Wireless charging components, electronic devices and wireless charging systems
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-10
- Publication Date
- 2026-08-11
AI Technical Summary
[0003]当无线充电接收设备或者无线充电发射设备跌落时,电感线圈由于自身重力导致的窜动容易使得电感线圈或者与电感线圈连接的器件被撕裂或变形失效
Smart Images

Figure CN224626323U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of wireless charging, and more particularly to a wireless charging component, electronic device, and wireless charging system. Background Technology
[0002] Wireless charging receivers (e.g., mobile phones) or wireless charging transmitters (e.g., wireless charging pads) achieve wireless charging through inductor coils. Inductor coils are typically made of metals such as copper and are relatively heavy.
[0003] When a wireless charging receiver or transmitter is dropped, the inductor coil may be torn or deformed due to the force of its own weight. Utility Model Content
[0004] This application provides a wireless charging component, electronic device, and wireless charging system that can improve the fixing effect of the inductor coil and improve the overall heat dissipation effect.
[0005] In a first aspect, a wireless charging component is provided, comprising: an inductor coil, a connecting piece, a bracket, and a first heat sink, wherein the inductor coil is connected to the connecting piece; the connecting piece is connected to the bracket; the first heat sink is connected to the bracket, a first portion of the first heat sink is attached to the surface of the bracket, and a second portion of the first heat sink is correspondingly disposed with respect to the surface of the inductor coil.
[0006] In the above embodiments, the inductor coil and the bracket are connected by a connecting piece, resulting in a better connection and reducing the possibility of wireless charging component failure due to inductor coil movement. Furthermore, the first heat sink includes a first portion attached to the surface of the bracket and a second portion corresponding to the surface of the inductor coil. The heat sink has a large area, resulting in better heat dissipation for the wireless charging component.
[0007] In conjunction with the first aspect, in some implementations of the first aspect, the connecting piece is a heat sink, and at least a portion of the connecting piece is attached to the surface of the bracket away from the first heat sink.
[0008] In the above embodiments, the connecting piece is attached to the surface of the bracket, thereby dissipating heat in the area near the bracket, thus further increasing the area of the heat dissipation area of this application and further improving the heat dissipation effect.
[0009] In conjunction with the first aspect, in some implementations of the first aspect, the wireless charging assembly further includes a second heat sink connected to the bracket and the connecting piece, at least a portion of the second heat sink being attached to the surface of the bracket away from the first heat sink.
[0010] In the above embodiments, the connecting piece connects the inductor coil, the bracket, and the second heat sink simultaneously, thereby improving the fixing effect of the inductor coil and enhancing the heat dissipation capacity of the wireless charging component.
[0011] In conjunction with the first aspect, in some implementations of the first aspect, at least one of the first heat sink, the connecting piece, and the second heat sink is a graphite heat sink.
[0012] In the above embodiments, for example, a graphite heat sink can be made by filling graphite powder into two thin containers formed of organic materials. Graphite heat sinks can also take other forms.
[0013] Optionally, the first and second heat sinks can also be, for example, heat spreaders or other types of heat sinks, and this application does not limit them.
[0014] In conjunction with the first aspect, in some implementations of the first aspect, the inductor coil is connected to the connecting piece by adhesive; the connecting piece is connected to the bracket by adhesive; the first portion of the first heat sink is connected to the surface of the bracket by adhesive; the second heat sink is connected to the bracket by adhesive and / or the second heat sink is connected to the connecting piece by adhesive.
[0015] In the above embodiments, the connection is achieved by adhesive bonding, resulting in a simple structure and a small overall volume for the wireless charging component. This allows for the thinning and lightening of electronic devices when the wireless charging component is installed in them.
[0016] In conjunction with the first aspect, in some implementations of the first aspect, the bracket is a motherboard bracket or a mid-frame.
[0017] If the electronic device contains a small board, the bracket can also be a small board bracket.
[0018] In some embodiments, the bracket may also be a structural component in an electronic device that provides support.
