A heat dissipation fixing structure for dual-mode ceramic dielectric and its filter

Abstract

This utility model discloses a heat dissipation and fixing structure for a dual-mode ceramic dielectric and its filter. The structure includes a metal cavity and a dual-mode ceramic dielectric module disposed within the cavity. The key feature is the inclusion of a heat dissipation clamp disposed outside the metal cavity, with a locking mechanism. This utility model integrates clamping and heat dissipation functions through the heat dissipation clamp, solving the problems of reliable locking after angle adjustment of the dual-mode ceramic dielectric module and heat dissipation during operation, significantly improving the performance stability and service life of the filter. This utility model has a simple structure, low cost, and is suitable for mass production.

Description

Technical Field

[0001] This utility model relates to the field of microwave communication device technology, and in particular to a heat dissipation fixing structure and filter of a dual-mode ceramic dielectric. Background Technology

[0002] Dual-mode ceramic filters utilize a single ceramic resonator to excite the coupling of two electromagnetic modes (such as TE mode and TM mode) to achieve filtering function. They have advantages such as small size, low cost, high Q value, and stable performance, and are widely used in wireless communication systems.

[0003] For example, Chinese patent CN112886162A discloses a small microwave dielectric dual-mode filter with an asymmetric zero point. It typically includes a metal cavity, a dual-mode ceramic dielectric module housed within the cavity, connectors, and sleeve pads. In practical applications of this type of filter, two key challenges to its performance and reliability have been identified: First, the angular position of the ceramic dielectric module within the cavity directly determines the frequency of the filter's transmission zero. Precise adjustment and reliable fixation are essential during assembly; any minute displacement can lead to performance degradation. Second, the filter generates heat during operation due to conductor and dielectric losses. If this heat accumulates and causes a temperature rise, it alters the dielectric constant of the ceramic material, leading to frequency drift, performance instability, and even shortened device lifespan.

[0004] Currently, traditional fixing methods often struggle to simultaneously meet the demands for precise angle adjustment, secure locking, and efficient heat dissipation. This is particularly problematic in compact filter designs where poor heat dissipation paths and the inherently poor thermal conductivity of ceramics exacerbate the issue.

[0005] Therefore, there is an urgent need for a new structure that can simultaneously solve the problems of angle fixation and heat dissipation of dual-mode ceramic dielectric modules. Utility Model Content

[0006] The technical problem to be solved by this utility model is: In view of the above-mentioned shortcomings of the prior art, a heat dissipation fixing structure for dual-mode ceramic dielectric is provided, which can easily adjust and reliably lock the angular position of the ceramic dielectric module, and at the same time effectively improve its heat dissipation conditions, thereby improving the performance stability and service life of the filter.

[0007] The technical solution adopted by this utility model to solve its technical problem is: to provide a heat dissipation fixing structure for a dual-mode ceramic medium, including a metal cavity and a dual-mode ceramic medium module disposed in the metal cavity. The key is that it also includes a heat dissipation clamp disposed outside the metal cavity. The heat dissipation clamp is provided with a locking mechanism. The dual-mode ceramic medium module is fixed in its angular position relative to the metal cavity by the clamping force of the locking mechanism of the heat dissipation clamp.

[0008] Furthermore, the heat dissipation clamp is an integrally formed metal component with a clamping arm and heat dissipation fins.

[0009] Furthermore, the locking mechanism is an adjusting bolt located at the top of the arm of the heat dissipation clamp.

[0010] Furthermore, the heat dissipation clamp is made of a thermally conductive metal material, such as aluminum alloy or copper alloy.

[0011] Furthermore, the mounting surface of the heat dissipation clamp that contacts the metal cavity is coated with a heat dissipation coating.

[0012] Furthermore, it also includes a connector that passes through the mounting hole of the heat dissipation clamp to connect the heat dissipation clamp in series, and then connects the dual-mode ceramic media modules in series, fixing the connected dual-mode ceramic media modules into an integrated module.

[0013] Furthermore, the connector is a long screw.

[0014] A dual-mode ceramic filter includes a heat dissipation fixing structure for the dual-mode ceramic dielectric.

[0015] Furthermore, it also includes a coupling plate disposed within the metal cavity and cooperating with the dual-mode ceramic dielectric module.

[0016] Furthermore, the dual-mode ceramic filter is a bandpass filter used in wireless communication devices.

