Electronic device

Abstract

This disclosure provides an electronic device, relating to the field of electronic device technology. The electronic device includes: a first antenna for supporting a first operating frequency band; a second antenna for supporting a second operating frequency band, the second operating frequency band being lower than the first operating frequency band, the radiating ports of the second antenna and the first antenna being positioned opposite each other; and a de-isolation structure electrically connected between the second antenna near the antenna end and the motherboard ground plane to improve the isolation between the first antenna and the second antenna. The electronic device provided by this disclosure can optimize the isolation between the two antennas by setting the de-isolation structure, and improve antenna performance while avoiding occupying a large amount of internal space of the electronic device.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] With the development of electronic device technology, the functions carried by electronic devices are constantly increasing, and their internal integration is also getting higher and higher. How to effectively improve the isolation between antennas within a limited space has become a technical problem that urgently needs to be solved.

[0003] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0004] To overcome the problems existing in the related technologies, this disclosure provides an electronic device.

[0005] According to a first aspect of the present disclosure, an electronic device is provided, comprising:

[0006] The first antenna is used to support the first operating frequency band;

[0007] A second antenna is used to support a second operating frequency band, which is lower than the first operating frequency band, and the radiation ports of the second antenna and the first antenna are arranged opposite to each other.

[0008] The isolation structure is electrically connected between the second antenna near the antenna end and the motherboard ground plane to improve the isolation between the first antenna and the second antenna.

[0009] The embodiments disclosed herein optimize the isolation between two antennas by setting a de-isolation structure, thereby improving antenna performance while avoiding occupying a large amount of internal space in the electronic device.

[0010] In some exemplary embodiments of this disclosure, the deisolation structure includes a first metal layer, a second metal layer, and a spring sheet structure stacked together;

[0011] The first metal layer and the second metal layer are electrically connected to the motherboard ground layer, and a gap is formed between the first metal layer and the second metal layer.

[0012] The spring-loaded structure is disposed on the side of the first metal layer away from the second metal layer, and the spring-loaded structure is electrically connected to the second antenna near the end of the antenna.

[0013] The embodiments disclosed herein can improve the isolation between two antennas based on a simple structure, avoiding the occupation of a large space inside the electronic device. Furthermore, this disclosure does not require physically increasing the spacing between the two antennas to achieve isolation optimization, further enabling antenna miniaturization. Moreover, this disclosure avoids the increased cost and antenna efficiency loss caused by using LC resonant circuits to improve isolation.

[0014] In some exemplary embodiments of this disclosure, the first metal layer and the second metal layer have capacitive properties.

[0015] This disclosure allows for optimization of antenna isolation by setting the capacitance property between the first and second metal layers. Furthermore, this disclosure allows for determining the frequency of de-isolation based on this capacitance value, thereby reducing mutual interference between the first and second antennas through the de-isolation structure.

[0016] In some exemplary embodiments of this disclosure, the first metal layer is electrically connected to the motherboard ground layer through a first matching circuit, the first matching circuit being used to adjust the second operating frequency band.

[0017] The embodiments disclosed herein can adjust the impedance of the second antenna based on the first matching circuit, thereby adjusting the second operating frequency band and improving antenna performance.

[0018] In some exemplary embodiments of this disclosure, the second metal layer is electrically connected to the motherboard ground layer via a microstrip line.

[0019] In some exemplary embodiments of this disclosure, at least one of a capacitor element and an inductor element is disposed on the microstrip line to adjust the capacitance value between the first metal layer and the second metal layer.

[0020] The embodiments disclosed herein can be grounded by setting a second metal sheet through an inductive element and / or a capacitive element, which enables the frequency adjustment of the isolation degree, improves the flexibility of the isolation degree, and thus further improves the antenna performance.

[0021] In some exemplary embodiments of this disclosure, the spring structure is electrically connected to the first metal layer via SMT (Surface Mount Technology).

[0022] Since the spring structure can be bent and stretched, the spring structure selected in this embodiment is suitable for modular design. By adjusting the degree of bending of the spring, electrical connections at different distances or angles can be achieved. Furthermore, using the spring structure to achieve the electrical connection between the second antenna and the first metal layer can reduce manufacturing complexity and space occupation while ensuring good electrical connection.