[0019] In a second aspect, an electronic device is provided, including a wireless charging component as described in the first aspect or any implementation thereof.
[0020] In conjunction with the second aspect, in some implementations of the second aspect, the electronic device includes an energy storage component electrically connected to the inductor coil, the energy storage component being used to discharge to and / or charge the inductor coil.
[0021] In the above embodiments, the wireless charging component can be used in electronic devices, which can wirelessly charge and / or wirelessly discharge through the wireless charging component.
[0022] In conjunction with the second aspect, in some implementations of the second aspect, the energy storage component is a battery, and the second portion of the first heat sink, on the surface away from the inductor coil, is disposed corresponding to the battery.
[0023] In the above embodiment, the second part of the first heat sink can be used to dissipate heat from the battery.
[0024] In conjunction with the second aspect, in some implementations of the second aspect, the electronic device includes a printed circuit board (PCB) disposed corresponding to the surface of a first portion of the first heat sink away from the bracket, the bracket being used to fix the PCB.
[0025] In the above embodiments, the first part of the first heat sink can be used for PCB heat dissipation.
[0026] Thirdly, a wireless charging system is provided, comprising: a first electronic device, which is the electronic device described in the second aspect or any implementation thereof; and a second electronic device, which includes an inductor coil coupled to an inductor coil in the first electronic device.
[0027] Optionally, the second electronic device may also be the electronic device described in the second aspect or any implementation thereof. Attached Figure Description
[0028] Figure 1 This is a schematic diagram of an electronic device 10 provided in an embodiment of this application.
[0029] Figure 2 This is a schematic diagram of a wireless charging scenario provided in an embodiment of this application.
[0030] Figure 3 This is a schematic structural diagram of a wireless charging component provided in an embodiment of this application.
[0031] Figure 4 This is an exploded view of a wireless charging component provided in an embodiment of this application.
[0032] Figure 5 This is an exploded view of a wireless charging component provided in an embodiment of this application.
[0033] Figure 6 This is a schematic structural diagram of a bracket provided in an embodiment of this application.
[0034] Figure 7 This is a schematic diagram showing the wireless charging component provided in this application in conjunction with other components in an electronic device. Detailed Implementation
[0035] The following explains the terminology that may appear in the embodiments of this application.
[0036] It should be understood that the term "and / or" used in this document is merely a description of the same field in the related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.
[0037] The phrase "within the range" used in this application, unless otherwise specified, includes both endpoints of the range by default. For example, in the range of 1 to 5, it includes the values 1 and 5.
[0038] Coupling can be understood as direct coupling and / or indirect coupling. "Coupled connection" can be understood as a direct coupling connection and / or indirect coupling connection. Direct coupling can also be called "electrical connection," which can be understood as physical contact and electrical conduction between components; it can also be understood as the form of connection between different components in a circuit structure through physical lines that can transmit electrical signals, such as copper foil or wires on a printed circuit board (PCB). "Indirect coupling" can be understood as electrical conduction between two conductors through a gap / non-contact method. In one embodiment, indirect coupling can also be called capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between the gaps between two conductive parts.
[0039] The technical solutions in this application will now be described with reference to the accompanying drawings.
[0040] like Figure 1 As shown, the electronic device 10 may include: a cover 13, a display / module 15, a printed circuit board (PCB) 17, a middle frame 19, and a rear cover 21. It should be understood that in some embodiments, the cover 13 may be a glass cover, but it may also be replaced with a cover made of other materials, such as a PET (Polyethylene terephthalate) cover.
[0041] The cover plate 13 can be set close to the display module 15, and can be mainly used to protect the display module 15 from dust.
[0042] In some embodiments, the display module 15 may include a liquid crystal display (LCD), a light emitting diode (LED) display panel, or an organic light-emitting diode (OLED) display panel, etc., and the embodiments of this application do not limit this.
