Circuit board, electronic device and movable platform

Abstract

The utility model discloses a circuit board, electronic equipment and movable platform, its mounting structure includes setting on the first position and second position of circuit board, is provided with first mounting structure on the first position, and / or is provided with second mounting structure on the second position, and the first position is provided with two at least, and the second position is arranged in the vertical space of two first position connection line as the axle, the end surface of first mounting structure and the end surface of second mounting structure are not on the same plane, or, first mounting structure and second mounting structure only set one of both. The utility model is provided with structure on the first position and / or second position on the circuit board to make the position of first position and second position on the circuit board after installation not on the same plane on the mounting seat, and the circuit board forms reverse predeformation after installation, thereby increasing the rigidity of circuit board, and resisting the influence of the deflection or drift of sensor on the sensor circuit board due to external force, impact load or thermal stress.

Description

Technical Field

[0001] This utility model relates to the field of sensor module technology, and in particular to a circuit board, electronic device and mobile platform. Background Technology

[0002] As a core perception unit for autonomous driving, the imaging and perception performance of intelligent driving cameras directly affects the system's reliability, stability, lifespan, and driving safety.

[0003] Vehicle-mounted cameras need to maintain stable imaging under fluctuating temperatures (-40℃ to 85℃) throughout the day. Factors such as the matching stability of the sensor circuit board and the front cover, as well as strain on the board, can affect the sensors, leading to sensor drift and causing anomalies such as image distortion or color distortion. For example, this can cause image distortion or increased blind spots, impacting the decision-making of the autonomous driving system. Furthermore, insufficient camera mounting precision can disrupt the spatial alignment between multiple sensors, causing fusion algorithms to fail, reducing system redundancy and safety. Parameter offsets within the camera can also lead to multi-sensor fusion failure (such as perception conflicts caused by spatial alignment errors between the camera and radar), requiring periodic calibration and correction. Therefore, the connection stability between the sensor circuit board and the front cover, as well as the temperature resistance consistency of the sensor circuit board, directly determine the camera's perception performance.

[0004] In existing technologies, the solutions to the above problems mostly involve adding reinforcing plates or other structures to the circuit board to strengthen it and reduce the impact on sensor offset or drift. However, these methods not only increase costs but also result in more numerous and thicker structures, affecting heat dissipation and overall structural dimensions. Utility Model Content

[0005] This utility model provides a circuit board, electronic device, and mobile platform to solve the problem in the prior art where sensor circuit boards cause sensor offset or drift under the influence of high temperature.

[0006] According to a first aspect of the present invention, a circuit board is provided, comprising a first position and a second position disposed on the circuit board, wherein a first mounting structure is disposed at the first position and / or a second mounting structure is disposed at the second position, wherein at least two first positions are provided, and the second position is disposed within a vertical space with the line connecting the two first positions as an axis.

[0007] The end face of the first mounting structure and the end face of the second mounting structure are not on the same plane, or...

[0008] Only one of the first mounting structure and the second mounting structure is provided.

[0009] The circuit board of this invention features structures at a first and / or second position on the board, with these structures arranged to create a difference in height between the end faces of the first and second positions. This ensures that, after mounting the board on a mounting base, the first and second positions are not on the same plane. This height difference design allows the mounted board to undergo reverse pre-deformation, increasing its rigidity and resisting the effects of external forces, impact loads, or thermal stress on the sensor's offset or drift. This improves image quality, particularly in cases where the sensor includes a camera, to address temperature-related drift or defocusing issues in camera imaging.

[0010] In some implementations, after the circuit board is mounted on the mounting base, the second position on the circuit board is closer to the mounting base than the first position on the circuit board.

[0011] Therefore, by setting it up in this way, the first position on the circuit board can be lifted up, forming an upward arched deformation to resist the natural positive deformation (such as concavity) that occurs when the circuit board is subjected to loads (such as pressure, thermal stress) or environmental effects (such as temperature creep) in the later stages, thus maintaining the flatness of the board surface.

[0012] In some embodiments, the height difference between the end face of the first mounting structure and the end face of the second mounting structure is no greater than 0.15 mm, or...

[0013] The height difference between the first mounting structure or the second mounting structure and the plane of the circuit board on which it is disposed is not greater than 0.15mm.

[0014] Therefore, this configuration can effectively resist the effects of external forces, impact loads, or thermal stress on the offset or drift of the sensor on the sensing circuit board, without damaging the circuit board.

[0015] In some implementations, the first position and the second position are set at the edge of a preset device position on the circuit board or at a force point on the circuit board.

