An interconnect assembly and folding device

Abstract

This application discloses an interconnect component and a folding device, relating to the field of electronic devices. The aim is to reduce the space occupied by the interconnect component. Specifically, the interconnect component includes a first interconnect structure and a second interconnect structure connected by optical fibers; the first interconnect structure includes a first cover and a surface-emitting laser; the first cover covers the surface-emitting laser, and a first end is connected to and coupled to the surface-emitting laser. The distance from the surface-emitting laser's surface away from the first cover to the surface of the first cover away from the surface-emitting laser is less than or equal to 1.5 mm. The outer diameter of the optical fiber cladding is less than or equal to 250 μm, and the number of fiber cores is greater than or equal to 50. The interconnect component features high transmission speed, a small optical fiber bending radius, and a small space occupation, freeing up sufficient space for improving screen flatness, arranging liquid cooling films, and adding interfaces, etc. This can meet the needs of ultra-thin foldable screen electronic products and broaden application scenarios.

Description

Technical Field

[0001] This application relates to the field of electronic devices, and more particularly to an interconnect component and a folding device. Background Technology

[0002] Foldable devices (such as foldable phones) are gradually becoming one of the most popular electronic products on the market. When unfolded, foldable devices offer a larger display area, enhancing the viewing experience. When folded, they are compact and easy to carry. The slim and portable nature of foldable devices is a key performance factor for consumers. The size of the interconnect components that link the two main components of a foldable device also affects its miniaturization.

[0003] This application provides an interconnect component designed to reduce the space occupied by the interconnect component. Utility Model Content

[0004] This application provides an interconnect component and a folding device designed to reduce the space occupied by the interconnect component.

[0005] To achieve the above objectives, this application adopts the following technical solution.

[0006] In a first aspect, this application provides an interconnect component. The interconnect component includes an optical fiber, a first interconnect structure, and a second interconnect structure. The optical fiber includes a first end and a second end disposed opposite to each other. The first interconnect structure includes a first cover and a surface-emitting laser; the first cover covers the surface-emitting laser, the first end is connected to and coupled to the first cover, and the surface-emitting laser has a first surface facing away from the first cover, which is used for connection to a first substrate. The second interconnect structure includes a second cover and a photodetector; the second cover covers the photodetector, the second end is connected to and coupled to the second cover, and the photodetector has a second surface facing away from the second cover, which is used for connection to a second substrate. The distance from the first surface to the surface of the first cover facing away from the surface-emitting laser is less than or equal to 2 mm, and / or, the distance from the second surface to the surface of the second cover facing away from the photodetector is less than or equal to 2 mm.

[0007] Thus, the smaller distance allows for a reduction in the size of the first interconnect structure in the direction perpendicular to the first surface, or vice versa, in the direction perpendicular to the second surface, which is beneficial for miniaturization of the interconnect components. Furthermore, the interconnect components transmit signals via optical fibers, surface-emitting lasers, and photodetectors. Compared to signal transmission using conductive interconnects, optical fibers are smaller and require less space. When the interconnect components are used in folding devices, the optical fibers occupy less internal space on the hinge, which is beneficial for miniaturization of the folding device.

[0008] In conjunction with the first aspect, in some feasible ways, the distance from the first surface to the surface of the first cover opposite to the surface emitting the laser is less than or equal to 1.5 mm. This allows for a further reduction in the volume of the first interconnect structure.

[0009] In conjunction with the first aspect, in some feasible ways, the distance from the second surface to the surface of the second cover opposite to the photodetector is less than or equal to 1.5 mm. This allows for a further reduction in the volume of the second interconnect structure.

[0010] In conjunction with the first aspect, in some feasible embodiments, the optical fiber includes a cladding and a plurality of cores; the cladding surrounds the outer peripheral surface of the plurality of cores; the diameter of the outer peripheral surface of the cladding is less than or equal to 250 μm.

[0011] Since the first end of the optical fiber is connected to the first cover, the size of the optical fiber affects the size of the first cover along the z-direction. Having an outer circumferential surface diameter of cladding less than or equal to 250 μm helps reduce the size of the first cover in the direction perpendicular to the first surface, thereby reducing the volume of the interconnect components.

[0012] In conjunction with the first aspect, in some feasible ways, the number of fiber cores in an optical fiber is greater than or equal to 50.

[0013] Thus, the optical fiber has a large number of cores and a small bending radius, which is less than or equal to 1 mm. The optical fiber requires less space during bending, which helps reduce the size of the first cover in the direction perpendicular to the first surface, thereby reducing the volume of the interconnect components.

[0014] In conjunction with the first aspect, in some feasible embodiments, the first cover is provided with a channel that accommodates a portion of the optical fiber, the channel including a first opening and a second opening, the first opening being opposite to the surface-emitting laser, and the orientation of the first opening and the orientation of the second opening being perpendicular to each other.

[0015] Thus, the central angle corresponding to the partial bend of the optical fiber within the first cover is close to 90°, which can fully utilize the minimum bending radius of the optical fiber. Reducing the space occupied by the optical fiber bending in the first cover helps to reduce the volume of the first interconnect structure.

[0016] In conjunction with the first aspect, in some feasible ways, the first cover is a one-piece molded part. Compared with a split structure for the first cover, the first interconnect structure has fewer parts and the assembly process for the first interconnect structure is simpler.

[0017] In conjunction with the first aspect, in some feasible embodiments, the first cover includes a connected male end and a connected female end, at least one of which is directly connected to the optical fiber.

[0018] In this way, the coupling efficiency between the optical fiber and the surface-emitting laser can be improved by increasing the assembly precision of the male and female connectors. The assembly precision requirements for the male connector and the first substrate are reduced.

[0019] In conjunction with the first aspect, in some feasible ways, the second cover is a one-piece molded part.

[0020] In conjunction with the first aspect, in some feasible embodiments, the second cover includes a connected male end and a connected female end, at least one of which is directly connected to the optical fiber.

[0021] In conjunction with the first aspect, in some feasible implementations, the surface-emitting laser is a vertical-cavity surface-emitting laser (VCSEL). Thus, the surface-emitting laser exhibits a high data transmission rate. This can improve the transmission efficiency of interconnect components, enabling their application in high-speed signal transmission scenarios.

[0022] In conjunction with the first aspect, in some feasible ways, the photodetector operates in the 400nm-1500nm range, and / or the surface-emitting laser operates in the 400nm-1500nm range.

[0023] Thus, interconnect components can be applied in scenarios where the operating wavelength of optical signals is in the range of 400nm-1500nm.

[0024] In conjunction with the first aspect, in some feasible ways, the communication transmission rate of the photodetector is greater than or equal to 10 Gbps, and / or the communication transmission rate of the surface-emitting laser is greater than or equal to 10 Gbps.

[0025] Thus, interconnect components can be used in scenarios with transmission rates greater than or equal to 10Gbps. For example, they can be used in foldable devices such as foldable phones.

[0026] In conjunction with the first aspect, in some feasible ways, the photosensitive surface diameter of the photodetector is less than or equal to 100 μm.

[0027] Thus, with a smaller photosensitive surface diameter, the photodetector can transmit at a higher rate, greater than or equal to 10Gbps, and the interconnect components can be used in high-transmission-rate scenarios.

[0028] In conjunction with the first aspect, in some feasible embodiments, the interconnect assembly further includes the first substrate and the second substrate; the first cover is connected to the first substrate, and the surface-emitting laser is located between the first cover and the first substrate. The second cover is connected to the second substrate, and the photodetector is located between the second cover and the second substrate.

[0029] Thus, the first substrate is used to support the first cover and the surface-emitting laser. The second substrate is used to support the photodetector and the second cover.

[0030] In conjunction with the first aspect, in some feasible ways, the first substrate is away from the surface of the first cover, and the distance between the surface of the first cover and the surface of the first substrate is less than or equal to 2 mm.

[0031] Thus, in the direction perpendicular to the first surface, the first interconnect structure occupies less space, which is beneficial for miniaturizing the interconnect components.

[0032] In conjunction with the first aspect, in some feasible ways, the first substrate has a receiving groove in which at least a portion of the surface-emitting laser is located.

[0033] In this way, the space of the first interconnect structure in the direction perpendicular to the first surface can be further saved.

[0034] In conjunction with the first aspect, in some feasible ways, the surface-emitting laser protrudes from the first substrate.

[0035] Thus, during the assembly of the laser emitter and the first substrate, there is no need to perform grooving or thinning on the surface of the first substrate, simplifying the process and avoiding the reduction of the strength of the first substrate by grooving or thinning.

