Substrate, package structure and electronic device

Abstract

This disclosure relates to a substrate, a packaging structure, and an electronic device. The substrate includes: a plate having opposite first and second surfaces; the first surface for mounting electronic components; and pads located on the second surface. The pads have polygonal cross-sections in a direction parallel to the plate. A plurality of pads are distributed in n rows and m columns, with at least some adjacent rows and / or at least some adjacent columns of pads staggered. This facilitates wiring and connection between lines and pads, reduces wiring difficulty, and shortens wiring length, thereby helping to reduce signal loss and delay. Furthermore, the increased soldering area of ​​the pads helps improve the soldering strength of the electronic components. Additionally, because the contact area between the pads and the plate is larger in this embodiment, the firmness of the pads fixed to the plate is also improved, making the pads more stable and thus improving their stress resistance.

Description

Technical Field

[0001] This disclosure relates to the field of packaging, and more particularly to a substrate, packaging structure, and electronic device. Background Technology

[0002] With the development of electronic devices, more and more electronic devices have emerged. Some electronic devices have increasingly more functions, containing printed circuit boards (PCBs) and electronic components. These electronic components are located on the PCBs, thus forming circuits with various functions. The PCBs have pads, and the distribution of these pads affects the pads, the PCB itself, and the use of the corresponding functions. Utility Model Content

[0003] This disclosure provides a substrate, a packaging structure, and an electronic device.

[0004] A first aspect of this disclosure provides a substrate, comprising: a plate body having opposite first and second surfaces; the first surface for mounting electronic components; and pads located on the second surface; wherein the pads have polygonal cross-sections in a direction parallel to the plate body; and a plurality of the pads are distributed in n rows and m columns, with the pads in at least two adjacent rows and / or at least two adjacent columns being staggered.

[0005] In one embodiment, the cross-section is square; wherein, in the same row and / or the same column, one side of the first pad and one side of the second pad are arranged opposite each other, and the first pad and the second pad are any two adjacent pads.

[0006] In one embodiment, the cross-section is rhomboid; wherein, in the same row and / or the same column, a corner of the third pad and a corner of the fourth pad are arranged opposite each other, and the third pad and the fourth pad are any two adjacent pads.

[0007] In one embodiment, the rhombus is a rhombus with all interior angles being right angles.

[0008] In one embodiment, any pad in row f overlaps with the pads in row f-1 and column h, and the pads in row f-1 and column q, in the column direction; wherein column h is the column preceding the column containing any pad in row f, and column q is the column following the column containing any pad in row f; 2≤f≤n, 1≤h≤m.

[0009] In one embodiment, any pad in the j-th column overlaps with the pads in the (j-1)-th column and the r-th row, as well as the pads in the (j-1)-th column and the t-th row, in the direction of the row; wherein the r-th row is the row preceding the row containing any pad in the j-th column, and the t-th row is the row following the row containing any pad in the j-th column; 1≤r≤n, 2≤j≤m.

[0010] In one embodiment, the side length of the pad is greater than or equal to a preset length.

[0011] In one embodiment, the preset length is greater than or equal to 0.2 mm.

[0012] In one embodiment, the minimum spacing between two adjacent pads in the same row is greater than or equal to a first preset distance; and / or, the minimum spacing between two adjacent pads in the same column is greater than or equal to a second preset distance.

[0013] In one embodiment, the first preset distance and the second preset distance are both greater than or equal to 0.4 mm.

[0014] A second aspect of this disclosure provides a packaging structure, comprising: a substrate as described in any of the above embodiments; electronic components located on a first surface of the substrate; and a package body located on the first surface, wherein the electronic components are packaged within the packaging structure.

[0015] A third aspect of this disclosure provides an electronic device, comprising: a substrate as described in any of the above embodiments; or, a packaging structure as described in the above embodiments.

[0016] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0017] The substrate in this design includes a board body and pads. The board body has opposite first and second surfaces. The first surface is used to mount electronic components. The pads are located on the second surface, and the cross-section of the pads in a direction parallel to the board body is polygonal. Multiple pads are distributed in n rows and m columns, with pads in at least partially adjacent rows and / or at least partially adjacent columns being staggered.

[0018] On the one hand, the solution improves the arrangement of the pads by staggering at least some of them. The staggered pads facilitate wiring and connection between the lines and the pads, reducing the difficulty of wiring and shortening the length of the wiring, thereby helping to reduce signal loss and delay.