[0016] Therefore, by setting it up in this way, the positions of some of the first and second positions on the circuit board can be arranged according to the influence of the force and temperature shock on the sensor phase surface on the circuit board. For example, they can be set at the B2B connector or FAKRA connector or at the edge of important components such as sensor chips, so as to reduce their influence on the sensor, thereby improving the connection strength, connection rigidity and connection stability, and improving the imaging quality and imaging stability of the camera.

[0017] In some embodiments, a third position is provided at a location away from the preset device on the circuit board, and a third mounting structure is provided at the third position.

[0018] Therefore, this configuration allows for the further provision of a third position and a third mounting structure at that position to provide auxiliary support for the overall circuit board structure. This supports the circuit board against external forces, improving connection strength, rigidity, and stability, and ultimately enhancing the camera's imaging quality and stability. Furthermore, the placement of these auxiliary supports effectively reduces the impact on the sensor surface on the sensor circuit board.

[0019] In some embodiments, the first mounting structure includes a protruding structure or a recessed structure disposed at a corresponding position on one side of the circuit board; and / or,

[0020] The second mounting structure includes a raised structure or a recessed structure disposed at a corresponding position on one side of the circuit board.

[0021] Therefore, by using this configuration, the raised structure can be used to move the corresponding position on the circuit board further away from the mounting base, and the recessed structure can be used to move the corresponding position on the circuit board closer to the mounting base. This creates a height difference between the first and second positions on the circuit board, causing the circuit board to be positioned on different planes on the mounting base. This results in the circuit board undergoing reverse pre-deformation after installation, thereby improving the connection strength, connection stiffness, and connection stability, and ultimately enhancing the camera's imaging quality and stability.

[0022] In some embodiments, an opening or protrusion is provided at the first position; and / or,

[0023] An opening or a protrusion is provided at the second position.

[0024] Therefore, by using this configuration, the circuit board can be installed by using the openings provided at the first or second position to cooperate with the structure (such as protrusions, screw structures, riveting structures, etc.) on the mounting base for the circuit board, or the circuit board can be installed by using the protrusions provided at the first or second position to cooperate with the structure (such as recesses, etc.) on the mounting base for the circuit board, thereby improving the stability and convenience of installation.

[0025] In some embodiments, the first mounting structure includes a protrusion on one side of the circuit board, and the second position does not have a second mounting structure, or the second mounting structure includes a recessed structure on the same side of the circuit board.

[0026] Alternatively, the first position may not have a first mounting structure, and the second mounting structure may include a recessed structure on one side of the circuit board.

[0027] Alternatively, both the first mounting structure and the second mounting structure include a protrusion structure disposed on one side of the circuit board, and there is a height difference between the end faces of the protrusion structure of the first mounting structure and the protrusion structure of the second mounting structure;

[0028] Alternatively, both the first mounting structure and the second mounting structure include a recessed structure on one side of the circuit board, and there is a height difference between the end faces of the recessed structure of the first mounting structure and the recessed structure of the second mounting structure.

[0029] Therefore, by setting up in this way, a height difference between the first and second positions on the circuit board can be formed by setting a protruding structure at the first position and no structure or a recessed structure at the second position, or no structure at the first position and a recessed structure at the second position, or both the first and second positions have protruding or recessed structures. This allows the circuit board to form a reverse pre-deformation, thereby improving the connection strength, connection stiffness and connection stability, and improving the imaging quality and imaging stability of the camera.

[0030] According to a second aspect of the present invention, an electronic device is provided, including a housing and a sensor module, the sensor module including a circuit board as described in the first aspect above, the housing including a mounting base, and the circuit board mounted on the mounting base.

[0031] Because the electronic device of this utility model is equipped with the circuit board described in the first aspect above, the connection strength, connection rigidity and connection stability of the sensor module installation can be guaranteed. At the same time, it can also resist the influence of external force, impact load or thermal stress on the offset or drift of the sensor on the sensor circuit board by reverse pre-deformation during sensor circuit board installation. Thus, in the case of the sensor including the image acquisition module, the drift or defocusing abnormality of the sensor due to temperature during imaging is improved.

[0032] In some embodiments, the mounting base is provided with a support rib, which abuts against a first position and a second position on the circuit board.

[0033] In some embodiments, an opening is provided at the first position and / or the second position, and a positioning protrusion or mounting recess that mates with the opening is provided on the top surface of the support rib.

[0034] Therefore, by using this configuration, the support ribs on the mounting base can cooperate with the first and second positions, or the first or second mounting structure can cooperate with the first and second positions, so that after the circuit board is installed on the mounting base, it will form a reverse pre-deformation, thereby improving the connection strength, connection stiffness and connection stability, and improving the imaging quality and imaging stability of the camera.

