A phase change heat spreader and heat dissipation system

Abstract

This utility model provides a phase change radiator, comprising a shell with an internal cavity filled with a phase change refrigerant; an injection hole communicating with the cavity on one end face; porous metal fins arranged parallel to each other on the top surface of the shell, with a heat dissipation channel formed between adjacent porous metal fins; the bottom of each porous metal fin penetrates the top of the shell and contacts the phase change refrigerant; a cooling assembly is installed between adjacent porous metal fins using thermally conductive adhesive, with its cold end contacting the phase change refrigerant in the cavity through the top surface of the shell. This utility model also provides a heat dissipation system, comprising a shell and the aforementioned phase change radiator, with the phase change radiator fixedly installed inside the shell; a circulating fan is arranged at one end of the shell corresponding to the heat dissipation channel of the phase change radiator, and an air outlet is provided at the other end of the shell corresponding to the heat dissipation channel of the phase change radiator.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation equipment technology, specifically to a phase change radiator and heat dissipation system. Background Technology

[0002] High-power lasers are increasingly used in industrial processing, medical equipment, and military fields, generating a significant amount of heat during operation. Failure to manage this heat effectively and promptly can easily lead to performance degradation, shortened lifespan, or even malfunction. High-power lasers inherently produce higher heat flux densities, rendering traditional heat dissipation methods inadequate for their cooling requirements.

[0003] Currently, the following methods are used to cool high-power lasers: 1. Forced air cooling is currently the most widely used heat dissipation method. It typically utilizes aluminum or copper heat sinks to increase the convection area, and then uses a fan to force airflow for cooling. The advantages of this method are its simplicity and low cost. However, at room temperature, this method is inefficient, noisy, consumes a lot of power, and requires a large space. When applied to small, high-power devices, its heat dissipation capacity is insufficient. Furthermore, this method is greatly affected by the ambient temperature, making it difficult to provide a stable operating environment for lasers. If rapid cooling and heat dissipation are required, forced air cooling is often insufficient.

[0004] 2. Single-phase forced water cooling, a reliable cooling technology for conventional-sized liquid single-phase forced convection cooling, has been widely used in the cooling of various electronic and optoelectronic devices. However, the heat transfer coefficient of conventional single-phase forced convection is no longer suitable for laser cooling and cannot meet the temperature control requirements.

[0005] 3. Spray cooling: Spray cooling technology uses high-pressure gas or a high-pressure pump to atomize liquid through a nozzle and spray it onto the surface of the heating element. The heat is carried away by jet impact, strong convection and droplet phase change, thereby cooling the heating element.

[0006] However, as laser power increases, single-phase flow cooling is becoming increasingly inadequate for managing the heat under high heat flux density conditions. Furthermore, during laser operation, excessive instantaneous power and heat generation can lead to film boiling, severely reducing the thermal conductivity. Therefore, this phase change cooling method still cannot solve the heat dissipation problem of high-power lasers.

[0007] Phase change cooling technology, as an important means to solve the heat dissipation problem of high heat flux density, utilizes the latent heat absorbed by the cooling medium during the phase change process between solid-liquid and liquid-gas phases (such as water absorbing a large amount of heat when it turns into steam). It has advantages such as high heat dissipation per unit volume, fast response, and compact structure, and is suitable for the thermal control needs of electronic devices.

[0008] However, existing phase change heat sinks still lack a good solution for high heat flux density conditions such as high-power lasers. Due to the excessively high instantaneous power and heat generation, film boiling may still occur, resulting in a significant reduction in the thermal conductivity and heat transfer coefficient. Furthermore, since the phase change refrigerant needs to return to a solid or liquid state after its temperature drops before it can enter the next round of heat dissipation, this process is time-consuming. There is a possibility that the phase change material's latent heat absorption capacity will be limited during the next heat dissipation, making it unsuitable for scenarios requiring frequent heat dissipation. Summary of the Invention

[0009] The purpose of this invention is to address the shortcomings of existing technologies by providing a phase change heat sink and a heat dissipation system. By combining a composite cooling mechanism that absorbs latent heat through phase change and active thermoelectric cooling, the cooling efficiency is greatly enhanced, enabling rapid cooling of electronic equipment.

