A combined soft circuit board for new energy vehicle energy storage

CN224626864UActive Publication Date: 2026-08-11DONGGUAN HUANGJIANG DASHUN ELECTRONICS
View PDF 1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-04
Publication Date
2026-08-11

AI Technical Summary

Technical Problem

该软线路板的散热效果不佳,容易使其在使用时出现的高温,导致其使用寿命降低,增大损失;并且,现有的软线路板容易受到外界其他电子设备的电磁干扰,从而导致其自身信号泄漏,影响其工作

Benefits of technology

本实用通过在第一软线路板主体与第二软线路板主体上分别设置导热安装区域、导热硅胶片和微型金属散热片,从而便于使组合式软线路板起到快速散热的作用,以便提高组合式软线路板的使用寿命,进而降低损失。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN224626864U_ABST
    Figure CN224626864U_ABST
Patent Text Reader

Abstract

This utility model discloses a combined flexible circuit board for energy storage in new energy vehicles, including a first flexible circuit board body, a second flexible circuit board body, and a splicing assembly. The splicing assembly for connection and fixation is provided between the first and second flexible circuit board bodies. Heat dissipation components for rapid heat dissipation are provided at both ends of the top of the first and second flexible circuit board bodies. Electromagnetic shielding layers for electromagnetic interference are sprayed onto the front and back of the top of the first and second flexible circuit board bodies. This utility model facilitates rapid heat dissipation of the combined flexible circuit board by providing thermally conductive mounting areas, thermally conductive silicone pads, and micro-metal heat sinks on the first and second flexible circuit board bodies, thereby improving the service life of the combined flexible circuit board and reducing losses.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board technology, specifically a combined flexible circuit board for energy storage in new energy vehicles. Background Technology

[0002] The modular flexible circuit board for energy storage in new energy vehicles is a flexible electronic component used in battery management systems (BMS), energy storage modules, or other high-voltage / low-voltage electrical connections. Its design must balance high reliability, lightweight, high-temperature resistance, and vibration resistance to adapt to the complex operating conditions of new energy vehicles.

[0003] A search revealed that Chinese patent application number CN202121332870.0 discloses a multi-layer flexible composite circuit board structure. This utility model includes a circuit board body comprising a polyimide film, a wire support adhesive layer, a copper layer, a low-melting-point insulating adhesive, and a sealing protective film. Connecting structures are fixedly embedded at both ends of the circuit board body. These connecting structures include connecting gold fingers, connecting rings, fixing grooves, and spring limiting blocks. The circuit board body also has a wiring mounting structure, which includes a wiring board mounting groove, connecting wires, and connecting magnetic sheets. A wiring board module is attached to the wiring mounting structure. Each wiring board module includes a wiring board main board, an adhesive coating, and a channel magnetic sheet. This multi-layer flexible composite circuit board structure, compared to traditional connection methods, provides a more stable connection, easier installation, and offers some protection for the copper layer. Different wiring board modules can be used to achieve different functions.

[0004] However, the existing technology and the device still have the following drawbacks: The heat dissipation of this flexible circuit board is poor, which easily leads to high temperatures during use, resulting in a reduced lifespan and increased losses. In addition, the existing flexible circuit board is susceptible to electromagnetic interference from other electronic devices, which can cause signal leakage and affect its operation. Summary of the Invention

[0005] The purpose of this utility model is to provide a combined flexible circuit board for energy storage in new energy vehicles. This utility model provides a heat-conducting mounting area, a heat-conducting silicone pad, and a miniature metal heat sink on the first and second flexible circuit board bodies, respectively, thereby facilitating rapid heat dissipation of the combined flexible circuit board, improving its service life, and reducing losses; thus solving the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: A modular flexible circuit board for energy storage in new energy vehicles includes a first flexible circuit board body, a second flexible circuit board body, and splicing components. A splicing component for connecting and fixing is provided between the first flexible circuit board body and the second flexible circuit board body; The top ends of the first flexible circuit board body and the second flexible circuit board body are provided with heat dissipation components to facilitate rapid heat dissipation. The front and back sides of the top of the first and second flexible circuit boards are coated with an electromagnetic shielding layer for resisting electromagnetic interference.