[0019] On the other hand, by improving the shape of the pads, the cross-section of the pads in the direction parallel to the substrate is set to a polygon. Compared with spherical pads, this increases the soldering area of ​​the pads, which helps to improve the soldering strength of electronic devices. In addition, since the contact area between the pads and the board is larger in this embodiment, the firmness of the pads fixed to the board can also be improved, making the pads more stable and thus improving their stress resistance.

[0020] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0021] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0022] Figure 1 This is a schematic diagram of a substrate according to an exemplary embodiment;

[0023] Figure 2 This is another schematic diagram of a substrate according to an exemplary embodiment;

[0024] Figure 3 This is another schematic diagram of a substrate according to an exemplary embodiment;

[0025] Figure 4 This is a schematic diagram illustrating a packaging structure according to an exemplary embodiment;

[0026] Figure 5 This is a schematic diagram illustrating another packaging structure according to an exemplary embodiment. Detailed Implementation

[0027] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0028] refer to Figure 1 This is a schematic diagram of a substrate structure. Figure 2 This is another schematic diagram of the substrate, combined with... Figure 1 and Figure 2 The substrate includes:

[0029] The plate 1 has a first surface 101 and a second surface 102 that are opposite to each other. The first surface 101 is used to mount electronic components.

[0030] Pad 2, located on the second surface 102, has a polygonal cross-section in the direction parallel to the plate body, and multiple pads 2 are distributed in n rows and m columns, with at least some of the pads 2 in two adjacent rows and / or at least some of the pads 2 in two adjacent columns being staggered.

[0031] The substrate can be a printed circuit board (PCB), which can be the substrate in electronic components, such as the substrate in a chip, or the substrate used in a system-in-package structure.

[0032] The size, thickness, number of layers, etc. of the substrate are not limited.

[0033] The board body 1 serves as the main body of the substrate and is used to support various electronic components and solder pads 2 fixed on the board body 1. The board body 1 has a first surface 101 and a second surface 102 that are opposite to each other. The first surface 101 is used to mount electronic components, that is, the electronic components are located on the first surface 101.

[0034] For example, board 1 is a flat board, which facilitates the installation of pads 2 and electronic components.

[0035] For example, the plate 1 can be a plate with a square surface, a rectangular surface, a circular or elliptical surface, or a plate with other polygonal surfaces. It can be a regular shape or an irregular shape, etc.

[0036] The pad 2 is located on the second surface 102 of the board 1. The position of the pad 2 on the second surface and the number of pads 2 are not limited and can be determined according to requirements.

[0037] Regarding the distribution of pad 2, pad 2 is distributed in an array of n rows and m columns. n and m can be determined based on the size of pad 2, the size of board 1, and / or the distribution position of electronic components. n and m are positive integers. Figure 1 It shows 22 columns from 1 to 22, and 22 rows from A to AB.

[0038] There is a gap between two adjacent pads 2 in the row or column direction. The gap between two adjacent pads 2 is greater than the width of the trace, which facilitates surface routing through the gap between the pads 2.

[0039] Each of the n rows contains multiple pads 2, and each of the m columns contains multiple pads 2. Each pad 2 can be the same size and shape.

[0040] In an array of n rows and m columns of pads 2, the pads 2 in at least some adjacent rows and / or at least some adjacent columns are staggered.

[0041] In terms of row distribution, pads 2 can be staggered in at least two rows. These staggered pads 2 can include pads 2 from two adjacent rows, for example, pads 2 in row x and pads 2 in row x+1 can be staggered. Alternatively, pads 2 can be staggered in every other row, for example, pads 2 in row x and pads 2 in row x+z can be staggered. Where 1 ≤ x ≤ n, x+z ≤ n.

[0042] For example, in any two rows of staggered pads 2, including the adjacent two rows of staggered pads 2, it can be that some of the pads 2 are staggered, or all the pads 2 in the entire row of pads 2 are staggered.

[0043] With all pads 2 in a row of pads 2 staggered, there are no two aligned pads 2 in the column direction between two rows of pads 2. This ensures that each pad 2 is offset from the pads 2 in the adjacent row in the column direction, reducing alignment and making surface routing easier and reducing routing difficulty.