[0035] In some embodiments, the effective contact area between the top surface of the supporting rib and the contact surface at the first or second position is not less than 1.5mm*1.5mm, or...

[0036] The top diameter of the supporting rib is not less than 4.2 mm.

[0037] Therefore, this design ensures that the effective contact area between the support rib and the circuit board is neither too small nor too large. If it is too small, it will easily cause false support contact, and if it is too large, it will be inconvenient for the placement of components.

[0038] In some embodiments, an opening is provided at the second position, and a mounting recess is provided on the support rib corresponding to the second position. The mounting base is also provided with a screw structure or riveting structure that passes through the opening and fixes the circuit board to the mounting recess on the support rib.

[0039] Therefore, by using the mounting recesses on the support ribs and the screw and riveting structures, the second position on the circuit board can be fixed to a position that abuts against the support ribs, thereby creating a mounting height difference with the first position on the circuit board, so that the circuit board can undergo reverse pre-deformation.

[0040] According to a third aspect of the present invention, a portable platform is provided, including the electronic device described in the second aspect above.

[0041] The mobile platform of this utility model, by being equipped with the electronic equipment described in the second aspect above, can ensure the stability of its sensor detection function and improve the reliability and stability of the system and the algorithms used. Attached Figure Description

[0042] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the overall structure of a circuit board according to an embodiment of the present invention, wherein a first mounting structure with a protruding structure is provided at a first position and a second mounting structure is not provided at a second position.

[0044] Figure 2 This is a schematic diagram of the overall structure of a first mounting structure with a raised structure at a first position and a recessed structure at a second position, which is an embodiment of the present invention.

[0045] Figure 3This is a schematic diagram of the overall structure of a circuit board according to an embodiment of the present invention, in which a protrusion structure is provided at both the first and second positions.

[0046] Figure 4 This is a schematic diagram of the overall structure of a circuit board according to an embodiment of the present invention, in which a recessed structure is provided at both the first and second positions.

[0047] Figure 5 This is a schematic diagram of the overall structure of a second mounting structure of a circuit board according to an embodiment of the present invention, wherein the first mounting structure is not provided at the first position and a recessed structure is provided at the second position.

[0048] Figure 6 This is a schematic diagram of the structure of a circuit board for connecting to a mounting base according to an embodiment of the present invention.

[0049] Figure 7 This is a schematic diagram of the overall structure of the mounting base for the circuit board according to one embodiment of the present invention.

[0050] Figure 8 This is an exploded view of an electronic device with a circuit board according to one embodiment of the present invention.

[0051] Figure 9 This is a schematic diagram of the internal structure of an electronic device equipped with a circuit board according to one embodiment of the present invention.

[0052] Explanation of reference numerals in the attached drawings: 1. Mounting base; 11. Support rib; 12. Step structure; 131. Positioning protrusion; 132. Mounting recess; 14. Opening; 15. Screw structure; 16. Protrusion; 21. First position; 22. Second position; 23. Third position; 24. First mounting structure; 25. Second mounting structure; 26. Third mounting structure; 31. Protruding structure; 32. Recessed structure. Detailed Implementation

[0053] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0054] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0055] In the description of this application, it should be understood that the use of terms such as "center," "middle," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" to indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings is solely for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Features defined with "first" and "second" are used to distinguish feature names and do not have special meanings. Furthermore, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0056] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0057] It should also be noted that, in this document, the terms "comprising" or "including" include not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The terminology used herein is generally that commonly used by those skilled in the art; in case of any discrepancy with commonly used terminology, the terminology used herein shall prevail.

[0058] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0059] The present invention will now be described in further detail with reference to the accompanying drawings.

[0060] Figures 1 to 5 The schematic diagram illustrates the structural composition of a circuit board according to one embodiment of the present invention, with reference to... Figures 1 to 5 As shown, the circuit board of this utility model includes a first position 21 and a second position 22 disposed on the circuit board. Both the first position 21 and the second position 22 are positions where the circuit board abuts against the mounting base 1 after being mounted on it, thus supporting and fixing the circuit board. At least two first positions 21 are provided, and the second position 22 is disposed in a vertical space with the line connecting the two first positions 21 as an axis. Simultaneously, a first mounting structure 24 is provided on the first position 21, or a second mounting structure 25 is provided on the second position 22, or both the first and second positions 21 and second positions 22 are simultaneously provided. Specifically, the end face of the first mounting structure 24 and the end face of the second mounting structure 25 are not on the same plane, or only one of the first and second mounting structures 24 or 25 is provided. This arrangement ensures that after the circuit board is mounted on the mounting base 1, the positions of the first positions 21 and the second positions 22 on the circuit board are not on the same plane, allowing the circuit board to undergo reverse pre-deformation to resist bending deformation caused by external forces, impact loads, or thermal stress during operation. Among them, reverse pre-deformation is the circuit board deformation that is opposite in direction to the bending deformation caused by external force, impact load or thermal stress during the operation of the circuit board.

