An isolated shared-housing metallized film capacitor

Abstract

This utility model discloses an isolated shared-shell metallized thin-film capacitor, including a heat dissipation structure. The heat dissipation structure includes a cover disposed outside the shell, a fan rotatably disposed inside the cover, and a heat dissipation channel communicating with a first accommodating cavity and a second accommodating cavity inside the bottom of the encapsulation shell. The heat dissipation channel communicates with the interior of the cover, and the cover is also provided with heat dissipation holes for gas exhaust. This utility model, through the heat dissipation channel, cover, and fan, promotes airflow when the fan rotates, thereby drawing heat out of the first and second accommodating cavities and dissipating it through the heat dissipation holes. Heat inside the first or second encapsulation shell sequentially enters the heat dissipation channel and the cover, and is finally discharged to the outside through the heat dissipation holes on the cover, ensuring the capacitor's heat dissipation efficiency.

Description

Technical Field

[0001] This utility model belongs to the field of metallized film capacitor technology, and particularly relates to an isolated shared-shell metallized film capacitor. Background Technology

[0002] Capacitors are commonly used in many products and applications, including filtering, energy storage, absorption circuits, and electrical safety. However, when installing and using these capacitors, it is sometimes necessary to consider the spatial layout of different capacitors used on the same product.

[0003] The prior art patent application document CN218456030U discloses an isolated shared shell metallized film capacitor, which encapsulates two independent capacitors in two different capacitor package cavities. The capacitor leads of the two independent capacitors are led out from the corresponding package shell openings, which greatly reduces the risk of different capacitors being installed and used safely in the limited space of the same product.

[0004] In the aforementioned prior art, when the capacitor is installed in the cavity, its outer wall is in close contact with the inner wall of the cavity, which is not conducive to heat dissipation. If the heat generated by the capacitor during operation cannot be dissipated in time, it may lead to excessive temperature, thereby affecting the working efficiency of the capacitor and even shortening its service life. Utility Model Content

[0005] This utility model addresses the problems in the prior art by proposing the following technical solution:

[0006] This utility model provides an isolated shared-shell metallized thin-film capacitor, comprising:

[0007] The bottom of the packaging shell has a shell body extending from both sides to form a first packaging shell and a second packaging shell facing away from each other. The first packaging shell and the second packaging shell respectively form a first receiving cavity and a second receiving cavity inside.

[0008] The heat dissipation structure includes a cover disposed outside the housing, a fan rotatably disposed inside the cover, a heat dissipation channel communicating with a first accommodating cavity and a second accommodating cavity inside the bottom of the encapsulation housing, the heat dissipation channel communicating with the inside of the cover, and heat dissipation holes for gas exhaust on the cover.

[0009] As a preferred embodiment of the above technical solution, the heat dissipation channel is provided with a plurality of first through holes that communicate with the first accommodating cavity and the second accommodating cavity, and the end of the heat dissipation channel near the cover is provided with a second through hole that communicates with the inside of the cover.

[0010] As a preferred embodiment of the above technical solution, a capacitor body is installed in both the first accommodating cavity and the second accommodating cavity, and a fixing ring is provided between the inner wall of the first accommodating cavity and the outer wall of the capacitor body.

[0011] As a preferred embodiment of the above technical solution, a dust filter is also embedded at the end of the first and second packaging shells away from the bottom of the packaging shell.

[0012] As a preferred embodiment of the above technical solution, the capacitor body includes terminals, which are led out from the end of the first and second encapsulation housings away from the bottom of the encapsulation housings.

[0013] The beneficial effects of this utility model are as follows:

[0014] By using the heat dissipation channels, the cover, and the fan, airflow is promoted when the fan rotates, thereby drawing out the heat from the first and second accommodating cavities and dissipating it through the heat dissipation holes. The heat inside the first or second encapsulation housing enters the heat dissipation channels and the cover in sequence, and is finally discharged to the outside through the heat dissipation holes on the cover, ensuring the heat dissipation efficiency of the capacitor. Attached Figure Description

[0015] Figure 1 The diagram shown is a front view of the capacitor in the embodiment.