[0043] The middle frame 19 mainly serves to support the entire machine. Figure 1 The diagram shows PCB 17 positioned between the middle frame 19 and the back cover 21. It should be understood that in some embodiments, PCB 17 may also be positioned between the middle frame 19 and the display module 15; this application does not impose limitations on this. The printed circuit board PCB 17 can be made of flame-retardant material (FR-4) dielectric substrate, Rogers dielectric substrate, or a hybrid dielectric substrate of Rogers and FR-4, etc. Here, FR-4 is a designation for a flame-retardant material grade, and Rogers dielectric substrate is a high-frequency board. Electronic components, such as radio frequency chips, are carried on PCB 17. In some embodiments, a metal layer can be provided on the printed circuit board PCB 17. This metal layer can be used for grounding the electronic components carried on the printed circuit board PCB 17, or for grounding other components, such as bracket antennas, frame antennas, etc. This metal layer can be called a ground plane, grounding layer, or grounding layer. In some embodiments, this metal layer can be formed by etching metal onto the surface of any dielectric substrate in PCB 17. In some embodiments, the metal layer for grounding may be disposed on the side of the printed circuit board PCB 17 near the mid-frame 19. In some embodiments, the edge of the printed circuit board PCB 17 may be considered as the edge of its ground layer. In some embodiments, the metal mid-frame 19 may also be used for grounding the aforementioned components. The electronic device 10 may also have other ground planes / grounding layers, as previously described, and will not be repeated here.
[0044] Due to the compact nature of electronic devices, a ground plane / grounding layer is typically provided in the internal space 0-2mm from the inner surface of the frame (e.g., printed circuit boards, mid-frames, screen metal layers, batteries, etc. can all be considered part of the ground plane). In some embodiments, a medium is filled between the frame and the ground plane. The length and width of the rectangle formed by the inner surface contour of the filling medium can be simply considered as the length and width of the ground plane; alternatively, the length and width of the rectangle formed by the superimposed contour of all conductive parts inside the frame can be considered as the length and width of the ground plane.
[0045] The electronic device 10 may also include a battery (not shown in the figure). The battery may be disposed between the middle frame 19 and the back cover 21, or between the middle frame 19 and the display module 15; this embodiment does not limit this. In some embodiments, the PCB 17 is divided into a motherboard and a daughterboard, and the battery may be disposed between the motherboard and the daughterboard. The motherboard may be disposed between the middle frame 19 and the upper edge of the battery, and the daughterboard may be disposed between the middle frame 19 and the lower edge of the battery.
[0046] The electronic device 10 may also include a frame 11, which may include a conductive material such as metal. The frame 11 may be disposed between the display module 15 and the back cover 21 and extend circumferentially around the periphery of the electronic device 10. The frame 11 may have four sides surrounding the display module 15 to help secure the display module 15.
[0047] In one implementation, the frame 11, primarily composed of conductive material, can be referred to as the conductive frame or metal frame of the electronic device 10, suitable for industrial design (ID) with a metallic appearance. In another implementation, the outer surface of the frame 11 is primarily made of conductive material, such as metal, thus forming the appearance of a metallic frame. In these implementations, the conductive portion of the outer surface of the frame 11 can be used as an antenna radiator of the electronic device 10, and is commonly referred to as a frame antenna.
[0048] In another implementation, the outer surface of the frame 11 is primarily made of a non-conductive material, such as plastic, forming the appearance of a non-metallic frame, suitable for non-metallic IDs. In another implementation, the inner surface of the frame 11 may include a conductive material, such as a metallic material. In this implementation, the conductive portion of the inner surface of the frame 11 can be used as an antenna radiator of the electronic device 10.
[0049] The middle frame 19 may include the frame 11. The middle frame 19, including the frame 11, is a single unit that supports the electronic components in the device. The cover plate 13 and the rear cover 21 respectively cover the upper and lower edges of the frame to form the housing of the electronic device. In some embodiments, the cover plate 13, the rear cover 21, the frame 11, and / or the middle frame 19 may be collectively referred to as the housing of the electronic device 10. It should be understood that "housing" may refer to part or all of any one of the cover plate 13, the rear cover 21, the frame 11, or the middle frame 19, or to any combination of the cover plate 13, the rear cover 21, the frame 11, or the middle frame 19.