[0061] Mounting base 1 is a structure for mounting circuit boards. It can be a device housing structure, a base structure, etc., and this embodiment does not limit this. In some possible implementations, when mounting base 1 is a device housing structure, such as the housing structure of a camera module, mounting base 1 can be set as the front shell of the camera module, or as the rear shell of the camera module, or as an integral housing structure formed by combining the front shell and the rear shell, etc.

[0062] The structure within the mounting base 1 can be configured according to existing technologies. For example, the mounting base 1 can be formed as a flat surface to support and fix the circuit board. (Refer to...) Figure 7 and Figure 8As shown, the mounting base 1 can also be a hollow structure with several support structures extending toward the mounting position of the circuit board for supporting the circuit board. These support structures can be stepped structures 12 used solely for supporting the circuit board. The height tolerance between the stepped structures 12 can be set to ±0.03mm, and they can be formed by cold heading or die casting, and can be achieved without CNC machining when the tolerance meets the requirements. These support structures can also be support ribs 11 with structures for mounting and fixing the circuit board. These structures for mounting and fixing the circuit board can include, for example, positioning protrusions 131 or mounting recesses 132 provided on the top surface of the support ribs 11. The positioning protrusions 131 can mate with the openings 14 on the circuit board to position and mount the circuit board. The mounting recesses 132 can mate with the openings 14 on the circuit board to position and fix the circuit board to the mounting base 1 by screw structures 15 or riveting structures. The height tolerance between the support ribs 11 can be set to ±0.03mm, which can be achieved by cold heading or CNC machining.

[0063] Specifically, at least two first positions 21 and at least one second position 22 must be provided. The second position 22 is positioned within the vertical space of the line connecting the two first positions 21. For example, the second position 22 can be directly positioned between the two first positions 21, or positioned in the vertical space between the two first positions 21. This design ensures that when the first positions 21 and 22 on the circuit board are not on the same plane on the mounting base 1, the position of the second position 22 on the circuit board will be slightly higher or lower than the position of the first position 21 on the mounting base 1. This causes the circuit board to deform slightly after being mounted on the mounting base 1, resulting in a reverse pre-deformation.

[0064] In some possible implementations, when the mounting base 1 is a rear shell, the first position 21 and the second position 22 can be located on the side of the circuit board where no chips or other pre-installed devices are mounted, thereby reducing the impact of the placement of the first position 21 and the second position 22 on the chips or other pre-installed devices. Alternatively, when the mounting base 1 is an integral housing structure formed by combining a front shell and a rear shell, the first position 21 and the second position 22 can also be located on different surfaces of the circuit board, thereby allowing for better arrangement of the specific placement positions of the first position 21 and the second position 22.

[0065] In other possible implementations, the second position 22 may also be provided as at least two. In this case, after the circuit board is mounted on the mounting base 1, the positions of the two second positions 22 on the circuit board and the portion between them on the mounting base 1 will be slightly higher or lower than the position of the first position 21 on the circuit board on the mounting base 1, thereby causing the aforementioned area on the circuit board to form a reverse pre-deformation. For example, referring to... Figure 1 As shown, in Figure 1 In the embodiment shown, the two second positions 22 are located in the vertical space with the line connecting the two first positions 21 as the axis, so that the two second positions 22 and the two first positions 21 are arranged approximately diagonally on the circuit board. At the same time, the height difference between the two second positions 22 and the two first positions 21 can cause the circuit board to form a reverse pre-deformation after it is mounted on the mounting base 1.

[0066] It is understandable that when the circuit board is mounted on the mounting base 1 and undergoes reverse pre-deformation, the deformation of the circuit board will occur not only near the second position 22, but also near the first position 21. Therefore, the position setting and number of the first position 21 and the second position 22 will affect the effect after installation. Specifically, the positions of the first position 21 and the second position 22 on the circuit board can be set at the edge of the preset device position on the circuit board or at the force point position on the circuit board.