[0007] Preferably, the splicing assembly includes a connector, a groove, a first through hole, a retaining ring, a second through hole, and a retaining post. The connector is installed at one end of the first flexible circuit board body and is provided in three sets. The top surface of the connector has a groove, and the inside of the groove has a through first through hole. The retaining ring is fixedly installed at one end of the second flexible circuit board body and is provided in three sets. One end of the top surface of the retaining ring has a second through hole, and the retaining ring is engaged inside the groove. The first through hole and the second through hole correspond to each other. The top of the retaining ring is provided with a retaining post, and the retaining ring passes through the inside of the second through hole and the first through hole in sequence.

[0008] Preferably, the heat dissipation component includes a thermally conductive mounting area, a thermally conductive silicone pad, and a miniature metal heat sink. The thermally conductive mounting area is disposed at the top ends of the first flexible circuit board body and the second flexible circuit board body. A thermally conductive silicone pad is adhered to the surface of the thermally conductive mounting area, and miniature metal heat sinks are adhered to both sides of the thermally conductive silicone pad with thermally conductive adhesive.

[0009] Preferably, mounting holes are provided around the bottom outer edges of the first flexible circuit board body and the second flexible circuit board body to facilitate installation and fixing.

[0010] Preferably, the bottom ends of the first flexible circuit board body and the second flexible circuit board body are provided with two sets of positioning grooves for positioning and fixing.

[0011] Preferably, fixing posts are fixedly installed at the center of the bottom ends of the first flexible circuit board body and the second flexible circuit board body.

[0012] Compared with the prior art, the beneficial effects of this utility model are: This invention facilitates rapid heat dissipation of the combined flexible circuit board by setting thermally conductive mounting areas, thermally conductive silicone pads, and miniature metal heat sinks on the first and second flexible circuit board bodies, respectively, thereby improving the service life of the combined flexible circuit board and reducing losses.

[0013] This invention provides an electromagnetic shielding layer on the first and second flexible circuit board bodies, thereby facilitating the electromagnetic interference resistance of the combined flexible circuit board formed by the first and second flexible circuit board bodies. This protects the electronic device from electromagnetic interference from external electronic devices and also prevents signal leakage. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the explosion separation structure of this utility model; Figure 3 for Figure 2 A schematic diagram of the structure viewed from below.

[0015] In the figure: 1. First flexible circuit board body; 101. Connector; 102. Groove; 103. First through hole; 2. Second flexible circuit board body; 201. Snap ring; 202. Second through hole; 3. Snap post; 4. Positioning groove; 5. Mounting hole; 6. Fixing post; 7. Thermally conductive mounting area; 8. Thermally conductive silicone sheet; 9. Miniature metal heat sink; 10. Electromagnetic shielding layer. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figures 1-3 This utility model provides a technical solution: A modular flexible circuit board for energy storage in new energy vehicles includes a first flexible circuit board body 1, a second flexible circuit board body 2, and splicing components. A splicing assembly for connection and fixation is provided between the first flexible circuit board body 1 and the second flexible circuit board body 2. The splicing assembly includes a connecting seat 101, a groove 102, a first through hole 103, a retaining ring 201, a second through hole 202, and a retaining post 3. The connecting seat 101 is installed at one end of the first flexible circuit board body 1, and three sets are provided. The top surface of the connecting seat 101 has a groove 102, and the inside of the groove 102 has a through first through hole 103. The retaining ring 201 is fixedly installed at one end of the second flexible circuit board body 2, and three sets are provided. The top surface of the retaining ring 201 has a second through hole 202, and the retaining ring 201 is engaged inside the groove 102. The first through hole 103 corresponds to the second through hole 202. The top of the retaining ring 201 is provided with a retaining post 3, and the retaining ring 201 passes through the inside of the second through hole 202 and the first through hole 103 in sequence.

[0018] This utility model, by setting the above splicing components, facilitates the splicing of the first flexible circuit board body 1 and the second flexible circuit board body 2 to form a combined flexible circuit board.

[0019] By taking the first flexible circuit board body 1 and the second flexible circuit board body 2, the retaining ring 201 is inserted into the groove 102 provided on the connector 101. At the same time, the first through hole 103 corresponds to the second through hole 202. Then, the retaining post 3 is taken out and passed through the second through hole 202 and the first through hole 103 in sequence, so as to facilitate the first flexible circuit board body 1 and the second flexible circuit board body 2 to be locked and fixed.

