Liquid cooling plate structure

Abstract

This utility model discloses a liquid-cooled plate structure, relating to the field of laser technology. The liquid-cooled plate structure includes a plate body, a support portion, and a liquid-cooling structure. The plate body has a receiving end and a mounting end arranged opposite to each other, and a cavity is formed within the plate body. The support portion is formed on the receiving end, and one end of the support portion has an inwardly recessed liquid storage tank, with a conductive portion located in the middle of the liquid storage tank. The liquid-cooling structure connects the conductive portion and the cavity to introduce coolant into the liquid storage tank and the cavity. In this utility model's technical solution, water can be injected between the laser pump bottom surface and the surface of the water-cooled plate through the conductive portion to eliminate air between them, thereby reducing contact thermal resistance. Furthermore, a circulating water-cooling structure is also provided in the cavity. This dual-layer cooling structure can promptly remove heat from the plate body, thus achieving efficient cooling of the pump carrier.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a liquid cooling plate structure. Background Technology

[0002] In the actual production and testing of high-power semiconductor lasers, heat dissipation is a critical technology. This heat load is a key factor limiting the normal operation of the laser. When heat accumulates in critical parts of the laser to a certain level, its performance deteriorates rapidly, key parameters change, and in severe cases, the laser burns out. In actual production testing, thermal grease is typically applied between the laser and the water-cooling plate, or water is applied to ensure good contact and reduce thermal resistance. When replacing a laser for testing, the water-cooling plate surface needs to be cleaned and reapplied again to ensure normal production testing. This traditional production method is extremely inefficient. Utility Model Content

[0003] The main purpose of this invention is to propose a liquid-cooled plate structure, which aims to solve the problem that the water-cooling effect of traditional laser production structures is limited, which easily leads to a reduction in production efficiency.

[0004] To achieve the above objectives, the liquid-cooled plate structure proposed in this utility model includes:

[0005] The plate body has a receiving end and a mounting end that are arranged opposite to each other, and a cavity is formed inside the plate body;

[0006] A support portion is formed on the receiving end, and one end of the support portion is recessed inward to form a liquid storage tank, wherein a guiding portion is provided in the middle of the liquid storage tank; and,

[0007] A liquid-cooled structure is connected to the conductive part and the cavity part for introducing coolant into the liquid storage tank and the cavity part.

[0008] In one embodiment, the receiving end face is further provided with a liquid collection structure for collecting coolant overflowing from the liquid storage tank.

[0009] In one embodiment, the liquid collection structure includes a drain trough disposed on the receiving end, and a drain hole is provided at the lowest point of the drain trough;

[0010] The support portion is formed inside the drain trough, and a liquid-blocking portion is formed on the support portion at the midpoint between the storage tank and the drain trough.

[0011] In one embodiment, the bottom of the liquid storage tank is provided with a flow guiding structure, the flow guiding structure comprising:

[0012] The main tank section is located on the bottom surface of the liquid storage tank; and,

[0013] Multiple diversion channels are arranged alternately along the extension direction of the main channel end;

[0014] One end of the conductive part is located at the middle position of the bottom of the main groove section, and the other end of the conductive part is located on the mounting end.

[0015] In one embodiment, one end of the mounting end is recessed to its inner side to form a recessed groove.

[0016] A sealing plate is provided at the opening of the settling tank, and the cavity is formed between the settling tank and the sealing plate.

[0017] In one embodiment, a recessed platform is provided at the edge of the settling tank, and the sealing plate is installed on the recessed platform, with the outer end face of the sealing plate flush with the outer end face of the mounting end.

[0018] In one embodiment, a sealing groove is provided on the sunken platform, and a sealing ring is provided in the sealing groove, with one end of the sealing ring abutting against the sealing plate.

[0019] In one embodiment, the liquid cooling structure includes an inlet and an outlet disposed on the sealing plate;

[0020] One end of the water inlet and the water outlet are both connected to the cavity, and the water inlet and the water outlet are arranged alternately along the length of the sealing plate.

[0021] In one embodiment, the sealing plate is provided with a connection port corresponding to the conductive portion;

[0022] The liquid cooling structure also includes a liquid inlet pipe located outside the cavity at the connection port.

