A building edge computing gateway device

Abstract

This utility model discloses a building edge computing gateway device. Through a heterogeneous dual-processor collaborative processing circuit module, it enables parallel processing of upper-layer applications and lower-layer real-time data acquisition and control tasks, avoiding resource contention and latency, improving system processing efficiency, and enabling rapid response to various events within the building. Simultaneously, a multi-channel communication interface circuit module integrates multiple interfaces, compatible with sensors, controllers, and other devices using different protocols, allowing for unified data access and processing, resolving device compatibility issues, and achieving interconnectivity and centralized management of building equipment. Furthermore, a three-phase power parameter metering circuit module can accurately read three-phase power parameters such as voltage and current in real time and transmit them to the heterogeneous dual-processor module for in-depth analysis. Based on this analysis, the device operating status can be adjusted, achieving refined energy management. This allows the building to promptly grasp energy usage, make optimization decisions, improve energy utilization efficiency, and effectively solve the problem of real-time analysis and utilization of power data.

Description

Technical Field

[0001] This utility model relates to the field of edge computing gateway technology, and in particular to a building edge computing gateway device. Background Technology

[0002] As buildings become increasingly intelligent, a large number of smart devices, such as sensors, controllers, and actuators, are integrated inside. These devices generate massive amounts of data. At the same time, buildings are becoming increasingly demanding and real-time in terms of energy management, data interaction, and data management.

[0003] However, traditional building data management methods often rely on cloud computing, uploading all data to the cloud for processing and analysis. But this approach has many drawbacks: on the one hand, data transmission to the cloud will generate significant network latency. For some application scenarios with extremely high real-time requirements, such as fire alarms and emergency responses to equipment failures, cloud computing cannot meet the needs for rapid decision-making and control. On the other hand, large amounts of data transmission will increase the burden on network bandwidth, increase network costs, and in the event of network instability or interruption, the intelligent systems inside the building may be paralyzed and unable to function properly.

[0004] In terms of data interaction, due to the wide variety of equipment inside the building and the different communication protocols, sensors and controllers produced by different manufacturers may use different communication interfaces and protocols, resulting in poor compatibility between devices and making it difficult to achieve unified monitoring and management.

[0005] In terms of energy management, buildings consume a huge amount of electricity. However, existing electricity metering devices are often single-function and cannot be deeply integrated with the building's overall intelligent system, making it difficult to achieve real-time analysis and utilization of electricity data. Utility Model Content

[0006] In view of this, the present invention proposes a building edge computing gateway device, which can effectively solve the defects of the existing technology, such as low processing efficiency, poor compatibility between devices, and difficulty in realizing real-time analysis and utilization of power data.

[0007] The technical solution of this utility model is implemented as follows:

[0008] A building edge computing gateway device, comprising:

[0009] The heterogeneous dual-processor collaborative processing circuit module is used to execute upper-layer application processing tasks and lower-layer real-time data acquisition and control tasks in parallel.

[0010] The three-phase power parameter metering circuit module is used for real-time reading of three-phase power parameters;

[0011] The multi-channel communication interface circuit module is used to integrate multiple communication interfaces for communication with various external devices.

[0012] As a further optional embodiment of the building edge computing gateway device, the heterogeneous dual-processor collaborative processing circuit module includes:

[0013] The main processor circuit is used to execute upper-layer application processing tasks based on the SOM core board circuit.

[0014] Real-time coprocessor circuits are used to perform low-level real-time data acquisition and control tasks based on MCU microcontroller circuits.

[0015] As a further optional embodiment of the building edge computing gateway device, the three-phase power parameter metering circuit module includes:

[0016] The voltage sampling circuit is used to input the three-phase AC voltage and the neutral wire signal to the voltage sampling pin of the power metering chip.

[0017] The current sampling circuit is used to input the secondary side signal of the current transformer to the current sampling pin of the power metering chip.

[0018] The power metering chip is used to transmit the collected three-phase power parameters to the real-time coprocessor circuit unit.