[0036] In conjunction with the first aspect, in some feasible ways, the first substrate is provided with a protrusion, the first cover is provided with a slot, and the protrusion engages with the slot; or, the first cover is provided with a protrusion, the first substrate is provided with a slot, and the protrusion engages with the slot.

[0037] In this way, the first cover and the first substrate are connected by utilizing their shapes, eliminating the need for additional components to connect the first cover and the first substrate.

[0038] In conjunction with the first aspect, in some feasible ways, the photodetector protrudes from the second substrate.

[0039] In conjunction with the first aspect, in some feasible ways, the second substrate is provided with a protrusion, the second cover is provided with a slot, and the protrusion engages with the slot; or, the second cover is provided with a protrusion, the second substrate is provided with a slot, and the protrusion engages with the slot.

[0040] In conjunction with the first aspect, in some feasible ways, the first interconnect structure further includes a first lens for coupling a beam from the surface-emitting laser to the first end.

[0041] In this way, the first lens can shape the beam from the surface-emitting laser and couple it to the first end, reducing the coupling loss of the first interconnect structure and thus helping to reduce the loss of the interconnect components.

[0042] In conjunction with the first aspect, in some feasible ways, the first lens and the first cover are connected as a single integral part.

[0043] In this way, the first lens and the first cover do not need to be assembled separately, thus avoiding the problem of low assembly accuracy of the first lens and the first cover.

[0044] In conjunction with the first aspect, in some feasible embodiments, the second interconnect structure further includes a second lens for coupling a light beam from the second end to the photodetector.

[0045] Thus, the second lens helps reduce the coupling loss of the second interconnect structure and the loss of the interconnect components.

[0046] Secondly, this application provides a folding device. The folding device includes a first body, a second body, and any of the interconnecting components provided in the first aspect. The first body and the second body are rotatably connected. The first body is connected to the first interconnecting structure, and the second body is connected to the second interconnecting structure.

[0047] Because the interconnect components occupy less space, the foldable device only needs to provide less space for the interconnect components, which can provide more space for other components and optimize the performance of the foldable device.

[0048] In conjunction with the second aspect, in some feasible embodiments, the first body includes a connected first mid-frame and a first printed circuit board, the first printed circuit board and the first substrate being arranged along the thickness direction of the first substrate.

[0049] Thus, the first substrate is set independently of the first printed circuit board, and the first substrate and the first interconnect structure can be pre-connected before being assembled with the first printed circuit board.

[0050] In conjunction with the second aspect, in some feasible embodiments, the first body includes a connected first mid-frame and a first printed circuit board, the first printed circuit board serving as the first substrate.

[0051] Thus, in this type of embodiment, reusing the first printed circuit board as the first substrate can further save space along the direction perpendicular to the first surface of the first interconnect structure. In this type of embodiment, the interconnect components may not include the first substrate, reducing the number of devices and helping to save on device fabrication costs.

[0052] In conjunction with the second aspect, in some possible implementations, the folding device includes a plurality of interconnecting components, including a first interconnecting component and a second interconnecting component. The first interconnecting component has a first interconnecting structure connected to the first body, and the second interconnecting structure of the first interconnecting component is connected to the second body. The second interconnecting component has a second interconnecting structure connected to the first body, and the second interconnecting structure of the first interconnecting component is also connected to the second body.

[0053] Thus, the first and second bodies are interconnected through multiple interconnecting components.

[0054] In conjunction with the second aspect, in some feasible embodiments, the folding device further includes: a third body; the third body is rotatably connected to the second body; when the folding device is in a flattened state, the first body, the second body, and the third body are arranged in sequence; or, when the folding device is in a flattened state, the first body, the third body, and the second body are arranged in sequence.

[0055] In conjunction with the second aspect, in some possible implementations, the folding device further includes a third interconnect component. In the third interconnect component, one of the first and second interconnect structures is connected to the third body, and the other interconnect structure is connected to either the first or second body.

[0056] Regarding the beneficial effects of the second aspect, please refer to the description of any optional implementation method in the first aspect, which will not be repeated here. Based on the implementation methods provided in the above aspects, this application can also be further combined to provide more implementation methods. Attached Figure Description

[0057] Figure 1 This is a schematic diagram of the structure of a folding device in a flattened state, as provided in an embodiment of this application.

[0058] Figure 2 This is a structural diagram of the folding device in the folded state provided in the embodiment of this application.

[0059] Figure 3 This is an exploded view of the folding device provided in an embodiment of this application.

[0060] Figure 4a This is a schematic diagram of the structure of an interconnect component provided in an embodiment of this application.

[0061] Figure 4b This is a schematic diagram of a first interconnect structure and an optical fiber provided in an embodiment of this application.

[0062] Figure 5 This is a schematic diagram of another interconnect component provided in an embodiment of this application.

[0063] Figure 6 This is a schematic diagram of another interconnect component provided in an embodiment of this application.

[0064] Figure 7 This is a schematic diagram of another folding device in a flattened state, provided as an embodiment of this application.

[0065] Figure 8 This is a schematic diagram of the structure of a folding device in a flattened state, provided as an embodiment of this application.

[0066] In the diagram: 001-Folding device; 10-First main body; 20-Second main body; 30-First pivot; 011-First middle frame; 012-First back cover; 0111-First side frame; 0112-First middle plate; 140-First printed circuit board; 210-Second middle frame; 211-Second side frame; 212-Second middle plate; 220-Second back cover; 240-Second printed circuit board; 40-Display screen; 31-First door panel; 32-Second door panel; 33-Shaft; 003-Second body; 100-Interconnection assembly; 130-Fiber optic cable; 110-First interconnection structure; 120-Second interconnection. Structure; 121-Second cover; 122-Photodetector; 111-First cover; 112-Surface-emitting laser; 113-Channel; 131-First end; 132-Second end; 101-First surface; 102-Second surface; 201-First substrate; 202-Second substrate; 133-Clad layer; 134-Fiber core; 114-Connecting male end; 115-Connecting female end; 116-First opening; 117-Second opening; 118-First lens; 123-Second lens; 203-Protrusion; 204-Slot; 205-Receiving groove; 03-Second rotating shaft; 06-Third body. Detailed Implementation

[0067] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0068] In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more. "At least one" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, and c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be a single item or multiple items.

[0069] Furthermore, to facilitate a clear description of the technical solutions in the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with substantially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that "first" and "second" are not necessarily different. Meanwhile, in the embodiments of this application, words such as "exemplarily" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design scheme described as "exemplarily" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of words such as "exemplarily" or "for example" is intended to present related concepts in a concrete manner for ease of understanding.

[0070] In describing some embodiments, the term "connection" and its derivative expressions are used. The term "connection" should be interpreted broadly; for example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium. Furthermore, the use of "based on" implies openness and inclusivity, because processes, steps, calculations, or other actions "based on" one or more of the stated conditions or values ​​may in practice be based on additional conditions or values ​​beyond those stated.

[0071] In the accompanying drawings, the thickness of some layers or regions has been selectively exaggerated for clarity, and the dimensional proportions between the portions shown do not reflect actual dimensional proportions. Therefore, variations in shape relative to the drawings are conceivable due to factors such as manufacturing techniques and / or tolerances. Consequently, exemplary embodiments should not be construed as being limited to the shapes of the regions shown in this application, but rather include shape deviations caused, for example, by manufacturing processes. For instance, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0072] This application provides a foldable device, which can be, for example, a mobile phone, a tablet, a personal digital assistant (PDA), or a television. For ease of explanation, the following description uses a mobile phone as an example.

[0073] Figure 1 This is a structural schematic diagram of a folding device 001 in its flattened state, provided as an embodiment of this application. Figure 2 This is a schematic diagram of the folding device 001 provided in the embodiment of this application in its folded state. Please refer to... Figure 1 and Figure 2The folding device 001 can be folded or unfolded, thus changing its size according to actual needs and usage scenarios. For example, when it is necessary to view the screen, the folding device 001 can be unfolded to such a size as... Figure 1 As shown, unfolding the display screen of the folding device 001 provides a better viewing experience. When it is necessary to answer or make a call, the folding device 001 can be folded to the desired position. Figure 2 This design allows for a more comfortable grip and improves the user experience.

[0074] It is understandable that the folding state of the folding device 001 is not limited to... Figure 2 The state shown. The folding device 001 can have multiple folding states, for example, in... Figure 1 The flattened state and Figure 2 The folding device 001 can also have multiple folding states between its folding states.

[0075] like Figure 1 As shown, the folding device 001 includes a first main body 10, a second main body 20, and a first rotating shaft 30. Both the first main body 10 and the second main body 20 are connected to the first rotating shaft 30. When the folding device 001 is in the unfolded state, and the first main body 10, the second main body 20, and the first rotating shaft 30 are in the flattened state, the first main body 10, the second main body 20, and the first rotating shaft 30 are arranged sequentially along the x-direction.