[0044] In terms of column distribution, at least two columns of pads 2 are staggered. The staggered pads 2 can include pads from two adjacent columns; for example, pads 2 in column y and pads 2 in column y+1 can be staggered. Alternatively, pads 2 from every other column can be staggered; for example, pads 2 in column y and pads 2 in column y+a can be staggered. Where 1 ≤ y ≤ m, and y+a ≤ m.

[0045] For example, in any two columns of staggered pads 2, including two adjacent columns of staggered pads 2, some pads 2 can be staggered, or all pads 2 in the entire column of pads 2 can be staggered.

[0046] With all pads 2 in a row staggered, there are no two aligned pads 2 in the row direction. This ensures that each pad 2 is offset from the pads 2 in the adjacent column, reducing alignment and making surface routing easier and reducing routing difficulty.

[0047] For example, the pads 2 in some rows are staggered, and the pads 2 in some columns are staggered, that is, the pads 2 in both rows and columns are staggered. This can include: pads 2 in some adjacent rows and at least some adjacent columns being staggered.

[0048] From the perspective of the distribution information of pad 2 on board 1, this solution improves the arrangement of pad 2 by staggering at least some pad 2. The staggered pad 2 facilitates wiring and connection between the line and the pad 2, reduces the difficulty of wiring, and shortens the length of the wiring, thereby helping to reduce signal loss and delay.

[0049] From the perspective of the shape of pad 2, the cross-section of pad 2 in the direction parallel to board 1 is a polygon, including but not limited to: square, rectangle, rhombus, triangle, pentagon, hexagon, etc. From the perspective of three-dimensional solidity, pad 2 can be a cube, such as a cube, cuboid, square prism, triangular prism, pentagonal prism, hexagonal prism, etc.

[0050] Figure 1 The pad 2 shown has a square cross-section in the direction parallel to the plate 1, which can be regarded as a cube or cuboid from a three-dimensional perspective. Compared with the spherical pad, the soldering area of ​​the pad 2 in this embodiment is increased.

[0051] For example, a cube with the same length and width as the diameter of a spherical pad has a larger cross-sectional area in the direction parallel to plate 1 than the spherical pad. To illustrate with specific values, a rhomboid pad with a length and width of 0.33 mm, compared to a spherical pad with a diameter of 0.33 mm, has a 27.3% larger cross-sectional area in the row and column directions with the same outer diameter, in the direction parallel to plate 1. Figure 1 As shown, the direction of the row can be horizontal, and the direction of the column can be vertical.

[0052] For example, a cuboid with the same width as the diameter of the spherical pad and a length greater than the diameter of the spherical pad has a cross-sectional area in a direction parallel to plate 1 that is also greater than the cross-sectional area of ​​the spherical pad.

[0053] By improving the shape of pad 2, and setting the cross-section of pad 2 in the direction parallel to board 1 to a polygon, the welding area of ​​pad 2 is increased compared to a spherical pad, which helps to improve the welding strength of electronic devices. In addition, since the contact area between pad 2 and board 1 is larger in this embodiment, the firmness of pad 2 fixed to board 1 can also be improved, making pad 2 more stable and thus improving the stress resistance of pad 2.

[0054] In one embodiment, the second surface 102 can also be used to mount electronic components, and some electronic components can also be located on the second surface 102 and fixed to the board 1 by the solder pads 2. This facilitates the assembly of electronic components and enables the realization of corresponding functions.

[0055] In one embodiment, reference Figure 3 This is another schematic diagram of the substrate, which can be a planar view, perpendicular to the second surface 102 and directed toward the second surface 102.

[0056] In the direction parallel to board 1, the cross-section of pad 2 in the direction parallel to board 1 is square. Pad 2 can be a cube or a cuboid. When pad 2 is a cuboid, the length and width of pad 2 in the plane parallel to board 1 are the same, and the length and width can be greater than the height in the direction perpendicular to board 1.

[0057] This increases the welding area between pad 2 and board 1, thereby improving the welding strength of pad 2 and its stress resistance, making pad 2 less prone to failure under external stress.

[0058] Based on the staggered distribution of pads 2 in at least two adjacent rows and / or at least two adjacent columns, in the same row and / or the same column, one side of the first pad 201 and one side of the second pad 202 are arranged opposite each other, and the first pad 201 and the second pad 202 are any two adjacent pads.

