Frequency hopping filter

Abstract

This application provides a frequency-hopping filter, relating to the field of communication technology. It includes: a dielectric resonator, a switched capacitor matrix, a high-voltage drive module, and a numerically controlled storage module. The numerically controlled storage module and the high-voltage drive module are communicatively connected. The switched capacitor matrix and the dielectric resonator are connected via a bus. The switched capacitor matrix is ​​composed of a first switched capacitor unit and a second switched capacitor unit connected in parallel. The high-voltage drive module is electrically connected to the first switched capacitor unit and the second switched capacitor unit. This application uses a dielectric resonator instead of the traditional LC or cavity resonator, enabling the frequency-hopping filter to simultaneously possess a high Q value, large power capacity, and low loss. By simply adjusting the matrix capacitor value, the filter can achieve a good frequency response curve during frequency modulation, with less debugging time and easier engineering. This allows the filter to reduce size, decrease internal device losses, improve RF performance, and reduce production costs.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a frequency hopping filter. Background Technology

[0002] Frequency hopping filters are widely used in multi-passband, broadband, and frequency hopping communication and radar systems, and are an important component of the system's radio frequency front end.

[0003] Based on the resonance method, frequency hopping filters mainly include four types: inductor-capacitor (LC) electrically tunable filters, switched capacitor matrix LC frequency hopping filters, cavity resonant frequency hopping filters, and microstrip resonant frequency hopping filters.

[0004] LC electrically tunable filters have low power capacity and small size, and are generally suitable for receiver links or small signal transmitter links. Switched capacitor matrix LC frequency hopping filters have higher power capacity, but due to the rapid degradation of the quality factor (Q) and large insertion loss at high frequencies, they are not suitable for high-power RF front-ends and low-noise receiver front-ends. Cavity resonant frequency hopping filters have advantages such as high power capacity and high Q value, but they are large in size, have high structural cost, and complex assembly processes.

[0005] In summary, existing frequency hopping filters cannot effectively balance the relationship between Q value and structural complexity. Utility Model Content

[0006] This application provides a frequency hopping filter to address the shortcomings of existing frequency hopping filters that cannot effectively balance the relationship between Q value and structural complexity, thereby simplifying the structure of the frequency hopping filter while ensuring a high Q value.

[0007] This application provides a frequency hopping filter, including: a dielectric resonator, a switched capacitor matrix, a high-voltage drive module, and a numerically controlled storage module. The numerically controlled storage module and the high-voltage drive module are communicatively connected. The switched capacitor matrix and the dielectric resonator are connected via a bus. The switched capacitor matrix is ​​composed of a first switched capacitor unit and a second switched capacitor unit connected in parallel. The high-voltage drive module and the first switched capacitor unit are electrically connected, and the high-voltage drive module and the second switched capacitor unit are electrically connected.

[0008] According to the frequency hopping filter provided in this application, the first switched capacitor unit includes a first diode, a second diode, a first capacitor, a second capacitor, a third capacitor, a first resistor, and a second resistor. One end of the first capacitor, the cathode of the first diode, and one end of the first resistor are electrically connected; One end of the second capacitor, the positive terminal of the second diode, and one end of the second resistor are electrically connected; The other end of the first capacitor and the other end of the second capacitor are grounded. The positive terminal of the first diode, the other end of the first resistor, the other end of the second resistor, the negative terminal of the second diode, and one end of the third capacitor are electrically connected. The other end of the third capacitor is connected to the bus.

[0009] According to the frequency hopping filter provided in this application, the second switched capacitor unit includes a third diode, a fourth diode, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, a third resistor, and a fourth resistor: One end of the fourth capacitor, the cathode of the third diode, and one end of the third resistor are electrically connected; One end of the fifth capacitor, the positive terminal of the fourth diode, and one end of the fourth resistor are electrically connected; The positive terminal of the third diode, the other end of the third resistor, and one end of the sixth capacitor are electrically connected; The negative terminal of the fourth diode, the other end of the fourth resistor, and one end of the seventh capacitor are electrically connected; The other ends of the fourth capacitor and the fifth capacitor are grounded; The other ends of the sixth capacitor and the seventh capacitor are both connected to the bus.