[0019] As a further optional embodiment of the building edge computing gateway device, the multi-channel communication interface circuit module includes:

[0020] Ethernet interface circuitry, used for gigabit Ethernet PHY chips to support gigabit data transmission rates;

[0021] RS485 interface circuit, used for isolated RS485 transceivers, supporting cascading of multiple devices;

[0022] 4G module interface circuit, used to support remote data transmission and mobile network access;

[0023] Wi-Fi / Bluetooth module interface circuit, used to support short-range wireless communication;

[0024] The USB interface circuit is used to support USB storage device connection, data transfer, and device debugging.

[0025] As a further optional embodiment of the building edge computing gateway device, the device also includes:

[0026] The data storage circuit module is used to store user data and expand user data access methods.

[0027] As a further optional embodiment of the building edge computing gateway device, the data storage circuit module includes:

[0028] eMMC flash memory circuitry is used to store user data;

[0029] TF card interface circuit, used to expand user data access methods.

[0030] The beneficial effects of this utility model are as follows: Through the design of the heterogeneous dual-processor collaborative processing circuit module, the upper-layer application processing tasks and the lower-layer real-time data acquisition and control tasks can be executed in parallel. This division of labor and cooperation avoids resource contention and latency when a single processor handles multiple tasks simultaneously, significantly improving the overall processing efficiency of the system and enabling rapid response to various events and needs within the building. The multi-channel communication interface circuit module integrates multiple communication interfaces, enabling communication with various external devices. It is compatible with various types of devices, such as sensors and controllers with different protocols, and can uniformly access and process data from devices with different protocols, solving the compatibility problem caused by protocol differences between devices and realizing interconnection and centralized management of equipment within the building. The three-phase power parameter metering circuit module can read three-phase power parameters, such as voltage, current, power, and energy, in real time and accurately. This real-time collected power data can be directly transmitted to the heterogeneous dual-processor collaborative processing circuit module. The high-performance heterogeneous dual-processor collaborative processing circuit module performs in-depth analysis and processing of these power data, and adjusts the operating status of relevant equipment in a timely manner based on the power data, thereby achieving refined energy management. This real-time data acquisition and processing capability enables buildings to keep abreast of energy usage, make optimization decisions, and improve energy efficiency, solving the problem of difficulty in real-time analysis and utilization of power data in existing technologies. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the components of a building edge computing gateway device according to the present invention;

[0033] Figure 2 A circuit diagram of the main processor circuit;

[0034] Figure 3 A circuit diagram of a real-time coprocessor circuit;

[0035] Figure 4 This is a circuit diagram of a voltage sampling circuit;

[0036] Figure 5 This is a circuit diagram of a current sampling circuit;

[0037] Figure 6 This is a circuit diagram of an energy metering chip;

[0038] Figure 7 This is a circuit diagram of an Ethernet interface circuit.

[0039] Figure 8 This is a circuit diagram of an RS485 interface circuit.

[0040] Figure 9 A circuit diagram of the 4G module interface circuit;

[0041] Figure 10 A circuit diagram of the Wi-Fi / Bluetooth module interface circuit;

[0042] Figure 11 This is a circuit diagram of a USB interface circuit.

[0043] Figure 12 A circuit diagram of an eMMC flash memory circuit;

[0044] Figure 13 This is a circuit diagram of the TF card interface circuit. Detailed Implementation

[0045] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0046] refer to Figures 1 to 13 A building edge computing gateway device includes a heterogeneous dual-processor collaborative processing circuit module, a three-phase power parameter metering circuit module, a multi-channel communication interface circuit module, and a data storage circuit module, wherein:

[0047] A heterogeneous dual-processor collaborative processing circuit module is used to execute upper-layer application processing tasks and lower-layer real-time data acquisition and control tasks in parallel. In some embodiments, the heterogeneous dual-processor collaborative processing circuit module includes:

[0048] The main processor circuit is used to execute upper-layer application processing tasks based on the SOM core board circuit.

[0049] Real-time coprocessor circuits are used to perform low-level real-time data acquisition and control tasks based on MCU microcontroller circuits.