[0023] In one embodiment, the bottom of the settling tank is provided with multiple fins.

[0024] In this invention, water is injected between the bottom surface of the laser pump and the surface of the water-cooled plate through the conductive part to eliminate air between them and reduce contact thermal resistance. When the water level accumulated on the surface of the water-cooled plate is higher than the water-blocking parts around it, the excess water will be discharged through the drain holes at the lowest point of the drainage grooves around the water-cooled plate. Furthermore, a circulating water-cooling structure is also provided in the cavity. This double-layer cooling structure can promptly remove heat from the plate body, thereby achieving efficient cooling of the pump carrier. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0026] Figure 1 A schematic diagram of the overall structure of an embodiment of the liquid cooling plate structure provided by this utility model;

[0027] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0028] Figure 3 for Figure 1 A schematic diagram of the back structure of the liquid cooling plate structure;

[0029] Figure 4 for Figure 3 A schematic diagram of the liquid cooling plate structure excluding the sealing plate.

[0030] Explanation of icon numbers:

[0031] 100. Liquid-cooled plate structure; 1. Plate body; 11. Receiving end; 111. Liquid storage tank; 1111. Conducting part; 112. Drainage tank; 1121. Drainage hole; 113. Liquid blocking part; 12. Mounting end; 121. Settling tank part; 122. Lowering platform part; 1221. Sealing groove; 123. Sealing plate; 1231. Connection port; 2. Flow guiding structure; 21. Main tank section; 22. Diversion tank; 3. Liquid cooling structure; 31. Water inlet; 32. Water outlet; 33. Liquid inlet pipe; 4. Fins.

[0032] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0034] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0035] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0036] In the actual production and testing of high-power semiconductor lasers, heat dissipation is a critical technology. This heat load is a key factor limiting the normal operation of the laser. When heat accumulates in critical parts of the laser to a certain level, its performance deteriorates rapidly, key parameters change, and in severe cases, the laser burns out. In actual production testing, thermal grease is typically applied between the laser and the water-cooling plate, or water is applied to ensure good contact and reduce thermal resistance. When replacing a laser for testing, the water-cooling plate surface needs to be cleaned and reapplied again to ensure normal production testing. This traditional production method is extremely inefficient.

[0037] This utility model proposes a liquid cooling plate structure 100 to solve the above problems.

[0038] Please see Figures 1 to 2 In one embodiment of this utility model, a liquid-cooled plate structure 100 is provided, which includes a plate body 1, a support portion, and a liquid-cooling structure 3. The plate body 1 has a receiving end 11 and a mounting end 12 disposed opposite to each other, and a cavity is formed within the plate body 1. The support portion is formed on the receiving end 11, and a liquid storage tank 111 is recessed inward at one end of the support portion. A conductive portion 1111 is provided at the middle position of the liquid storage tank 111. The liquid-cooling structure 3 connects the conductive portion 1111 and the cavity to introduce coolant into the liquid storage tank 111 and the cavity.

[0039] In this embodiment, the main body 1 of the liquid-cooled plate structure 100 is specifically configured as a double-layer liquid-cooled structure 3. Specifically, the mounting end 12 is one end connected to the mounting structure, which is generally a frame structure, and the liquid-cooled plate structure 100 is usually installed using a detachable connection method. The receiving end 11 is one end where the pump carrier is placed. One layer of the double-layer liquid-cooled structure 3 includes a liquid storage tank 111 structure on the receiving end 11. The liquid-cooled structure 3 can continuously supply coolant to the liquid storage tank 111 through the conductive part 1111. The pump carrier is placed on the open end of the liquid storage tank 111, so when the liquid storage tank 111 is full of coolant, the surface of the coolant can continuously and effectively contact one end face of the pump carrier, thereby removing heat from the pump carrier. The second layer of the double-layer liquid cooling structure 3 is the cavity of the plate body 1. When the liquid cooling structure 3 is working, coolant can also be injected into the cavity. The entire cavity can effectively remove the heat from the entire plate body 1, thereby allowing the plate body 1 to have a relatively low temperature, which can promote the cooling effect of the coolant in the liquid storage tank 111. At the same time, it can effectively remove the heat transferred when in contact with the pump carrier, thereby improving the cooling effect on the entire pump carrier.