[0076] For ease of description, the thickness direction of the folding device 001 is defined as the z-direction. The first direction, which will be referred to as the z-direction in the following text and figures, is defined as the y-direction, and the x-direction, y-direction and z-direction are mutually perpendicular.

[0077] It is understood that the aforementioned perpendicularity allows for the existence of assembly and manufacturing errors. For example, the perpendicularity between the x and z directions is not limited to an angle of 90° between the x and z directions. For example, the angle between the x and z directions can be 85° to 95°. For example, it can be 85°, 87°, 88°, 89°, 90°, 91°, 92°, 93°, or 95°, etc.

[0078] Figure 3 This is an exploded structural diagram of a folding device 001 provided in an embodiment of this application. Please refer to... Figure 3 The first main body 10 includes a first middle frame 011, which includes a first side frame 0111 and a first middle plate 0112. The first side frame 0111 is connected to the first pivot 30.

[0079] The first middle plate 0112 is located within the area formed by the first frame 0111 and is connected to the inner wall of the first frame 0111. For example, the first frame 0111 and the first middle plate 0112 are connected as an integral part. The folding device 001 may also include a first rear cover 012. The first rear cover 012 is connected to the first frame 0111, and the first rear cover 012 and the first middle plate 0112 are stacked along the z-direction.

[0080] In some embodiments, there is a gap between the first rear cover 012 and the first middle plate 0112, and the first rear cover 012, the first middle plate 0112 and the first frame 0111 together form a receiving space. The circuit board, battery and other components of the folding device 001 are received in this receiving space.

[0081] Exemplarily, the first body 10 may further include a first printed circuit board (PCB) 140. In some embodiments, the first PCB 140 is located between the first rear cover 012 and the first middle plate 0112. In some embodiments, the first middle plate 0112 is located between the first PCB 140 and the first rear cover 012.

[0082] It is understood that the aforementioned first middle frame 011, first back cover 012, and first printed circuit board 140 are merely examples of some of the components on the first main body 10. The first main body 10 may also be equipped with devices such as cameras, antennas, or sensors.

[0083] The second main body 20 may include a second middle frame 210, which may include a second side frame 211 and a second middle plate 212. The second side frame 211 is connected to the first pivot 30. The second main body 20 may also include a second printed circuit board 240. For a structural description of the second main body 20, please refer to the description of the first main body 10 above. The folding device 001 may also include a second rear cover 220, which is stacked with the second middle frame 210.

[0084] It is understood that the devices housed in the aforementioned receiving space of the first main body 10 and the devices housed in the receiving space of the second main body 20 may not be completely identical. The shapes of the first intermediate plate 0112 and the second intermediate plate 212 may be different. This application embodiment does not impose any limitations on this.

[0085] In embodiments of this application, the folding device 001 further includes an interconnect component 100, one end of which is located on a first body 10, and the other end of which is located on a second body 20. Devices on the first body 10 and devices on the second body 20 can communicate via the interconnect component 100. For example, one end of the interconnect component 100 is signal-connected to a first printed circuit board 140, and the other end of the interconnect component 100 is signal-connected to a second printed circuit board 240.

[0086] In some embodiments, the interconnect component 100 passes through the first pivot 30, which can make full use of the thickness of the first pivot 30 along the z direction to save the thickness of the folding device 001. In addition, during the folding or unfolding process of the folding device 001, the first pivot 30 can also constrain the space for movement of the interconnect component 100, and prevent the interconnect component 100 from moving too much along the z direction.

[0087] This application does not limit the structure of the first pivot 30. Exemplarily, the first pivot 30 includes a first door panel 31, a second door panel 32, and a shaft 33. When the folding device 001 is in a flattened state, the first door panel 31, the second door panel 32, and the shaft 33 are arranged along the x-direction. The first door panel 31 and the shaft 33 are rotatably connected, for example, through an arc-shaped groove and a slider. In an embodiment where the interconnecting component 100 passes through the first pivot 30, the interconnecting component 100 passes through the arc-shaped groove. Alternatively, the first door panel 31 and the shaft 33 are rotatably connected via a hinge. Similarly, the second door panel 32 and the shaft 33 are rotatably connected, for example, through an arc-shaped groove and a slider; or, the second door panel 32 and the shaft 33 are rotatably connected via a hinge. The first frame 0111 is connected to the first door panel 31, for example, by screws or snap-fit. The second frame 211 is connected to the second door panel 32, for example, by screwing or snap-fitting.

[0088] In some embodiments, the folding device 001 may further include a display screen 40. The first body 10, the second body 20, and the first pivot 30 jointly support the display screen 40. When the folding device 001 is in a folded state, the angle between the surface of the first body 10 facing the display screen 40 and the surface of the second body 20 facing the display screen 40 can be -10° to 10°, and the opening of this angle faces the display screen 40, for example, it can be ±10°, ±9°, ±8°, ±7°, ±6°, ±5°, ±4°, ±3°, ±2°, ±1°, or 0°. When the folding device 001 is in a flattened state, the angle between the surface of the first main body 10 facing the display screen 40 and the surface of the second main body 20 facing the display screen 40 can be 170° to 190°, and the opening of the angle faces the display screen 40. For example, it can be 170°, 172°, 175°, 178°, 179°, 180°, 181°, 182°, 185°, 188° or 190°.

[0089] This application does not limit the folding type of the folding device 001. In some embodiments, the folding device 001 has an inward folding structure, that is, when the folding device 001 is in the folded state, the display screen 40 is located between the first main body 10 and the second main body 20. In other embodiments, the folding device 001 has an outward folding structure, that is, when the folding device 001 is in the folded state, both the first main body 10 and the second main body 20 are located between opposite ends of the display screen 40.

[0090] For example, the display screen 40 may be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a flexible light-emitting diode (FLED) display, a MiniLED display, a MicroLED display, a Micro-OLED display, a quantum dot light-emitting diode (QLED) display, etc.

[0091] Figure 4a This is a schematic diagram of the structure of an interconnect component 100 provided in an embodiment of this application. Please refer to... Figure 4aThe interconnect component 100 includes an optical fiber 130, a first interconnect structure 110, and a second interconnect structure 120. The optical fiber 130 includes a first end 131 and a second end 132 disposed opposite to each other. The first end 131 is connected to the first interconnect structure 110, and the second end 132 is connected to the second interconnect structure 120.

[0092] The first interconnect structure 110 includes a first cover 111 and a surface-emitting laser 112. The first cover 111 covers the surface-emitting laser 112. The first end 131 of the optical fiber 130 is connected to the first cover 111 and coupled to the surface-emitting laser 112. The surface-emitting laser 112 includes a first surface 101 for connection with the first substrate 201.

[0093] The second interconnect structure 120 includes a second cover 121 and a photodetector (PD) 122. The second cover 121 covers the photodetector 122. The second end 132 of the optical fiber 130 is connected to the second cover 121 and coupled to the photodetector 122. The photodetector 122 includes a second surface 102 for connection to the second substrate 202.

[0094] The distance H between the first surface 101 and the surface of the first cover 111 facing away from the surface-emitting laser 112 is less than or equal to 2 mm. This small distance reduces the size of the first interconnect structure 110 in the direction perpendicular to the first surface 101, which is beneficial for miniaturization of the interconnect assembly 100. In addition, the interconnect assembly 100 transmits signals through the optical fiber 130, the surface-emitting laser 112, and the photodetector 122. Compared with signal transmission using conductive interconnects, the optical fiber 130 is smaller in size and requires less space.

[0095] When the interconnect component 100 is applied to a folding device, the optical fiber 130 passes through the first pivot 30 (e.g., Figure 2 As shown, the optical fiber 130 occupies little internal space in the first pivot 30, which is beneficial for miniaturization of the folding device. The freed-up space in the first pivot 30 can be used to improve the screen flatness of the folding device, arrange liquid cooling film, or add interfaces, which helps to improve the performance of the folding device.

[0096] In some embodiments of this application, the distance H between the first surface 101 and the surface of the first cover 111 facing away from the laser emitting 112 is less than or equal to 1.5 mm. This further reduces the size of the first interconnect structure 110 in the direction perpendicular to the first surface 101, which is beneficial for miniaturizing the interconnect component 100.

[0097] For example, the distance H between the first surface 101 and the surface of the first cover 111 that emits the laser 112 away from the surface can be 2mm, 1.8mm, 1.6mm, 1.5mm, 1.4mm, 1.3mm, 1.2mm, 1.1mm or 1mm, etc.