[0010] According to the frequency hopping filter provided in this application, the number of switched capacitor matrices is 2, the number of dielectric resonators is 2, one switched capacitor matrix is ​​connected to one dielectric resonator, and two switched capacitor matrices are connected through an eighth capacitor.

[0011] According to the frequency hopping filter provided in this application, the high-voltage drive module is connected to an external power supply.

[0012] According to the frequency hopping filter provided in this application, the switched capacitor matrix is ​​composed of multiple first switched capacitor units and multiple second switched capacitor units connected in parallel.

[0013] According to the frequency hopping filter provided in this application, the high-voltage drive module is electrically connected to the first resistor or the second resistor.

[0014] According to the frequency hopping filter provided in this application, the high-voltage drive module is electrically connected to the third or fourth resistor.

[0015] According to the frequency hopping filter provided in this application, the first switched capacitor unit and the second switched capacitor unit are evenly distributed on both sides of the bus, and the input terminal and the output terminal of the bus are both grounded.

[0016] The frequency hopping filter provided in this application also includes a housing.

[0017] The frequency hopping filter provided in this application includes: a dielectric resonator, a switched capacitor matrix, a high-voltage drive module, and a numerically controlled storage module. The numerically controlled storage module and the high-voltage drive module are communicatively connected. The switched capacitor matrix and the dielectric resonator are connected via a bus. The switched capacitor matrix is ​​composed of a first switched capacitor unit and a second switched capacitor unit connected in parallel. The high-voltage drive module is electrically connected to the first switched capacitor unit and the second switched capacitor unit. This application uses a dielectric resonator to replace the traditional LC or cavity resonator, enabling the frequency hopping filter to simultaneously possess a high Q value, large power capacity, and low loss. By simply adjusting the matrix capacitor value, the filter can achieve a good frequency response curve during frequency modulation, with less debugging time and easier engineering. This allows the filter to reduce size, reduce internal device losses, improve RF performance, and reduce production costs. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the switched capacitor matrix and dielectric resonator provided in this application.

[0020] Figure 2 This is one of the structural schematic diagrams of the frequency hopping filter provided in this application.

[0021] Figure 3 This is the second schematic diagram of the frequency hopping filter provided in this application.

[0022] Figure 4 These are the simulation results of the frequency hopping filter provided in this application.

[0023] Figure label: 11: First resistor; 12: Second resistor; 13: Third resistor; 14: Fourth resistor; 21: First diode; 22: Second diode; 23: Third diode; 24: Fourth diode; 31: First capacitor; 32: Second capacitor; 33: Third capacitor; 34: Fourth capacitor; 35: Fifth capacitor; 36: Sixth capacitor; 37: Seventh capacitor; 38: Eighth capacitor; 41: First dielectric resonator; 42: Second dielectric resonator; 100: First switched capacitor unit; 200: Second switched capacitor unit; 300: Switched capacitor matrix; 400: Numerical control storage module; 500: High voltage drive module; 600: Housing; 50: Bus; 60: Input / output interface. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that in the description of the embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terms "upper," "lower," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; and they can be internal connections between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0026] The design principle of inductor-capacitor (LC) electrically tunable filters is mainly based on the characteristics of varactor tubes. They have small power capacity, generally below 20dBm. Since the Q value of the LC structure deteriorates rapidly at high frequencies and the insertion loss is also large, they are generally suitable for receiving links or small signal transmitting links. Due to the inductor characteristics, the LC resonant configuration requires glue for fixing, and the performance indicators will deteriorate during the glue dispensing process, making debugging more difficult.

[0027] Similar to LC-based electrically tunable filters, LC-based frequency hopping filters with switched capacitor matrices suffer from rapid Q-value degradation at high frequencies, resulting in significant insertion loss. They are generally suitable for Very High Frequency (VHF) and Ultra High Frequency (UHF) applications. Due to their multi-layered stacked structure, they require consideration of high magnetic ring height and board-to-board height, resulting in a relatively large size. This makes them unsuitable for high-power RF front-ends and low-noise receiver front-ends. LC resonant configurations, due to their inductive characteristics, require adhesive bonding for fixation. However, performance deteriorates during the adhesive bonding process, making debugging more difficult.