[0050] Alternatively, the border 11 may not be considered part of the middle frame 19. In some embodiments, the border 11 may be connected to and integrally formed with the middle frame 19. In another embodiment, the border 11 may include an inwardly extending protrusion to connect with the middle frame 19, for example, by means of a spring, screw, welding, etc.
[0051] The back cover 21 can be made of metal; it can also be made of non-conductive material, such as a glass back cover, a plastic back cover, or other non-metallic back cover; or it can be made of both conductive and non-conductive materials. In some embodiments, the back cover 21, which includes conductive material, can replace the middle frame 19 and be integrated with the frame 11 as a whole, providing support for the electronic components in the device.
[0052] In some embodiments, conductive portions in the mid-frame 19 and / or rear cover 21 can serve as a reference ground for the electronic device 10, wherein the frame 11, PCB 17, etc. of the electronic device can be grounded through electrical connection with the mid-frame.
[0053] Figure 1 The electronic device 10 is shown only schematically, and the actual shape, size, and construction of these components are not subject to change. Figure 1 limited.
[0054] It should be understood that in the embodiments of this application, the side where the display screen of the electronic device is located can be considered as the front, the side where the back cover is located as the back, and the side where the frame is located as the side.
[0055] Figure 2 This is a schematic diagram of a wireless charging scenario provided in an embodiment of this application.
[0056] like Figure 2 As shown, electronic device 1 and electronic device 2 are close to each other, and coil 1 of electronic device 1 is coupled to coil 2 of electronic device 2.
[0057] In this device, electronic device 1 can serve as a wireless charging transmitter. For example, electronic device 1 can be a wireless charging base, or it can be an electronic device with the function of discharging through coil 1, and so on.
[0058] Electronic device 2 can act as a wireless charging receiver. For example, electronic device 2 can be a mobile phone, an earphone case, a watch, etc.
[0059] In a wireless charging scenario, coil 1 generates a time-varying magnetic field, and coil 2 couples the time-varying magnetic field to generate an induced current, thereby charging the wireless electronic device 2.
[0060] Figure 3 and Figure 4This is a schematic diagram of a wireless charging component provided in an embodiment of this application. To more easily illustrate the structure of the wireless charging component, the technical solution of this application embodiment is described using the application of the wireless charging component in a smartphone as an example. The structure is established with the width direction of the smartphone as the x-axis, the length direction as the y-axis, and the thickness direction as the z-axis. Figure 3 and Figure 4 The coordinate system shown. The two surfaces of each component along the positive z-axis are called the first surface and the second surface, respectively. For example, for... Figure 3 and Figure 4 The first heat sink 340 is attached to the surface of the bracket 330. The surface on which the first heat sink 340 is attached to the bracket 330 can be called the first surface of the first heat sink 340, and the surface on the first heat sink 340 that is away from the bracket 330 can be called the second surface.
[0061] Figure 3 The upper middle image is a positive isometric projection along the negative z-axis. Figure 3 The lower image is an isometric projection along the positive z-axis. Figure 4 It corresponds Figure 3 The exploded view above.
[0062] like Figure 3 and Figure 4 As shown, the wireless charging assembly includes: an inductor coil 310, a connecting piece 320, a bracket 330, and a first heat sink 340. The inductor coil 310 is connected to the connecting piece 320, and the connecting piece 320 is connected to the bracket 330. The first heat sink 340 is connected to the bracket 330, with a first portion 341 of the first heat sink 340 attached to the surface (second surface) of the bracket 330, and a second portion 342 of the first heat sink 340 correspondingly disposed to the surface (second surface) of the inductor coil 310.
[0063] The inductor coil 310 may have wireless charging transmitting and / or wireless charging receiving functions.
