An electronic device, an electric drive system and a vehicle
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-18
- Publication Date
- 2026-08-11
AI Technical Summary
[0004]基于此，本申请提供了一种电子器件、电驱动系统及车辆，以解决相关技术中金属屏蔽罩空间占用较大的问题
[0020]电子器件通过导电胶带覆盖并粘接在电子元器件外的方式形成屏蔽结构，导电胶带呈柔性，受力时可发生形变，能够较为紧密贴合电子元器件的表面轮廓，因此其占用空间较小；同时，其通过粘接方式连接，无需在电路板或金属化带上加工连接孔等结构，安装过程更为简便。此外，相较于钣金屏蔽罩，导电胶带的材料成本更低，且可通过剪裁加工成任意形状，进一步降低了加工制造成本。导电胶带与金属化带导电接触，保证了屏蔽性能的可靠性。电子器件将绝缘层直接设置在电子元器件表面，使导电胶带与电子元器件之间实现绝缘隔离，降低了元器件间短路导致的损坏风险；同时，绝缘层紧贴电子元器件表面，缩短了绝缘隔离距离，从而有助于缩小导电胶带的到电子元器件的距离，优化了电子器件的空间利用率。
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Figure CN224626868U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of electrical components, and more particularly to an electronic device, an electric drive system, and a vehicle. Background Technology
[0002] In vehicles, power and electronic control products such as on-board chargers, DC-DC converters, and motor controllers require electromagnetic shielding for their internal PCBs (Printed Circuit Boards) to ensure that each electronic component operates independently and reliably.
[0003] In related technologies, sheet metal metal shielding covers are used to cover the electronic components that need to be shielded, and the metal shielding covers and PCB boards are fixed with screws. The metal shielding covers occupy a large amount of space. Utility Model Content
[0004] Based on this, this application provides an electronic device, an electric drive system, and a vehicle to solve the problem of large space occupation by metal shielding covers in related technologies.
[0005] In a first aspect, embodiments of this application provide an electronic device, comprising:
[0006] The circuit board has a metallized strip on its surface for grounding.
[0007] Electronic components are mounted on the circuit board;
[0008] An insulating layer is disposed on the surface of the electronic component;
[0009] A conductive tape is applied over the insulating layer, and at least a portion of the conductive tape is bonded to and in conductive contact with the metallized tape.
[0010] In some embodiments, the metallization strip is annular, the electronic components are disposed inside the metallization strip, and the conductive tape is bonded to the metallization strip around its entire edge.
[0011] In some embodiments, the metallization strip is non-circular, and the edge of the conductive tape is bonded to the metallization strip and the circuit board.
[0012] In some embodiments, the electronic device further includes a reinforcing film adhered to the surface of the conductive tape.
[0013] In some embodiments, the reinforcing film is a PA film or a PP film.
[0014] In some embodiments, the reinforcing film is adhered to the inner surface of the conductive tape.
[0015] In some embodiments, the electronic device further includes a shielding layer disposed on the surface of the conductive tape.
[0016] In some embodiments, the insulating layer is an insulating varnish sprayed onto the surface of the electronic component.
[0017] Secondly, embodiments of this application provide an electric drive system, including a motor and the electronic device described in the first aspect, wherein the electronic device is electrically connected to the motor.
[0018] Thirdly, embodiments of this application provide a vehicle including the electronic device described in the first aspect or the electric drive system described in the second aspect.
[0019] This application has at least the following beneficial effects:
[0020] Electronic components are shielded by conductive tape, which is then covered and bonded to them. The conductive tape is flexible and deformable under stress, allowing it to closely conform to the surface contours of the components, thus occupying less space. Furthermore, the adhesive bonding eliminates the need for connecting holes in the circuit board or metallized strip, simplifying installation. Compared to sheet metal shielding, conductive tape is less expensive and can be cut into any shape, further reducing manufacturing costs. The conductive tape makes conductive contact with the metallized strip, ensuring reliable shielding performance. An insulating layer is directly placed on the surface of the electronic components, achieving insulation between the conductive tape and the components, reducing the risk of damage from short circuits. Simultaneously, the insulating layer's close contact with the component surface shortens the insulation distance, further optimizing space utilization and reducing the distance between the conductive tape and the components. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a cross-sectional view of an electronic device in some embodiments of this application.
[0023] Figure 2 This is a top view of an electronic device in some embodiments of this application after the conductive tape, reinforcing film, insulating layer, and shielding layer are concealed.
[0024] Figure 3This is a top view of the electronic device after the reinforcing film, insulating layer and shielding layer are hidden in some embodiments of this application.
[0025] Figure 4 This is a top view of an electronic device after concealing conductive tape, reinforcing film, insulating layer, and shielding layer in other embodiments of this application.