[0017] The beneficial effects of this utility model are: Integrated fixing and heat dissipation functions: This utility model cleverly solves the two major problems of angle fixing and heat dissipation simultaneously through a metal component that integrates the functions of a clamp and a heat sink. The structure is compact and the design is ingenious.

[0018] Adjustable and Reliably Fixed Zero Point: By loosening and tightening the adjusting bolts on the heat dissipation clamp, the angle of the ceramic dielectric module can be easily fine-tuned, thereby accurately setting the filter's zero point position. After adjustment, tightening the bolts will securely lock the module angle with a strong clamping force, preventing displacement during use.

[0019] Excellent heat dissipation performance: The heat dissipation clamp is made of a high thermal conductivity metal and wraps around the outer wall of the cavity, providing a huge heat dissipation surface area and forming an efficient heat dissipation path from the dual-mode ceramic dielectric module, the metal cavity, the heat dissipation clamp, and the external environment. In addition, thermal radiation efficiency can be further enhanced by coating the contact surface with a heat dissipation coating, effectively reducing the filter's operating temperature, ensuring stable performance, and extending service life.

[0020] Simple structure and low cost: This structural component does not require complex processing technology and expensive materials, is simple to manufacture, is suitable for mass production, and helps to reduce costs. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of the heat dissipation clamp described in this utility model.

[0022] Figure 2 This is a schematic diagram of the dual-mode module structure after assembly according to this utility model.

[0023] Figure 3 This is a schematic diagram of the assembly of the heat dissipation clamp and the dual-mode ceramic dielectric module in this utility model.

[0024] Numbering on the map: 1. Metal cavity; 2. Dual-mode ceramic dielectric module; 3. Heat dissipation clamps; 4. Long screw; 5. Coupling plate. Detailed Implementation

[0025] The following embodiments are described to aid in understanding this application. These embodiments are not, and should not be, construed in any way as limiting the scope of protection of this application.

[0026] In the following description, those skilled in the art will recognize that throughout this discussion, components may be described as individual functional units (which may include subunits), but those skilled in the art will recognize that various components or portions thereof may be divided into individual components or may be integrated together (including integrated within a single system or component).

[0027] Furthermore, the connection between components or systems is not intended to be limited to a direct connection; on the contrary, data between these components may be modified, reformatted, or otherwise altered by intermediate components. Additionally, other or fewer connections may be used. It should also be noted that the terms "connection," "link," or "input" should be understood to include direct connections, indirect connections via one or more intermediate devices, and wireless connections.

[0028] The technical solution of this utility model will be described in detail below with reference to the accompanying drawings and four specific embodiments. It should be noted that the following embodiments are only used to more clearly illustrate the technical solution of this utility model, and should not be used to limit the protection scope of this utility model.

[0029] Example 1 like Figures 1 to 3 As shown, the present invention provides a dual-mode ceramic medium fixing and heat dissipation structure, which mainly includes a metal cavity 1, a dual-mode ceramic medium module 2, a heat dissipation clamp 3, and a long screw 4 as a connecting member.

[0030] The heat dissipation clamp 3 is preferably integrally formed from die-cast or milled aluminum alloy. Its structure includes two clamping arms and multiple heat dissipation fins extending from the outer side of the clamping arms, thus combining clamping and heat dissipation functions. At the top of each of the two clamping arms, a locking mechanism is provided; in this embodiment, this mechanism is an adjusting bolt (threaded holes are not shown in the figure, but are described in the text). Rotating this bolt adjusts the opening degree of the clamping arms, thereby changing the inner diameter of the clamp. The heat dissipation clamp 3 is made of a thermally conductive metal material, such as aluminum alloy or copper alloy. A heat dissipation coating (such as a ceramic coating) with high thermal conductivity and high radiation properties can be coated on the surface of the heat dissipation clamp 3 that contacts the outer wall of the metal cavity 1.

[0031] The dual-mode ceramic dielectric module 2 is placed inside the metal cavity 1. The heat dissipation clamp 3 is fitted onto the outside of the metal cavity 1.

[0032] It also includes a connector that passes through the mounting hole of the heat dissipation clamp 3 to connect the heat dissipation clamp in series, and then connects the dual-mode ceramic media module 2 in series, fixing the connected dual-mode ceramic media module 2 into an integrated module. The connector is a long screw 4.