[0023] In some exemplary embodiments of this disclosure, the first metal layer is at least partially made of copper, and the second metal layer is at least partially made of copper.

[0024] In some exemplary embodiments of this disclosure, the first metal layer and / or the second metal layer are metal layers on the internal circuit board of the electronic device.

[0025] In this embodiment of the disclosure, at least one of the first metal layer and the second metal layer can be implemented based on the metal layer structure on the circuit board, thereby further reducing the cost of deploying the deisolation structure and reducing the space occupied inside the electronic device.

[0026] In some exemplary embodiments of this disclosure, the first metal layer and the second metal layer are two metal layers on the same circuit board;

[0027] Alternatively, the first metal layer and the second metal layer are metal layers on two different circuit boards, and the two circuit boards are stacked together.

[0028] The embodiments of this disclosure can achieve a deisolation structure through a copper layer on the internal circuit board of an electronic device. This structure is simple to implement, effectively reduces costs, and can further reduce the space occupied inside the electronic device. Furthermore, by selecting at least one metal layer on the circuit board to implement the deisolation structure of this application, the flexibility of the spacing between the first metal layer and the second metal layer can be guaranteed, thereby improving the flexibility of the isolation optimization of this disclosure.

[0029] In some exemplary embodiments of this disclosure, a gap is provided between the first antenna and the second antenna.

[0030] The first antenna and the second antenna can achieve electromagnetic coupling through a gap, which can improve the isolation between the two antennas and thus ensure antenna performance.

[0031] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0032] The electronic device provided in this disclosure can optimize the isolation between two antennas by setting a de-isolation structure, and improve the performance of the antennas while avoiding occupying a large amount of internal space of the electronic device.

[0033] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0034] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0035] Figure 1 This is a schematic diagram of the structure of an electronic device according to some embodiments of the present disclosure.

[0036] Figure 2 This is a schematic diagram of a deisolation structure according to some embodiments of the present disclosure.

[0037] Figure 3 This is a schematic diagram of the structure of a first metal layer and a second metal layer according to some embodiments of the present disclosure.

[0038] Figure 4 This is a schematic diagram illustrating the effect of S-parameters between the first antenna and the second antenna according to some embodiments of the present disclosure.

[0039] Figure 5 This is a structural block diagram of an electronic device according to some embodiments of the present disclosure. Detailed Implementation

[0040] Some embodiments of this disclosure will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. Various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those orders set forth herein, but can be changed as will become apparent upon understanding this disclosure, except for operations that must be performed in a particular order. Furthermore, for clarity and brevity, descriptions of features known in the art may be omitted.

[0041] The embodiments described in the following examples of this disclosure are not representative of all embodiments consistent with this disclosure. Rather, they are merely examples consistent with some aspects of this disclosure as detailed in the appended claims.

[0042] The specific implementation methods of the embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0043] Figure 1 This is a schematic diagram illustrating the structure of an electronic device 100 according to an exemplary embodiment of the present disclosure. Figure 1As shown, the electronic device 100 may include: a first antenna 1, a second antenna 2, and a deisolation structure 3.

[0044] The first antenna 1 can be used to support a first operating frequency band. The second antenna 2 can be used to support a second operating frequency band, which is lower than the first operating frequency band. The second antenna 2 is positioned opposite to the radiation port of the first antenna 1. The isolation structure 3 can be electrically connected between the second antenna 2 near the antenna end and the motherboard ground plane to improve the isolation between the first antenna 1 and the second antenna 2.

[0045] For example, such as Figure 1 As shown, the second antenna 2 near the end of the antenna can be the end of the second antenna 2 near the end of the first antenna 1.

[0046] It should be noted that the second antenna 2 and the first antenna 1 are arranged opposite each other, that is, the second antenna 2 and the first antenna 1 are arranged in an opening-to-open manner. The opening of the antenna can refer to the effective area of ​​the antenna for signal radiation, that is, the radiation port.