[0067] The setting of the first position 21 and the second position 22 can support the preset components on the circuit board (such as important components like chips or connecting components like B2B connectors or FAKRA connectors) without affecting their normal operation. The stress points on the circuit board can be locations where bending deformation occurs due to loads (such as pressure or thermal stress) or environmental factors (such as temperature creep) during actual application, thereby improving the effect of reverse pre-deformation after the circuit board is installed. This pre-deformation increases the rigidity of the circuit board, resisting the effects of external forces, impact loads, or thermal stress on the sensor's offset or drift on the sensing circuit board, thus improving the drift or defocusing anomalies in camera and other sensor imaging caused by temperature and other factors. Specifically, these first positions 21 and second positions 22 can be set to positions for mounting and fixing the circuit board to the mounting base 1. For example, refer to... Figure 6 As shown, an opening 14 or a protrusion 16 can be provided at the first position 21 on the circuit board, and an opening 14 or a protrusion 16 can also be provided at the second position 22 on the circuit board. The opening 14 can cooperate with the positioning protrusion 131, screw structure 15, and riveting structure on the mounting base 1 to install the circuit board onto the mounting base 1. The protrusion 16 can cooperate with the mounting recess 132 on the mounting base 1 to install the circuit board onto the mounting base 1. (Refer to...) Figure 1 As shown, in Figure 1In the embodiment shown, the first position 21 and the second position 22 can be the positions on the circuit board where the opening 14 is provided, so that the circuit board can be installed and fixed on the support rib 11 on the mounting base 1 which is provided with the positioning protrusion 131 or the mounting recess 132, cooperate with the support rib 11 to fix the circuit board, form reverse pre-deformation, and improve the performance of the circuit board.

[0068] For example, the pre-deformation formed after the circuit board is installed can be formed as a downward bending deformation of the middle part of the circuit board, or it can be formed as an upward bending deformation of the middle part of the circuit board. The specific design can be set according to the deformation direction and magnitude of the circuit board itself during actual application, as long as it can offset or partially offset the deformation of the circuit board itself. In some possible implementations, in actual application, taking the mounting base 1 as the front shell of the camera module as an example, the deformation direction of the circuit board itself is a downward bending deformation of the middle part (i.e., towards the rear shell). Then, when designing the structure of the first position 21 and the second position 22 of the corresponding embodiment, it can be set so that after the circuit board is installed on the mounting base 1, the position of the second position 22 on the circuit board on the mounting base 1 is closer to the mounting base 1 than the position of the first position 21 on the circuit board on the mounting base 1. This way, after the circuit board is installed on the mounting base 1, a pre-deformation of the middle part of the circuit board bending upward (i.e., towards the front shell) will occur, thereby offsetting the deformation of the circuit board during actual application.

[0069] Specifically, the height difference between the end face of the first mounting structure 24 and the end face of the second mounting structure 25 can be set to no more than 0.15mm, or the height difference between the first mounting structure 24 or the second mounting structure 25 and the plane of the circuit board on which it is mounted can be set to no more than 0.15mm. That is, after the circuit board is mounted on the mounting base 1, the height difference between the plane where the first position 21 on the circuit board is located on the mounting base 1 and the plane where the second position 22 on the circuit board is located on the mounting base 1 can be set to no more than 0.15mm. In some possible implementations, it can be set to 0.05mm~0.15mm. Specific setting values ​​can be analyzed and evaluated using software simulation, and also need to be combined with actual measurement and preliminary data for design reference. Specifically, for the mounted circuit board, the strain near its key components should be ≤500μm (300μm recommended).

[0070] The first mounting structure 24 located at the first position 21 and the second mounting structure 25 located at the second position 22 can be the same structure or different structures. Both the first mounting structure 24 and the second mounting structure 25 can be structures commonly used in the prior art, and this utility model does not limit them in this regard. Specifically, refer to... Figures 1 to 5As shown, the first mounting structure 24 and the second mounting structure 25 may include a protruding structure 31 or a recessed structure 32 disposed at corresponding positions on the side of the circuit board facing the mounting base 1. These protruding structures 31 can be implemented by screen printing, pad printing, or localized electroplating alloy on the end of the circuit board, while the recessed structures 32 can be implemented by machining or chemical etching on the end of the circuit board.

