TOF camera module stacking structure

Abstract

This utility model provides a TOF camera module stacking structure, including a base; a laser emitting module and an image acquisition module, spaced apart on the base, respectively for emitting light towards a target object and receiving reflected light from the target object; a top shell, mounted on the base and mated with the base to form a housing, the top shell having a light-emitting hole and a light-receiving hole spaced apart, respectively facing the laser emitting module and the image acquisition module; a partition layer, placed between the base and the top shell, with the top surface of the partition layer abutting against the bottom surface of the top shell facing the base, the partition layer having a first clearance hole and a second clearance hole spaced apart, respectively fitting and sleeved on the outside of the laser emitting module and the image acquisition module; the portion of the partition layer connecting the top shell, the base, the laser emitting module and the image acquisition module forms a barrier structure, used to block the crosstalk path of the emitted light reflected from the inner cavity of the housing to the image acquisition module, avoiding crosstalk between the emitted light and the reflected light, and ensuring ranging accuracy.

Description

Technical Field

[0001] This utility model relates to the field of TOF camera technology, and in particular to a TOF camera module stacking structure. Background Technology

[0002] A Time-of-Flight (TOF) camera device emits modulated infrared light from a laser toward the object being photographed. The emitted infrared light is reflected when it encounters the object, and the image acquisition unit receives the reflected infrared light. The control unit calculates the time difference or phase difference between the emission and reflection of the infrared light to determine the distance between the device and the object, thereby generating the object's depth information. This information is then combined with images from a traditional camera, where different colors represent different distances, to present the object's three-dimensional outline.

[0003] However, in traditional Time-of-Flight (TOF) cameras, the infrared light emitted by the laser is easily reflected inside the camera's housing, creating a crosstalk path that leads to the receiving lens of the image acquisition unit. This results in crosstalk between the infrared light emitted by the laser and the infrared light reflected back to the image acquisition unit (e.g., ...). Figure 1 As shown in the figure, this leads to a decrease in the ranging accuracy of the TOF camera device, affecting its normal use and operational stability. In addition, the sealing performance of traditional TOF camera devices is limited, making it difficult to waterproof and dustproof, causing moisture and dust to easily seep into the device casing, thereby contaminating the inner surface of the camera's glass cover. Utility Model Content

[0004] This invention proposes a TOF camera module stacking structure to solve the technical problem of crosstalk between emitted and reflected light caused by the reflection of emitted light from the housing cavity to the image acquisition unit in traditional TOF camera devices.

[0005] To solve the above problems, the technical solution adopted by this utility model is as follows:

[0006] This utility model provides a TOF camera module stacking structure, including:

[0007] Base;

[0008] The laser emitting module and the image acquisition module are spaced apart on the base, and are respectively used to emit outgoing light towards the target object and receive reflected light from the target object;

[0009] The top shell is installed on the base and docked with the base to form a shell. The top shell is provided with light-emitting holes and light-receiving holes at intervals, which are respectively facing the laser emission module and the image acquisition module.

[0010] A partition layer is placed between the base and the top shell, with the top surface of the partition layer abutting against the bottom surface of the top shell facing the base. The partition layer is provided with a first clearance hole and a second clearance hole at intervals, which are respectively fitted onto the outside of the laser emission module and the image acquisition module.

[0011] The partition layer connecting the top shell, base, laser emission module, and image acquisition module forms a barrier structure to block the crosstalk path of emitted light reflected from the inner cavity of the shell to the image acquisition module.

[0012] Preferably, the laser emitting module includes:

[0013] The main circuit board is located on the top surface of the base facing the top shell;

[0014] The laser emitter is located on the top surface of the circuit board facing the top shell;

[0015] The transmitting bracket is located on the top surface of the circuit board facing the top shell and covers the outside of the laser emitter. The transmitting bracket is provided with a third clearance hole facing the laser emitter.

[0016] The transmitting lens is located on the top surface of the transmitting bracket facing the top shell and covers the third clearance hole, and extends through the first clearance hole into the light output hole.

[0017] Preferably, the image acquisition module includes:

[0018] An image acquisition unit is disposed on the top surface of the circuit board facing the top shell, spaced apart from the laser emitter;

[0019] The receiving bracket is located on the top surface of the circuit board facing the top shell and covers the outside of the image acquisition unit. The receiving bracket is provided with a fourth clearance hole facing the image acquisition unit.

[0020] The receiving lens is located on the top surface of the receiving bracket facing the top shell and covers the fourth clearance hole, and extends through the second clearance hole into the light-collecting hole.