[0064] In some embodiments, the wireless charging component provided in this application may have a wireless charging transmission function, for example, it may be a wireless charging transmitter. Figure 2 The inductor coil 310 in the wireless charging assembly is a component of electronic device 1. It can be connected to an AC or DC power source (e.g., an energy storage device such as a battery) and emits energy obtained from the AC or DC power source through the inductor coil 310 to charge or power other electronic devices. Illustratively, the electronic device can be connected to an AC power source (e.g., a 220V power supply), and the inductor coil 310 will emit energy obtained from the AC power source to charge or power other devices. Illustratively, the electronic device can have a DC power source (e.g., a battery), and the inductor coil 310 can emit energy obtained from the battery to charge or power other devices.
[0065] In other embodiments, the wireless charging component provided in this application may have a wireless charging receiving function, for example, it may be a wireless charging receiving component. Figure 2 The inductor coil 310 is a component in electronic device 2. The energy received by the inductor coil 310 can be used by the electronic device or to charge energy storage components (such as batteries or capacitors) in the electronic device. Schematic, the inductor coil 310 in the wireless charging component can be electrically connected to the energy storage component to charge the energy storage component for use by the electronic device.
[0066] In other embodiments, the wireless charging component provided in this application can be applied to electronic devices that simultaneously possess wireless charging transmitting and receiving functions. The electronic device may include an energy storage component (e.g., a battery) electrically connected to the inductor coil 310. For example, when the electronic device acts as a wireless charging receiver, the inductor coil 310 can charge the battery by sensing the received energy; while when the electronic device acts as a wireless charging transmitter, the inductor coil 310 can transmit the energy stored in the battery to power other devices.
[0067] In this embodiment, since the inductor coil 310 is directly connected to the bracket 330 via the connecting piece 320, when the electronic device falls, the inductor coil 310's movement due to its own gravity can be suppressed by the fixing effect of the bracket 330, resulting in a good fixing effect. Furthermore, the first portion 341 of the first heat sink 340 is attached to the surface of the bracket 330, and the second portion 342 of the first heat sink 340 is correspondingly disposed with respect to the surface of the inductor coil 310 (for example, it can contact the second surface of the inductor coil 310 (i.e., the surface larger / farther in the positive z-axis direction or the surface closer to the positive z-axis direction)). Therefore, the area of the first heat sink 340 is large, resulting in better heat dissipation of the wireless charging component.
[0068] Additionally, the inductor coil 310 will be connected via, for example, a board-to-board (BTB) connector (e.g. Figure 4 The BTB connector 311 is connected to, for example, a PCB. When the inductor coil 310 moves, the pins of the BTB connector may deform or even crack under stress. The inductor coil 310 is implemented using a flexible printed circuit (FPC), which is also easily torn during movement. However, in the wireless charging assembly provided in this application embodiment, because the inductor coil 310 and the bracket 330 are well fixed, the movement of the inductor coil 310 is effectively suppressed. The possibility of BTB connector pin deformation and cracking, as well as inductor coil FPC cracking, can be reduced, thereby improving the reliability of the wireless charging assembly.
[0069] The connecting piece 320 can be a flexible piece, which can serve as a medium for connecting the inductor coil 310 and the bracket 330.
[0070] In some embodiments, such as Figure 3 and Figure 4 As shown, the wireless charging assembly also includes a second heat sink 321 connected to the bracket 330 and the connecting piece 320. At least a portion of the second heat sink 321 is attached to the surface of the bracket 330 away from the first heat sink 340 (the first surface). In this way, in addition to the first heat sink 340 being attached to the second surface of the bracket 330, the second heat sink 321 is attached to the other surface (the first surface) of the bracket 330, thereby enabling heat dissipation for the entire wireless charging module and improving the heat dissipation effect.
[0071] Optionally, the second heat sink 321 can also be replaced with a Mylar sheet of the same shape.
[0072] In other embodiments, Figure 3 and Figure 4 The second heat sink 321 and the connecting piece 320 can be a single component, which can still be referred to as the connecting piece.