[0050] Specifically, the main processor circuit executes upper-layer application processing tasks based on the SOM core board circuit. The SOM core board integrates a high-performance application processor, large-capacity RAM, and eMMC flash memory, enabling it to handle computationally demanding tasks such as data analysis and network communication protocol stacks. The real-time coprocessor circuit, based on the MCU microcontroller circuit, focuses on low-level real-time data acquisition and control tasks, such as rapid reading of sensor data and instant device control. The two work in parallel without interference, greatly improving the overall processing power and efficiency of the system, and simultaneously meeting the needs of complex application processing and real-time data acquisition and control. This heterogeneous dual-processor architecture achieves reasonable task allocation, separating computationally intensive upper-layer application tasks from low-level data acquisition and control tasks with extremely high real-time requirements. This avoids resource contention and performance bottlenecks that may occur when a single processor handles multiple types of tasks. For example, while performing large-scale data analysis, it does not affect the real-time acquisition of sensor data and the rapid response of devices, ensuring the stable operation of the system in various complex scenarios.

[0051] The main processor and the real-time coprocessor achieve efficient collaboration through a dedicated communication interface circuit. The main processor can configure and monitor the real-time coprocessor, while the real-time coprocessor can also transmit the collected real-time data to the main processor for further analysis and processing. This collaborative mechanism ensures that the system can fully utilize the high-performance computing capabilities of the main processor while processing real-time tasks, enabling in-depth analysis and utilization of real-time data.

[0052] A three-phase power parameter metering circuit module is used for real-time reading of three-phase power parameters; in some embodiments, the three-phase power parameter metering circuit module includes:

[0053] The voltage sampling circuit is used to input the three-phase AC voltage and neutral signal to the voltage sampling pin of the power metering chip through a resistor divider network and a filter capacitor.

[0054] The current sampling circuit is used to input the signal from the secondary side of the current transformer to the current sampling pin of the energy metering chip after passing through the sampling resistor and RC filter circuit.

[0055] The power metering chip is used to connect to the coprocessor via an ultra-high-speed SPI interface circuit. The coprocessor configures the power metering chip and reads various high-precision electrical parameters such as voltage, current, power, energy, and harmonics through this interface.

[0056] Specifically, through the coordinated operation of voltage and current sampling circuits, basic parameters such as three-phase AC voltage and current can be accurately acquired. The voltage sampling circuit uses a resistor divider network and filter capacitors to process the three-phase AC voltage and neutral wire signal before inputting it into the energy metering chip. The current sampling circuit inputs the signal from the secondary side of the current transformer into the energy metering chip after passing through a sampling resistor and an RC filter circuit. Based on these accurate voltage and current sampling data, the energy metering chip can further calculate various high-precision electrical parameters such as power, energy, and harmonics, providing a comprehensive and accurate data foundation for building energy management.

[0057] The voltage and current sampling circuit can collect three-phase power parameters in real time, process them, and quickly input them into the power metering chip. The power metering chip is connected to the coprocessor through the ultra-high-speed SPI interface, realizing fast data transmission. This enables the coprocessor to obtain the latest power parameter information in a timely manner, providing a guarantee for real-time monitoring and analysis.

[0058] This circuit module and the coprocessor form an efficient collaborative working mechanism. The coprocessor can configure the power metering chip through the SPI interface and adjust the metering parameters and modes according to actual needs. At the same time, the power metering chip will promptly feed back the power parameters collected and calculated in real time to the coprocessor. The coprocessor can then perform further processing and analysis based on this data, such as real-time monitoring of power quality and analysis of power consumption patterns, thereby improving the overall operating efficiency of the device.

[0059] Both voltage and current sampling circuits employ filter capacitors and RC filter circuits. These filter circuits effectively filter out high-frequency noise and interference signals, improving the quality and stability of the sampled signals. In the building environment, there are various sources of electromagnetic interference, such as electromagnetic interference generated by motors, frequency converters, and other equipment. Through the processing of the filter circuits, the impact of these interferences on the measurement of electrical parameters can be reduced, ensuring the accuracy of the measurement results.

[0060] A multi-channel communication interface circuit module is used to integrate multiple communication interfaces for communication with various external devices; in some embodiments, the multi-channel communication interface circuit module includes:

[0061] Ethernet interface circuitry, used for gigabit Ethernet PHY chips to support gigabit data transmission rates;

[0062] RS485 interface circuit, used for isolated RS485 transceivers, supporting cascading of multiple devices;

[0063] 4G module interface circuit, used to support remote data transmission and mobile network access;

[0064] Wi-Fi / Bluetooth module interface circuit, used to support short-range wireless communication;

[0065] The USB interface circuit is used to support USB storage device connection, data transfer, and device debugging.