[0047] Furthermore, this embodiment does not limit the shape of the first antenna 1 and the second antenna 2. The shapes of the first antenna 1 and the second antenna 2 can be, for example, straight, L-shaped, etc. The shapes of the first antenna 1 and the second antenna 2 can be the same or different. This embodiment also does not limit the placement of the first antenna 1 and the second antenna 2 in the electronic device 100; the first antenna 1 and the second antenna 2 can be, for example, placed at the top, side, or corner, etc. Figure 1 This is merely an example and is not intended to limit the shape and size of the first antenna 1, the second antenna 2, etc.

[0048] This disclosure does not limit the types of the first antenna 1 and the second antenna 2. For example, the first antenna 1 can be a monopole antenna, an inverted-F antenna, etc. Similarly, the second antenna 2 can also be a monopole antenna, an inverted-F antenna, etc.

[0049] In an exemplary embodiment, the first antenna 1 and the second antenna 2 can be electrically connected to their respective feed sources. For example... Figure 1 As shown, the first antenna 1 can be electrically connected to the first feed 11, which is used to excite the first antenna 1 to generate resonance in a first operating frequency band. Furthermore, the second antenna 2 can be electrically connected to the second feed 21, which is used to excite the second antenna 2 to generate resonance in a second operating frequency band.

[0050] The embodiments disclosed herein do not limit the first operating frequency band and the second operating frequency band. The first operating frequency band and the second operating frequency band can be the same or different frequency bands. For example, the first operating frequency band and the second operating frequency band can be two frequency bands that are adjacent to each other, or they can be two frequency bands that have overlapping parts.

[0051] In one possible implementation, the first operating frequency band can be a 5GHz WiFi (Wireless Fidelity) band, and the second operating frequency band can be a 2.4GHz WiFi band. Alternatively, the first operating frequency band can be the n78 band, and the second operating frequency band can be the B5 band.

[0052] In some embodiments, since the second operating frequency band is a lower frequency band, the resonant wavelength of the second antenna 2 is longer. In antenna design, low-frequency antennas typically require a longer physical length. A longer physical length means a wider surface current distribution range, and the current distribution is concentrated near the end of the second antenna 2, which is also the point of maximum current standing wave ratio. The current of the first antenna 1 is relatively dispersed compared to the second antenna 2. Therefore, in this embodiment, the isolation structure 3 is placed on the second antenna 2, which operates at a relatively lower frequency band, to improve the isolation optimization effect and thus ensure the antenna performance of the first antenna 1 and the second antenna 2.

[0053] It should be noted that the embodiments disclosed herein do not limit the positions of the first antenna 1 and the second antenna 2 on the electronic device 100. Figure 1 This is merely an example and is not intended to limit this disclosure. Exemplarily, the first antenna 1 and the second antenna 2 may be disposed on the top, side, or bottom of the electronic device 100.

[0054] For example, the electronic device 100 in this disclosure embodiment may be a mobile phone, tablet computer, e-reader, MP3 player, MP4 player, laptop computer, in-vehicle system or desktop computer, portable terminal, laptop terminal, desktop terminal, action camera, drone, monitor camera and similar products.

[0055] It should be noted that the embodiments of this disclosure optimize the isolation between two antennas by setting the isolation structure 3, thereby improving antenna performance while avoiding occupying a large amount of internal space of the electronic device.

[0056] In some exemplary embodiments of this disclosure, a gap may be provided between the first antenna 1 and the second antenna 2.

[0057] like Figure 1As shown, the gap between the second antenna 2 and the first antenna 1 can be a slit. In some exemplary embodiments, the slit can enable electromagnetic coupling between the first antenna 1 and the second antenna 2, thereby improving the isolation between the two antennas and ensuring antenna performance.

[0058] In some exemplary embodiments of this disclosure, the isolation structure 3 includes a first metal layer 31, a second metal layer 32, and a spring sheet structure 33 stacked together; the first metal layer 31 and the second metal layer 32 are electrically connected to the motherboard ground plane, and a gap is formed between the first metal layer 31 and the second metal layer 32; the spring sheet structure 33 is disposed on the side of the first metal layer 31 away from the second metal layer 32, and the spring sheet structure 33 is electrically connected to the second antenna 2 near the end of the antenna.

[0059] In an exemplary embodiment, the first metal layer 31 and the second metal layer 32 may be fully or partially stacked. Furthermore, this embodiment does not limit the medium between the first metal layer 31 and the second metal layer 32; the medium may be any insulating material.