[0010] To achieve the above objectives, the technical solution adopted by this utility model is as follows: In a first aspect, this application provides a phase change heat sink, comprising: The housing has an internal cavity filled with a phase change refrigerant; one end face of the housing has an injection port communicating with the cavity. Metal porous fins are arranged in parallel on the top surface of the shell, and a heat dissipation channel is formed between two adjacent metal porous fins; the bottom of each metal porous fin penetrates the top of the shell and contacts the phase change refrigerant. The refrigeration component is installed between two adjacent porous metal fins using thermally conductive adhesive, and its cold end contacts the phase change refrigerant in the cavity through the top surface of the housing.

[0011] In the standby state of the laser, the control cooling component is activated, and the phase change refrigerant in the cold end cooling cavity is turned into a solid state. During this process, the metal porous fins adsorb some liquid for pre-cooling and cooling, providing an initial strong cold source for the laser emission stage.

[0012] In laser operating mode, a high instantaneous heat flux is generated. The heat from the laser is first conducted through the shell of the phase change heat sink to the phase change refrigerant in the cavity. The phase change refrigerant absorbs heat, melts and evaporates rapidly, absorbing a large amount of latent heat, and then evaporates and dissipates through the capillary action of the metal porous fins, thus achieving phase change cooling.

[0013] In one possible embodiment, the cooling assembly includes a semiconductor cooling chip and a plurality of first thermally conductive microfins disposed at the hot end of the semiconductor cooling chip.

[0014] During the cooling process of a thermoelectric cooler, the first thermally conductive microfins dissipate heat from the hot end of the thermoelectric cooler, reducing the temperature of the hot end through active heat dissipation, thereby enabling the thermoelectric cooler to reach a lower cooling temperature. The thermoelectric cooler is a solid-state component without sliding parts, easily fixedly connected to the thermally conductive microfins, and operates without vibration or noise during cooling.

[0015] In one possible embodiment, each of the first thermally conductive microfins is connected to an adjacent porous metal fin so that the heat generated at the hot end can be used to vaporize the liquid phase change refrigerant that is directed to the heat dissipation surface by capillary action, thereby improving the heat dissipation efficiency of the hot end during the cooling phase.

[0016] In one possible embodiment, the cooling assembly further includes a second thermally conductive microfin disposed at the cold end of the semiconductor cooling chip. The second thermally conductive microfin includes a first fin vertically connected to the cold end of the semiconductor cooling chip and a second fin crosswise mounted on the first fin. The first fin extends through the top surface of the housing into the cavity, wherein a sealing gasket is provided at the connection between the first fin and the top surface of the housing.

[0017] When the semiconductor refrigeration chip is cooling, the low temperature it generates is conducted to the phase change refrigerant through the first fin and the second fin cross-mounted on the first fin. Since the contact area between the first fin and the phase change refrigerant is larger than the area of ​​the cold end of the semiconductor refrigeration chip, the heat conduction area is increased, thus improving the cooling efficiency.

[0018] In one possible embodiment, the bottom of the housing is further provided with a receiving cavity for installing components to be cooled.

[0019] The phase change heat sink is able to withstand instantaneous strong thermal load impacts through the cavity at the bottom of the housing for installing the components to be cooled, and the heat of the components to be cooled is evenly conducted to the phase change refrigerant in the housing and its cavity.

[0020] Secondly, this application provides a heat dissipation system, including: a housing and at least one phase change heat sink as described in any one of the first aspects, wherein the phase change heat sink is fixedly installed inside the housing; a circulating fan is arranged at one end of the housing corresponding to the heat dissipation channel of the phase change heat sink, and an air outlet is provided at the other end of the housing corresponding to the heat dissipation channel.

[0021] The circulating fan forces the heat dissipation of the heat dissipation channel formed by the adjacent metal porous fins and the first thermally conductive microfins of the phase change radiator, so that the heat or vaporized phase change refrigerant in the heat dissipation channel is quickly discharged, making up for and increasing the momentum of the air flowing in the heat dissipation channel, and further improving the heat exchange efficiency.