[0016] Figure 2 What is shown is Figure 1 Enlarged schematic diagram of the structure at point A in the diagram;

[0017] Figure 3 The diagram shown is a side view of the capacitor body and the fixing ring in the embodiment;

[0018] Reference numerals: 1. Capacitor body; 2. Terminal; 10. Encapsulation shell bottom; 11. First encapsulation shell; 12. Second encapsulation shell; 13. First accommodating cavity; 14. Second accommodating cavity; 21. Cover; 22. Fan; 23. Heat dissipation channel; 24. First through hole; 25. Second through hole; 26. Heat dissipation hole; 30. Retaining ring; 40. Dust filter. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0020] Example

[0021] like Figure 1 , Figure 2 As shown, Figure 1 The diagram shown is a front view of the capacitor in the embodiment. Figure 2What is shown is Figure 1 Enlarged schematic diagram of the structure at point A in the diagram;

[0022] This device includes:

[0023] The bottom of the encapsulation shell 10 has shell bodies extending from both sides of the bottom of the encapsulation shell 10, forming a first encapsulation shell 11 and a second encapsulation shell 12 facing away from each other. The first encapsulation shell 11 and the second encapsulation shell 12 respectively form a first receiving cavity 13 and a second receiving cavity 14 inside.

[0024] The heat dissipation structure includes a cover 21 disposed outside the housing body, a fan 22 rotatably disposed inside the cover 21, a heat dissipation channel 23 disposed inside the bottom 10 of the encapsulation housing that communicates with the first accommodating cavity 13 and the second accommodating cavity 14, the heat dissipation channel 23 communicating with the inside of the cover 21, and a heat dissipation hole 26 for gas exhaust on the cover 21.

[0025] The first accommodating cavity 13 and the second accommodating cavity 14 are used to install the capacitor body 1;

[0026] Through the heat dissipation channel 23, the cover 21 and the fan 22, the airflow is promoted when the fan 22 rotates, so that the heat in the first accommodating cavity 13 and the second accommodating cavity 14 can be extracted and discharged through the heat dissipation hole 26. The heat inside the first encapsulation shell 11 or the second encapsulation shell 12 enters the heat dissipation channel 23 and the cover 21 in sequence, and is finally discharged to the outside through the heat dissipation hole 26 on the cover 21.

[0027] Specifically, the inside of the cover 21 forms a relatively closed cavity, which is only connected to the heat dissipation channel 23;

[0028] The heat dissipation channel 23 is provided with a number of first through holes 24 that communicate with the first accommodating cavity 13 and the second accommodating cavity 14. The end of the heat dissipation channel 23 near the cover 21 is provided with a second through hole 25 that communicates with the inside of the cover 21.

[0029] The first through hole 24 enables the heat dissipation channel 23 to connect with the first accommodating cavity 13 and the second accommodating cavity 14. Its function is to conduct the heat generated by the capacitor body 1 during operation from the first accommodating cavity 13 and the second accommodating cavity 14, so that the heat enters the heat dissipation channel 23. By setting multiple first through holes 24, the heat dissipated by the capacitor in the first accommodating cavity 13 and the second accommodating cavity 14 can be collected more evenly, thereby improving the heat dissipation efficiency.

[0030] By setting the second through hole 25, hot air in the heat dissipation channel 23 is introduced into the housing 21, and the fan 22 is used to accelerate the airflow circulation. Finally, the hot air is discharged to the external environment through the heat dissipation hole 26 on the housing 21.

[0031] Specifically, in the prior art, the fan 22 is usually driven by a micro motor to rotate, which will not be elaborated here.

[0032] like Figure 1 , Figure 3 As shown, Figure 1 The diagram shown is a front view of the capacitor in the embodiment. Figure 3 The diagram shown is a side view of the capacitor body and the fixing ring in the embodiment;

[0033] A fixing ring 30 is provided between the inner wall of the first accommodating cavity 13 and the second accommodating cavity 14 and the outer wall of the capacitor body 1.