[0026] Figure 5 This is a top view of the electronic device after the reinforcing film, insulating layer and shielding layer are hidden in other embodiments of this application.
[0027] Explanation of reference numerals in the attached figures:
[0028] 100 - Electronic components, 110 - Circuit board, 111 - Metallized strip, 120 - Electronic components, 130 - Insulating layer, 140 - Conductive tape, 150 - Reinforcing film, 160 - Shielding layer. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, of the embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. The embodiments of this application will be described in detail below with reference to the accompanying drawings.
[0030] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0031] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0032] The terms “first,” “second,” and “third” (if any) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.
[0033] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or display that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or display.
[0034] In related technologies, sheet metal metal shielding covers are used to cover the electronic components that need to be shielded, and the metal shielding covers and PCB boards are fixed with screws. The metal shielding covers occupy a large amount of space.
[0035] In view of this, the inventors designed an electronic device 100, an electric drive system and a vehicle. The electronic device 100 forms a shielding structure by covering and bonding it to the outside of the electronic component 120 with conductive tape 140. The conductive tape 140 is flexible and can deform under force, so it occupies less space.
[0036] The electronic device 100, electric drive system and vehicle provided in the embodiments of this application are described in detail below with reference to the accompanying drawings.
[0037] like Figure 1 As shown, the electronic device 100 includes: a circuit board 110, electronic components 120, an insulating layer 130, and conductive tape 140. A metallized strip 111 for grounding is provided on the surface of the circuit board 110; the electronic components 120 are mounted on the circuit board 110; the insulating layer 130 is disposed on the surface of the electronic components 120; the conductive tape 140 covers the insulating layer 130, and at least a portion of the conductive tape 140 is bonded to and electrically contacts the metallized strip 111.
[0038] The electronic device 100 may be an on-board charger, DC-DC converter, motor controller, etc., and is not limited in this application.
[0039] Specifically, such as Figure 1As shown, a metallization strip 111 is provided on the upper surface of the circuit board 110. The metallization strip 111 is a thin metal film deposited on the surface of the insulating substrate (such as FR-4, polyimide, etc.) of the circuit board during the circuit board manufacturing process using chemical methods (such as chemical copper plating) or electroplating methods. Its material can be gold, copper, aluminum, nickel, etc. The thickness of the metallization strip 111 is typically between a few micrometers and tens of micrometers, and its width and length can be customized according to design requirements. The metallization strip 111 can be used to achieve electrical connections, signal transmission, and other functions, and it is also used for grounding. In some embodiments, the metallization strip 111 is made of copper.
[0040] Electronic component 120 can be a radio frequency chip, power amplifier, optical module driver chip, audio decoder, digital signal processor, buck converter, boost converter, or other components requiring electromagnetic shielding. Electronic component 120 is mounted on the upper surface of circuit board 110. Electronic component 120 typically needs to be electrically connected to the circuitry on circuit board 110. The specific electrical connection relationship is related to the structure of electronic component 120 and circuit board 110, and the functions to be implemented, and is not limited in this application.
[0041] The conductive tape 140 achieves electromagnetic shielding and electrical connection through conductive materials (such as aluminum foil, copper foil, or metal particles), while simultaneously utilizing the adhesive properties of the adhesive layer to achieve mechanical fixation with other components. The structure of the conductive tape 140 is known to those skilled in the art. The conductive tape 140 is flexible and can deform under stress. The conductive tape 140 can be copper foil tape, aluminum foil tape, etc., and is not limited thereto in this application. In some embodiments, the conductive tape 140 is copper foil tape.
[0042] Conductive tape 140 is applied over the insulating layer 130, which is in turn applied to the surface of electronic component 120. Thus, conductive tape 140 covers the electronic component 120. Conductive tape 140 can reduce or eliminate the influence of external electromagnetic interference on the signal of electronic component 120 inside conductive tape 140, and also reduce or eliminate the interference caused by signal leakage from electronic component 120 inside conductive tape 140.
[0043] The insulating layer 130 is located between the conductive tape 140 and the electronic component 120, providing insulation between them and preventing short circuits that could damage the electronic component 120 due to the conductive tape 140. The insulating layer 130 can be formed by spraying insulating varnish or similar methods.
[0044] At least a portion of the conductive tape 140 is adhered to the metallized strip 111. In some embodiments, the adhesive layer of the conductive tape 140 is conductive, and after adhesion, the conductive tape 140 makes conductive contact with the metallized strip 111. The conductive tape 140 can also be adhered to the circuit board 110. The metallized strip 111 is used for grounding, and after the conductive tape 140 is adhered to the metallized strip 111, the conductive tape 140 is also grounded. After the conductive tape 140 is grounded, electromagnetic interference induced on the conductive tape 140, such as static electricity, external radiation, or noise coupled from internal circuits, is conducted to the ground through a low-impedance path, preventing the formation of interference loops or secondary radiation. At the same time, after grounding, the conductive tape 140 and the circuit ground form an equipotential, which can prevent arcing, breakdown, or signal distortion caused by potential differences.