[0059] Taking the direction of the row as an example, since the pad 2 is a cubic or cuboid three-dimensional structure, the pad 2 has six faces. The bottom face faces the board 1, the top face faces the same direction as the second surface 102 of the board 1, and the remaining four faces face four different directions.

[0060] In a row of pads 2, the sides of any two adjacent pads 2 are arranged opposite each other. For example, in a certain row, the first pad 201 and the second pad 202 are any two adjacent pads, and the first pad 201 is located to the left of the second pad 202. Then the right-facing side of the first pad 201 and the left-facing side of the second pad 202 are arranged opposite each other.

[0061] exist Figure 3 The image shows the top surface of pad 2. The right edge of the top surface of the first pad 201 faces the left edge of the top surface of the second pad 202, and the right edge of the top surface of the first pad 201 is parallel to the left edge of the top surface of the second pad 202.

[0062] This positional relationship exists between any two adjacent pads 2 in a certain row.

[0063] Similarly, in the direction of rows, any two adjacent pads 2 in any row also have this positional relationship.

[0064] For example, in a column of pads 2, the sides of any two adjacent pads 2 are arranged opposite each other. If in a certain column, the first pad 201 and the second pad 202 are any two adjacent pads, and the first pad 201 is located below the second pad 202, then the downward-facing side of the first pad 201 and the upward-facing side of the second pad 202 are arranged opposite each other.

[0065] exist Figure 3The image shows the top surface of pad 2. The lower edge of the top surface of the first pad 201 faces the upper edge of the top surface of the second pad 202, and the lower edge of the top surface of the first pad 201 is parallel to the upper edge of the top surface of the second pad 202.

[0066] In a certain column, any two other adjacent pads 2 have this positional relationship.

[0067] Similarly, in the column direction, any two adjacent pads 2 in any column also have this positional relationship.

[0068] In one embodiment, reference Figure 1 The diagram shows the second surface 102 of the board 1 and the top surface of the pad 2. The pad 2 has a rhomboid cross section in the direction parallel to the board 1.

[0069] In the same row and / or the same column, one corner of the third pad and one corner of the fourth pad are set opposite each other, and the third pad and the fourth pad are any two adjacent pads.

[0070] This example illustrates another shape of pad 2 and the relative positional relationship between pads 2. In this example, the cross-section of the pad in the direction parallel to board 1 is rhomboid, and the angle of the interior angle of the rhombus is not limited. From a solid perspective, pad 2 is a quadrangular prism.

[0071] For example, the cross-section of pad 2 in the direction parallel to board 1 is a rhombus with all interior angles being right angles, i.e., a square, such as... Figure 1 As shown.

[0072] Based on the staggered distribution of pads 2 in at least two adjacent rows and / or at least two adjacent columns, in the same row and / or the same column, a corner of the third pad 203 and a corner of the fourth pad 204 are set opposite each other, and the third pad 203 and the fourth pad 204 are any two adjacent pads.

[0073] Taking the direction of the row as an example, since pad 2 is a three-dimensional structure of a quadrangular prism, pad 2 has four corners and six faces. The bottom face faces the board 1, the top face faces the same direction as the second surface 102 of the board 1, and the remaining four faces face four different directions.

[0074] In a row of pads 2, the corners of any two adjacent pads 2 are positioned opposite each other. For example, in a certain row, if the third pad 203 and the fourth pad 204 are any two adjacent pads, and the third pad 203 is located to the left of the fourth pad 204, then one corner of the third pad 203 faces the fourth pad 204, and one corner of the fourth pad 204 faces the third pad 203; the corners of the third pad 203 and the fourth pad 204 are positioned opposite each other. Figure 1As shown, the four corners of pad 2 face the four directions of up, down, left, and right respectively. In the row and column directions, the corners of two adjacent pads 2 are opposite each other, rather than facing each other side by side.

[0075] exist Figure 1 The image shows the top surface of pad 2, with the right corner of the third pad 203 facing the left corner of the fourth pad 204. This positional relationship exists between any two adjacent pads 2 in a given row.

[0076] Similarly, in the direction of rows, any two adjacent pads 2 in any row also have this positional relationship.

[0077] For example, in a column of pads 2, the corners of any two adjacent pads 2 are set opposite each other. If, in a certain column, the third pad 203 and the fourth pad 204 are any two adjacent pads, and the third pad 203 is located below the fourth pad 204, then the downward-facing corner of the third pad 203 and the upward-facing corner of the fourth pad 204 are set opposite each other.