[0028] Mechanical motor-controlled adjustable filters have low frequency hopping rates, require motor control, are bulky, and have low trajectory accuracy when the motor adjusts the frequency, leading to deterioration of in-band matching and Q value within the cavity, resulting in severe distortion of their frequency response curve.

[0029] Cavity frequency hopping filter: Due to its structural characteristics, it requires the configuration of cavity, RF module, CNC module, power supply module and isolation module. The assembly process is complicated and the assembled size is large, resulting in low applicability. The cavity resonant configuration requires screws or structural parts to be welded and fixed, and some positions need to be glued for curing, resulting in high assembly cost, high debugging difficulty and high production cost.

[0030] To address the aforementioned issues, this application presents a frequency hopping filter.

[0031] Figure 1 This is a schematic diagram of the frequency hopping filter provided in this application, as shown below. Figure 1 As shown, a frequency hopping filter includes: a dielectric resonator, a switched capacitor matrix 300, a high-voltage drive module 500, and a numerically controlled storage module 400. The numerically controlled storage module 400 and the high-voltage drive module 500 are communicatively connected. The switched capacitor matrix 300 and the dielectric resonator are connected via a bus 50. The switched capacitor matrix 300 is composed of a first switched capacitor unit 100 and a second switched capacitor unit 200 connected in parallel. The high-voltage drive module 500 is electrically connected to the first switched capacitor unit 100 and the second switched capacitor unit 200.

[0032] This application uses a radio frequency dielectric resonator (dielectric resonator) to replace the traditional LC or cavity resonator. With LC and cavity resonators, tuning still requires adjusting the inductor or cavity while tuning the capacitor to achieve a better resonant frequency response curve. The main characteristics of a dielectric resonator are high Q value, large power capacity, and low loss. By simply adjusting the matrix capacitor value, the filter can achieve a good frequency response curve during frequency tuning, with less tuning time and easier engineering. This allows the filter to reduce size, decrease internal device losses, improve RF performance, and reduce production costs.

[0033] The frequency-hopping filter of this application includes an RF module and a control module. The control module includes a high-voltage drive module 500 and a numerically controlled storage module 400. The RF module includes a dielectric resonator and a switched capacitor matrix 300. The numerically controlled storage module 400 includes a data storage chip, and the high-voltage drive module 500 includes a high-voltage drive integrated chip. The data storage chip stores the resonant capacitance data of the frequency-hopping filter and, through an external address code, retrieves the stored internal resonant capacitance data to control the high-voltage drive integrated chip. The output voltage controls the switched capacitor matrix 300 to adjust the capacitance value of the switched capacitor matrix 300, thereby adjusting the operating frequency of the frequency-hopping filter.

[0034] Understandably, the high-voltage drive module 500 is connected to an external power supply.

[0035] The high-voltage drive module 500 is connected to an external power supply to obtain high and low voltages, and outputs the final voltage through the high-voltage drive integrated chip to regulate the capacitance value of the switched capacitor matrix 300.

[0036] The frequency hopping filter provided in this application includes: a dielectric resonator, a switched capacitor matrix 300, a high-voltage drive module 500, and a numerically controlled storage module 400. The numerically controlled storage module 400 and the high-voltage drive module 500 are communicatively connected. The switched capacitor matrix 300 and the dielectric resonator are connected via a bus 50. The switched capacitor matrix 300 is composed of a first switched capacitor unit 100 and a second switched capacitor unit 200 connected in parallel. The high-voltage drive module 500 is electrically connected to the first switched capacitor unit 100 and the second switched capacitor unit 200. This application uses a dielectric resonator to replace the traditional LC or cavity resonator, enabling the frequency hopping filter to simultaneously possess a high Q value, large power capacity, and low loss. By simply adjusting the matrix capacitor value, the filter can achieve a good frequency response curve during frequency modulation, with less debugging time and easier engineering. This allows the filter to reduce size, reduce internal device losses, improve RF performance, and reduce production costs.

[0037] This application effectively reduces the size of the frequency hopping filter, reduces the number of components used, and also saves costs. Furthermore, the frequency hopping filter of this application can maintain a good Chebyshev waveform throughout the frequency hopping range, and does not significantly deteriorate the standing wave ratio and in-band insertion loss.