[0022] This utility model has substantial features and progress compared to the prior art. Specifically, the phase change radiator provided by this utility model utilizes the bottom of the metal porous fins to contact the phase change refrigerant. Due to its complex spatial structure and large specific surface area, the metal porous fins can reduce the nucleation boiling and pool boiling phenomena of the phase change refrigerant in contact with them, thereby enhancing the heat dissipation performance of the phase change radiator.

[0023] Further, a refrigeration component is added to achieve active cooling and store cold energy in advance, giving the radiator a certain "cold inertia". When heat dissipation begins, the phase change refrigerant undergoes two phase change stages: "solid-liquid" melting and "liquid-gas" evaporation, which greatly improves the overall heat capacity of the radiator.

[0024] The heat dissipation system provided by this utility model utilizes forced air cooling, and achieves forced convection heat exchange on the heat dissipation channel of the phase change radiator through an external circulation fan, which significantly improves heat dissipation efficiency and reduces heat dissipation pressure. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the phase change heat sink described in this utility model.

[0026] Figure 2 This is a cross-sectional view of the phase change heat sink described in this utility model.

[0027] Figure 3 This is a schematic diagram of the structure of the outer shell described in this utility model.

[0028] Figure 4 This is a schematic diagram of the heat dissipation system described in this utility model.

[0029] In the figure: 1. Shell; 2. Porous metal fins; 3. Semiconductor cooling chip; 4. First thermally conductive microfin; 5. Injection hole; 6. Second thermally conductive microfin; 601. First fin; 602. Second fin; 7. Outer shell; 8. Fan; 9. Air outlet; 10. Receiving cavity; 11. Phase change heat sink. Detailed Implementation

[0030] The technical solution of this utility model will be further described in detail below through specific embodiments.

[0031] Example 1 like Figure 1-2As shown, a phase change radiator includes a housing 1 with an internal cavity filled with a phase change refrigerant; one end face of the housing has an injection port 5 communicating with the cavity. In this embodiment, the phase change refrigerant can be any known phase change refrigerant, such as water, injected into the cavity through the injection port 5 and replenished periodically, or replenished only when the liquid level of the phase change refrigerant is lower than a preset height. It is understood that the latter method requires an additional liquid level sensor and corresponding control circuitry.

[0032] Metal porous fins 2 are arranged in parallel on the top surface of the housing 1, and a heat dissipation channel is formed between two adjacent metal porous fins 2; the bottom of each metal porous fin 2 penetrates the top of the housing 1 and contacts the phase change refrigerant.

[0033] Specifically, the porous metal fin 2 can be made of any suitable metal material, such as copper, aluminum, iron, or nickel, or it can be made of metal foam material, such as foamed copper, foamed aluminum, foamed iron, or foamed nickel. It can also be made of composite materials, such as copper, graphite, or carbon nanotubes, which are highly thermally conductive materials. In this embodiment, the porous metal fin 2 is a foamed metal fin, made of foamed metal.

[0034] In addition, the metal porous fins 2 can also adopt any shape suitable for heat dissipation. For example, multiple metal porous fins 2 can be arranged perpendicular to the top surface of the housing 1, or they can be arranged inclined to the top surface of the housing 1, that is, the extension direction of the metal porous fins 2 has an angle of less than 90 degrees with the top surface of the housing 1. These variations do not exceed the protection scope of this utility model.

[0035] It is understandable that the bottom of the metal porous fin 2 is in contact with the phase change refrigerant, and uses capillary action to adsorb part of the liquid phase change refrigerant. Due to its complex spatial structure and large specific surface area, the metal porous fin 2 can reduce the nucleation boiling and pool boiling phenomena of the phase change refrigerant in contact with it, thereby enhancing the heat dissipation performance of the phase change radiator 11.

[0036] In specific implementation, the metal porous fins 2 can be integrally formed with the shell 1, or the shell 1 can be formed first, wherein the top surface of the shell 1 has multiple parallel through slots, and then the metal porous fins 2 are embedded in the through slots and fixedly connected to the through slots by mechanical fixing, thermal adhesive bonding, welding or other methods.