[0060] Figure 2 This is a schematic diagram of a deisolation structure 3 according to an exemplary embodiment of the present disclosure.

[0061] like Figure 2 As shown, the first metal layer 31 and the second metal layer 32 are parallel to each other. The first metal layer 31 is a rectangular metal sheet structure, and the second metal layer 32 is an L-shaped metal sheet structure. In this embodiment, the stacked area of ​​the first metal layer 31 and the second metal layer 32 is equal to the area of ​​the first metal layer 31.

[0062] And, as Figure 2 As shown, the first metal layer 31 included in the isolation structure 3 can be a rectangular metal sheet structure, with its length marked L1 and its width marked W1. Furthermore, the spring structure 33 is disposed on the side of the first metal layer 31 away from the second metal layer 32, so the isolation structure 3 can achieve electrical connection with the second antenna 2 through the spring structure 33.

[0063] In Figure 2 In the process, the second metal layer 32 included in the isolation structure 3 can be an L-shaped metal sheet structure, which can be considered as consisting of a larger rectangle and a smaller rectangle. The length of the larger rectangle is marked as L2, and the width is marked as W2. In addition, the gap distance between the first metal layer 31 and the second metal layer 32 can be represented by H.

[0064] It should be noted that, in this embodiment of the present disclosure, the frequency of the deisolation degree of the deisolation degree structure 3 can be adjusted by adjusting the gap distance between the first metal layer 31 and the second metal layer 32. For example, the gap distance between the first metal layer 31 and the second metal layer 32 can be proportional to the frequency of the deisolation degree.

[0065] For example, the first metal layer 31 is at least partially made of copper. For instance, the first metal layer 31 can be a copper-plated layer, thus also serving as a patch spring function. Therefore, this disclosure can achieve electrical connection between the deisolation structure 3 and the second antenna 2 near the antenna end. In addition, the second metal layer 32 is at least partially made of copper. For instance, the second metal layer 32 can be a copper layer, which may include a copper-plated structure or be the original copper foil of a copper-clad laminate. This copper layer can be coupled to the first metal layer 31.

[0066] In addition, in the exemplary embodiment, the first metal layer 31 and the second metal layer 32 can be directly connected to the motherboard ground layer to achieve grounding, or they can be grounded through a corresponding matching circuit. This disclosure embodiment does not limit this.

[0067] Therefore, the embodiments of this disclosure can improve the isolation between two antennas based on a simple structure, avoiding the occupation of a large space inside the electronic device 100. Furthermore, this disclosure does not require physically increasing the spacing between the two antennas to achieve isolation optimization, further enabling antenna miniaturization. Moreover, this disclosure avoids the increased cost and antenna efficiency loss caused by using LC resonant circuits to improve isolation.

[0068] In some exemplary embodiments of this disclosure, the first metal layer 31 and the second metal layer 32 have capacitive properties.

[0069] In some possible embodiments, a parallel plate capacitor is formed between the first metal layer 31 and the second metal layer 32, and the capacitance value between the first metal layer 31 and the second metal layer 32 may be negatively correlated with the frequency of the deisolation.

[0070] For example, in embodiments of this disclosure, the frequency of the deisolation degree of the deisolation structure 3 can be adjusted by the stacked area between the first metal layer 31 and the second metal layer 32. For example, the stacked area between the first metal layer 31 and the second metal layer 32 can be inversely proportional to the frequency of the deisolation degree.

[0071] In an exemplary embodiment, the capacitance value between the first metal layer 31 and the second metal layer 32 can be determined based on the following formula (1).

[0072]

[0073] In formula (1), C can represent the capacitance between the first metal layer 31 and the second metal layer 32. ε can represent the dielectric constant of the medium between the first metal layer 31 and the second metal layer 32. S can represent the stacked area between the first metal layer 31 and the second metal layer 32. H can represent the gap distance between the first metal layer 31 and the second metal layer 32.

[0074] In some possible implementations, the capacitance value between the first metal layer 31 and the second metal layer 32 can be determined based on the frequency at which deisolation is required. This capacitance value between the first metal layer 31 and the second metal layer 32 can be inversely proportional to the frequency of deisolation.