[0040] In the above structure, the liquid cooling structure 3 is connected to the liquid storage tank 111 and the cavity, and the liquid cooling structure 3 can continuously inject coolant into the liquid storage tank 111 and the cavity. It is conceivable that when the coolant overflows from the liquid storage tank 111, a corresponding liquid collection structure can be provided in the lower area of ​​the plate body 1 to collect the coolant. As for the cavity, a corresponding water inlet structure and water outlet structure can be provided on the cavity, and the liquid cooling structure 3 can be connected to the two interfaces to achieve a circulating supply of coolant. The above-mentioned liquid supply structure is a common structural feature and can be designed and used according to actual conditions; it will not be described in detail here.

[0041] In this embodiment, a liquid collection structure is also provided on the end face of the receiving end 11 to collect the coolant overflowing from the liquid storage tank 111.

[0042] The liquid collection structure includes a drain trough 112 provided on the receiving end 11, and a drain hole 1121 is provided at the lowest point of the drain trough 112; the support portion is formed inside the drain trough 112, and a liquid blocking portion 113 is formed on the support portion at the middle position corresponding to the liquid storage tank 111 and the drain trough 112.

[0043] like Figure 1 and Figure 4As shown, a drain trough 112 is formed on the outer periphery of the reservoir 111 structure, and a support platform is also formed on the plate body 1 corresponding to the outer periphery of the drain trough 112. A baffle 113 is formed between the drain trough 112 and the reservoir 111. To ensure that the coolant in the reservoir 111 can flow smoothly into the drain trough 112 and does not overflow from the outer periphery of the plate body 1, the actual height of the baffle 113 is approximately 1mm-2mm lower than the support platform. With this arrangement, when the coolant in the reservoir 111 flows into the drain trough 112, its surface can maintain good contact with the pump carrier without affecting the discharge of the coolant. Specifically, the coolant in the drain trough 112 collects at the lowest point of the drain hole 1121. In actual installation, a pipe structure can be connected to one end of the drain hole 1121 corresponding to the mounting end 12, so that the coolant discharged from the drain tank 112 can be collected in a centralized manner.

[0044] The depth of the reservoir 111 is approximately 2 mm to ensure that the coolant in the conductive section 1111 is evenly distributed throughout the reservoir 111. In this embodiment, a flow guiding structure 2 is provided at the bottom of the reservoir 111. The flow guiding structure 2 includes a main channel section 21 and multiple branch channels 22. The main channel section 21 is located on the bottom surface of the reservoir 111; the multiple branch channels 22 are arranged alternately along the extension direction of the main channel end; one end of the conductive section 1111 is located at the middle position of the bottom of the main channel section 21, and the other end of the conductive section 1111 is located on the mounting end 12.

[0045] like Figure 1 and Figure 2 As shown, the main tank section 21 is located at the middle position of the liquid storage tank 111 and extends along the length direction of the liquid storage tank 111. Multiple diversion tanks 22 are evenly spaced along the extension direction of the main tank section 21, and the diversion tanks 22 are perpendicular to the main tank section 21, as shown. Figure 1 As shown, multiple distribution channels 22 cover various positions on the bottom of the storage tank 111. When the guide section 1111 supplies water to the middle position of the main tank section 21, the coolant can flow along the main tank section 21 into the multiple distribution channels 22, thereby guiding the coolant to various positions in the storage tank 111 through the multiple distribution channels 22. This allows a uniform water film structure to be formed between the plate body 1 and the pump carrier end face as much as possible, effectively eliminating air on the contact surface of the pump carrier, reducing contact thermal resistance, and greatly improving heat transfer efficiency.

[0046] In one embodiment of this application, one end of the mounting end 12 is recessed to its inner side to form a recessed groove 121; a sealing plate 123 is provided at the opening of the recessed groove 121, and the cavity is formed between the recessed groove 121 and the sealing plate 123.