[0038] It is understood that the first switched capacitor unit 100 includes a first diode 21, a second diode 22, a first capacitor 31, a second capacitor 32, a third capacitor 33, a first resistor 11, and a second resistor 12. One end of the first capacitor 31, the negative terminal of the first diode 21, and one end of the first resistor 11 are electrically connected; One end of the second capacitor 32, the positive terminal of the second diode 22, and one end of the second resistor 12 are electrically connected; The other end of the first capacitor 31 and the other end of the second capacitor 32 are grounded; The positive terminal of the first diode 21, the other end of the first resistor 11, the other end of the second resistor 12, the negative terminal of the second diode 22, and one end of the third capacitor 33 are electrically connected. The other end of the third capacitor 33 is connected to bus 50.

[0039] It is understood that the second switched capacitor unit 200 includes a third diode 23, a fourth diode 24, a fourth capacitor 34, a fifth capacitor 35, a sixth capacitor 36, a seventh capacitor 37, a third resistor 13, and a fourth resistor 14. One end of the fourth capacitor 34, the cathode of the third diode 23, and one end of the third resistor 13 are electrically connected; One end of the fifth capacitor 35, the positive terminal of the fourth diode 24, and one end of the fourth resistor 14 are electrically connected; The positive terminal of the third diode 23, the other end of the third resistor 13, and one end of the sixth capacitor 36 are electrically connected; The negative terminal of the fourth diode 24, the other end of the fourth resistor 14, and one end of the seventh capacitor 37 are electrically connected; The other end of the fourth capacitor 34 and the other end of the fifth capacitor 35 are grounded; The other end of the sixth capacitor 36 and the other end of the seventh capacitor 37 are both connected to bus 50.

[0040] It is understandable that the switched capacitor matrix 300 is composed of multiple first switched capacitor units 100 and multiple second switched capacitor units 200 connected in parallel.

[0041] It is understandable that the first switched capacitor unit 100 and the second switched capacitor unit 200 are evenly distributed on both sides of the bus 50, and the input terminal and the output terminal of the bus 50 are both grounded.

[0042] It is understandable that the high-voltage drive module 500 is electrically connected to the first resistor 11 or the second resistor 12.

[0043] It is understandable that the high-voltage drive module 500 is electrically connected to the third resistor 13 or the fourth resistor 14.

[0044] like Figure 1As shown, the first switched capacitor unit 100 includes a first diode 21, a second diode 22, a first capacitor 31, a second capacitor 32, a third capacitor 33, a first resistor 11, and a second resistor 12. The second switched capacitor unit 200 includes a third diode 23, a fourth diode 24, a fourth capacitor 34, a fifth capacitor 35, a sixth capacitor 36, a seventh capacitor 37, a third resistor 13, and a fourth resistor 14. The first capacitor 31 and the second capacitor 32 of all first switched capacitor units 100 are grounded. The fourth capacitor 34 and the fifth capacitor 35 of all second switched capacitor units 200 are grounded. Figure 1 It comprises two switched capacitor matrices 300. Each switched capacitor matrix 300 includes seven first switched capacitor units 100 and three second switched capacitor units 200. All seven first switched capacitor units 100 and three second switched capacitor units 200 are connected in parallel. The bus 50 includes an RF bus 50. Both the first switched capacitor units 100 and the second switched capacitor units 200 are connected to the bus 50 and are evenly arranged on both sides of the bus 50, thereby enabling RF control of each first switched capacitor unit 100 or second switched capacitor unit 200. Figure 1 As shown, in each switched capacitor matrix 300, four first switched capacitor units 100 and one second switched capacitor unit 200 are evenly arranged on one side of the bus 50. Three first switched capacitor units 100 and two second switched capacitor units 200 are evenly arranged on the other side of the bus 50.

[0045] The high-voltage drive module 500 is electrically connected to the first resistor 11 or the second resistor 12 of each first switched capacitor unit 100, thereby regulating the voltage input to each first switched capacitor unit 100. The high-voltage drive module 500 is also electrically connected to the third resistor 13 or the fourth resistor 14 of each second switched capacitor unit 200, thereby regulating the voltage input to each second switched capacitor unit 200.

[0046] Furthermore, the high-voltage drive module 500 is electrically connected to the first resistor 11 or the second resistor of each first switched capacitor unit 100, thereby inputting control data to each first switched capacitor unit 100 to regulate the generation of radio frequency signals in each first switched capacitor unit 100. The control data includes high and low level data (parallel data codes).