[0071] Specifically, by setting a first mounting structure 24 on the first position 21 and / or a second mounting structure 25 on the second position 22, when designing the height difference between the plane where the first position 21 on the circuit board is located on the mounting base 1 and the plane where the second position 22 on the circuit board is located on the mounting base 1 after the circuit board is mounted on the mounting base 1, the following reference is made: Figure 3 As shown, it can be formed by the height difference of the protruding structures 31 between the first mounting structure 24 and the second mounting structure 25, both of which are formed by protruding structures 31; or refer to Figure 4 As shown, it can also be formed by the depth difference of the recessed structure 32 between the first mounting structure 24 and the second mounting structure 25, both of which are formed by the recessed structure 32; or by referring to Figure 2 As shown, it can be formed by a first mounting structure 24 formed by a protruding structure 31 and a second mounting structure 25 formed by a recessed structure 32; it can also be referred to Figure 1 As shown, by providing a protruding structure 31 at the first position 21 while not providing a structure at the second position 22, or referring to... Figure 5 As shown, a recessed structure 32 is provided at the second position 22 without a structure at the first position 21. In embodiments where the mounting base 1 is an integral shell structure formed by combining a front shell and a rear shell, it can also be formed by providing protruding structures 31 on both sides of the circuit board, providing recessed structures 32 on both sides of the circuit board, or providing both protruding structures 31 and recessed structures 32 on both sides of the circuit board. In practical applications, combinations can be made according to actual conditions, and this utility model does not limit this.

[0072] The specific configuration of the first mounting structure 24 or the second mounting structure 25, whether the first mounting structure 24 and the second mounting structure 25 are set as raised structures 31 or recessed structures 32, and the number of the first mounting structure 24 and the second mounting structure 25 can all be designed according to the actual application scenario, such as the bending deformation of the circuit board due to load (such as pressure, thermal stress) or environmental effects (such as temperature creep) during actual application. It is only necessary that the reverse pre-deformation formed on the circuit board can offset or partially offset the deformation of the circuit board itself.

[0073] Additionally, in some possible implementations, a third position 23 may be provided. The third position 23 is located away from the preset components on the circuit board. A third mounting structure 26 may be provided at the third position 23 to abut against the stepped structure 12 on the mounting base 1, providing auxiliary support for the circuit board and assisting in reverse pre-deformation after installation. The third mounting structure 26 can also be a raised structure 31 or a recessed structure 32, which can be achieved through methods such as screen printing, localized electroplating, machining, or chemical etching on the circuit board end. (Refer to...) Figure 1 As shown, in Figure 1 In the embodiment shown, a third position 23 is provided on the circuit board, and a third mounting structure 26 formed by the protruding structure 31 is provided on the third position 23. Specifically, the third position 23 is set at a position corresponding to the position of the step structure 12 on the mounting base 1 which is only used to support the circuit board, so as to provide auxiliary support for the position on the circuit board that is far away from the preset device.

[0074] In some embodiments where the mounting base 1 is provided with support ribs 11, the effective contact area between the support ribs 11 and the circuit board can be designed to improve the support performance of the circuit board. Specifically, the support ribs 11 can be set such that the effective contact area between their top surface and the contact surface of the circuit board is not less than 1.5mm*1.5mm, or the top surface diameter of the support ribs 11 is not less than 4.2mm, to ensure that the effective contact area between the support ribs 11 and the circuit board is neither too small nor too large. If it is too small, it will easily cause a false support contact; if it is too large, it will be inconvenient for device placement.

[0075] For example, refer to Figure 1 and Figure 8 As shown, taking the mounting base 1 as the front shell of the camera module as an example, the mounting base 1 has a hollow structure to accommodate the components on the circuit board and to facilitate heat dissipation. The mounting base 1 is provided with several support ribs 11 and several stepped structures 12. The positions of these support ribs 11 and stepped structures 12 on the mounting base 1 are designed according to the structure of the circuit board to be mounted, corresponding to the first position 21, the second position 22, and the third position 23 on the circuit board. When the circuit board is mounted on the mounting base 1, the side of the circuit board with pre-set components such as chips faces the mounting base 1, and thus the first position 21, the second position 22, and the third position 23, and the mounting structures thereon, are all located on this surface of the circuit board. The first position 21 on the circuit board is located at... Figure 1 The upper left and lower right corners of the circuit board are shown. The second position 22 on the circuit board is located at... Figure 1The circuit board shown has three chips at its upper right and lower left corners. Both the first position 21 and the second position 22 have openings 14. The first position 21 has a first mounting structure 24 formed by a protrusion 31, while the second position 22 does not have a second mounting structure 25.