[0037] In particular, regardless of the method, it is necessary to ensure that the bottom of the porous metal fin 2 is in contact with the phase change refrigerant, and it is also necessary to ensure that the connection between the through groove and the porous metal fin 2 is sealed.

[0038] Therefore, when using mechanical fixing, sealing components such as gaskets must be installed at the connection between the through-slot and the porous metal fin 2 to prevent the phase change refrigerant in the cavity from leaking out. However, when using adhesive or welding methods, if it can be ensured that the connection between the through-slot and the porous metal fin 2 is already sealed, sealing components such as gaskets are not required.

[0039] The refrigeration component is installed between two adjacent porous metal fins 2 using thermally conductive adhesive, and its cold end contacts the phase change refrigerant in the cavity through the top surface of the housing 1.

[0040] Specifically, the cooling component is fixed to the two adjacent porous metal fins 2 and the top surface of the housing 1 by thermally conductive adhesive. This prevents the cooling component from falling off due to gravity when the heat sink is subsequently rotated. It also serves as a seal to prevent the liquid phase change refrigerant in the cavity from leaking out. At the same time, the thermally conductive adhesive does not affect the low-temperature conduction of the cold end of the cooling component to the phase change refrigerant in the cavity.

[0041] It is understandable that after the cooling component cools, its cold end conducts the low temperature to the cavity of housing 1 through the thermally conductive adhesive and the top surface of housing 1, causing the phase change refrigerant in the cavity of housing 1 to cool below the freezing point and form a phase change heat sink to store cold energy. This process is equivalent to building a "solid-state cold storage block," giving the system a certain degree of "cold inertia." It is also understandable that the cooling component can start cooling in the laser's standby state or during non-working periods, or it can cool in advance during the laser's off period, thereby improving preparation efficiency.

[0042] In a specific implementation, the cooling component includes a semiconductor cooling chip 3 and a plurality of first thermally conductive microfins 4 disposed at the hot end of the semiconductor cooling chip 3.

[0043] The thermoelectric cooler 3 is a solid chip without sliding parts, fixedly connected to the first thermally conductive microfin 4 by thermally conductive adhesive. The first thermally conductive microfin 4 dissipates heat from the hot end of the cooler. It is understood that the first thermally conductive microfin 4 can be made of any suitable metal or foamed metal material, such as copper, aluminum, iron, or nickel. Furthermore, the thermally conductive fins can also be in any shape suitable for heat dissipation. To enhance the thermal conductivity of the thermoelectric cooler 3, a layer of thermal grease can be applied to its surface, which helps to evenly distribute heat at the contact surface and avoids uneven cooling.

[0044] Furthermore, the bottom of the housing 1 is provided with a receiving cavity 10 for installing components to be cooled. Specifically, the housing 1 is made of metal, which facilitates the rapid and uniform conduction of heat generated by the components to be cooled to the phase change refrigerant in the cavity, so as to melt the solid phase change refrigerant and realize the solid-liquid-gas phase change.

[0045] It is understood that the phase change heat sink 11 also includes a drive circuit board, which is disposed on the outside of the housing 1 and electrically connected to the cooling component to control the start and stop of the cooling component.

[0046] It is understood that multiple driving circuits can be set on the driving circuit board, each driving circuit is connected to a semiconductor cooling chip, and the driving circuit directly adopts the existing driving circuit of the semiconductor cooling chip 3; this embodiment does not make any improvements to the driving circuit part.

[0047] For ease of understanding, this embodiment provides a specific working process of the phase change heat sink 11 applied to a laser.

[0048] Step 1: The liquid phase change refrigerant is filled into the cavity inside the phase change heat sink 11 through the injection hole, and the laser is installed in the receiving cavity 10 of the phase change heat sink 11. At this time, the metal porous fins 2 pre-absorb part of the liquid phase change refrigerant through the bottom that is in contact with the phase change refrigerant.