[0021] Preferably, the bottom surface of the partition layer abuts against the top surfaces of the transmitting bracket and the receiving bracket facing the top shell.

[0022] Preferably, the transmitting lens, receiving lens, first clearance hole, second clearance hole, light-emitting hole, and light-collecting hole are all cylindrical.

[0023] Preferably, the top shell comprises:

[0024] The top cover plate has light-emitting holes and light-collecting holes spaced apart on it.

[0025] A pair of supporting side plates are respectively located on the bottom surface of the top cover plate facing the base, and respectively connected to the top surface of the base facing the top cover plate.

[0026] Furthermore, the top surface of the top cover plate facing away from the base is provided with a mounting groove to cover the laser emitting module and image acquisition module below, and the light emitting hole and the light receiving hole are spaced apart on the bottom surface of the mounting groove;

[0027] The TOF camera module stacking structure also includes:

[0028] A light-transmitting cover plate is installed in the mounting groove.

[0029] Preferably, the light-transmitting cover is a glass cover, and the areas of the glass cover facing the light-emitting hole and the light-receiving hole respectively form a pair of cylindrical light-transmitting areas. The bottom surface of the glass cover facing the base is screen-printed with ink layers that surround the pair of light-transmitting areas.

[0030] Preferably, the partition layer is made of foam material.

[0031] Preferably, the top cover, base, mounting groove, glass cover, and partition layer are all cuboid.

[0032] Compared with the prior art, the present invention has the following beneficial effects:

[0033] The TOF camera module stacking structure provided by this utility model forms a barrier structure that fills the internal space of the housing by connecting the top shell, base, laser emitting module, and image acquisition module through a foam partition layer. This, together with the screen-printed ink partition layer on the bottom surface of the glass cover and the solid portion of the top cover located between the light-emitting hole and the light-receiving hole, blocks the crosstalk path of the emitted light from the laser emitting module reflected within the housing cavity to the image acquisition module, thus achieving light sealing. This prevents crosstalk between emitted and reflected light at the receiving lens, ensuring the ranging accuracy of the TOF camera module. Furthermore, the compression of the foam partition layer by the top shell and base creates a pair of sealed small cavities between the inner surface of the glass cover and the light-emitting hole, the end face of the emitting lens, the light-receiving hole, and the end face of the receiving lens. This prevents moisture and dust from seeping into the housing from condensing or accumulating on the inner surface of the glass cover, thus ensuring the light emission and reception effects and operational stability of the TOF camera module. Attached Figure Description

[0034] To more clearly illustrate the technical solution proposed by this utility model, the present utility model will be described in detail below with reference to the embodiments and accompanying drawings. It should be understood that the embodiments and accompanying drawings described in the following detailed description are merely some embodiments of this utility model, and those skilled in the art can make changes to these drawings under the concept of this utility model.

[0035] Figure 1 This is a schematic diagram illustrating the crosstalk principle between emitted and reflected rays;

[0036] Figure 2A three-dimensional structural schematic diagram of an embodiment of the TOF camera module stacking structure provided by this utility model;

[0037] Figure 3 An exploded view of an embodiment of the TOF camera module stacking structure provided by this utility model;

[0038] Figure 4 A cross-sectional view of an embodiment of the TOF camera module stacking structure provided by this utility model;

[0039] Figure 5 A schematic diagram illustrating the working principle of the ink barrier layer used for screen printing on glass covers to block crosstalk.

[0040] Figure 6 A schematic diagram illustrating the working principle of the top cover plate blocking crosstalk;

[0041] Figure 7 A schematic diagram illustrating the working principle of the interlayer for blocking crosstalk.

[0042] The main markings in the attached figures are as follows:

[0043] 1. Base; 11. Mounting hole; 12. Circuit board; 2. Laser emitting module; 21. Laser emitter; 22. Emitting bracket; 221. Third clearance hole; 23. Emitting lens; 3. Image acquisition module; 31. Image acquisition unit; 32. Receiving bracket; 321. Fourth clearance hole; 33. Receiving lens; 4. Top shell; 41. Top cover plate; 411. Mounting groove; 412. Light emission hole; 413. Light collection hole; 42. Support side plate; 421. Mounting column; 5. Separating layer; 51. First clearance hole; 52. Second clearance hole; 6. Connecting screw; 7. Light-transmitting cover plate; 71. Ink separator.

[0044] Other markings in the diagram are as follows:

[0045] A. Outgoing ray; B. Reflected ray; C. Transmitting area; D. Crosstalk path. Detailed Implementation

[0046] To make the technical problem to be solved, the technical solution and the beneficial effects of this utility model clearer, the following description is provided in conjunction with the appendix. Figure 2-7 The present invention will be further described in detail with reference to the embodiments.