[0098] In some embodiments of this application, the distance from the second surface 102 to the surface of the second cover 121 facing away from the photodetector 122 is 2 mm. This can reduce the size of the second interconnect structure 120 in the direction perpendicular to the second surface 102, which is beneficial for miniaturization of the interconnect component 100. This distance is described in the foregoing description of distance H and will not be repeated here.

[0099] The coupling between the first end 131 of the aforementioned optical fiber 130 and the surface-emitting laser 112 means that optical signals can be transmitted between the first end 131 of the optical fiber 130 and the surface-emitting laser 112. The optical signals emitted by the surface-emitting laser 112 can be transmitted to the first end 131 of the optical fiber 130. The coupling between the second end 132 of the optical fiber 130 and the photodetector 122 is similar.

[0100] During the use of interconnect component 100 in a folding device, the first surface 101 is perpendicular to the z-direction of the folding device. Herein, the direction perpendicular to the first surface 101 is defined as the z-direction. The distance from the aforementioned first surface 101 to the surface of the laser emitting from the back surface of the first cover 111 is the distance between the surfaces of the first surface 101 and the laser emitting from the back surface of the first cover 111 along the z-direction.

[0101] When the surface of the laser emitting device 112 on the back side of the first cover 111 is an irregular surface, the distance H between the first surface 101 and the surface of the laser emitting device 112 on the back side of the first cover 111 is: the maximum distance between the first surface 101 and the surface of the laser emitting device 112 on the back side of the first cover 111.

[0102] In the embodiments of this application, the minimum bending radius of the optical fiber 130 is less than or equal to 1 mm. Thus, the optical fiber 130 requires less space during bending. Exemplarily, the minimum bending radius of the optical fiber 130 can be 1 mm, 0.9 mm, 0.8 mm, 0.7 mm, 0.6 mm, etc. The aforementioned minimum bending radius refers to the radius at which the optical fiber 130 can be safely bent within any given range, and the bending loss is less than 1.0 dB / turn (decibels per turn).

[0103] In some embodiments of this application, the optical fiber 130 is a multi-core optical fiber. When the outer diameter of the optical fiber is the same, multi-core optical fibers are easier to bend than single-core optical fibers. Multi-core optical fibers can reduce the bending radius of the optical fiber 130, and the space required for bending the optical fiber 130 is smaller, which helps save space required for the interconnect component 100 during bending or unfolding.

[0104] In the embodiments of this application, the number of fiber cores 134 in the optical fiber 130 is greater than or equal to 50. Thus, the optical fiber 130 has a relatively large number of fiber cores 134, resulting in a small bending radius, which is less than or equal to 1 mm. This also reduces the space required for bending the optical fiber 130.

[0105] In embodiments of this application, the optical fiber 130 includes a cladding 133 and a plurality of fiber cores 134. The cladding 133 surrounds the outer peripheral surface of the plurality of fiber cores 134, and the diameter D of the outer peripheral surface of the cladding 133 is less than or equal to 250 μm (micrometers).

[0106] The refractive index of the fiber core 134 is greater than that of the cladding 133. The cladding 133 can reflect the optical signals transmitted within the fiber core 134, confining the optical signals within the fiber core 134 and protecting it. This achieves low-loss transmission of the optical signal. Furthermore, the waveguide formed by each fiber core 134 and cladding 133 also has good flexibility, giving the optical fiber 130 superior bending performance.

[0107] Since the first end 131 of the optical fiber 130 is connected to the first cover 111, the size of the optical fiber 130 affects the size of the first cover 111 along the z-direction. If the diameter D of the outer peripheral surface of the cladding 133 is smaller, the size of the first cover 111 along the z-direction will be smaller.

[0108] In some embodiments, the diameter D of the outer peripheral surface of the cladding 133 is 220 μm-250 μm. Thus, the optical fiber 130 has little impact on the z-direction dimension of the first cover 111, and this diameter size does not impose strict requirements on the fabrication process of the optical fiber 130.

[0109] For example, the diameter D of the outer peripheral surface of the cladding 133 can be 250μm, 245μm, 242μm, 240μm, 230μm, 220μm, 210μm, 200μm, 180μm, etc.

[0110] In embodiments of this application, the core 134 may be made of materials such as poly(methyl methacrylate) (PMMA). The cladding 133 may be made of materials such as poly(vinylidene fluoride) (PVDF).

[0111] In some embodiments of this application, the optical fiber 130 may further include a coating layer that surrounds the outer peripheral surface of the cladding 133 and can protect the cladding 133.

[0112] In some embodiments of this application, the coating layer surrounds the outer peripheral surface of a portion of the cladding 133. For example, the coating layer is disposed on the outer peripheral surface of the portion of the cladding 133 located between the first interconnect structure 110 and the second interconnect structure 120. Thus, the coating layer does not occupy space in the first interconnect structure 110, saving space in the first interconnect structure 110. Similarly, the coating layer does not occupy space in the second interconnect structure 120, saving space in the second interconnect structure 120.

[0113] In some embodiments of this application, the fiber core 134 may also include an optical cable jacket that surrounds the outer periphery of the cladding 133 and can protect the cladding 133.

[0114] In some embodiments of this application, the optical cable protective sleeve surrounds the outer peripheral surface of a portion of the cladding 133. For example, the optical cable protective sleeve surrounds the outer peripheral surface of the portion of the cladding 133 located between the first interconnect structure 110 and the second interconnect structure 120. This prevents the optical cable protective sleeve from occupying space in the first interconnect structure 110 and the second interconnect structure 120.

[0115] In some embodiments of this application, the coating layer is not necessary and can be omitted. Similarly, the optical cable protective sleeve is not necessary and can be omitted.

[0116] The shape of the first cover 111 is not limited in this application embodiment, and is set according to the size of the space for installing the first cover 111. In some embodiments, according to requirements such as strength or aesthetics, reinforcements, coatings or hollow structures may be provided on the first cover 111.

[0117] In some embodiments of this application, the first cover 111 can be a single-piece molded part. Compared with the first cover 111 being a split structure, the first interconnect structure 110 has fewer parts and the assembly process of the first interconnect structure 110 is simpler.

[0118] In some embodiments of this application, the first cover 111 can be a split structure.

[0119] Figure 4b This is a schematic diagram of a first interconnection structure 110 and an optical fiber 130 provided in an embodiment of this application. Figure 4b The first interconnect structure 110 and Figure 4a The differences in the first interconnect structure 110 include: the first cover 111 is a split structure.

[0120] Figure 4bIn the first cover 111, there are a male connection end 114 and a female connection end 115, at least one of the male connection end 114 and the female connection end 115 is directly connected to the optical fiber 130.

[0121] During the assembly of the first interconnect structure 110, one of the male connector 114 and the female connector 115 can be assembled with the surface-emitting laser 112 first, and then the male connector 114 and the female connector 115 can be assembled. For example, the relative positions of the male connector 114 and the surface-emitting laser 112 can be determined first. After assembling the male connector 114 and the female connector 115, the relative positions of the female connector 115 and the surface-emitting laser 112 can also be determined. After the optical fiber 130 is connected to at least one of the male connector 114 and the female connector 115, the relative positions of the optical fiber 130 and the surface-emitting laser 112 can be determined.

[0122] For example, in assembling the first interconnect structure 110 with other components of the folding device, the male connector 114 and the first substrate 201 are assembled first, followed by the surface-emitting laser 112 and the first substrate 201. Then, the female connector 115 and the optical fiber 130 are assembled. Even if the assembly precision of the male connector 114 and the first substrate 201 is low during the assembly process, the relative position error between the male connector 114 and the surface-emitting laser 112 can be reduced, and the assembly precision of the male connector 114 and the female connector 115 can be improved, resulting in a more accurate relative position between the surface-emitting laser 112 and the female connector 115. After the optical fiber 130 is connected to the first cover 111, it helps to improve the assembly precision of the optical fiber 130 and the surface-emitting laser 112, and optimizes the coupling efficiency of the optical fiber 130 and the surface-emitting laser 112.

[0123] In this way, the coupling efficiency between the optical fiber 130 and the surface-emitting laser 112 can be improved by increasing the assembly precision of the male connector 114 and the female connector 115. The assembly precision requirements for the male connector 114 and the first substrate 201 are reduced.

[0124] At least one of the aforementioned male connector 114 and female connector 115 is directly connected to the optical fiber 130, including: male connector 114 is directly connected to the optical fiber 130, while female connector 115 is not directly connected to the optical fiber 130. Alternatively, male connector 114 is not directly connected to the optical fiber 130, while female connector 115 is directly connected to the optical fiber 130. Alternatively, both male connector 114 and female connector 115 are directly connected to the optical fiber 130.