[0073] Figure 5 An exploded view of another wireless charging component provided in an embodiment of this application is shown. Figure 5 As shown, the inductor coil 310 is connected to the bracket 330 via a connecting piece 320', which can be attached to the surface of the bracket 330 away from the first heat sink 340 (the first surface). The connecting piece 320' can have only a connecting function, connecting the inductor coil 310 and the bracket 330, providing good fixation for the inductor coil 310 and suppressing its movement. Alternatively, the connecting piece 320' can also have a heat dissipation function, thereby enhancing the heat dissipation effect of the entire wireless charging assembly.
[0074] When a wireless charging assembly with a second heat sink 321 or a connecting piece 320' that has a heat dissipation function is used in electronic devices such as smartphones, the heat dissipation area is significantly increased compared to the current solution that only uses a single-layer heat sink. For example, it can be increased by 700mm. 2 When electronic devices are in a gaming environment, the heat dissipation capacity can be increased by 0.3-0.4 mA / ℃, improving the heat dissipation experience of mobile phones.
[0075] In the embodiments of this application, the connecting piece 320 / 320' (when it only has a connecting function) can be made of organic material and has a certain degree of bending capability. For example, the connecting piece 320 / 320' can be Mylar sheet. Mylar sheet can be a plastic sheet made of polyethylene terephthalate (PET).
[0076] In the embodiments of this application, the first heat sink 340, the second heat sink 321, or the connecting piece 320' can be a graphite heat sink.
[0077] In one embodiment, a graphite heat sink can be formed by loading graphite powder into a thin plastic container (e.g., a container made of double-layered PET). In other embodiments, the graphite heat sink can also be formed, for example, by forming a composite heat dissipation film with graphite and other materials, such as forming a multilayer structure with metal foil (copper, aluminum, etc.), thereby enhancing the thermal conductivity of the graphite heat sink both within the sheet and in the vertical direction.
[0078] Graphite heat sinks can be implemented in other ways, and this application does not limit them.
[0079] Optionally, in some embodiments, the first heat sink 340, the second heat sink 321, or the connecting piece 320' can also be other forms of heat sinks, such as a structure that dissipates heat through a vapor chamber, that is, through capillary action.
[0080] In the embodiments of this application, the first heat sink 340, the second heat sink 321, or the connecting piece 320' may use the same type of heat dissipation structure or different types of heat dissipation structures, and this application does not limit this.
[0081] Figures 3 to 5 The connections between different components (including the connection between inductor coil 310 and connecting piece 320, the connection between connecting piece 320 and second heat sink 321, the connection between connecting piece 320 and bracket 330, the connection between second heat sink 321 and bracket 330, the connection between first heat sink 340 and bracket 330, the connection between inductor coil 310 and connecting piece 320', and the connection between connecting piece 320' and bracket 330) can be achieved by adhesive bonding. Adhesive bonding can be achieved by curing solid or liquid adhesives. Adhesives can include dispensing, backing adhesive, or other forms. Backing adhesive can be a solid adhesive, such as acrylic or other materials. Dispensing adhesive can be a liquid adhesive, which connects different components after curing; for example, dispensing adhesive can be epoxy resin, acrylic, or other materials.
[0082] For the connection between the connecting piece 320' and the bracket 330, the connection between the second heat sink 321 and the bracket 330, and the connection between the first heat sink 340 and the bracket 330, adhesive backing or dispensing can be applied to the second surface of the connecting piece 320' (and / or the first surface of the bracket 330), the second surface of the second heat sink 321 (and / or the first surface of the bracket 330), and the first surface of the first heat sink 340 (and / or the second surface of the bracket 330) respectively, so that the various components can be reliably connected.