[0049] Step 2: When the laser is in standby mode, the thermoelectric cooler 3 is powered on. The low temperature of the cold end of the thermoelectric cooler 3 is conducted through the surface of the housing 1 to the liquid phase change refrigerant in the cavity, cooling the liquid phase change refrigerant to below 0°C, causing it to freeze and form an ice-state cold source. Simultaneously, the hot end of the thermoelectric cooler 3 dissipates heat through the first thermally conductive microfins 4. It should be noted that this process can also utilize an external fan to dissipate heat through the heat dissipation channels formed by the first thermally conductive microfins 4.

[0050] Step 3: When the laser is in emission mode, it generates instantaneous high heat flux. The high heat flux is conducted through the shell 1 to the solid phase change refrigerant in the cavity. The solid phase change refrigerant absorbs heat, melts, and then evaporates rapidly, absorbing a large amount of latent heat. At the same time, the metal porous fins 2 adsorb part of the liquid phase change refrigerant through capillary action and vaporize it, thus achieving phase change cooling.

[0051] Step 4: After absorbing heat, the gaseous phase change refrigerant forms a vapor flow in the flow channel. The vapor and heat are carried away by external fans, etc., to complete the forced convection heat dissipation.

[0052] Step 5: After the laser beam finishes emitting, it enters standby mode and controls the semiconductor cooling chip 3 to continue cooling, re-condensing the liquid phase change refrigerant to achieve repeated use of phase change cycle heat dissipation and cooling.

[0053] It is understood that the phase change heat sink 11 of this utility model can be used to dissipate heat from any suitable type of electronic device, including but not limited to lasers, communication devices, photovoltaic devices, etc.

[0054] Example 2 like Figure 2As shown, this embodiment provides another specific embodiment of the first thermally conductive microfin 4.

[0055] In this embodiment, each of the first thermally conductive microfins 4 is connected to an adjacent porous metal fin 2.

[0056] In this structure, since the porous metal fins 2 can pre-adsorb some of the liquid phase change refrigerant at the bottom that is in contact with the phase change refrigerant, when cooling, part of the heat generated at the hot end of the semiconductor cooling chip 3 is conducted to the adjacent porous metal fins 2 through the first thermally conductive microfins 4. This heat can be absorbed by the liquid phase change refrigerant adsorbed by the porous metal fins 2, thereby increasing the heat dissipation channels at the hot end during the cooling stage and achieving rapid cooling during the cooling stage.

[0057] It is understood that the shape of the first thermally conductive microfin can be any shape, as long as its two ends can be connected to the hot end of the metal porous fin and the semiconductor cooling chip respectively, such as inclined shape, curved shape, etc.

[0058] Furthermore, this embodiment provides a shape for the first thermally conductive microfin 4 under this structure.

[0059] like Figure 2 As shown, the first thermally conductive microfin 4 is an L-shaped microfin, and the adjacent L-shaped microfins have different sizes, forming a heat dissipation channel between two adjacent L-shaped microfins.

[0060] It is understood that the L-shaped microfins can conduct heat generated at the hot end of the semiconductor cooling chip 3 to the porous metal fins 2, and the porous metal fins 2 can use some of the adsorbed liquid phase change refrigerant to cool the heat generated at the hot end. Furthermore, multiple L-shaped microfins are arranged in parallel and overlapping configurations at the hot end of the semiconductor cooling chip 3, thereby obtaining a large heat dissipation area in a small space. The use of micro-heat dissipation channels improves heat dissipation performance and temperature uniformity; simultaneously, it can also quickly conduct heat from the hot end to the porous metal fins 2.

[0061] In one possible embodiment, multiple L-shaped microfins are symmetrically distributed with respect to the center of the hot end of the semiconductor cooling chip 3, and are respectively connected to the adjacent metal porous fins 2 on both sides to improve the uniformity of heat dissipation.

[0062] In practice, one end of the L-shaped microfin is fixedly connected to the hot end of the semiconductor cooling chip 3 using thermally conductive adhesive, and the other end is connected to the adjacent porous metal fin 2 using thermally conductive adhesive. The L-shaped microfin, connected by thermally conductive adhesive, conducts the heat from the hot end of the semiconductor cooling chip 3 to the adjacent porous metal fin 2 for heat dissipation.