[0034] The fixing ring 30 is fixedly connected to the capacitor body 1, and the fixing ring 30 is fixedly connected to the inner wall of the first accommodating cavity 13 or the second accommodating cavity 14.

[0035] The fixing ring 30 creates a gap between the outer wall of the capacitor body 1 and the inner wall of the cavity, which helps heat to enter the heat dissipation channel 23 from the surface of the capacitor body 1 and improves the overall heat dissipation efficiency; and the fixing ring 30 can provide additional physical support for the capacitor to ensure its stability in the cavity.

[0036] like Figure 1 As shown, Figure 1 The diagram shown is a front view of the capacitor in the embodiment.

[0037] Terminal 2 of capacitor body 1 is led out from the end of the first package housing 11 and the second package housing 12 away from the bottom of the package housing 10.

[0038] The above design helps to simplify the circuit connection process, making it easier to connect the capacitor body 1 to external circuits;

[0039] A dust filter 40 is also embedded at the end of the first encapsulation housing 11 and the second encapsulation housing 12 away from the bottom of the encapsulation housing 10.

[0040] The dust filter 40 ensures airflow inside the first and second encapsulation housings 11 and 12, and effectively protects internal components from external dust, ensuring heat dissipation while preventing contamination of internal components.

[0041] Working principle: Two independent capacitor bodies 1 are respectively installed in the first accommodating cavity 13 in the first encapsulation housing 11 and the second accommodating cavity 14 in the second encapsulation housing 12. The outer wall of each capacitor body 1 is separated from the inner wall of the corresponding accommodating cavity by a fixing ring 30. The terminals 2 of the capacitor body 1 are led out from the end of the first encapsulation housing 11 and the second encapsulation housing 12 away from the bottom 10 of the encapsulation housing, which facilitates the connection of external circuits.

[0042] When the capacitor body 1 generates heat during operation, the fan 22 operates. This heat enters the heat dissipation channel 23 through the first through hole 24. The hot air in the heat dissipation channel 23 enters the interior of the cover 21 through the second through hole 25, and is finally discharged to the external environment through the heat dissipation hole 26.

[0043] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. A metallized thin-film capacitor with an isolated shared housing, characterized in that, include: The bottom of the encapsulation shell (10) has a shell body extending from both sides to form a first encapsulation shell (11) and a second encapsulation shell (12) facing away from each other. The first encapsulation shell (11) and the second encapsulation shell (12) respectively form a first accommodating cavity (13) and a second accommodating cavity (14). The heat dissipation structure includes a cover (21) disposed outside the housing body, a fan (22) rotatably disposed inside the cover (21), a heat dissipation channel (23) disposed inside the bottom (10) of the encapsulation housing that communicates with the first accommodating cavity (13) and the second accommodating cavity (14), the heat dissipation channel (23) communicating with the inside of the cover (21), and the cover (21) is also provided with heat dissipation holes (26) for gas exhaust.

2. The isolated shared-casing metallized thin-film capacitor according to claim 1, characterized in that, The heat dissipation channel (23) is provided with a plurality of first through holes (24) that communicate with the first accommodating cavity (13) and the second accommodating cavity (14). The end of the heat dissipation channel (23) near the cover (21) is provided with a second through hole (25) that communicates with the inside of the cover (21).

3. The isolated shared-casing metallized thin-film capacitor according to claim 1, characterized in that, A capacitor body (1) is installed in both the first accommodating cavity (13) and the second accommodating cavity (14), and a fixing ring (30) is provided between the inner wall of the first accommodating cavity (13) and the outer wall of the capacitor body (1).

4. The isolated shared-casing metallized thin-film capacitor according to claim 1, characterized in that, A dust filter (40) is also embedded at the end of the first encapsulation shell (11) and the second encapsulation shell (12) away from the bottom (10) of the encapsulation shell.

5. A metallized thin-film capacitor with an isolated shared housing according to claim 3, characterized in that, The capacitor body (1) includes terminals (2) which are led out from one end of the first encapsulation housing (11) and the second encapsulation housing (12) away from the bottom (10) of the encapsulation housing.

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