[0020] The first flexible circuit board body 1 and the second flexible circuit board body 2 are provided with heat dissipation components at both ends of the top to facilitate rapid heat dissipation. The heat dissipation components include a thermally conductive mounting area 7, a thermally conductive silicone pad 8, and a miniature metal heat sink 9. The thermally conductive mounting area 7 is located at both ends of the top of the first flexible circuit board body 1 and the second flexible circuit board body 2. The thermally conductive silicone pad 8 is bonded to the surface of the thermally conductive mounting area 7, and the miniature metal heat sink 9 is bonded to both sides of the thermally conductive silicone pad 8 with thermally conductive adhesive.

[0021] This utility model provides a thermally conductive mounting area 7, a thermally conductive silicone pad 8, and a miniature metal heat sink 9 on the first flexible circuit board body 1 and the second flexible circuit board body 2, respectively. This facilitates rapid heat dissipation of the combined flexible circuit board, thereby improving its service life and reducing losses.

[0022] Furthermore, in the heat dissipation of the combined flexible circuit board, the heat-conducting mounting area 7 is brought into direct contact with the surfaces of the first flexible circuit board body 1 and the second flexible circuit board body 2. Through this contact, heat is conducted to the thermally conductive silicone pad 8. The silicone pad utilizes its high thermal conductivity (1-5 W / (m·K)) and flexibility to fill gaps, reduce contact thermal resistance, and simultaneously provide insulation and buffering. Heat is further transferred to the miniature metal heat sink 9 (such as an ultra-thin copper / aluminum sheet), where the high thermal conductivity of the metal (>200 W / (m·K)) rapidly dissipates the heat. This achieves highly efficient heat dissipation for the first flexible circuit board body 1 and the second flexible circuit board body 2.

[0023] Thermally conductive mounting area 7 is a local high-temperature area on the flexible printed circuit board (FPC) that requires heat dissipation (such as power chips or BMS sampling points), and heat is transferred through surface contact. Thermally conductive silicone pad 8 is a flexible insulating material (thickness 0.3~1.0mm, thermal conductivity 1~5 W / (m·K)) used to fill the gap between the heat source and the heat sink, reduce contact thermal resistance and buffer vibration; Miniature metal heat sinks 9 (such as 0.1~0.3mm copper / aluminum fins) rapidly dissipate heat to the surrounding environment through high thermal conductivity (>200 W / (m·K)) and increased surface area design (such as perforations or fins).

[0024] The thermally conductive mounting area 7 is typically made of a high thermal conductivity metal substrate (such as copper foil C1100 or aluminum foil 1050) or ceramic-filled epoxy resin (such as Bergquist GF3000). Commonly used thermal conductive silicone pads include Bergers Sil-Pad® 2000 (3.0 W / mK), Laird Tflex™ 600 (1.8 W / mK), or Fuji Polymer PORON® (1.5 W / mK), with a silicone / ceramic composite substrate; The miniature metal heat sink 9 can be made of 0.1mm thick copper sheet (T2 pure copper) or anodized aluminum (such as A6063). Special models include the Japanese Fujikura ultra-thin graphene-copper composite sheet (GFL-100, in-plane thermal conductivity 800 W / mK).

[0025] The selection of these three options should be based on a comprehensive consideration of the FPC's power consumption, bending requirements, and cost.

[0026] The front and back sides of the top of the first flexible circuit board body 1 and the second flexible circuit board body 2 are coated with an electromagnetic shielding layer 10 for resisting electromagnetic interference. This invention, by providing the electromagnetic shielding layer 10 on the first flexible circuit board body 1 and the second flexible circuit board body 2, facilitates the electromagnetic interference resistance of the combined flexible circuit board formed by the first flexible circuit board body 1 and the second flexible circuit board body 2, thereby protecting electronic equipment from electromagnetic interference from external electronic equipment and preventing signal leakage.

[0027] Furthermore, the working principle of the electromagnetic shielding layer 10 is to form a continuous barrier by using conductive materials (such as metal foil, conductive coating) or magnetic materials (such as ferrite), and to block or weaken the propagation of electromagnetic waves (EMI / RFI) by utilizing three mechanisms: surface reflection (impedance mismatch causes electromagnetic wave bounce), absorption loss (eddy current / hysteresis effect converts electromagnetic energy into heat energy) and internal multiple reflection attenuation, thereby protecting electronic equipment from interference or leakage.