[0033] During assembly, the long screw 4 is first passed through the mounting holes of the heat dissipation clamp 3 in sequence to achieve the "series connection" of the heat dissipation clamp 3, thereby achieving the "series connection" of the dual-mode ceramic medium module 2. Finally, the entire component is pressed and fixed together by the pressing force generated by tightening the nut.

[0034] During debugging, first slightly loosen the two adjusting bolts at the top of the heat dissipation clamp 3 arm to reduce the clamping force on the metal cavity 1. At this time, the operator can use a tool to slightly rotate the entire metal cavity 1 assembly with the clamp (or finely adjust the angle of the dual-mode ceramic dielectric module 2 by other means). This rotation will change the angle of the dual-mode ceramic dielectric module 2 inside the cavity, thereby changing its coupling relationship with the coupling plate 5, realizing the dynamic adjustment of the filter zero point position. Use a network analyzer to monitor the frequency response of the filter. When the zero point is adjusted to the optimal position, immediately tighten the adjusting bolts on the heat dissipation clamp 3. The strong clamping force generated by the bolts firmly clamps the heat dissipation clamp 3 onto the metal cavity 1, thereby completely locking the relative positions between all components and fixing the debugged zero point position.

[0035] During operation, the heat generated by the dual-mode ceramic dielectric module 2 is primarily conducted through the walls of the metal cavity 1 to the heat dissipation clamp 3, which is in close contact with it. Once the heat reaches the heat dissipation clamp 3, it dissipates into the air through convection and radiation via its large surface area (especially the heat dissipation fins). The applied heat dissipation coating further enhances the thermal radiation efficiency.

[0036] Example 2 A dual-mode ceramic filter includes a heat dissipation and fixing structure for the dual-mode ceramic dielectric, and a coupling piece 5 disposed in the metal cavity 1 and cooperating with the dual-mode ceramic dielectric module 2. The dual-mode ceramic filter is a bandpass filter for wireless communication devices.

[0037] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A heat dissipation and fixing structure for a dual-mode ceramic dielectric, comprising a metal cavity (1) and a dual-mode ceramic dielectric module (2) disposed within the metal cavity (1), characterized in that: It also includes a heat dissipation clamp (3) located outside the metal cavity (1). The heat dissipation clamp (3) is equipped with a locking mechanism. The dual-mode ceramic medium module (2) is fixed in angle position by the clamping force of the locking mechanism of the heat dissipation clamp (3).

2. The heat dissipation and fixing structure for a dual-mode ceramic dielectric as described in claim 1, characterized in that: The heat dissipation clamp (3) is an integrally formed metal component with a clamp arm and heat dissipation fins.

3. The heat dissipation and fixing structure for a dual-mode ceramic dielectric as described in claim 1, characterized in that: The locking mechanism is an adjusting bolt located at the top of the arm of the heat dissipation clamp (3).

4. The heat dissipation and fixing structure for a dual-mode ceramic dielectric as described in claim 1, characterized in that: The heat dissipation clamp (3) is made of thermally conductive metal material.

5. The heat dissipation and fixing structure for a dual-mode ceramic dielectric as described in claim 1, characterized in that: The mounting surface of the heat dissipation clamp (3) that contacts the metal cavity (1) is coated with a heat dissipation coating.

6. The heat dissipation and fixing structure for a dual-mode ceramic dielectric as described in claim 1, characterized in that: It also includes a connector, which passes through the mounting hole of the heat dissipation clamp (3) to connect the heat dissipation clamp (3) in series, and then connects the dual-mode ceramic media module (2) in series, fixing the connected dual-mode ceramic media module (2) into an integrated module.

7. The heat dissipation and fixing structure for a dual-mode ceramic dielectric as described in claim 6, characterized in that: The connector is a long screw.

8. A dual-mode ceramic filter, characterized in that: The heat dissipation fixing structure includes the dual-mode ceramic medium as described in any one of claims 1 to 7.

9. The dual-mode ceramic filter as described in claim 8, characterized in that: It also includes a coupling piece (5) disposed in the metal cavity (1) and cooperating with the dual-mode ceramic medium module (2).

10. The dual-mode ceramic filter as described in claim 8, characterized in that: The dual-mode ceramic filter is a bandpass filter used in wireless communication devices.

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