[0063] Of course, one end of the L-shaped microfin can also be fixedly connected to the hot end of the semiconductor cooling chip 3 by welding, and the other end can be connected to the adjacent metal porous fin 2 by welding.

[0064] Example 3 This embodiment provides another specific embodiment of the refrigeration component.

[0065] In this embodiment, the cooling assembly further includes a second thermally conductive microfin 6 disposed at the cold end of the semiconductor cooling chip 3. The second thermally conductive microfin 6 includes a first fin 601 vertically connected to the cold end of the semiconductor cooling chip 3 and a second fin 602 crosswise mounted on the first fin 601. The first fin 601 extends through the top surface of the housing 1 into the cavity.

[0066] Specifically, the first fin 601 and the second fin 602 can be made of any suitable metal material, such as copper, aluminum, iron, or nickel. Additionally, they can be any shape suitable for heat conduction. It can be understood that when the thermoelectric cooler 3 is cooling, the first fin 601 connected to its cold end and the second fin 602 crosswise mounted on the first fin 601 allow the cold end of the thermoelectric cooler 3 to contact the phase change refrigerant in the cavity of the housing 1 through the heat-conducting fins 6, increasing the heat conduction area and improving cooling efficiency.

[0067] In addition, to prevent the phase change refrigerant in the cavity from leaking out from the connection between the first fin 601 and the housing 1, a sealing gasket is provided at the connection between the first fin 601 and the top surface of the housing 1.

[0068] Similarly, the first fin 601 can be fixedly connected to the cold end of the semiconductor refrigeration chip 3 by means of thermally conductive adhesive bonding, or it can be fixedly connected to the cold end of the semiconductor refrigeration chip 3 by means of welding or other methods.

[0069] Example 4 like Figure 3-4 As shown, this embodiment provides a specific implementation of the heat dissipation system.

[0070] In this embodiment, the heat dissipation system includes: a housing 7 and at least one phase change heat sink 11 as described in the above embodiment. The phase change heat sink 11 is fixedly installed inside the housing 7. A circulating fan is arranged at one end of the housing 7 corresponding to the heat dissipation channel of the phase change heat sink 11, and an air outlet is provided at the other end of the housing 7 corresponding to the heat dissipation channel.

[0071] It is understandable that the circulating fan can be a fan 8, which generates cooling airflow and forces the heat dissipation channel formed by the adjacent metal porous fins 2 and the adjacent first micro fins 4 of the phase change radiator 11 to dissipate heat, so that the heat in the heat dissipation channel or the vaporized phase change refrigerant is quickly discharged at the provided air outlet 9, thereby improving the heat dissipation efficiency of the phase change radiator 11.

[0072] In actual assembly, depending on the size of the housing 7 and the diameter of the fan 8, at least one fan 8 can be selected for arrangement.

[0073] Preferably, the outer casing 7 is further provided with a power supply interface and a communication interface. The power supply interface is electrically connected to the phase change heat sink 11 and the circulating fan, respectively, and the communication interface is communicatively connected to the phase change heat sink 11 and the circulating fan, thereby supplying power to the phase change heat sink 11 and the circulating fan, and controlling the start and stop of the phase change heat sink 11 and the circulating fan. Specifically, both the communication interface and the power supply interface are connected to the drive circuit board of the phase change heat sink 11, so as to control the start and stop of the semiconductor cooling chip 3 through the drive circuit board.

[0074] In addition, an intelligent control system can be set up. This system controls the start and stop of the phase change heat sink 11 and the circulating fan via power and communication interfaces, and adjusts the power of the thermoelectric elements and the fan to achieve both energy-saving operation and precise temperature control. Alternatively, depending on different operating conditions, the intelligent control system can control the operation of some or all of the thermoelectric cooling elements. These can all be designed and implemented by the user according to their specific needs.