[0045] Electronic component 100 is covered and bonded to electronic component 120 by conductive tape 140 to form a shielding structure. The conductive tape 140 is flexible and deformable under stress, allowing it to closely conform to the surface contour of electronic component 120, thus occupying less space. Furthermore, the adhesive bonding eliminates the need for connecting holes or other structures on the circuit board 110 or metallized strip 111, simplifying the installation process. In addition, compared to sheet metal shielding, the conductive tape 140 has a lower material cost and can be cut into any shape, further reducing manufacturing costs. The conductive tape 140 and metallized strip 111 are in conductive contact, ensuring reliable shielding performance. The electronic device 100 has an insulating layer 130 directly disposed on the surface of the electronic component 120, which achieves insulation isolation between the conductive tape 140 and the electronic component 120, reducing the risk of damage caused by short circuits between components. At the same time, the insulating layer 130 is in close contact with the surface of the electronic component 120, shortening the insulation isolation distance, thereby helping to reduce the distance between the conductive tape 140 and the electronic component 120 and optimizing the space utilization of the electronic device 100.
[0046] like Figure 2 and Figure 3 As shown, in some embodiments, the metallization strip 111 is annular, the electronic components 120 are disposed inside the metallization strip 111, and the conductive tape 140 is bonded to the metallization strip 111 around its edge.
[0047] In other words, such as Figure 2 As shown, the metallization strip 111 is arranged in a ring around the electronic component 120, forming a ring that surrounds the electronic component 120, as shown. Figure 3As shown, the edges of the conductive tape 140 are all bonded to the metallized strip 111. With this design, the edges of the conductive tape 140 are bonded to the metallized strip 111 around the entire perimeter, which helps to reduce electromagnetic leakage and improve the shielding performance of the conductive tape 140. Furthermore, the conductive tape 140 and the metallized strip 111 are in conductive contact around the entire perimeter, and the conductive tape 140 is grounded at multiple points, which reduces the grounding impedance and helps to avoid the formation of interference loops or secondary radiation.
[0048] like Figure 4 and Figure 5 As shown, in some embodiments, the metallization strip 111 is non-circular, and the edge of the conductive tape 140 is bonded to the metallization strip 111 and the circuit board 110.
[0049] A portion of the edge of the conductive tape 140 is adhered to the metallized strip 111, and another portion is adhered to the circuit board 110. The conductive tape 140 is adhered around its entire edge, which helps reduce electromagnetic leakage and improves the shielding performance of the conductive tape 140. The metallized strip 111 does not wrap around the electronic component 120, reducing the amount of material used in the metallized strip 111, lowering the cost of the circuit board 110, thereby reducing the production cost of the electronic component 100, and also helping to improve the processing efficiency of the circuit board 110. In these embodiments, the metallized strip 111 can be in the shape of a line, a C-shape, a U-shape, an L-shape, etc., and is not limited in this application.
[0050] like Figure 4 As shown, in some embodiments, the metallization band 111 is U-shaped.
[0051] In some embodiments, the electronic device 100 further includes a reinforcing film 150 adhered to the surface of the conductive tape 140.
[0052] A reinforcing film 150 is bonded to the surface of the conductive tape 140, giving the conductive tape 140 a certain degree of toughness, which facilitates its adhesion to the circuit board 110. Furthermore, with the reinforcing film 150 in place, the conductive tape 140 and the reinforcing film 150 can be pre-punched into uneven shapes to adapt to the uneven surfaces of the electronic components 120, ensuring the conductive tape 140 is close to the insulating layer and reducing its space occupation.
[0053] The reinforcing film 150 can be a PA film (polyamide film) or a PP film (polypropylene film), etc. Both PA and PP films have a certain degree of toughness and are inexpensive, which helps to reduce the manufacturing cost of electronic device 100.
[0054] In some implementations, the reinforcing membrane 150 is a PP membrane.
[0055] The reinforcing film 150 can be adhered to the outer surface of the conductive tape 140, or it can be adhered to the outer surface of the conductive tape 140, and this application does not limit it.
[0056] In some embodiments, the reinforcing film 150 is adhered to the inner surface of the conductive tape 140.