[0125] This application does not limit the connection method between the male terminal 114 and the female terminal 115. For example, the male terminal 114 and the female terminal 115 can be connected by bonding, snap-fitting, welding, or screwing.

[0126] Figure 4b In the example, the male connector 114 and the female connector 115 are arranged along the z-direction. In other words, along the z-direction, the male connector 114 is located between the female connector 115 and the surface-emitting laser 112.

[0127] In some embodiments of this application, the arrangement direction of the male terminal 114 and the female terminal 115 can be other directions, such as a direction parallel to the first surface 101. This application does not limit this.

[0128] Figure 4b In the example, the first cover 111 includes two components: a male connection end 114 and a female connection end 115. In some embodiments, depending on the requirements, the first cover 111 may include three, four or more components, which are connected together to form the first cover 111.

[0129] As described above, the first end 131 of the optical fiber 130 is connected to the first cover 111, and the first end 131 of the optical fiber 130 is coupled to the surface-emitting laser 112. The optical fiber 130 is partially bent within the first cover 111.

[0130] Figure 4b and Figure 4a In the example, the first cover 111 has a channel 113 that houses a portion of the optical fiber 130. In other words, a portion of the optical fiber 130 is located within the channel 113. The channel 113 includes a first opening 116 and a second opening 117, which are located at opposite ends of the channel 113. The first opening 116 is opposite to the surface-emitting laser 112. The second opening 117 allows the optical fiber 130 to pass through. The orientations of the first opening 116 and the second opening 117 are perpendicular to each other.

[0131] For example, Figure 4b In the middle, the first opening 116 faces downwards, and the second opening 117 faces to the right.

[0132] Thus, the central angle corresponding to the partial bend of the optical fiber 130 within the first cover 111 is close to 90°, which can fully utilize the minimum bending radius of the optical fiber 130. Reducing the space occupied by the bending of the optical fiber 130 in the first cover 111 is beneficial to reducing the volume of the first interconnect structure 110.

[0133] In the embodiments of this application, an angle of 85°-95° ​​between the orientation of the first opening 116 and the orientation of the second opening 117 is considered to mean that the orientations of the first opening 116 and the second opening 117 are perpendicular to each other. For example, the angle between the orientations of the first opening 116 and the second opening 117 is 85°, 86°, 88°, 89°, 90°, 91°, 92°, 93°, 95°, etc.

[0134] In some embodiments of this application, the surface-emitting laser 112 is a vertical-cavity surface-emitting laser (VCSEL). Thus, the surface-emitting laser 112 has a high data transmission rate. This can improve the transmission efficiency of the interconnect component 100, enabling the interconnect component 100 to be applied to high-speed signal transmission scenarios.

[0135] For example, in embodiments of this application, the surface-emitting laser 112 and the photodetector 122 can be packaged using flip-chip technology, which helps to reduce the aforementioned distance H. Alternatively, in some embodiments, the surface-emitting laser 112 and the photodetector 122 can be packaged using wire bonding.

[0136] In some embodiments of this application, the communication transmission rate of the surface-emitting laser 112 is greater than or equal to 10 Gbps. Thus, the interconnect component 100 can be used in scenarios with a transmission rate greater than or equal to 10 Gbps.

[0137] In some embodiments of this application, the diameter of the emitting surface of the surface-emitting laser 112 is less than or equal to 100 μm. The emitting surface of the surface-emitting laser 112 refers to the end face of the surface-emitting laser 112 used to emit optical signals. A smaller emitting surface diameter results in a higher transmission rate for the surface-emitting laser 112, greater than or equal to 10 Gbps, allowing the interconnect component 100 to be used in high-transmission-rate scenarios.

[0138] For example, the diameter of the photosensitive surface of the surface-emitting laser 112 can be 100μm, 95μm, 90μm, 85μm, 80μm or 70μm, etc.

[0139] In some embodiments of this application, the surface-emitting laser 112 has a dimension of 0.15 μm-0.5 μm along the z-direction. This results in a smaller space occupied by the surface-emitting laser 112 along the z-direction, which helps save space in the second interconnect structure 120 along the z-direction. For example, the dimension of the surface-emitting laser 112 along the z-direction can be 0.15 μm, 0.16 μm, 0.17 μm, 0.18 μm, 0.19 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, or 0.5 μm, etc.

[0140] For example, the surface-emitting laser 112 operates in the 400nm-1500nm range. Thus, the interconnect component 100 can be used in scenarios where the optical signal operates in the 400nm-1500nm range. For instance, the surface-emitting laser 112 operates at a wavelength of 850nm.

[0141] In the embodiments of this application, the structure of the second cover 121 is described in the aforementioned description of the first cover 111. The connection relationship between the second cover 121 and the second end 132 of the optical fiber 130 is described in the aforementioned description of the first cover 111 and the first end 131 of the optical fiber 130.

[0142] The photodetector 122 has a communication transmission rate greater than or equal to 10 Gbps. Therefore, the interconnect component 100 can be used in scenarios with transmission rates greater than or equal to 10 Gbps. For example, it can be used in foldable devices such as foldable phones.

[0143] For example, the photodetector 122 operates in the 400nm-1500nm range. Thus, the interconnect component 100 can be used in scenarios where the optical signal operates in the 400nm-1500nm range.

[0144] For example, the operating wavelength of a photodetector is 850 nm.

[0145] In some embodiments, the photosensitive surface diameter of the photodetector 122 is less than or equal to 100 μm. The photosensitive surface of the photodetector 122 refers to the end face of the photodetector 122 used to receive optical signals from the second end 132. A smaller photosensitive surface diameter results in a higher transmission rate for the photodetector 122, greater than or equal to 10 Gbps, allowing the interconnect component 100 to be used in high-transmission-rate scenarios.

[0146] For example, the diameter of the photosensitive surface of the photodetector 122 can be 100μm, 95μm, 90μm, 85μm, 80μm or 70μm, etc.

[0147] In some embodiments of this application, the photodetector 122 has a dimension of 0.15 μm-0.5 μm along the z-direction. This results in a smaller space occupied by the photodetector 122 along the z-direction, which helps save space in the second interconnect structure 120 along the z-direction. For example, the dimension of the photodetector 122 along the z-direction can be 0.15 μm, 0.16 μm, 0.17 μm, 0.18 μm, 0.19 μm, 0.2 μm, 0.25 μm, 0.3 μm, 0.35 μm, 0.4 μm, or 0.5 μm, etc.

[0148] In some embodiments of this application, there is a gap between the surface-emitting laser 112 and the first end 131 of the optical fiber 130, and the beam emitted from the surface-emitting laser 112 passes through this gap to the first end 131. In other words, the optical path between the surface-emitting laser 112 and the first end 131 of the optical fiber 130 is a free-space optical path.

[0149] In some embodiments of this application, the beam emitted from the surface-emitting laser 112 can be shaped to increase the coupling efficiency between the surface-emitting laser 112 and the first end 131 of the optical fiber 130.

[0150] Similarly, in some embodiments, there is a gap between the photodetector 122 and the second end 132 of the optical fiber 130, through which the light beam emitted from the second end 132 is transmitted to the photodetector 122. In other words, the optical path between the photodetector 122 and the second end 132 of the optical fiber 130 is a free-space optical path.

[0151] In some embodiments of this application, the beam emitted from the second end 132 can be shaped to increase the coupling efficiency between the photodetector 122 and the second end 132 of the optical fiber 130.

[0152] Figure 5 A schematic diagram of another interconnect component 100 provided in an embodiment of this application. Please refer to... Figure 5 The first interconnect structure 110 also includes a first lens 118, which is used to couple the light beam from the surface-emitting laser 112 to the first end 131. In this way, the first lens 118 can shape the light beam from the surface-emitting laser 112 and couple it to the first end 131, thereby reducing the coupling loss of the first interconnect structure 110 and helping to reduce the loss of the interconnect component 100.

[0153] For example, the first lens 118 can be a coupling lens or a focusing lens, which is beneficial to improving the coupling efficiency between the surface-emitting laser 112 and the first end 131 of the optical fiber 130.

[0154] In some embodiments of this application, the first lens 118 and the first cover 111 are connected.

[0155] In some embodiments of this application, a free-space optical path may exist between the first lens 118 and the surface-emitting laser 112. In some embodiments, the first lens 118 and the surface-emitting laser 112 may be directly connected; for example, the first lens 118 may be a transparent adhesive layer, and the light-emitting surface of the surface-emitting laser 112 may be directly connected to the transparent adhesive layer.

[0156] In some embodiments of this application, the first lens 118 and the first cover 111 are connected as a single integral part. Thus, the first lens 118 and the first cover 111 do not need to be assembled separately, avoiding the problem of low assembly accuracy in the first lens 118 and the first cover 111.