[0075] This embodiment does not limit the frequency of the deisolation degree. The frequency of the deisolation degree can be determined based on the frequency at which the first antenna 1 and the second antenna 2 have a high degree of mutual interference. For example, the frequency of the deisolation degree can be close to the center frequency of the first operating frequency band. Alternatively, the frequency of the deisolation degree can be close to the center frequency of the second operating frequency band. Or, the frequency of the deisolation degree can be the average of the center frequency of the first operating frequency band and the center frequency of the second operating frequency band, etc.

[0076] It should be noted that the isolation of the antenna element can be optimized by setting the capacitance property between the first metal layer 31 and the second metal layer 32 in the embodiments of this disclosure. Furthermore, the frequency of de-isolation can be determined based on the capacitance value, thereby reducing the mutual interference between the first antenna 1 and the second antenna 2 through the de-isolation structure 3.

[0077] In this embodiment, the capacitance value between the first metal layer 31 and the second metal layer 32 can be adjusted based on the gap distance and stacked area between the two metal layers, thereby enabling flexible adjustment of the frequency of deisolation.

[0078] In some possible implementations, the structural schematic diagram of a first metal layer 31 and a second metal layer 32 provided in this disclosure can be as follows: Figure 3 As shown. In this Figure 3 In the middle, the first metal layer 31 is electrically connected to the motherboard ground layer 7 through the first matching circuit 5, and the first matching circuit 5 is used to adjust the second operating frequency band.

[0079] like Figure 3 As shown, the first metal layer 31 can be electrically connected to the motherboard ground layer 7 via the first matching circuit 5 to achieve grounding. Exemplarily, the first matching circuit 5 can be electrically connected to the first metal layer 31 and the motherboard ground layer 7 respectively via wire points.

[0080] The present disclosure does not limit the structure of the first matching circuit 5. The structure of the first matching circuit 5 can be configured according to the second operating frequency band. The first matching circuit 5 may include at least one of a capacitor element and an inductor element.

[0081] It should be noted that, according to the embodiments of this disclosure, the impedance of the second antenna 2 can be adjusted based on the first matching circuit 5, thereby achieving adjustment of the second operating frequency band and improving antenna performance.

[0082] In addition, in Figure 3 In this configuration, the second metal layer 32 can be electrically connected to the motherboard ground layer via the microstrip line 6. For example, using... Figure 2 For example, the second metal layer 32 can be electrically connected to the microstrip line 6 through the portion that is not stacked with the first metal layer 31, thereby grounding.

[0083] Furthermore, in some exemplary embodiments of this disclosure, at least one of a capacitor element and an inductor element may be provided on the microstrip line 6 to adjust the capacitance value between the first metal layer 31 and the second metal layer 32.

[0084] In an exemplary embodiment, the microstrip line 6 can provide an effective radio frequency grounding path for the second metal layer 32, maintaining a stable potential in the metal layer and preventing the formation of parasitic radiation or interference sources. Furthermore, by adding inductor and / or capacitor elements to the microstrip line 6, the capacitance value of the deisolation structure 3 can be adjusted, thereby enabling adjustment of the deisolation frequency. Therefore, by grounding the second metal sheet 32 ​​through inductor and / or capacitor elements, this embodiment of the present disclosure can achieve frequency adjustment of the deisolation, improving the flexibility of the deisolation and further enhancing antenna performance.

[0085] In some exemplary embodiments of this disclosure, the spring structure 33 can be electrically connected to the first metal layer 31 via SMT.

[0086] In some exemplary embodiments, the spring structure 33 can be mounted onto the first metal layer 31 using SMT (Surface Mount Technology). Alternatively, the first metal layer 31 can be provided with an interface or pad that matches the spring structure 33, thereby firmly attaching the spring structure 33 to the first metal layer 31 by means of soldering or other methods, and forming a good electrical connection.

[0087] For example, this embodiment does not limit the method of electrical connection between the spring structure 33 and the second antenna 2. For instance, if a detachable connection is required between the spring structure 33 and the second antenna 2, a plug-in connection can be used. Alternatively, the spring structure 33 and the second antenna 2 can be fixedly connected by welding or other methods.

