are all provided with corresponding mounting grooves for correspondingly installing the first sealing ring 11 and the second sealing ring 12. The setting of the sealing rings improves the sealing effect between the heat dissipation shell and the middle frame 1.

[0040] More preferably, a thin layer of thermally conductive silicone grease is applied between the left end face of the middle frame 1 and the right end face of the first heat dissipation shell 2, and between the right end face of the middle frame 1 and the left end face of the second heat dissipation shell 3. The application of the thermally conductive silicone grease helps to improve the connection of the contact surfaces and also enables effective heat dissipation.

[0041] Preferably, the first heat dissipation shell 2, the middle frame 1, and the second heat dissipation shell 3 are connected sequentially at corresponding positions on the four corners by screws.

[0042] Preferably, the first control circuit board 4 and the second control circuit board 5 are connected to the middle frame 1 by studs to fix the control circuit boards.

[0043] The bottom of the aforementioned solid-state transformer, namely the bottom of the first heat dissipation shell 2 and the second heat dissipation shell 3, is provided with mounting feet 8 for mounting the solid-state transformer.

[0044] In addition, such as Figure 7 As shown, a side-pull lifting ring 13 is provided on the top of the solid-state transformer. Specifically, the side-pull lifting ring 13 is located on the top surface of the middle frame 1. The side-pull lifting ring 13 includes a ring body 131 and a column body 132. The column body 132 is threadedly connected to the middle frame 1, and the ring body 131 and the column body 132 are rotatably connected via a connector 133. During lifting, the ring body 131 of the side-pull lifting ring 13 is in an upward-standing state; in the non-lifting state, the ring body 131 is in a horizontal or downward-hanging state to ensure electrical safety.

[0045] This application adopts a three-body, two-lobed structure, dividing the solid-state transformer into three main parts: a central frame 1 and two separate heat dissipation shells 2 and 3 on either side. These three parts are independently formed and dissipate heat, actively dissipating heat through a larger outer surface. The integral and continuous nature of the cast shell enhances its sealing and waterproofing capabilities in complex operating environments, ensuring high reliability of the equipment. It achieves modular design, maintaining the structure of the cast shell and the central frame 1 unchanged, and only replacing the PCB control boards (first control circuit board 4 and second control circuit board 5) and two power boards to cover different power levels. This allows for flexible model switching, convenient production, and easy application. Meanwhile, the central frame 1 houses the low-heat control circuitry that requires shielding, while the two side heat dissipation shells, as a pair of lobes, house the power components and utilize their walls for efficient heat dissipation.

[0046] The technical features of the above embodiments can be combined in any way (as long as there is no contradiction in the combination of these technical features). For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described; these embodiments not explicitly written should also be considered to be within the scope of this specification.

Claims

1. A pair-shaped solid-state transformer, characterized in that, include: The middle frame and a first heat dissipation shell and a second heat dissipation shell are disposed on both sides of the middle frame, and the first heat dissipation shell and the left side of the middle frame form a left half cavity, and the second heat dissipation shell and the right side of the middle frame form a right half cavity; A first sealing ring is provided between the first heat dissipation shell and the left side of the middle frame, and a second sealing ring is provided between the second heat dissipation shell and the right side of the middle frame; The left and right sides of the middle frame are respectively provided with a first control circuit board and a second control circuit board, and the inner walls of the first heat dissipation shell and the second heat dissipation shell are respectively provided with a first power board and a second power board. The first power board and the second power board are each equipped with multiple power components, and the multiple power components are respectively connected to the first control circuit board and the second control circuit board.

2. The double-lobe solid-state transformer according to claim 1, characterized in that, The cross-section of the middle frame is an "I" shaped structure.

3. The double-lobe solid-state transformer according to claim 1, characterized in that, Both the first heat dissipation shell and the second heat dissipation shell have multiple heat dissipation ribs on their outer walls.

4. The double-lobe solid-state transformer according to claim 1 or 3, characterized in that, A thin layer of thermally conductive silicone grease is applied between the left end face of the middle frame and the right end face of the first heat dissipation shell, and between the right end face of the middle frame and the left end face of the second heat dissipation shell.

5. The double-lobe solid-state transformer according to claim 1, characterized in that, The first heat dissipation shell, the middle frame, and the second heat dissipation shell are connected sequentially at corresponding positions on the four corners by screws.

6. The double-lobe solid-state transformer according to claim 1, characterized in that, The first control circuit board and the second control circuit board are respectively connected to the middle frame by studs.

7. The double-lobe solid-state transformer according to claim 1, characterized in that, Both the top surfaces of the first and second heat dissipation shells are provided with high-voltage terminals, which are used to connect to an external power grid or load.

8. The double-lobe solid-state transformer according to claim 1, characterized in that, The bottom of the middle frame, the first heat dissipation shell, and the second heat dissipation shell are provided with mounting feet.

9. The double-lobe solid-state transformer according to claim 1 or 8, characterized in that, The top surface of the middle frame is provided with a side pull ring, which includes a column and a ring. The column is threaded to the middle frame, and the ring is rotatably connected to the column through a connector.

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