[0075] Preferably, the phase change radiator 11 is further provided with mounting plates on both side walls, and mounting holes are provided on the mounting plates; the outer casing 7 is provided with threaded through holes corresponding to the mounting holes; the phase change radiator 11 is fixedly mounted on the outer casing 7 by fastening screws passing through the threaded through holes and mounting holes to prevent it from falling off.

[0076] Specifically, the working principle of this embodiment can be referred to in Embodiment 1, and will not be elaborated here.

[0077] It is understood that this embodiment utilizes a phase change cooling mechanism to overcome the failure of film boiling heat transfer; the foam fin structure, combined with capillary transport, enhances liquid distribution and heat exchange; the semiconductor cooling chip assists in temperature control, improving system response speed; a composite cooling mechanism is used: combining thermoelectric active cooling, phase change latent heat absorption, and forced air cooling, adapting to different working cycles; suitable for high heat flux density: the high heat generated during short-term laser emission can be rapidly absorbed by the ice phase change; through an intermittent cooling preparation mechanism, ice is actively made by the semiconductor cooling chip during non-emission stages, establishing a cold source in advance and reducing workload; compact and integrated structure: the coupling design of microfins, foam structure, and thermoelectric chip adapts to the size requirements of laser modules.

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and not to limit it; although the utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of this utility model or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the technical solution claimed by this utility model.

Claims

1. A phase change heat spreader, comprising: include: The casing has an internal cavity filled with a phase change refrigerant; One end face is provided with an injection hole that communicates with the cavity; Metal porous fins are arranged in parallel on the top surface of the shell, and a heat dissipation channel is formed between two adjacent metal porous fins; the bottom of each metal porous fin penetrates the top of the shell and contacts the phase change refrigerant. The refrigeration component is installed between two adjacent porous metal fins using thermally conductive adhesive, and its cold end contacts the phase change refrigerant in the cavity through the top surface of the housing.

2. The phase change heat spreader of claim 1, wherein: The cooling assembly includes a semiconductor cooling chip and a plurality of first thermally conductive microfins disposed at the hot end of the semiconductor cooling chip.

3. The phase change heat spreader of claim 2, wherein: Each of the first thermally conductive microfins is connected to an adjacent porous metal fin.

4. The phase change heat spreader of claim 2 or 3, wherein: The first thermally conductive microfin is an L-shaped microfin, and multiple L-shaped microfins are arranged in parallel at the hot end of the semiconductor cooling chip.

5. The phase change heat spreader of claim 2 or 3, wherein: The cooling assembly further includes a second thermally conductive microfin disposed at the cold end of the semiconductor cooling chip. The second thermally conductive microfin includes a first fin vertically connected to the cold end of the semiconductor cooling chip and a second fin crosswise mounted on the first fin. The first fin extends through the top surface of the housing into the cavity. A sealing gasket is provided at the connection between the first fin and the top surface of the housing.

6. The phase change heat spreader of claim 5, wherein: The bottom of the housing also has a receiving cavity for installing components to be cooled.

7. The phase change heat spreader of claim 6, wherein: It also includes a drive circuit board, which is disposed on the outside of the housing and electrically connected to the refrigeration component via wires.

8. A heat dissipation system, characterized by, include: The housing and at least one phase change heat sink according to any one of claims 1 to 7, wherein the phase change heat sink is fixedly installed inside the housing; a circulating fan is arranged at one end of the housing corresponding to the heat dissipation channel of the phase change heat sink, and an air outlet is provided at the other end of the housing corresponding to the heat dissipation channel.

9. The heat dissipation system of claim 8, wherein, The outer casing is also provided with a power supply interface and a communication interface. The power supply interface is electrically connected to the phase change heat sink and the circulating fan, respectively, and the communication interface is communicatively connected to the phase change heat sink and the circulating fan, respectively.

10. The heat dissipation system of claim 8 or 9, wherein, Mounting plates are provided on both sides of the phase change heat sink, and mounting holes are provided on the mounting plates; threaded through holes are provided on the outer shell corresponding to the mounting holes; the phase change heat sink is fixedly mounted on the outer shell by fastening screws passing through the threaded through holes and mounting holes.

Images