[0078] exist Figure 1 The image shows the top surface of pad 2, with the corner below the third pad 203 positioned opposite the corner above the fourth pad 204. This positional relationship exists between any two other adjacent pads 2 in a given column.

[0079] Similarly, in the column direction, any two adjacent pads 2 in any column also have this positional relationship.

[0080] In one embodiment, any pad 2 in row f overlaps with pad 2 in row f-1 and column h, as well as pad 2 in row f-1 and column q, in the column direction.

[0081] Wherein, column h is the column before any pad 2 in row f, and column q is the column after any pad 2 in row f; 2≤f≤n, 1≤h≤m.

[0082] refer to Figure 1 In this example, the cross-section of the pad 2 is rhomboid in the direction parallel to the board 1, and the pad 2 is limited to have overlapping areas when any two adjacent pads 2 are set opposite each other in the row and column directions.

[0083] For example, the upper corner area of ​​the pad in the second row and second column overlaps vertically with the lower corner area of ​​the pad in the first row and first column, and also overlaps vertically with the lower corner area of ​​the pad in the first row and third column.

[0084] Since pad 2 in row f-1, column h and pad 2 in row f-1, column q are adjacent pads in the same row, there is a gap between these two pads. Furthermore, the gap between the lower corner area of ​​pad 2 in row f-1, column h and the lower corner area of ​​pad 2 in row f-1, column q gradually increases from top to bottom. Combined with the fact that the column containing any pad 2 in row f is located between the columns containing these two pads, it is convenient that the upper corner area of ​​any pad 2 in row f is located in the gap between the lower corner area of ​​pad 2 in row f-1, column h and the lower corner area of ​​pad 2 in row f-1, column q.

[0085] With the shape of pad 2 remaining unchanged, relative to Figure 3 The scheme shown has an overlap area in the column direction between any pad 2 in row f, pad 2 in row f-1 and column h, and pad 2 in row f-1 and column q. This allows for an increase in the number of pads 2 in the column direction without changing the area of ​​the second surface 102 in board 1. This facilitates the assembly of more electronic components and helps improve chip performance.

[0086] In one embodiment, any pad 2 in column j overlaps with pad 2 in column j-1, row r, and row j-1, row t in the direction of the row.

[0087] Wherein, the r-th row is the row preceding any pad 2 in the j-th column, and the t-th row is the row following any pad in the j-th column; 1≤r≤n, 2≤j≤m.

[0088] For example, the left corner area of ​​the pad in the third row and fourth column overlaps horizontally with the right corner area of ​​pad 2 in the second row and second column, and vertically overlaps with the lower corner area of ​​the pad in the fourth row and second column.

[0089] Since pad 2 in column j-1, row r and pad 2 in column j-1, row t are adjacent pads in the same column, there is a gap between these two pads. Furthermore, the gap between the right corner area of ​​pad 2 in column j-1, row r and the right corner area of ​​pad 2 in column j-1, row t gradually increases from left to right. Combined with the fact that the row containing any pad 2 in column j is located between the rows containing these two pads, it is convenient for the left corner area of ​​any pad 2 in column j to be located in the gap between the right corner area of ​​pad 2 in column j-1, row r and the right corner area of ​​pad 2 in column j-1, row t.

[0090] With the shape of pad 2 remaining unchanged, relative to Figure 3The scheme shown has an overlap in the row direction between any pad 2 in column j and the right corner area of ​​pad 2 in column j-1 and row r and the right corner area of ​​pad 2 in column j-1 and row t. This allows for an increase in the number of pads 2 in the row direction without changing the area of ​​the second surface 102 in board 1. This facilitates the assembly of more electronic components and helps improve chip performance.

[0091] This solution can be implemented independently or in combination with any pad 2 in row f, and pads 2 in row f-1, column h, and row f-1, column q, where there is an overlap in the column direction. This increases the number of pads 2 in both row and column directions, facilitating the placement of more pads 2, thereby enabling the assembly of more electronic components and improving chip performance.

[0092] In one embodiment, the side length of the pad 2 is greater than or equal to a preset length, which can be determined according to usage requirements, such as being greater than or equal to 0.2 mm. For example, if the cross-section of the pad 2 is rhomboid or square in the direction parallel to the board 1, then the minimum side length is 0.2 mm. Figure 1 The diagram shows that the side length of pad 2 is 0.33 mm ± 0.025 mm.