[0157] For example, both the first lens 118 and the first cover 111 are made of light-transmitting materials. The surfaces of the first cover 111 and the surface-emitting laser 112 facing each other include curved surfaces, which can be regarded as light-shaping surfaces. The beam emitted by the surface-emitting laser 112 passes through the curved surface and is received by the first end 131.

[0158] Figure 5 In some embodiments, the second interconnect structure 120 may further include a second lens 123, which is used to couple the light beam from the second end 132 to the photodetector 122. Thus, the second lens 123 helps reduce the coupling loss of the second interconnect structure 120 and consequently reduces the loss of the interconnect component 100.

[0159] The structure of the second lens 123 is described in the preceding description of the first lens 118. The descriptions of the second lens 123 and the second cover 121 are described in the preceding descriptions of the first lens 118 and the first cover 111.

[0160] In some embodiments of this application, the first lens 118 is not necessary, and the size of the light-incident surface of the first end 131 is larger than the size of the light-emitting surface of the surface-emitting laser 112. Even if the interconnect assembly 100 does not have the first lens 118, the coupling efficiency between the first end 131 and the surface-emitting laser 112 is still high. In addition, by not having the first lens 118, the interconnect assembly 100 can save the size of the first interconnect structure 110 along the z-direction.

[0161] In some embodiments of this application, the second lens 123 is not necessary and can be omitted. This can save the dimensions of the second interconnect structure 120 along the z-direction.

[0162] In other words, in the embodiments of this application, the interconnect component 100 may be provided with one or both of the first lens 118 and the second lens 123. Alternatively, the interconnect component 100 may not be provided with either the first lens 118 or the second lens 123.

[0163] As described above, in the embodiments of this application, the first surface 101 is used to connect with the first substrate 201. The second surface 102 is used to connect with the second substrate 202.

[0164] In some embodiments of this application, the interconnect component 100 does not include the aforementioned first substrate 201 and second substrate 202. For example, during the use of the interconnect component 100, the first surface 101 and the first printed circuit board 140 in the folding device (e.g.) Figure 3 (As shown) connection. The second surface 102 and the second printed circuit board 240 in the folding device (as shown) Figure 3 (As shown) connection.

[0165] In some embodiments of this application, the interconnect component 100 may include the aforementioned first substrate 201 and second substrate 202.

[0166] Please return Figure 4a The interconnect component 100 also includes a first substrate 201 and a second substrate 202. The first substrate 201 is connected to a first cover 111. A surface-emitting laser 112 is located between the first substrate 201 and the first cover 111. The second substrate 202 is connected to the second cover 121, and a photodetector 122 is located between the second substrate 202 and the second cover 121.

[0167] Thus, the first substrate 201 is used to support the first cover 111 and the surface-emitting laser 112. The second substrate 202 is used to support the second substrate 202 and the surface-emitting laser 112.

[0168] In some scenarios, the first substrate 201 may be provided with a first circuit, which is electrically connected to the surface-emitting laser 112. The first circuit can be used to transmit electrical signals to the surface-emitting laser 112. Similarly, the second substrate 202 may be provided with a second circuit, which is electrically connected to the photodetector 122. The second circuit can be used to transmit electrical signals to the photodetector 122.

[0169] For example, the first substrate 201 may include a conductive layer and a dielectric layer, which are stacked along the thickness direction of the first substrate 201. The first substrate 201 may be referred to as a printed circuit board. Similarly, in some embodiments, the second substrate 202 may be referred to as a printed circuit board.

[0170] Figure 4a In the example, the surface-emitting laser 112 protrudes from the first substrate 201. In other words, the surface-emitting laser 112 and the first substrate 201 do not overlap along the z-direction. Thus, during the assembly of the surface-emitting laser 112 and the first substrate 201, there is no need to perform grooving or thinning on the surface of the first substrate 201, simplifying the process and avoiding the reduction of the strength of the first substrate 201 by grooving or thinning.

[0171] Figure 4a In the example, the photodetector 122 protrudes from the second substrate 202. Along the z-direction, the photodetector 122 and the second substrate 202 do not overlap. Similarly, during the assembly of the photodetector 122 and the second substrate 202, there is no need to perform grooving or thinning on the surface of the second substrate 202, simplifying the process and avoiding any reduction in the strength of the second substrate 202 due to grooving or thinning.

[0172] For example, the connection process between the surface-emitting laser 112 and the first substrate 201 can be surface mount technology (SMT). The surface mount technology can improve the assembly accuracy of the surface-emitting laser 112 and the first substrate 201, which is beneficial to improving the coupling efficiency between the first end 131 and the surface-emitting laser 112.

[0173] Similarly, the connection process between the photodetector 122 and the second substrate 202 can be a surface mount process, which is beneficial to improving the coupling efficiency between the second end 132 and the photodetector 122.

[0174] In embodiments where the interconnect component 100 includes a first substrate 201, the first substrate 201 is located away from the surface of the first cover 111, and the distance from the surface of the first cover 111 away from the surface of the first substrate 201 is less than or equal to 2 mm. Along the z-direction, the first interconnect structure 110 occupies less space, which is beneficial for miniaturization of the interconnect component 100.

[0175] In some embodiments, the surface of the first substrate 201 facing away from the surface of the first cover 111 is less than or equal to 1.5 mm. This can further reduce the space occupied by the first interconnect structure 110.

[0176] For example, the surface of the first substrate 201 facing away from the surface of the first cover 111 can be 2mm, 1.8mm, 1.6mm, 1.5mm, 1.4mm, 1.3mm, 1.2mm, 1.1mm or 1mm, etc.

[0177] In embodiments where the interconnect component 100 includes a second substrate 202, the second substrate 202 is located away from the surface of the second cover 121, and the distance from the surface of the second cover 121 away from the surface of the second substrate 202 is less than or equal to 2 mm. This also facilitates the miniaturization of the interconnect component 100.

[0178] In some embodiments, the surface of the second substrate 202 facing away from the surface of the second cover 121 is less than or equal to 1.5 mm. This can further reduce the space occupied by the second interconnect structure 120.

[0179] For example, the surface of the second substrate 202 facing away from the surface of the second cover 121 can be 2mm, 1.8mm, 1.6mm, 1.5mm, 1.4mm, 1.3mm, 1.2mm, 1.1mm or 1mm, etc.

[0180] When the interconnect component 100 is used in a device with a small requirement for the z-direction dimension, the distance between the surface of the first substrate 201 and the surface of the first cover 111 facing away from the surface of the first substrate 201 can be greater than 2 mm. Similarly, the distance between the surface of the second substrate 202 and the surface of the second cover 121 facing away from the surface of the second substrate 202 can be greater than 2 mm.

[0181] The embodiments of this application do not limit the connection method between the first cover 111 and the first substrate 201.

[0182] For example, the first cover 111 and the first substrate 201 are snapped together, bonded together, or welded together.

[0183] Figure 4b In the example, the first substrate 201 is provided with a protrusion 203, and the first cover 111 is provided with a slot 204, and the protrusion 203 and the slot 204 are engaged. In this way, the first cover 111 and the first substrate 201 are connected by utilizing the shapes of the first cover 111 and the first substrate 201, without the need for additional components for connecting the first cover 111 and the first substrate 201.

[0184] In some embodiments of this application, the first substrate 201 is provided with a slot 204, and the first cover 111 is provided with a protrusion 203, which engages with the slot 204. This also allows for the connection between the first cover 111 and the first substrate 201.

[0185] The connection method between the second cover 121 and the second substrate 202 is described in the description of the first cover 111 and the first substrate 201, and will not be repeated here.

[0186] In some embodiments of this application, in order to make full use of the space of the first substrate 201 in the z direction, a card slot can be provided on the first substrate 201.

[0187] Figure 6 This is a schematic diagram of another interconnect component 100 provided in an embodiment of this application. Please refer to... Figure 6 The first substrate 201 has a receiving groove 205, and at least a portion of the surface-emitting laser 112 is located within the receiving groove 205. Thus, the space of the first substrate 201 in its thickness direction is multiplexed by the surface-emitting laser 112. This facilitates a reduction in the size of the interconnect assembly 100 along the z-direction.

[0188] In some embodiments of this application, the entire surface-emitting laser 112 is located within the receiving groove 205. This further saves space along the z-direction of the first interconnect structure 110.

[0189] In some embodiments of this application, a portion of the surface-emitting laser 112 is located within the receiving groove 205, and another portion is located outside the receiving groove 205. Similarly, the space of the first substrate 201 in its thickness direction can be utilized, which is beneficial for miniaturization of the interconnect components 100.