[0066] Specifically, it integrates multiple communication interfaces such as Ethernet, RS485, 4G, Wi-Fi / Bluetooth, and USB, which can meet the communication needs of various devices and scenarios within a building. For example, in scenarios requiring high-speed and stable wired connections, such as video surveillance transmission within a building, the Ethernet interface can be used; for industrial environments or long-distance device connections, the RS485 interface can leverage its strong anti-interference capabilities and support for multi-device cascading; when remote data transmission or mobile network access is required, the 4G module interface can enable data interaction with a remote server; for short-range wireless device connections, such as communication with smartphones, tablets, and other mobile devices, the Wi-Fi / Bluetooth interface provides a convenient solution; and the USB interface can be used to connect USB storage devices for data storage and transmission, as well as for device debugging and other operations.

[0067] A data storage circuit module is used to store user data and expand user data access methods; in some embodiments, the data storage circuit module includes:

[0068] eMMC flash memory circuitry is used to store user data;

[0069] TF card interface circuit, used to expand user data access methods.

[0070] Specifically, the eMMC flash memory circuit is used to store user data. It boasts a large storage capacity and fast data read / write speeds, meeting the gateway's storage needs for various types of user data (such as system configuration information, application data, and historical data collected from devices) during operation. The TF card interface circuit provides the possibility of expanding user data access methods. Users can insert TF cards as needed to further expand storage capacity to handle large-scale data storage, such as long-term video surveillance data storage or large amounts of sensor historical data storage. Data storage requirements vary significantly across different building intelligence application scenarios. For some small buildings or scenarios with low data storage requirements, the eMMC flash memory capacity may be sufficient; however, in large buildings or scenarios with higher data storage requirements, expanding storage via the TF card interface becomes essential. This design allows the gateway to flexibly adapt to various application scenarios, improving product versatility.

[0071] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A building edge computing gateway device, characterized in that, include: The heterogeneous dual-processor collaborative processing circuit module is used to execute upper-layer application processing tasks and lower-layer real-time data acquisition and control tasks in parallel. The three-phase power parameter metering circuit module is used for real-time reading of three-phase power parameters; The multi-channel communication interface circuit module is used to integrate multiple communication interfaces for communication with various external devices.

2. The building edge computing gateway device according to claim 1, characterized in that, The heterogeneous dual-processor collaborative processing circuit module includes: The main processor circuit is used to execute upper-layer application processing tasks based on the SOM core board circuit. Real-time coprocessor circuits are used to perform low-level real-time data acquisition and control tasks based on MCU microcontroller circuits.

3. The building edge computing gateway device according to claim 2, characterized in that, The three-phase power parameter metering circuit module includes: The voltage sampling circuit is used to input the three-phase AC voltage and the neutral wire signal to the voltage sampling pin of the power metering chip. The current sampling circuit is used to input the secondary side signal of the current transformer to the current sampling pin of the power metering chip. The power metering chip is used to transmit the collected three-phase power parameters to the real-time coprocessor circuit unit.

4. The building edge computing gateway device according to claim 3, characterized in that, The multi-channel communication interface circuit module includes: Ethernet interface circuitry, used for gigabit Ethernet PHY chips to support gigabit data transmission rates; RS485 interface circuit, used for isolated RS485 transceivers, supporting cascading of multiple devices; 4G module interface circuit, used to support remote data transmission and mobile network access; Wi-Fi / Bluetooth module interface circuit, used to support short-range wireless communication; The USB interface circuit is used to support USB storage device connection, data transfer, and device debugging.

5. The building edge computing gateway device according to claim 4, characterized in that, The device further includes: The data storage circuit module is used to store user data and expand user data access methods.

6. The building edge computing gateway device according to claim 5, characterized in that, The data storage circuit module includes: eMMC flash memory circuitry is used to store user data; TF card interface circuit, used to expand user data access methods.

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