[0047] Please refer to the following: Figure 2-7 The TOF camera module stacking structure provided by this utility model includes:

[0048] Base 1; laser emitting module 2 and image acquisition module 3 are spaced apart on base 1, respectively used to emit outgoing light A towards the target object and receive reflected light B from the target object; top shell 4 is installed on base 1 and docked with base 1 to form a shell, and the top shell 4 is provided with light emitting hole 412 and light receiving hole 413 spaced apart, the opening positions of light emitting hole 412 and light receiving hole 413 are respectively facing laser emitting module 2 and image acquisition module 3;

[0049] The partition layer 5 is placed between the base 1 and the top shell 4, and the top surface of the partition layer 5 facing away from the bottom shell abuts against the bottom surface of the top shell 4 facing the base 1. The partition layer 5 is provided with a first clearance hole 51 and a second clearance hole 52 at intervals. The first clearance hole 51 and the second clearance hole 52 are respectively matched and sleeved on the outside of the laser emission module 2 and the image acquisition module 3.

[0050] The portion of the partition layer 5 connected between the top shell 4, the base 1, the laser emitting module 2, and the image acquisition module 3 forms a barrier structure that fills the corresponding internal space of the shell. This structure is used to block the crosstalk path of the emitted light A from the laser emitting module 2 reflected in the inner cavity of the shell to the image acquisition module 3, so as to avoid crosstalk between the emitted light A and the reflected light B.

[0051] Please refer to the following: Figure 2-4 In one embodiment of the TOF camera module stacking structure provided by this utility model, the laser emitting module 2 includes:

[0052] The circuit board 12 is located on the top surface of the base 1 facing the top shell 4, and the projection of the circuit board 12 onto the top shell 4 covers the light-emitting hole 412 and the light-collecting hole 413; the laser emitter 21 is located on the top surface of the circuit board 12 facing the top shell 4; the emitting bracket 22 is located on the top surface of the circuit board 12 or the base 1 facing the top shell 4, and covers the outside of the laser emitter 21, and the emitting bracket 22 has a third clearance hole 221 facing the laser emitter 21; the emitting lens 23 is located on the top surface of the emitting bracket 22 facing the top shell 4 and covers the third clearance hole 221, and extends through the first clearance hole 51 into the light-emitting hole 412.

[0053] Please refer to the following: Figure 2-4 In a preferred embodiment of the TOF camera module stacking structure provided by this utility model, the laser emitter 21 consists of a laser and a circuit sub-board, and is integrally mounted on the circuit main board 12.

[0054] Please refer to the following: Figure 2-5 In one embodiment of the TOF camera module stacking structure provided by this utility model, the image acquisition module 3 includes:

[0055] Image acquisition unit 31 is disposed on the top surface of circuit board 12 facing top shell 4, spaced apart from laser emitter 21; receiving bracket 32 ​​is disposed on the top surface of circuit board 12 or base 1 facing top shell 4, and covers the outside of image acquisition unit 31, and receiving bracket 32 ​​is provided with a fourth clearance hole 321 facing image acquisition unit 31; receiving lens 33 is disposed on the top surface of receiving bracket 32 ​​facing top shell 4 and covers the fourth clearance hole 321, and extends through second clearance hole 52 into light-collecting hole 413.

[0056] Please refer to the following: Figure 2-4 In a preferred embodiment of the TOF camera module stacking structure provided by this utility model, the image acquisition unit 31 consists of an acquisition unit and a circuit sub-board, and is integrally mounted on the circuit main board 12.

[0057] Please refer to the following: Figure 2-4 In a preferred embodiment of the TOF camera module stacking structure provided by this utility model, the circuit board 12 is a PCB circuit board.

[0058] Please refer to the following: Figure 2-4 7. In a preferred embodiment of the TOF camera module stacking structure provided by this utility model, the bottom surface of the partition layer 5 abuts against the top surface of the transmitting bracket 22 and the receiving bracket 32 ​​facing the top shell 4, respectively.

[0059] Please refer to the following: Figure 2-7 In a preferred embodiment of the TOF camera module stacking structure provided by this utility model, the transmitting lens 23, the receiving lens 33, the first clearance hole 51, the second clearance hole 52, the light-emitting hole 412, and the light-collecting hole 413 are all cylindrical.