[0088] like Figure 2 As shown, since the spring structure 33 can be bent and stretched, the spring structure 33 selected in this embodiment is suitable for modular design. By adjusting the degree of bending of the spring, electrical connections at different distances or angles can be achieved. Furthermore, by using the spring structure 33 to achieve the electrical connection between the second antenna 2 and the first metal layer 31, the manufacturing complexity and space occupied can be reduced while ensuring a good electrical connection.

[0089] In some exemplary embodiments of this disclosure, the first metal layer 31 and / or the second metal layer 32 are metal layers on the internal circuit board of the electronic device 100.

[0090] It should be noted that the electronic device 100 may include at least one circuit board, and any circuit board may include at least one metal layer. For example, a single-sided circuit board may include one metal layer on which all conductive paths can be arranged. Secondly, a double-sided circuit board may include two metal layers, a bottom layer and a bottom layer, on which conductive paths can be arranged and interconnected via vias, etc. Furthermore, a multilayer board may include at least one inner metal layer in addition to the top and bottom layers. The inner metal layers may be spaced based on an insulating material to provide higher wiring density and more complex circuit design capabilities.

[0091] In this embodiment of the disclosure, at least one of the first metal layer 31 and the second metal layer 32 can be implemented based on the metal layer structure on the circuit board, thereby further reducing the cost of deploying the deisolation structure 3 and reducing the space occupied inside the electronic device 100.

[0092] In some exemplary embodiments of this disclosure, the first metal layer 31 and the second metal layer 32 are two metal layers on the same circuit board. Alternatively, the first metal layer 31 and the second metal layer 32 are metal layers on two separate circuit boards, which are stacked together.

[0093] In an exemplary embodiment, the first metal layer 31 and the second metal layer 32 can be configured using two metal layers on a first circuit board. The first circuit board can be a double-sided board or a multi-sided board.

[0094] It should be noted that for multi-panel displays, there may be multiple metal inner layers. For example, the top layer of the first circuit board can be used as the first metal layer 31. Then, the gap distance between the first metal layer 31 and the second metal layer 32 can be determined according to the frequency of the required deisolation, thereby selecting a metal inner layer with a suitable distance as the second metal layer 32.

[0095] In some embodiments, the first metal layer 31 and the second metal layer 32 may be two metal layers on the motherboard of the electronic device 100, and the motherboard may also include a ground layer, i.e., a ground plane layer, in addition to multiple metal layers. Therefore, the first metal layer 31 and the second metal layer 32 may be electrically connected to the ground plane layer to achieve grounding.

[0096] Taking the motherboard of the electronic device 100 as an example, since the top layer of the motherboard of the electronic device 100 is provided with a copper-plated structure, the electrical connection between the first metal layer 31 and the spring structure 33 can be realized based on the copper-plated structure.

[0097] In an exemplary embodiment, the electronic device 100 may include a first circuit board and a second circuit board, and the first circuit board and the second circuit board are stacked. In this case, a certain metal layer in the first circuit board may be used as the first metal layer 31, and a certain metal layer in the second circuit board may be used as the second metal layer 32.

[0098] It should be noted that, in this case, the gap distance between the first metal layer 31 and the second metal layer 32 can also be determined according to the required deisolation frequency, so that metal layers with appropriate distances can be selected from the first circuit board and the second circuit board as the first metal layer 31 and the second metal layer 32 respectively.

[0099] It should be noted that the isolation structure 3 can be implemented by the copper layer on the circuit board inside the electronic device 100. This structure is simple to implement, effectively reduces costs and can further reduce the space occupied inside the electronic device 100. Furthermore, by selecting at least one metal layer on the circuit board to implement the isolation structure 3 of this application, the flexibility of the spacing between the first metal layer 31 and the second metal layer 32 can be guaranteed, thereby improving the flexibility of the isolation optimization of this disclosure.

[0100] Figure 4 This is a schematic diagram illustrating the effect of S-parameters between a first antenna 1 and a second antenna 2, as shown in an exemplary embodiment of this disclosure.

[0101] In Figure 4In this context, S1,2 can represent the S-parameters between the first antenna 1 and the second antenna 2 when the deisolation structure 3 is not set. S1,2_1 can represent the S-parameters between the first antenna 1 and the second antenna 2 when the deisolation structure 3 is set. Figure 4 The horizontal axis represents frequency, measured in GHz (gigahertz), and the vertical axis represents isolation, measured in dB (decibels).