[0047] Furthermore, the high-voltage drive module 500 is electrically connected to the third resistor 14 or the fourth resistor 14 of each second switched capacitor unit 200, thereby inputting control data to each second switched capacitor unit 200 to regulate the generation of radio frequency signals in each second switched capacitor unit 200.

[0048] For example, the first switched capacitor matrix consists of 7 first switched capacitor units and 3 second switched capacitor units connected in parallel. The high-voltage drive module generates 10 output voltages (e.g., HV1, HV2, HV3, ..., HV10), which are respectively supplied to each first switched capacitor unit and each second switched capacitor unit in the first switched capacitor matrix. Simultaneously, the high-voltage drive module generates 10 parallel data codes (D1, D2, D3, ..., D10) based on the received Serial Peripheral Interface (SPI) control signal, which are respectively supplied to each first switched capacitor unit and each second switched capacitor unit in the first switched capacitor matrix.

[0049] like Figure 3 As shown, the high-voltage drive module 500 further includes a high-voltage drive integrated chip. The numerical control storage module 400 includes a field-programmable gate array (FPGA) control chip. The frequency modulation filter is powered through an external interface, providing high-voltage and low-voltage power to the high-voltage drive integrated chip according to the external interface. The high-voltage drive integrated chip outputs voltage to the switched capacitor matrix 300. Simultaneously, the FPGA control chip acquires the SPI control signal and converts it into parallel data code, sending it to the high-voltage drive integrated chip. The high-voltage drive integrated chip forwards the data code to the switched capacitor matrix 300. The switched capacitor matrix 300 adjusts the resonant capacitor according to the data code and the output voltage to regulate the generation of the radio frequency signal.

[0050] It is understandable that there are two switched capacitor matrices 300 and two dielectric resonators. One switched capacitor matrix 300 is connected to one dielectric resonator, and two switched capacitor matrices 300 are connected through the eighth capacitor 38.

[0051] The switched capacitor matrix 300 has two elements, and the dielectric resonator has two elements. For example... Figure 1 As shown, the frequency hopping filter includes a first switched capacitor matrix 300, a second switched capacitor matrix 300, a first dielectric resonator 41, and a second dielectric resonator 42. One end of the first switched capacitor matrix 300 is connected to the first dielectric resonator 41, and the other end is connected to one end of the eighth capacitor 38. One end of the second switched capacitor matrix 300 is connected to the second dielectric resonator 42, and the other end is connected to the other end of the eighth capacitor 38. The first dielectric resonator 41 and the second dielectric resonator 42 are located at the two ends (input and output) of the bus 50, respectively.

[0052] like Figure 2 As shown, it can be understood that the frequency hopping filter also includes a housing 600.

[0053] The housing is used to secure the internal components of the frequency hopping filter and isolate them from the outside environment.

[0054] like Figure 2 As shown, it can be understood that the frequency hopping filter also includes an input / output interface 60.

[0055] The input / output interface 60 includes an input interface and an output interface. The input interface is used to receive signals and is connected to the input terminal of the bus. The output interface is used to output radio frequency signals and is connected to the output terminal of the bus.

[0056] This application reduces the filter frequency by increasing the resonant capacitor through controlling the switched capacitor matrix 300. By adjusting the combination of the first switched capacitor unit 100 and the second switched capacitor unit 200, this application enables the frequency variation range of the frequency hopping filter to reach 225MHz~678MHz while maintaining a good frequency response curve. The correspondence between the parameters of the resonant capacitor and the center frequency in the 225-678MHz range is shown in Table 1.

[0057] This application uses a dielectric resonator as the resonant core, improving the Q value of the frequency-hopping filter and thus enhancing its performance. This application uses a combination of a dielectric resonator and a switched capacitor matrix to change the resonant frequency of the frequency-hopping filter, improving its performance, reducing debugging difficulty and manufacturing costs, and also reducing the module size. This application uses a dielectric resonator and a switched capacitor matrix to replace the LC resonator, significantly improving the Q value, reducing module height, eliminating the need for adhesive dispensing, and improving the reliability of the frequency-hopping filter. This application uses a dielectric resonator to replace the cavity, reducing the module size of the frequency-hopping filter, improving the Q value, and eliminating the need for structural components or screws for fixing. The combination of the dielectric resonator and the switched capacitor matrix used in this application changes the capacitance value of the resonant capacitor matrix, thereby adjusting the frequency of the frequency-hopping filter. This application, by using a dielectric resonator, improves the Q value of the frequency-hopping filter, reduces losses, and has advantages such as simple structure, small size, and low cost, making it highly valuable for application.