[0028] Common materials and models for electromagnetic shielding layers include: conductive metals (such as 3M™ 1170 copper foil tape, TDK® Flexield flexible absorbing sheet), conductive coatings (such as Henkel Loctite® ECI 1010 silver epoxy coating), composite shielding films (such as Laird Technologies CF-100 conductive fabric / PET composite film), and ferrite substrates (such as Fair-Rite73 absorbing material). All of these must meet specific frequency band requirements (such as SE > 30dB at 1GHz) and flexibility requirements (bending radius < 5mm) to be suitable for automotive-grade (AEC-Q200) or consumer electronics applications.

[0029] Mounting holes 5 are provided around the bottom outer edges of the first flexible circuit board body 1 and the second flexible circuit board body 2 for easy installation and fixing. Two sets of positioning grooves 4 are provided at both ends of the bottom of the first flexible circuit board body 1 and the second flexible circuit board body 2. Fixing posts 6 are fixedly installed at the center of both ends of the bottom of the first flexible circuit board body 1 and the second flexible circuit board body 2.

[0030] This utility model uses components such as mounting holes 5, positioning grooves 4, and fixing posts 6 to facilitate the positioning and fixing of the first flexible circuit board body 1 and the second flexible circuit board body 2 during installation, thereby improving the stability of their fixed installation.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A modular flexible circuit board for energy storage in new energy vehicles, comprising a first flexible circuit board body (1), a second flexible circuit board body (2), and splicing components, characterized in that: A splicing component for connection and fixation is provided between the first flexible circuit board body (1) and the second flexible circuit board body (2); Among them, the top ends of the first flexible circuit board body (1) and the second flexible circuit board body (2) are provided with heat dissipation components to facilitate rapid heat dissipation; The front and back sides of the top of the first flexible circuit board body (1) and the second flexible circuit board body (2) are coated with an electromagnetic shielding layer (10) for resisting electromagnetic interference.

2. The combined flexible circuit board for energy storage in new energy vehicles according to claim 1, characterized in that: The splicing assembly includes a connector (101), a groove (102), a first through hole (103), a retaining ring (201), a second through hole (202), and a retaining post (3). The connector (101) is installed at one end of the first flexible circuit board body (1) and is provided in three sets. The top surface of the connector (101) is provided with a groove (102), and the inside of the groove (102) is provided with a through first through hole (103). The retaining ring (201) is fixedly installed at one end of the second flexible circuit board body (2) and is provided in three sets. The top surface of the retaining ring (201) is provided with a second through hole (202), and the retaining ring (201) is engaged inside the groove (102). The first through hole (103) corresponds to the second through hole (202). The top of the retaining ring (201) is provided with a retaining post (3), and the retaining ring (201) passes through the inside of the second through hole (202) and the first through hole (103) in sequence.

3. The combined flexible circuit board for energy storage in new energy vehicles according to claim 1, characterized in that: The heat dissipation assembly includes a thermally conductive mounting area (7), a thermally conductive silicone pad (8), and a miniature metal heat sink (9). The thermally conductive mounting area (7) is located at the top ends of the first flexible circuit board body (1) and the second flexible circuit board body (2). The surface of the thermally conductive mounting area (7) is bonded with a thermally conductive silicone pad (8), and the two sides of the thermally conductive silicone pad (8) are bonded with a miniature metal heat sink (9) by thermally conductive adhesive.

4. A combined flexible circuit board for energy storage in new energy vehicles according to claim 1, characterized in that: The bottom outer ends of the first flexible circuit board body (1) and the second flexible circuit board body (2) are provided with mounting holes (5) to facilitate installation and fixing.

5. A combined flexible circuit board for energy storage in new energy vehicles according to claim 1, characterized in that: The bottom ends of the first flexible circuit board body (1) and the second flexible circuit board body (2) are provided with two sets of positioning grooves (4) for positioning and fixing.

6. A combined flexible circuit board for energy storage in new energy vehicles according to claim 1, characterized in that: Fixed posts (6) are fixedly installed at the center of the bottom ends of the first flexible circuit board body (1) and the second flexible circuit board body (2).

Citation Information

Patent Citations

  • Multi-layer flexible combined circuit board structure

    CN216017262U