[0102] like Figure 4 As shown, after setting the de-isolation structure 3, the isolation value corresponding to S1,2_1 at the frequency point of 3.3462GHz is -37.531134dB, while without setting the de-isolation structure 3, the isolation value corresponding to S1,2 is approximately -10.324476dB. Therefore, according to... Figure 4 As can be seen, the embodiments of this disclosure effectively optimize the isolation between the first antenna 1 and the second antenna 2 through the de-isolation structure 3, thereby improving antenna performance.

[0103] Alternatively, the electronic device in this embodiment can be a foldable electronic device or a flat-screen electronic device (non-foldable electronic device). In one possible implementation, the electronic device is a foldable electronic device, and the cavity antenna can be arranged on either the first body or the second body connected by a hinge, for example, on the top of the first body. In another possible implementation, the electronic device is a flat-screen electronic device, and the cavity antenna is located on the top of the electronic device.

[0104] Figure 5 This is a block diagram illustrating an electronic device according to some embodiments of the present disclosure. The electronic device may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0105] Reference Figure 5 The electronic device 500 may include one or more of the following components: processing component 502, memory 504, power supply component 506, multimedia component 508, audio component 510, input / output (I / O) interface 512, sensor component 514, and communication component 516.

[0106] Processing component 502 typically controls the overall operation of electronic device 500, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 502 may include one or more processors 520 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 502 may include one or more modules to facilitate interaction between processing component 502 and other components. For example, processing component 502 may include a multimedia module to facilitate interaction between multimedia component 508 and processing component 502.

[0107] Memory 504 is configured to store various types of data to support the operation of device 500. Examples of this data include instructions for any application or method operating on electronic device 500, contact data, phonebook data, messages, pictures, videos, etc. Memory 504 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0108] Power supply component 506 provides power to various components of electronic device 500. Power supply component 506 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to electronic device 500.

[0109] Multimedia component 508 includes a screen that provides an output interface between the electronic device 500 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 508 includes a front-facing camera and / or a rear-facing camera. When the device 500 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0110] Audio component 510 is configured to output and / or input audio signals. For example, audio component 510 includes a microphone (MIC) configured to receive external audio signals when electronic device 500 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 504 or transmitted via communication component 516. In some embodiments, audio component 510 also includes a speaker for outputting audio signals.

[0111] I / O interface 512 provides an interface between processing component 502 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0112] Sensor assembly 514 includes one or more sensors for providing state assessments of various aspects of electronic device 500. For example, sensor assembly 514 may detect the on / off state of device 500, the relative positioning of components such as the display and keypad of electronic device 500, changes in position of electronic device 500 or a component of electronic device 500, the presence or absence of user contact with electronic device 500, orientation or acceleration / deceleration of electronic device 500, and temperature changes of electronic device 500. Sensor assembly 514 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 514 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 514 may also include an accelerometer, gyroscope, magnetometer, pressure sensor, or temperature sensor.

[0113] Communication component 516 is configured to facilitate wired or wireless communication between electronic device 500 and other devices. Electronic device 500 can access wireless networks based on communication standards, such as WiFi, 3G, 4G, 5G, other communication standards, or combinations thereof. In some embodiments of this disclosure, communication component 516 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In some embodiments of this disclosure, communication component 516 further includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0114] In some embodiments of this disclosure, the electronic device 500 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0115] In some embodiments of this disclosure, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 504 including instructions that can be executed by a processor 520 of an electronic device 500 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0116] It should be understood that, unless otherwise specifically indicated, features of various embodiments of this disclosure described herein can be combined with each other. As used herein, the term “and / or” includes any one of the relevant listed items and any combination of any two or more; similarly, “at least one of…” includes any one of the relevant listed items and any combination of any two or more.