[0093] Currently, the preset length can be greater than or less than 0.2 mm.

[0094] In one embodiment, the minimum spacing between two adjacent pads 2 in the same row is greater than or equal to a first preset distance.

[0095] In the direction of rows, within the same row, the minimum spacing between at least a portion of adjacent pads 2 can be greater than or equal to a first preset distance. Alternatively, the minimum spacing between any two adjacent pads 2 can both be greater than or equal to the first preset distance.

[0096] For example, the minimum spacing between two adjacent pads 2 in a portion of the rows may be greater than or equal to the first preset distance, or the minimum spacing between two adjacent pads 2 in each row may be greater than or equal to the first preset distance.

[0097] For example, the first preset distance is greater than or equal to 0.4 mm.

[0098] By setting the minimum spacing between two adjacent pads 2 in the same row, it is possible to facilitate both wiring and assembly of electronic components in the direction of the row.

[0099] In one embodiment, the minimum spacing between two adjacent pads 2 in the same column is greater than or equal to a second preset distance.

[0100] In the column direction, within the same column, the minimum spacing between at least a portion of adjacent pads 2 can be greater than or equal to a second preset distance. Alternatively, the minimum spacing between any two adjacent pads 2 can both be greater than or equal to the second preset distance.

[0101] For example, the minimum spacing between two adjacent pads 2 in a certain column may be greater than or equal to the second preset distance, or the minimum spacing between two adjacent pads 2 in each column may be greater than or equal to the second preset distance.

[0102] By setting the minimum spacing between two adjacent pads 2 in the same column, it is possible to facilitate both wiring and assembly of electronic components in the column direction.

[0103] The first preset distance can be the same as or different from the second preset distance.

[0104] In one embodiment, the minimum spacing between two adjacent pads 2 in the same row is greater than or equal to a first preset distance, and the minimum spacing between two adjacent pads 2 in the same column is greater than or equal to a second preset distance. This facilitates wiring and assembly of electronic components in both row and column directions.

[0105] refer to Figure 1 In the column and row directions, the spacing between the center points of two adjacent pads 2 in the same row and column is 0.75 mm, i.e., the center distance is 0.75 mm. Figure 1 The type shown represents the distance unit. Figure 1 The distance between two adjacent pads 2 diagonally upwards is also shown, which is 0.530 mm; the distance between the pads 2 in the outermost row and the outermost column and the edge of the board body 1 is also shown.

[0106] In one embodiment, the surface of pad 2 may be treated by electroless nickel / immersion gold (ENIG) or electroless nickel / palladium / immersion gold (ENEPIG).

[0107] In one embodiment, pad 2 can be a solder mask defined (SMD) pad or a non-solder mask defined (NSMD) pad.

[0108] In one embodiment, reference Figure 2 A packaging structure is also provided, including:

[0109] The substrate R in any of the above embodiments;

[0110] Electronic component E is located on the first surface 101 of substrate R;

[0111] Package P is located on the first surface 101, and electronic components E are encapsulated within the package structure.

[0112] Electronic component E can be any type of electronic component, including but not limited to: resistors, capacitors, inductors, controllers, bonding wires, chips, and devices used to achieve different functions.

[0113] The package P can be formed by system-in-package technology, such as plastic encapsulation.

[0114] For example, the pad 2 in the package structure also has a solder layer 21, which is used to reduce the warping of the package structure traces after the package structure is obtained through the packaging process, and to reduce the occurrence of empty solder joints. Figure 4 This is a schematic diagram showing a warped packaging structure. Figure 5 This is a schematic diagram of the improved packaging structure.

[0115] In one embodiment, an electronic device is also provided, comprising:

[0116] The substrate in any of the above embodiments;

[0117] or,

[0118] The packaging structure in the above embodiments.

[0119] The electronic device can include mobile terminal devices and fixed terminal devices. Mobile terminal devices can include mobile phones, tablets, in-vehicle central control devices, wearable devices, smart devices, and aircraft, while smart devices can include smart office equipment, smart home devices, and robots.

[0120] In another embodiment, reference Figure 1 Another example of a substrate with pads is also provided.

[0121] This substrate can be applied to Figure 2 The packaging structure shown allows for the placement of various bare dies, flip chips, resistors, capacitors, inductors, wire bonds, and other circuit components on the substrate 1, which are then packaged using a molding process. Figure 2 The packaging structure shown.