[0047] The opening of the cavity is located at the mounting end 12. During actual installation, the sealing plate 123 is installed at the opening of the sink 121 to seal the sink 121 and form a relatively sealed cavity structure.

[0048] In one embodiment, the liquid cooling structure 3 includes an inlet 31 and an outlet 32 ​​disposed on the sealing plate 123; one end of the inlet 31 and the outlet 32 ​​are both connected to the cavity portion, and the inlet 31 and the outlet 32 ​​are arranged alternately in the length direction of the sealing plate 123.

[0049] It is conceivable that the liquid cooling structure 3 also includes a coolant supply device. The inlet 31 of the coolant supply device is connected to the output end of the coolant supply device, and the outlet 32 ​​is connected to the input end of the coolant supply device, thereby forming a complete coolant circulation loop. In actual installation, it can be configured as follows... Figure 3 and Figure 4 As shown, the inlet 31 and the outlet 32 ​​are spaced apart along the length of the plate body 1, which can effectively increase the flow span of the coolant in the cavity and promote the cooling of the entire plate body 1.

[0050] Furthermore, in actual installation, the thickness between the bottom of the settling tank 121 and the bottom of the liquid storage tank 111 can be set to be relatively small. This allows the coolant to effectively carry away heat from the coolant in the liquid storage tank 111 during the flow of coolant in the cavity, contributing to a decrease in the temperature of the entire plate body 1.

[0051] In one embodiment of this application, the sealing plate 123 is provided with a connection port 1231 corresponding to the conductive part 1111; the liquid cooling structure 3 further includes a liquid inlet pipe 33 disposed outside the cavity at the connection port 1231.

[0052] The conductive part 1111 is located at the middle position of the liquid storage tank 111. The receiving end 11 is a fixing surface for installing the pump carrier. In order not to affect the installation of the pump carrier, in this embodiment, the water inlet end of the conductive part 1111 is located on the mounting end 12 side. Specifically, a connection port 1231 is provided on the sealing plate 123. One end of the conductive part 1111 is connected to the connection port 1231. In order to ensure the connection effect between the conductive part 1111 and the connection port 1231, a sealing ring (not shown in the figure) can be provided between the connection port 1231 and the end of the conductive part 1111. In the actual coolant supply process, a peristaltic pump can be connected to one end of the liquid inlet pipe 33, and the coolant can be guided from the conductive part 1111 to the liquid storage tank 111 through the pump body.

[0053] In the above embodiment, by placing the inlet pipe 33 on the sealing plate 123, the pump body structure can be positioned below the mounting end 12. For the overall machine structure, the corresponding test structure should be positioned above the plate body 1. Therefore, this structural arrangement effectively reduces the space occupied above the plate body 1, which is beneficial for the overall spatial layout of the machine.

[0054] As described above, the mounting end 12 is the mounting surface of the plate body 1. To ensure the overall aesthetics of the liquid cooling plate structure 100 and the installation stability of the mounting surface, in this embodiment, a recessed platform 122 is provided at the edge of the recessed groove 121. The sealing plate 123 is mounted on the recessed platform 122, and the outer end face of the sealing plate 123 is flush with the outer end face of the mounting end 12.

[0055] like Figure 4 As shown, a recessed platform 122 is formed at the mounting end 12 corresponding to the groove position of the recessed section 121. The depth of the recessed platform 122 and the thickness of the sealing plate 123 are substantially corresponding, and the cross-sectional size of the recessed platform 122 and the size of the sealing plate 123 are also corresponding. During installation, corresponding hole structures are provided on both the recessed platform 122 and the sealing plate 123. Specifically, the hole structure on the recessed platform 122 is a threaded hole. During installation, the sealing plate 123 is first recessed and placed over the recessed platform 122, and then the sealing plate 123 is installed on the recessed platform 122 using multiple screws.

[0056] To ensure the airtightness of the cavity, a sealing groove 1221 is provided on the recessed platform 122, and a sealing ring is provided in the sealing groove 1221. One end of the sealing ring abuts against the sealing plate 123.