[0076] Continue to refer to Figure 1 and Figure 8 As shown, a positioning protrusion 131 is provided on the top surface of the support rib 11 corresponding to the first position 21. The positioning protrusion 131 passes through the opening 14 at the first position 21 and abuts against the first mounting structure 24 formed by the protruding structure 31, so that the top surface of the support rib 11 indirectly abuts against the first position 21. A mounting recess 132 is provided on the top surface of the support rib 11 corresponding to the second position 22. The position of the opening 14 at the second position 22 corresponds to the position of the mounting recess 132, and the second position 22 is installed and fixed to the corresponding support rib 11 by a screw structure 15 or a riveting structure, so that the second position 22 abuts against the top surface of the support rib 11.

[0077] In this embodiment, after the circuit board is mounted on the mounting base 1, the second position 22 on the circuit board is closer to the mounting base 1 than the first position 21 on the circuit board. This causes the circuit board to undergo a reverse pre-deformation with its center bending upward (i.e. towards the front shell direction), which can offset or partially offset the deformation of the circuit board itself and improve the rigidity of the circuit board after installation.

[0078] At the same time, continue to refer to Figure 1 and Figure 8 As shown, in this embodiment, a third position 23 is also provided on the circuit board, and a third mounting structure 26 formed by the protruding structure 31 is provided on the third position 23 so as to abut against the stepped structure 12 on the mounting base 1 to achieve auxiliary support for the circuit board.

[0079] In this embodiment, the first position 21 and the second position 22 are arranged more evenly on the front housing, resulting in pre-deformation that makes the contact pressure between the circuit board and the support rib 11 more uniform, reducing local stress concentration and avoiding the problem of some screw structures 15 being overloaded while others are not sufficiently stressed. Furthermore, the continuous pressure contact between the circuit board and the support rib 11 increases interface friction damping, hindering the small displacement of the screw structure 15 caused by lateral vibration, and significantly reducing the probability of loosening. Further, referring to… Figure 9 As shown, the support rib 11 or the stepped structure 12 also has a reserved tolerance space, which can form a small amount of interference with the circuit board after the circuit board is installed (such as...). Figure 9The interference amount indicated by the middle arrow is used to compensate for processing or installation deviations (such as slight tilting of the support rib 11 or step structure 12, uneven plate thickness, etc.), ensuring that the designed clamping effect can still be achieved after assembly, and allowing the pre-deformation to directly offset the thermal deformation in the welding / locking process (such as the upward arching of the plate caused by welding shrinkage, etc.). At the same time, due to the small internal space of the camera module, using the traditional method of locking and connecting with screw structure 15 or riveting structure will occupy the space for component placement and will also increase the locking process, reducing production efficiency. In this embodiment, the support rib 11 corresponding to the first position 21 adopts the structure of positioning protrusion 131, which can improve the efficiency of the assembly process, reduce the cost of incoming material size control, reduce the size requirements of the circuit board, and reduce the overall outer contour size of the camera module.

[0080] The circuit board of this invention has a structure provided at the first position 21 and / or the second position 22 on the circuit board, so that after the circuit board is installed on the mounting base 1, the positions of the first position 21 and the second position 22 on the circuit board are not on the same plane on the mounting base 1. This height difference design allows the installed circuit board to form a reverse pre-deformation, thereby increasing the rigidity of the circuit board to resist the influence of external forces, impact loads or thermal stress on the offset or drift of the sensor on the sensing circuit board. This improves the situation of camera image drift or defocusing abnormalities caused by temperature when the sensor includes a camera.

[0081] This utility model also provides an electronic device, as shown in the reference. Figure 8 and Figure 9 As shown, the electronic device includes a housing and a sensor module. The sensor module includes a circuit board according to any of the embodiments described above. The housing includes a mounting base 1, and the circuit board is mounted on the mounting base 1 inside the housing. The housing includes a front shell and a rear shell. The mounting base 1 can be the front shell, the rear shell, or an integral housing structure formed by combining the front and rear shells. The first position 21 and the second position 22 on the circuit board can be located on one side of the circuit board or on both sides. Specific configuration methods can be referred to the relevant descriptions above and will not be repeated here.

[0082] Specifically, the electronic device described in this embodiment can be a camera module, a sensing module, a radar module, or other similar devices. Because the electronic device is equipped with the aforementioned circuit board, the connection strength, connection rigidity, and connection stability of its sensor module installation can be guaranteed. At the same time, it can also resist the effects of external forces, impact loads, or thermal stress on the offset or drift of the sensor on the sensor circuit board by reverse pre-deformation during sensor circuit board installation. This improves the situation of camera imaging drift or defocusing abnormalities caused by temperature when the sensor includes a camera.