[0083] For the connections between components such as inductor coil 310, connecting piece 320 / 320', second heat sink 321, and bracket 330, the first surface of inductor coil 310 and the second surface of connecting piece 320 / 320' can form an adhesive surface, or the second surface of inductor coil 310 and the first surface of connecting piece 320 / 320' can form an adhesive surface, the second surface of connecting piece 320 / 320' and the first surface of bracket 330 can form an adhesive surface, and the first surface of connecting piece 320 and the second surface of heat sink 321 can form an adhesive surface, or the second surface of connecting piece 320 and the first surface of heat sink 321 can form an adhesive surface. The connecting piece 320 / 320' and the second heat sink 321 are flexible sheets, allowing them to partially adhere to the bracket 330.
[0084] It should be understood that, in addition to adhesive bonding, different components can be connected by other methods, such as threaded connections and limiting mechanisms. These other connection methods can be used alone or in combination with adhesive bonding to achieve a reliable connection between different components.
[0085] It should be understood that the surface of the bracket 330 may have protrusions of different shapes for fixing or connecting other devices. The connection between the bracket 330 and other components, such as the motherboard, may also utilize additional connectors (e.g., threaded connectors). The components such as the first heat sink 340, connecting piece 320, second heat sink 321, and connecting piece 320' connected to the bracket 330 may have openings to avoid these protruding structures or additional connectors, thereby making the bonding surface between the bracket 330 and these components smoother and improving the reliability of the connection.
[0086] In this embodiment, the bracket 330 can be a motherboard bracket, a small board bracket, a mid-frame, or other components that provide support.
[0087] When the bracket 330 is a motherboard bracket, it can be a structure with a main body (which may be made of organic material) whose surface can be integrally formed with multiple protrusions and recesses for use with other components (such as a PCB). The bracket may also include reinforcing portions made of metal (such as reinforcing steel sheets) to provide structural strength. The reinforcing portions can be inserted into the main body to form the bracket 330. The surface of the main body is relatively uneven, while the reinforcing structure can be relatively flat. In this way, the second heat sink 321 and the first heat sink 340 or connecting piece 320' can primarily adhere to the relatively flat surface of the reinforcing structure, thereby improving the adhesion between the interfaces. Furthermore, for certain devices mounted on the bracket, the first heat sink 340 and the second heat sink 321 may affect device performance. For example, antennas and other devices may be mounted on the bracket 330; graphite heat sinks may affect the antenna's signal transmission and reception. In this case, the interference can be avoided by creating openings in the heat sink. Figure 6 A schematic diagram of the reinforcing region A of the bracket 330 is shown. The second heat sink 321 or the connecting piece 320' can be mainly attached to region A of the bracket 330, and the first heat sink 340 can also be attached to the other surface of the bracket 330 corresponding to region A.
[0088] When the bracket 330 is a small board bracket or a middle frame, the second heat sink 321 and the connecting piece 320' can still be attached to a relatively flat area of the bracket 330. The attachment method can be set according to the specific structure of the bracket 330, which will not be elaborated here.
[0089] In this embodiment of the application, when the wireless charging component is disposed in the electronic device, the electronic device may further include an energy storage component, which may be electrically connected to the inductor coil 310 to discharge to or charge the inductor coil 310.
[0090] The energy storage component can be a battery, and the second part 342 of the first heat sink 340, away from the surface of the inductor coil 310 (the second surface), can be set to correspond to the energy storage component.
[0091] The electronic device may also include a printed circuit board (PCB), which may be disposed corresponding to the surface of the first portion 341 of the first heat sink 340 away from the bracket 330.
[0092] In this way, the first part 341 and the second part 342 of the first heat sink 340 can be respectively positioned to correspond to the surface of the PCB and the surface of the battery / inductor coil 310, thereby effectively dissipating heat for the PCB and the battery / inductor coil 310.
[0093] In this embodiment, "two surfaces correspondingly arranged" can refer to two surfaces that are adjacent to each other without any other components between them, and the distance between the two correspondingly arranged surfaces can be small. In some embodiments, the two correspondingly arranged surfaces can at least partially adhere to or contact each other.