[0190] Similarly, in some embodiments, the second substrate 202 may have a receiving groove, and at least a portion of the photodetector 122 is located within the receiving groove 205 of the second substrate 202. Utilizing the space of the second substrate 202 in its thickness direction facilitates the miniaturization of the interconnect component 100.

[0191] In some embodiments of this application, the first substrate 201 has a receiving groove, while the second substrate 202 does not have the aforementioned receiving groove. Alternatively, the second substrate 202 has the aforementioned receiving groove, while the first substrate 201 does not have the aforementioned receiving groove. Alternatively, the first substrate 201 has the aforementioned receiving groove, and the second substrate 202 has the aforementioned receiving groove.

[0192] Figure 6 For the remaining structures, please refer to Figure 4a The description in the text.

[0193] Understandable, Figure 6 The first interconnect structure in can be Figure 4a The first interconnect structure 110 shown is illustrated. Figure 6 You can also set the aforementioned Figure 5 The first lens 118 or the second lens 123.

[0194] In the foregoing Figure 4a , Figure 5 and Figure 6 In the example, the first cover 111 and the second cover 121 have the same shape and size. In some usage scenarios, the shape and size of the first cover 111 can be set according to the space size for storing the first cover 111, and the shape and size of the second cover 121 can be set according to the space size for storing the second cover 121. This application embodiment does not limit this.

[0195] Please return Figure 3 Since the dimensions of the first interconnect structure 110 and the second interconnect structure 120 along the z direction are small, it is beneficial to reduce the dimensions of the folding device 001 along the z direction.

[0196] Figure 3 In the example, the folding device 001 includes two interconnect components 100, namely a first interconnect component and a second interconnect component.

[0197] The first interconnect structure 110 of the first interconnect component is connected to the first body 10. The second interconnect structure 120 of the first interconnect component is connected to the second body 20. The second interconnect structure 120 of the second interconnect component is connected to the first body 10. The first interconnect structure 110 of the second interconnect component is connected to the second body 20.

[0198] Thus, the first body 10 and the second body 20 are interconnected through the first interconnect component and the second interconnect component. Since the two interconnect structures in the interconnect component are connected by optical fibers, the area occupied by the optical fibers is small, especially the required size along the y-direction. This reduces the space required by the interconnect component at the first pivot point.

[0199] For example, the surface-emitting laser 112 of the first interconnect structure 110 of the first printed circuit board 140 and the first interconnect assembly (such as...) Figure 6 As shown, the second printed circuit board 240 and the photodetector 122 of the second interconnect structure 120 of the first interconnect component are connected. The signal from the first printed circuit board 140 is transmitted to the second printed circuit board 240 through the interconnect component 100.

[0200] Thus, the first body 10 and the second body 20 are interconnected through the first interconnect component and the second interconnect component. Since the two interconnect structures in the interconnect component are connected by optical fibers, the area occupied by the optical fibers is small, especially the required size along the y-direction. This reduces the space required by the interconnect component at the first pivot point.

[0201] The interconnect component 100 includes a first substrate 201 (such as...) Figure 6 In the embodiment shown, the first printed circuit board 140 and the first substrate 201 can be stacked. Since the first interconnect structure 110 has a smaller dimension along the z-direction, the arrangement of the interconnect components 100 has a smaller impact on the dimension of the folding device 001 along the z-direction.

[0202] In some embodiments, a portion of the first printed circuit board 140 serves as the first substrate 201. In other words, the first surface emitting laser 112 is connected to the first printed circuit board 140. In such embodiments, reusing the first printed circuit board 140 as the first substrate 201 can further save space along the z-direction of the first interconnect structure 110. In such embodiments, the interconnect component 100 may not include the first substrate 201, reducing the number of devices and helping to save on device fabrication costs.

[0203] In an embodiment where the first printed circuit board 140 and the first substrate 201 are stacked, the first substrate 201 faces away from the first cover 111 (e.g., Figure 6The distance from the surface of the first cover 111 to the surface of the first substrate 201 (as shown) is less than or equal to 2 mm. Thus, the space occupied by the interconnect component 100 in the z-direction is smaller.

[0204] In embodiments where the first printed circuit board 140 serves as the first substrate 201, the distance from the surface of the first printed circuit board 140 near the first cover 111 to the surface of the first cover 111 away from the first substrate 201 is less than or equal to 2 mm. Similarly, the interconnect components 100 occupy less space in the z-direction. In such embodiments, the surface-emitting laser 112 (e.g., Figure 6 As shown, the first surface 101 of the surface-emitting laser 112 can be protruded from the first substrate 201. Figure 6 The distance from the surface of the first cover 111 away from the surface of the first substrate 201 (as shown) is less than or equal to 2 mm. The surface-emitting laser 112 can be accommodated in the receiving groove 205 of the first substrate 201 (as shown). Figure 6 As shown, the distance from the surface of the receiving groove 205 near the first cover 111 to the surface of the first cover 111 away from the first substrate 201 is less than or equal to 2 mm. Thus, the arrangement of the first interconnect structure 110 occupies a dimension of the folding device 001 along the z-direction of less than or equal to 2 mm. This facilitates miniaturization of the folding device 001, or allows the folding device 001 to have more space for other structures.

[0205] Alternatively, in embodiments where a portion of the first printed circuit board 140 serves as the first substrate 201, the interconnect component 100 may not include the first substrate 201.

[0206] Similarly, in the interconnect component 100, a second substrate 202 (such as...) is included. Figure 6 In the embodiment shown, the second printed circuit board 240 and the second substrate 202 can be stacked. Alternatively, a portion of the second printed circuit board 240 can serve as the second substrate 202. In such embodiments, the interconnect component 100 may not include the second substrate 202, saving space along the z-direction of the folding device 001, reducing the number of devices, and saving device manufacturing costs.

[0207] In some embodiments, the folding device 001 may include only one interconnect component 100. For example, signals from the second printed circuit board 240 can be transmitted to the first printed circuit board 140 via a flexible printed circuit (FPC). In other words, signals from the first printed circuit board 140 to the second printed circuit board 240 are transmitted via the interconnect component 100, and signals from the second printed circuit board 240 to the first printed circuit board 140 are transmitted via the flexible printed circuit board.

[0208] In some embodiments of this application, the folding device 001 includes a plurality of interconnect components 100.

[0209] In the embodiments of this application, the folding device 001 is not limited to a two-fold device. For example, the folding device 001 can be a three-fold, four-fold, or more-fold device.

[0210] Figure 7 This is a schematic diagram of another folding device 001 provided in an embodiment of this application, in its flattened state. Please refer to... Figure 7 The folding device 001 also includes a second rotating shaft 03 and a third main body 06. Both the second main body 20 and the third main body 06 are rotatably connected to the second rotating shaft 03.

[0211] When the folding device 001 is in the flattened state, the first main body 10, the second main body 20 and the third main body 06 are arranged in sequence.

[0212] The interconnect component 100 connects the first main body 10 and the second main body 20. Because the interconnect component 100 occupies little space, the volume of the first rotating shaft 30 can be reduced. The volume of the folding device 001 with a three-fold structure including the interconnect component 100 can also be reduced accordingly.

[0213] exist Figure 7 In the example, the folding device 001 may include multiple interconnect components 100, with the first body 10 and the second body 20 interconnected via two interconnect components 100. The second body 20 and the third body 06 are interconnected via two interconnect components 100.

[0214] In some embodiments, the first interconnect structure 110 of the first interconnect component (such as...) Figure 6 (as shown) and the first body 10 are connected, and the second interconnection structure 120 of the first interconnection component (as shown) is connected to the first interconnection component. Figure 6 (As shown) and the second body 20 are connected. The first interconnect structure 110 of the third interconnect component is connected to the first body 10, and the second interconnect structure 120 of the third interconnect component is connected to the third body 06.

[0215] In some examples of this type of embodiment, the first interconnect structure 110 of the third interconnect component and the first interconnect structure 110 of the first interconnect component, both connected to the first body 10, can be interconnected. For example, the first interconnect structure 110 of the third interconnect component and the first interconnect structure 110 of the first interconnect component can share the first cover 111 (e.g., Figure 6 (As shown). In some embodiments, the first interconnect structure 110 of the third interconnect component and the first interconnect structure 110 of the first interconnect component may also share the first substrate 201 (e.g. Figure 6 (As shown).

[0216] Similarly, in other embodiments, two interconnect structures connected to the same body can share a cover and a substrate.

[0217] Figure 7 Please refer to the descriptions of each structure above. Figure 3 . Figure 7 Please refer to the foregoing for the connection method between the third main body 06 and the second main body 20. Figure 3 The connection method between the first main body 10 and the second main body 20.