[0117] Although terms such as “first” and “second” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections are not limited to these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Therefore, without departing from the teachings of the examples described herein, the first component, part, region, layer, or section mentioned in the examples may also be referred to as the second component, part, region, layer, or section. Furthermore, the terms “first” and “second” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as “first” or “second” may explicitly or implicitly include at least one of that feature. In the description herein, “a plurality” means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0118] It should be understood that spatial relative terms, such as “top,” “side,” and “bottom,” are used herein to describe the relationship between one element and another shown in the figures. In addition to the orientation depicted in the figures, these spatial relative terms are also intended to encompass different orientations of the device during use or operation. For example, if the device in the figures is flipped, the element described as being “top” relative to another element would be “bottom” relative to that other element. Thus, depending on the spatial orientation of the device, the term “top” encompasses both above and below orientations. The device may have other orientations (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein should be interpreted accordingly.

[0119] Furthermore, the term “exemplary” is used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as “exemplary” is not necessarily to be construed as advantageous compared to other aspects or designs. Rather, the use of the term “exemplary” is intended to present the concept in a concrete manner. As used herein, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless otherwise specified or clear from the context, “X applies A or B” is intended to mean any of the natural inclusive arrangements. That is, “X applies A or B” satisfies any of the foregoing instances if X applies A; X applies B; or both X applies A and B. Additionally, unless otherwise specified or clear from the context to refer to the singular form, the articles “a” and “an” as used in this application and the appended claims are generally understood to mean “one or more.”

[0120] Similarly, although this disclosure has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art upon reading and understanding the specification and drawings. This disclosure includes all such modifications and variations and is limited only by the scope of the claims. In particular, with respect to the various functions performed by the components described above (e.g., elements, resources, etc.), unless otherwise indicated, the terminology used to describe such components is intended to correspond to any component (functionally equivalent) that performs the specific function of the described component, even if structurally not equivalent to the disclosed structure. Furthermore, although specific features of this disclosure may have been disclosed with respect to only one of several implementations, such features may be combined with one or more other features of other implementations, as may be desired and advantageous to any given or particular application. Moreover, with regard to the terms “comprising,” “owning,” “having,” “having,” or variations thereof as used in the detailed description or claims, such terms are intended to be inclusive in a manner similar to the term “including.”

[0121] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope of this disclosure is indicated by the following claims.

[0122] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An electronic device, characterized in that, include: The first antenna is used to support the first operating frequency band; A second antenna is used to support a second operating frequency band, which is lower than the first operating frequency band, and the radiation ports of the second antenna and the first antenna are arranged opposite to each other. The isolation structure is electrically connected between the second antenna near the antenna end and the motherboard ground plane to improve the isolation between the first antenna and the second antenna.

2. The electronic device according to claim 1, characterized in that, The deisolation structure includes a first metal layer, a second metal layer, and a spring sheet structure stacked together. The first metal layer and the second metal layer are electrically connected to the motherboard ground layer, and a gap is formed between the first metal layer and the second metal layer. The spring-loaded structure is disposed on the side of the first metal layer away from the second metal layer, and the spring-loaded structure is electrically connected to the second antenna near the end of the antenna.

3. The electronic device according to claim 2, characterized in that, The first metal layer and the second metal layer have capacitive properties.

4. The electronic device according to claim 2, characterized in that, The first metal layer is electrically connected to the motherboard ground layer through a first matching circuit, which is used to adjust the second operating frequency band.

5. The electronic device according to claim 2, characterized in that, The second metal layer is electrically connected to the motherboard ground layer via a microstrip line.

6. The electronic device according to claim 5, characterized in that, The microstrip line is provided with at least one of a capacitor element and an inductor element to adjust the capacitance value between the first metal layer and the second metal layer.

7. The electronic device according to claim 2, characterized in that, The spring structure is electrically connected to the first metal layer via surface mount technology (SMT).

8. The electronic device according to any one of claims 2-7, characterized in that, The first metal layer is at least partially made of copper, and the second metal layer is at least partially made of copper.

9. The electronic device according to any one of claims 2-7, characterized in that, The first metal layer and / or the second metal layer are metal layers on the internal circuit board of the electronic device.

10. The electronic device according to claim 9, characterized in that, The first metal layer and the second metal layer are two metal layers on the same circuit board; Alternatively, the first metal layer and the second metal layer are metal layers on two different circuit boards, and the two circuit boards are stacked together.

11. The electronic device according to claim 1, characterized in that, A gap is provided between the first antenna and the second antenna.

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