[0058] Figure 4 The figure shows the simulation results of the frequency hopping filter of this application. As can be seen from the figure, the insertion loss is -1.29dB at the center frequency of 672MHz; -0.88dB at the center frequency of 414MHz; -0.57dB at the center frequency of 325MHz; -0.48dB at the center frequency of 279MHz; -0.77dB at the center frequency of 246MHz; and -0.62dB at the center frequency of 223MHz.

[0059] Furthermore, the correspondence between the resonant capacitance of the frequency hopping filter and the center frequency (center frequency point) of the frequency hopping filter is shown in Table 1.

[0060] Table 1

[0061] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0062] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A frequency hopping filter, characterized in that, include: The system includes a dielectric resonator, a switched capacitor matrix, a high-voltage drive module, and a numerically controlled storage module. The numerically controlled storage module and the high-voltage drive module are communicatively connected. The switched capacitor matrix and the dielectric resonator are connected via a bus. The switched capacitor matrix is ​​composed of a first switched capacitor unit and a second switched capacitor unit connected in parallel. The high-voltage drive module is electrically connected to the first switched capacitor unit and the second switched capacitor unit.

2. The frequency hopping filter according to claim 1, characterized in that, The first switched capacitor unit includes a first diode, a second diode, a first capacitor, a second capacitor, a third capacitor, a first resistor, and a second resistor. One end of the first capacitor, the cathode of the first diode, and one end of the first resistor are electrically connected; One end of the second capacitor, the positive terminal of the second diode, and one end of the second resistor are electrically connected; The other end of the first capacitor and the other end of the second capacitor are grounded; The positive terminal of the first diode, the other end of the first resistor, the other end of the second resistor, the negative terminal of the second diode, and one end of the third capacitor are electrically connected; The other end of the third capacitor is connected to the bus.

3. The frequency hopping filter according to claim 1, characterized in that, The second switched capacitor unit includes a third diode, a fourth diode, a fourth capacitor, a fifth capacitor, a sixth capacitor, a seventh capacitor, a third resistor, and a fourth resistor. One end of the fourth capacitor, the negative terminal of the third diode, and one end of the third resistor are electrically connected; One end of the fifth capacitor, the positive terminal of the fourth diode, and one end of the fourth resistor are electrically connected; The positive terminal of the third diode, the other end of the third resistor, and one end of the sixth capacitor are electrically connected; The negative terminal of the fourth diode, the other end of the fourth resistor, and one end of the seventh capacitor are electrically connected; The other end of the fourth capacitor and the other end of the fifth capacitor are grounded; The other end of the sixth capacitor and the other end of the seventh capacitor are both connected to the bus.

4. The frequency hopping filter according to claim 1, characterized in that, The number of switched capacitor matrices is 2, the number of dielectric resonators is 2, one switched capacitor matrix is ​​connected to one dielectric resonator, and two switched capacitor matrices are connected through an eighth capacitor.

5. The frequency hopping filter according to claim 1, characterized in that, The high-voltage drive module is connected to an external power source.

6. The frequency hopping filter according to claim 1, characterized in that, The switched capacitor matrix is ​​composed of multiple first switched capacitor units and multiple second switched capacitor units connected in parallel.

7. The frequency hopping filter according to claim 2, characterized in that, The high-voltage drive module is electrically connected to either the first resistor or the second resistor.

8. The frequency hopping filter according to claim 3, characterized in that, The high-voltage drive module is electrically connected to either the third resistor or the fourth resistor.

9. The frequency hopping filter according to claim 1, characterized in that, The first switched capacitor unit and the second switched capacitor unit are evenly distributed on both sides of the bus, and the input terminal and the output terminal of the bus are both grounded.

10. The frequency hopping filter according to claim 1, characterized in that, It also includes the casing.

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