[0060] Please refer to the following: Figure 2-4 6. In one embodiment of the TOF camera module stacking structure provided by this utility model, the top shell 4 includes:

[0061] The top cover plate 41 has the light-emitting holes 412 and light-collecting holes 413 spaced apart on it; a pair of supporting side plates 42 are respectively disposed on the bottom surface of the top cover plate 41 facing the base 1, and respectively connected to the top surface of the base 1 facing the top cover plate 41.

[0062] Please refer to the following: Figure 2-4 In a preferred embodiment of the TOF camera module stacking structure provided by this utility model, the base 1 is provided with a pair of mounting holes 11 corresponding to the connection between the base 1 and a pair of support side plates 42. The support side plate 42 is provided with a mounting post 421 in the middle. The mounting post 421 is provided with a threaded hole that matches the mounting hole 11. The support side plate 42 is fastened to the top surface of the base 1 facing the top cover plate 41 by connecting screws 6 passing through the corresponding mounting holes 11 and external threads.

[0063] Please refer to the following: Figure 2-6 In a preferred embodiment of the TOF camera module stacking structure provided by this utility model, the top surface of the top cover plate 41 facing away from the base 1 is provided with a mounting groove 411 covering the laser emitting module 2 and the image acquisition module 3 below, and the light emission hole 412 and the light collection hole 413 are spaced apart on the bottom surface of the mounting groove 411.

[0064] The TOF camera module stacking structure also includes:

[0065] The light-transmitting cover plate 7 is installed in the mounting groove 411.

[0066] In a preferred embodiment of the TOF camera module stacking structure provided by this utility model, the light-transmitting cover 7 is a glass cover. The areas of the glass cover (light-transmitting cover 7) directly opposite the light-emitting hole 412 and the light-receiving hole 413 respectively form a pair of cylindrical light-transmitting areas C. An ink separator 71 is screen-printed on the bottom surface of the glass cover facing the base 1, respectively surrounding the pair of light-transmitting areas C. That is, the ink separator 71 is located on the inner surface of the glass cover facing the inner cavity to ensure aesthetics.

[0067] In other embodiments of the TOF camera module stacking structure provided by this utility model, the light-transmitting cover 7 can also be made of light-transmitting plastic material.

[0068] In a preferred embodiment of the TOF camera module stacking structure provided by this utility model, the partition layer 5 is made of opaque foam material to ensure that the partition layer 5 can completely seal the light and block crosstalk.

[0069] In other embodiments of the TOF camera module stacking structure provided by this utility model, the partition layer 5 can also be made of other types of opaque elastic materials, such as plastics that meet the requirements.

[0070] Please refer to the following: Figure 2-7 The TOF camera module stacking structure provided by this utility model forms a barrier structure that fills the corresponding internal space (gap) of the housing by connecting the part of the foam separator 5 between the top shell 4, the base 1, the laser emitting module 2 and the image acquisition module 3. Together with the ink separator 71 screen-printed on the bottom surface of the glass cover facing the base 1, which respectively surrounds a pair of light-transmitting areas C, and the solid part of the top cover 41 located between the light-emitting hole 412 and the light-receiving hole 413, they jointly block the crosstalk path of the emitted light A emitted from the laser emitting module 2 reflected in the inner cavity of the housing to the image acquisition module 3, so as to achieve light sealing and avoid crosstalk between the emitted light A and the reflected light B at the receiving lens 33, thus ensuring the ranging accuracy of the TOF camera module.

[0071] Furthermore, when the top shell 4 and the base 1 are assembled into a shell, the foam separator layer 5 is compressed, causing the volume of the foam separator layer 5 to decrease and the density to increase. This creates a pair of sealed small cavities with certain dustproof and waterproof properties between the inner surface of the glass cover (transparent cover 7) and the light outlet 412, the end face of the transmitting lens 23, and between the inner surface of the glass cover and the light collection hole 413, the end face of the receiving lens 33. This prevents water vapor and dust from seeping into the inner cavity of the shell from other parts of the shell from contacting and contaminating the inner surface of the glass cover. As the glass cover conducts heat faster than the plastic shell, its temperature is lower than that of the plastic shell, causing water droplets to condense or dust to accumulate on the inner surface of the glass cover. This ensures the cleanliness of the glass cover surface and prevents it from affecting the ranging performance due to contamination.

[0072] Meanwhile, the TOF camera module stacking structure provided by this utility model integrates the laser emitting module 2 and the image acquisition module 3 on the same base 1 structural component. Its Z-axis (height direction) assembly dimensions are only related to the three Z-axis (height directions) of the laser emitting module 2, the image acquisition module 3 and the housing, which makes it easy to achieve overall thinning of the TOF camera module stacking structure and ensure that the emitting lens 23 and the lens end face sink to the wall of the top shell 4 without protruding from the top shell 4.