[0094] like Figure 7 As shown, the battery 350 can be disposed on the second surface side of the second portion 342 of the first heat sink 340, and the PCB 360 can be disposed on the second surface side of the first portion 341 of the first heat sink 340. The PCB 360 can be engaged and fixed with the bracket 330 through a structural component (or a connector additionally disposed in the uncovered area) exposed by the area not covered by the first portion 341 of the first heat sink 340.
[0095] Inductor 310 can be electrically connected to battery 350 via PCB 360. For example, inductor 310 can be connected to PCB 360 via BTB connector 311, and battery 350 can also be connected to PCB 360 via BTB connector 351, thus inductor 310 and battery 350 can be electrically connected via PCB 360.
[0096] In this embodiment, the electronic device may also include a threaded connector 370 for connection, thereby providing a reliable connection between the bracket 330, the PCB 360 and other structures in the electronic device.
[0097] This application also provides an electronic device that includes a wireless charging component as described above.
[0098] This application also provides a wireless charging system, including a first electronic device and a second electronic device. The first electronic device may include the wireless charging component described above, and the second electronic device may include an inductor coil coupled to the inductor coil in the first electronic device.
[0099] In some embodiments, the second electronic device may also include a wireless charging component as described above.
[0100] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A wireless charging assembly, comprising: It includes an inductor coil (310), a connecting piece (320 / 320'), a bracket (330), and a first heat sink (340), wherein, The inductor coil (310) is connected to the connecting piece (320 / 320'); The connecting piece (320 / 320') is connected to the bracket (330); The first heat sink (340) is connected to the bracket (330), the first part (341) of the first heat sink (340) is attached to the surface of the bracket (330), and the second part (342) of the first heat sink (340) is correspondingly disposed to the surface of the inductor coil (310).
2. The wireless charging assembly of claim 1, wherein, The connecting piece (320') is a heat sink, and at least a portion of the connecting piece (320') is attached to the surface of the bracket (330) away from the first heat sink (340).
3. The wireless charging component according to claim 1, characterized in that, The wireless charging assembly also includes a second heat sink (321) connected to the bracket (330) and the connecting piece (320), at least a portion of the second heat sink (321) being attached to the surface of the bracket (330) away from the first heat sink (340).
4. The wireless charging component according to any one of claims 1 to 3, characterized in that, At least one of the first heat sink (340), the connecting piece (320'), and the second heat sink (321) is a graphite heat sink.
5. The wireless charging component according to any one of claims 1 to 3, characterized in that, The inductor coil (310) and the connecting piece (320 / 320') are connected by adhesive. The connecting piece (320 / 320') is connected to the bracket (330) by adhesive bonding; The first part (341) of the first heat sink (340) is connected to the surface of the bracket (330) by adhesive bonding; The second heat sink (321) is connected to the bracket (330) by adhesive bonding; and / or The second heat sink (321) is connected to the connecting piece (320) by adhesive bonding.
6. The wireless charging component according to any one of claims 1 to 3, characterized in that, The bracket (330) is a motherboard bracket (330) or a mid-frame.
7. An electronic device, characterized in that, Includes the wireless charging component as described in any one of claims 1 to 6.
8. The electronic device according to claim 7, characterized in that, The electronic device includes an energy storage component electrically connected to the inductor coil (310), the energy storage component being used to discharge to and / or charge the inductor coil (310).
9. The electronic device according to claim 8, characterized in that, The energy storage component is a battery, and the second part (342) of the first heat sink (340) is disposed on the surface away from the inductor coil (310) corresponding to the battery.
10. The electronic device according to any one of claims 7 to 9, characterized in that, The electronic device includes a printed circuit board (PCB), which is disposed corresponding to the surface of the first portion (341) of the first heat sink (340) away from the bracket (330), and the bracket (330) is used to fix the PCB.
11. A wireless charging system, characterized in that, include: A first electronic device, wherein the first electronic device is the electronic device as described in any one of claims 7 to 10; The second electronic device includes an inductor (310) coupled to an inductor (310) in the first electronic device.