[0218] Figure 8 This is a schematic diagram of the structure of a folding device 001 in its flattened state, provided as an embodiment of this application. Please refer to... Figure 8 The folding device 001 also includes a third body 06. When the folding device 001 is in the unfolded state, the first body 10, the third body 06, and the second body 20 are arranged in sequence. In other words, the third body 06 is located between the first body 10 and the second body 20.

[0219] Interconnect component 100 connects the first body 10 and the second body 20, and passes through the third body 06. In this way, interconnect component 100 can connect the folded bodies located at both ends of a three-fold device. This also reduces the space required for the interconnect component in the y-direction.

[0220] Figure 8 In one embodiment, the folding device 001 may include a plurality of interconnecting components 100, with the first body 10 and the second body 20 interconnected via two interconnecting components 100. The first body 10 and the third body 06 are also interconnected via two interconnecting components 100.

[0221] Figure 8 Please refer to the descriptions of each structure above. Figure 3 For example, the connection method between the first body 10 and the third body 06 is described above. Figure 3 For the connection methods of the first main body 10 and the second main body 20, and the connection methods of the third main body 06 and the second main body 20, please refer to the foregoing. Figure 3 The connection method between the first main body 10 and the second main body 20.

[0222] It is understood that in the embodiments of this application, the folding device 001 may be a four-fold, six-fold, or more-folding device, and the embodiments of this application do not limit this.

[0223] The interconnect components of the folding device 001 provided in this application embodiment occupy little space on the pivot, which is beneficial to the miniaturization of the folding device 001.

[0224] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An interconnect component (100), characterized in that, The interconnect component (100) includes: The optical fiber (130) includes a first end (131) and a second end (132) disposed opposite to each other; The first interconnect structure (110) includes a first cover (111) and a surface-emitting laser (112); the first cover (111) covers the surface-emitting laser (112), the first end (131) is connected to the first cover (111) and coupled to the surface-emitting laser (112), the surface of the surface-emitting laser (112) facing away from the first cover (111) is a first surface (101), and the first surface (101) is used to connect to the first substrate (201); The second interconnect structure (120) includes a second cover (121) and a photodetector (122); the second cover (121) covers the photodetector (122), the second end (132) is connected to the second cover (121) and coupled to the photodetector (122), the surface of the photodetector (122) facing away from the second cover (121) is a second surface (102), and the second surface (102) is used to connect to the second substrate (202); The distance from the first surface (101) to the surface of the first cover (111) away from the surface-emitting laser (112) is less than or equal to 2 mm; and / or, the distance from the second surface (102) to the surface of the second cover (121) away from the surface of the photodetector (122) is less than or equal to 2 mm.

2. The interconnect component (100) according to claim 1, characterized in that, The distance from the first surface (101) to the surface of the first cover (111) away from the surface emitting laser (112) is less than or equal to 1.5 mm.

3. The interconnect component (100) according to claim 1 or 2, characterized in that, The distance from the second surface (102) to the surface of the second cover (121) away from the photodetector (122) is less than or equal to 1.5 mm.

4. The interconnect component (100) according to any one of claims 1-3, characterized in that, The optical fiber (130) includes a cladding (133) and a plurality of fiber cores (134); the cladding (133) surrounds the outer peripheral surface of the plurality of fiber cores (134); the diameter of the outer peripheral surface of the cladding (133) is less than or equal to 250 μm.

5. The interconnect component (100) according to claim 4, characterized in that, The number of fiber cores (134) in the optical fiber is greater than or equal to 50.

6. The interconnect component (100) according to any one of claims 1-5, characterized in that, The first cover (111) is provided with a channel (113) that houses part of the optical fiber (130). The channel includes a first opening (116) and a second opening (117). The first opening (116) is opposite to the surface-emitting laser (112), and the orientation of the first opening (116) and the orientation of the second opening (117) are perpendicular to each other.

7. The interconnect component (100) according to any one of claims 1-6, characterized in that, The first cover (111) is a one-piece molded part.

8. The interconnect component (100) according to any one of claims 1-6, characterized in that, The first cover (111) includes a male connector (114) and a female connector (115), at least one of the male connector (114) and the female connector (115) being directly connected to the optical fiber (130).

9. The interconnect component (100) according to any one of claims 1-8, characterized in that, The surface-emitting laser (112) is a vertical-cavity surface-emitting laser (112).

10. The interconnect component (100) according to any one of claims 1-9, characterized in that, The photodetector (122) operates in the range of 400nm-1500nm, and / or the surface-emitting laser (112) operates in the range of 400nm-1500nm.

11. The interconnect component (100) according to any one of claims 1-10, characterized in that, The communication transmission rate of the photodetector (122) is greater than or equal to 10 Gbps, and / or the communication transmission rate of the surface-emitting laser (112) is greater than or equal to 10 Gbps.

12. The interconnect component (100) according to any one of claims 1-11, characterized in that, The photosensitive surface diameter of the photodetector (122) is less than or equal to 100 μm.

13. The interconnect component (100) according to any one of claims 1-12, characterized in that, The interconnect component (100) further includes the first substrate (201) and the second substrate (202); the first cover (111) and the first substrate (201) are connected, and the surface-emitting laser (112) is located between the first cover (111) and the first substrate (201); The second cover (121) and the second substrate (202) are connected, and the photodetector (122) is located between the second cover (121) and the second substrate (202).

14. The interconnect component (100) according to claim 13, characterized in that, The first substrate (201) is away from the surface of the first cover (111), and the distance between the first cover (111) and the surface of the first substrate (201) is less than or equal to 2 mm.

15. The interconnect component (100) according to claim 13 or 14, characterized in that, The first substrate (201) has a receiving groove, and at least a portion of the surface-emitting laser (112) is located in the receiving groove.

16. The interconnect component (100) according to claim 13 or 14, characterized in that, The surface-emitting laser (112) protrudes from the first substrate (201).

17. The interconnect component (100) according to any one of claims 13-16, characterized in that, The first substrate (201) is provided with a protrusion (203), and the first cover (111) is provided with a slot (204), wherein the protrusion (203) is engaged with the slot (204); or, the first cover (111) is provided with a protrusion (203), and the first substrate (201) is provided with a slot (204), wherein the protrusion is engaged with the slot (204).

18. The interconnect component (100) according to any one of claims 1-17, characterized in that, The first interconnect structure (110) further includes a first lens (118) for coupling a beam from the surface-emitting laser (112) to the first end (131).

19. The interconnect component (100) according to claim 18, characterized in that, The first lens (118) and the first cover (111) are connected as an integral molded part.

20. The interconnect component (100) according to any one of claims 1-19, characterized in that, The second interconnect structure (120) further includes a second lens (123) for coupling a light beam from the second end (132) to the photodetector (122).

21. A folding device (001), characterized in that, The folding device (001) includes: A first body (10) and a second body (20), the first body (10) and the second body (20) being rotatably connected; and The interconnect component (100) according to any one of claims 1-20; The first body (10) is connected to the first interconnect structure (110), and the second body (20) is connected to the second interconnect structure (120).

22. The folding device (001) according to claim 21, characterized in that, The first body (10) includes a first middle frame (011) and a first printed circuit board (140) connected together, and the first printed circuit board (140) and the first substrate (201) are arranged along the thickness direction of the first substrate (201).

23. The folding device (001) according to claim 21, characterized in that, The first body (10) includes a first middle frame (011) and a first printed circuit board (140) connected together, the first printed circuit board (140) serving as the first substrate (201).

24. The folding device (001) according to any one of claims 21-23, characterized in that, The folding device (001) includes a plurality of interconnecting components (100), and the plurality of interconnecting components (100) includes a first interconnecting component and a second interconnecting component; The first interconnect structure (110) of the first interconnect component is connected to the first body (10), and the second interconnect structure (120) of the first interconnect component is connected to the second body (20); The second interconnect structure (120) of the second interconnect component is connected to the first body (10), and the first interconnect structure (110) of the second interconnect component is connected to the second body (20).

25. The folding device (001) according to any one of claims 21-24, characterized in that, The folding device (001) further includes: a third body (06); the third body (06) is rotatably connected to the second body (20); When the folding device (001) is in a flattened state, the first main body (10), the second main body (20) and the third main body (06) are arranged in sequence; Alternatively, when the folding device (001) is in a flattened state, the first main body (10), the third main body (06), and the second main body (20) are arranged in sequence.

26. The folding device (001) according to claim 25, characterized in that, The folding device (001) further includes: a third interconnect component; In the third interconnect component, one of the first interconnect structure (110) and the second interconnect structure (120) is connected to the third body (06), and the other interconnect structure is connected to the first body (10) or the second body (20).

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