[0073] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Those skilled in the art should understand that any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A TOF camera module stacking structure, characterized in that, include: Base (1); The laser emitting module (2) and the image acquisition module (3) are arranged at intervals on the base (1) to emit outgoing light (A) towards the target object and receive reflected light (B) from the target object, respectively. The top shell (4) is installed on the base (1) and docked with the base (1) to form a shell. The top shell (4) is provided with light-emitting holes (412) and light-collecting holes (413) at intervals, which are respectively facing the laser emitting module (2) and the image acquisition module (3). A partition layer (5) is placed between the base (1) and the top shell (4), and the top surface of the partition layer (5) abuts against the bottom surface of the top shell (4) facing the base (1). The partition layer (5) is provided with a first clearance hole (51) and a second clearance hole (52) at intervals, which are respectively matched and sleeved on the outside of the laser emission module (2) and the image acquisition module (3). The portion of the partition layer (5) connected between the top shell (4), the base (1), the laser emitting module (2), and the image acquisition module (3) forms a barrier structure to block the crosstalk path of the emitted light (A) reflected from the inner cavity of the shell to the image acquisition module (3).

2. The TOF camera module stacking structure as described in claim 1, characterized in that, The laser emitting module (2) includes: The circuit board (12) is located on the top surface of the base (1) facing the top shell (4); A laser emitter (21) is located on the top surface of the circuit board (12) facing the top shell (4); The transmitting bracket (22) is located on the top surface of the circuit board (12) facing the top shell (4) and covers the outside of the laser emitter (21). The transmitting bracket (22) is provided with a third clearance hole (221) facing the laser emitter (21). The transmitting lens (23) is located on the top surface of the transmitting bracket (22) facing the top shell (4) and covers the third clearance hole (221), and extends through the first clearance hole (51) into the light output hole (412).

3. The TOF camera module stacking structure as described in claim 2, characterized in that, The image acquisition module (3) includes: An image acquisition unit (31) is disposed on the top surface of the circuit board (12) facing the top shell (4) at a distance from the laser emitter (21); A receiving bracket (32) is provided on the top surface of the circuit board (12) facing the top shell (4) and covers the outside of the image acquisition device (31). The receiving bracket (32) is provided with a fourth clearance hole (321) facing the image acquisition device (31). The receiving lens (33) is located on the top surface of the receiving bracket (32) facing the top shell (4) and covers the fourth clearance hole (321), and extends through the second clearance hole (52) into the light-collecting hole (413).

4. The TOF camera module stacking structure as described in claim 3, characterized in that, The bottom surface of the partition layer (5) abuts against the top surface of the transmitting bracket (22) and the receiving bracket (32) facing the top shell (4), respectively.

5. The TOF camera module stacking structure as described in claim 3, characterized in that, The transmitting lens (23), the receiving lens (33), the first clearance hole (51), the second clearance hole (52), the light-emitting hole (412), and the light-collecting hole (413) are all cylindrical.

6. The TOF camera module stacking structure as described in any one of claims 1-5, characterized in that, The top shell (4) includes: The top cover plate (41) has the light-emitting hole (412) and the light-collecting hole (413) spaced apart on it. A pair of supporting side plates (42) are respectively disposed on the bottom surface of the top cover plate (41) facing the base (1) and respectively connected to the top surface of the base (1) facing the top cover plate (41).

7. The TOF camera module stacking structure as described in claim 6, characterized in that, The top cover plate (41) facing away from the base (1) has a mounting groove (411) covering the laser emitting module (2) and the image acquisition module (3) below. The light emission hole (412) and the light collection hole (413) are spaced apart on the bottom surface of the mounting groove (411). The TOF camera module stack structure also includes: A light-transmitting cover plate (7) is installed in the mounting groove (411).

8. The TOF camera module stacking structure as described in claim 7, characterized in that, The light-transmitting cover plate (7) is a glass cover plate. The area of ​​the glass cover plate facing the light-emitting hole (412) and the light-collecting hole (413) respectively forms a pair of cylindrical light-transmitting areas (C). The bottom surface of the glass cover plate facing the base (1) is screen-printed with ink layers (71) that surround the pair of light-transmitting areas (C).

9. The TOF camera module stacking structure as described in claim 8, characterized in that, The partition layer (5) is made of foam.

10. The TOF camera module stacking structure as described in claim 9, characterized in that, The top cover (41), the base (1), the mounting groove (411), the glass cover and the partition layer (5) are all cuboids.

Images