[0057] The sealing ring is installed by limiting the sealing groove 1221, and one end of the sealing ring protrudes from the opening of the sealing groove 1221 so that after the sealing plate 123 is installed, it can form a tight contact with the end face of the sealing plate 123, thereby keeping the entire cavity in a good sealing state.

[0058] As described above, the coolant flowing through the cavity effectively removes heat from the entire plate body 1. To improve the heat exchange effect between the plate body 1 and the coolant in the cavity, in this embodiment, multiple fins 4 are provided at the bottom of the sink 121.

[0059] like Figure 4 As shown, multiple heat dissipation fins 4 are evenly spaced along the length of the plate body 1 at the bottom of the recess 121. To avoid affecting the flow of the coolant, the height of the multiple heat dissipation fins 4 is approximately one-third or one-half the depth of the recess 121. It should also be noted that the mounting ends 12 of the multiple heat dissipation fins 4 are staggered. Figure 4 As shown, the mounting ends 12 of two adjacent heat dissipation fins 4 are respectively disposed on two opposite end faces in the width direction of the recess 121, and a notch structure is formed between the end of each heat dissipation fin 4 away from its mounting end 12 and the side wall of the recess 121. This arrangement allows for the formation of a serpentine coolant flow loop within the recess 121, thereby further improving the flow effect of the coolant within the cavity. The arrangement of multiple heat dissipation fins 4 also further increases the heat exchange area between the plate body 1 and the coolant, thus achieving a better cooling effect on the plate body 1.

[0060] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A liquid-cooled plate structure, characterized in that, include: The plate body has a receiving end and a mounting end that are arranged opposite to each other, and a cavity is formed inside the plate body; A support portion is formed on the receiving end, and one end of the support portion is recessed inward to form a liquid storage tank, wherein a guiding portion is provided in the middle of the liquid storage tank; and, A liquid-cooled structure is connected to the conductive part and the cavity part for introducing coolant into the liquid storage tank and the cavity part.

2. The liquid-cooled plate structure as described in claim 1, characterized in that, The receiving end is also provided with a liquid collection structure for collecting coolant overflowing from the storage tank.

3. The liquid-cooled plate structure as described in claim 2, characterized in that, The liquid collection structure includes a drain trough provided on the receiving end, and a drain hole is provided at the lowest point of the drain trough; The support portion is formed inside the drain trough, and a liquid-blocking portion is formed on the support portion at the midpoint between the storage tank and the drain trough.

4. The liquid-cooled plate structure as described in claim 1, characterized in that, The bottom of the liquid storage tank is provided with a flow guiding structure, the flow guiding structure including: The main tank section is located on the bottom surface of the liquid storage tank; and, Multiple diversion channels are arranged alternately along the extension direction of the main channel end; One end of the conductive part is located at the middle position of the bottom of the main groove section, and the other end of the conductive part is located on the mounting end.

5. The liquid-cooled plate structure as described in claim 1, characterized in that, One end of the mounting end is recessed to its inner side to form a recessed groove. A sealing plate is provided at the opening of the settling tank, and the cavity is formed between the settling tank and the sealing plate.

6. The liquid-cooled plate structure as described in claim 5, characterized in that, The trough has a recessed platform at its rim, and the sealing plate is installed on the recessed platform, with the outer end face of the sealing plate flush with the outer end face of the mounting end.

7. The liquid-cooled plate structure as described in claim 6, characterized in that, A sealing groove is provided on the sunken platform, and a sealing ring is provided in the sealing groove. One end of the sealing ring abuts against the sealing plate.

8. The liquid-cooled plate structure as described in claim 5, characterized in that, The liquid cooling structure includes an inlet and an outlet disposed on the sealing plate; One end of the water inlet and the water outlet are both connected to the cavity, and the water inlet and the water outlet are arranged alternately along the length of the sealing plate.

9. The liquid-cooled plate structure as described in claim 5, characterized in that, The sealing plate is provided with a connection port corresponding to the conductive part; The liquid cooling structure also includes a liquid inlet pipe located outside the cavity at the connection port.

10. The liquid-cooled plate structure as described in claim 5, characterized in that, The bottom of the settling tank is provided with multiple fins.

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