[0122] The pad arrangement at the bottom of board 1 in the substrate is as follows: Figure 3As shown, it also includes the pin identifier (Pin1 Index).

[0123] The pads are arranged in a staggered and uniform distribution with a pitch greater than 0.4mm. The second row of pad signals can be routed through the gaps between the first row of pads.

[0124] The pads are rhomboid in shape with a side length of 0.2mm or more. The spacing between the pads can be set according to the welding process capabilities to maximize the pad area.

[0125] Depending on the project requirements, the surface treatment solution for Pad can be ENEPIG, ENIG, or other surface treatment solutions.

[0126] Pad design can use NSMD or SMD solder definition, or a combination of both.

[0127] For larger components, there will be some warping after the component is manufactured, such as... Figure 4 It can be corrected by soldering on the pad, such as... Figure 5 This improves warping and welding defects.

[0128] The substrate provided in this embodiment has the above-described arrangement as follows: Figure 1 The diamond-shaped pads shown have a substrate weight of 1500g. Under a 1ms impact test, no pad failure was observed, indicating a significant improvement in strain resistance.

[0129] The substrate has the following effects:

[0130] 1. Compared with the spherical Pad, the welding area of ​​the Pad in this embodiment is increased. For example, it is changed from the original circular Pad with a diameter of 0.33mm to a rhomboid Pad with a length and width of 0.33mm, which increases the area by 27.3% and can effectively increase the stress resistance of the Pad.

[0131] 2. Compared with the spherical Pad, the straight edge of the Pad in this example has stronger stress and strain resistance when subjected to the same stress.

[0132] 3. The diamond-shaped Pad staggered layout combines the advantages of BGA signal arrangement. The second row of Pad signals can be routed out on the surface, reducing wiring difficulty and signal loss.

[0133] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the utility models disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0134] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A substrate, characterized in that, include: The plate has opposite first and second surfaces; the first surface is used to mount electronic components. The pads are located on the second surface; Wherein, the cross-section of the pad in the direction parallel to the board body is polygonal; the plurality of pads are distributed in n rows and m columns, and the pads in at least some adjacent rows and / or at least some adjacent columns are staggered.

2. The substrate according to claim 1, characterized in that, The cross-section is square; In the same row and / or the same column, one side of the first pad and one side of the second pad are arranged opposite each other, and the first pad and the second pad are any two adjacent pads.

3. The substrate according to claim 1, characterized in that, The cross-section is rhomboid; In the same row and / or the same column, one corner of the third pad and one corner of the fourth pad are positioned opposite each other, and the third pad and the fourth pad are any two adjacent pads.

4. The substrate according to claim 3, characterized in that, The rhombus is a rhombus in which all interior angles are right angles.

5. The substrate according to claim 3, characterized in that, Any pad in row f has an overlapping area with the pads in row f-1 and column h, and the pads in row f-1 and column q, in the column direction. Wherein, column h is the column preceding any of the pads in row f, and column q is the column following any of the pads in row f; 2≤f≤n, 1≤h≤m.

6. The substrate according to claim 3 or 5, characterized in that, Any pad in column j has an overlapping area with the pads in column j-1, row r, and column j-1, row t in the direction of the row. Wherein, the r-th row is the row preceding any of the pads in the j-th column, and the t-th row is the row following any of the pads in the j-th column; 1≤r≤n, 2≤j≤m.

7. The substrate according to any one of claims 2 to 4, characterized in that, The side length of the pad is greater than or equal to the preset length.

8. The substrate according to claim 7, characterized in that, The preset length is greater than or equal to 0.2 mm.

9. The substrate according to claim 1, characterized in that, The minimum spacing between two adjacent pads in the same row is greater than or equal to a first preset distance; And / or, The minimum spacing between two adjacent pads in the same column is greater than or equal to a second preset distance.

10. The substrate according to claim 9, characterized in that, The first preset distance and the second preset distance are both greater than or equal to 0.4 mm.

11. A packaging structure, characterized in that, include: The substrate according to any one of claims 1 to 10; Electronic components are located on the first surface of the substrate; The package is located on the first surface, and the electronic components are encapsulated within the package structure.

12. An electronic device, characterized in that, include: The substrate according to any one of claims 1 to 10; or, The packaging structure as described in claim 11.

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