[0083] Furthermore, the aforementioned circuit board can be a circuit board with a sensor chip, or it can be a power supply circuit board, an adapter board, or other circuit boards. Therefore, the power supply circuit board, adapter board in the sensor module, or other circuit boards and adapter boards in other modules can also be provided with the aforementioned first mounting structure and / or second mounting structure to achieve reverse pre-deformation of the board body, thereby improving the connection rigidity of these circuit boards and adapter boards.

[0084] This utility model also provides a mobile platform, wherein the aforementioned electronic equipment is provided on the mobile platform, which can improve the resistance of the mobile platform to the offset or drift of the sensor on the circuit board due to the reverse pre-deformation during circuit board installation. In the case of electronic equipment including a camera, it optimizes the camera imaging to avoid drift or defocusing abnormalities caused by temperature, adapts to more different working environments of the mobile platform, and improves the reliability and stability of the system and the algorithm used.

[0085] It should be noted that the mobile platform described in this embodiment of the present invention can be, for example, a mobile robot, model aircraft, drone, robotic arm, car, ship, etc. It should also be pointed out that the structure of the mobile platform is not limited to this; this embodiment is merely illustrative.

[0086] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A circuit board, characterized in that, This includes a first position (21) and a second position (22) disposed on the circuit board. A first mounting structure (24) is disposed on the first position (21), and / or a second mounting structure (25) is disposed on the second position (22). There are at least two first positions (21), and the second position (22) is disposed in a vertical space with the line connecting the two first positions (21) as an axis. The end face of the first mounting structure (24) and the end face of the second mounting structure (25) are not on the same plane, or, Only one of the first mounting structure (24) and the second mounting structure (25) is provided.

2. The circuit board according to claim 1, characterized in that, The height difference between the end face of the first mounting structure (24) and the end face of the second mounting structure (25) is not greater than 0.15mm, or, The height difference between the first mounting structure (24) or the second mounting structure (25) and the plane of the circuit board on which it is disposed is not greater than 0.15mm.

3. The circuit board according to claim 1, characterized in that, The first position (21) and the second position (22) are set at the edge of the preset device position on the circuit board or at the force point position on the circuit board.

4. The circuit board according to claim 3, characterized in that, A third position (23) is provided at a location away from the preset device on the circuit board, and a third mounting structure (26) is provided at the third position (23).

5. The circuit board according to any one of claims 1 to 4, characterized in that, The first mounting structure (24) includes a protruding structure (31) or a recessed structure (32) disposed at a corresponding position on one side of the circuit board; and / or, The second mounting structure (25) includes a raised structure (31) or a recessed structure (32) disposed at a corresponding position on one side of the circuit board.

6. The circuit board according to claim 5, characterized in that, An opening (14) or a protrusion (16) is provided at the first position (21); and / or, An opening (14) or a protrusion (16) is provided on the second position (22).

7. The circuit board according to claim 5, characterized in that, The first mounting structure (24) includes a protruding structure (31) disposed on one side of the circuit board, and the second position (22) does not have a second mounting structure (25) or the second mounting structure (25) includes a recessed structure (32) disposed on the same side of the circuit board. Alternatively, the first position (21) may not have the first mounting structure (24), and the second mounting structure (25) may include a recessed structure (32) on one side of the circuit board. Alternatively, both the first mounting structure (24) and the second mounting structure (25) include a protrusion structure (31) disposed on one side of the circuit board, and there is a height difference between the end faces of the protrusion structure (31) of the first mounting structure (24) and the protrusion structure (31) of the second mounting structure (25). Alternatively, both the first mounting structure (24) and the second mounting structure (25) include a recessed structure (32) disposed on one side of the circuit board, and there is a height difference between the end faces of the recessed structure (32) of the first mounting structure (24) and the recessed structure (32) of the second mounting structure (25).

8. An electronic device, characterized in that, The device includes a housing and a sensor module, the sensor module including a circuit board as described in any one of claims 1 to 7, the housing including a mounting base (1), and the circuit board mounted on the mounting base (1).

9. The electronic device according to claim 8, characterized in that, The mounting base (1) is provided with a support rib (11), which abuts against the first position (21) and the second position (22) on the circuit board.

10. The electronic device according to claim 9, characterized in that, An opening (14) is provided at the first position (21) and / or the second position (22), and a positioning protrusion (131) or a mounting recess (132) that mates with the opening (14) is provided on the top surface of the support rib (11).

11. The electronic device according to claim 9, characterized in that, The effective contact area between the top surface of the supporting rib (11) and the contact surface at the first position (21) or the second position (22) is not less than 1.5mm*1.5mm, or, The top diameter of the supporting rib (11) is not less than 4.2 mm.

12. A mobile platform, characterized in that, Includes the electronic device described in claim 8 above.

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