[0057] The inner surface of the conductive tape 140 is provided with an adhesive layer, and the reinforcing film 150 can be directly adhered to the inner surface without the need for an additional adhesive layer. In addition, with this design, the reinforcing film 150 is located between the conductive tape 140 and the insulating layer 130, which can effectively isolate the conductive tape 140 and the insulating layer 130, and prevent the adhesive layer on the inner surface of the conductive tape 140 from adhering to the insulating layer 130. This prevents the insulating layer 130 or electronic components 120 from falling off or being damaged due to tearing during the disassembly of the conductive tape 140.
[0058] In some embodiments, the electronic device 100 further includes a shielding layer 160 disposed on the surface of the conductive tape 140.
[0059] By providing a shielding layer 160 on the surface of the conductive tape 140, the electromagnetic shielding effect of the conductive tape 140 can be improved. The material of the shielding layer 160 can be nickel, silver, copper, etc., and the shielding layer 160 can be prepared on the surface of the conductive tape 140 by means of spraying, electroplating, etc., which is not limited in this application.
[0060] The shielding layer 160 can be disposed on the outer surface or the inner surface of the conductive tape 140, and is not limited thereto in this application. In some embodiments, the shielding layer 160 is disposed on the outer surface of the conductive tape 140.
[0061] To ensure the bonding effect between the conductive tape 140 and the metallized tape 111, in some embodiments, the width of the metallized tape 111 is 1.4mm to 1.6mm.
[0062] In some embodiments, the insulating layer 130 is an insulating varnish sprayed onto the surface of the electronic component 120.
[0063] The insulating varnish can be made of epoxy resin, polyester resin, polyimide resin, acrylic resin, etc. The insulating varnish is sprayed onto the surface of the electronic component 120. After the insulating varnish dries and solidifies, an insulating layer 130 is formed on the surface of the electronic component 120, which isolates the electronic component 120 from the conductive tape 140.
[0064] The following describes the fabrication process of electronic device 100:
[0065] First, an insulating varnish is sprayed onto the surface of the electronic component 120, and after the insulating varnish dries and cures, an insulating layer 130 is formed.
[0066] Next, cut a section of conductive tape 140 and trim the edges of the conductive tape 140;
[0067] Next, cut a piece of PP film and attach the PP film to the adhesive side of the conductive tape 140, making sure that the PP film does not cover the edge area of the conductive tape 140;
[0068] Next, nickel is sprayed onto the surface of the conductive tape 140 that does not contain adhesive to form a shielding layer 160.
[0069] Next, after the shielding layer 160 has solidified, conductive tape 140 is placed over the insulating layer 130. The edge of the conductive tape 140 is bonded to the upper surface of the circuit board 110. Note that at least a portion of the conductive tape 140 must be bonded to the metallized strip 111 of the circuit board 110 to make conductive contact with the metallized strip 111.
[0070] Based on the same inventive concept, this application also provides an electric drive system, including a motor and the above-mentioned electronic device 100, wherein the electronic device 100 is electrically connected to the motor.
[0071] It should be noted that in these embodiments, the electronic device 100 is a motor controller. The structure of the motor controller and its electrical connection with the motor are known to those skilled in the art and will not be described in detail here. Since the electric drive system includes the aforementioned electronic device 100, it naturally possesses all the beneficial effects of the electronic device 100, which will not be described in detail here.
[0072] Based on the same inventive concept, embodiments of this application also provide a vehicle, including the above-described electronic device 100 or the above-described electric drive system.
[0073] The electronic device 100 may be an on-board charger, DC-DC converter, motor controller, etc., for a vehicle, and is not limited thereto in this application. Since the vehicle includes the aforementioned electronic device 100 or the aforementioned electric drive system, it naturally possesses all the beneficial effects of the electronic device 100, which will not be elaborated here.
[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. An electronic device, characterized in that, include: The circuit board (110) has a metallized strip (111) on its surface for grounding; Electronic components (120) are mounted on the circuit board (110); An insulating layer (130) is disposed on the surface of the electronic component (120); A conductive tape (140) is disposed over the insulating layer (130), at least a portion of which is bonded to and in conductive contact with the metallized strip (111).
2. The electronic device according to claim 1, characterized in that, The metallized strip (111) is annular, the electronic component (120) is disposed inside the metallized strip (111), and the edge of the conductive tape (140) is bonded to the metallized strip (111) around its perimeter.
3. The electronic device according to claim 1, characterized in that, The metallized strip (111) is non-circular, and the edge of the conductive tape (140) is bonded to the metallized strip (111) and the circuit board (110).
4. The electronic device according to any one of claims 1-3, characterized in that, The electronic device (100) also includes a reinforcing film (150) bonded to the surface of the conductive tape (140).
5. The electronic device according to claim 4, characterized in that, The reinforcing membrane (150) is a PA membrane or a PP membrane.
6. The electronic device according to claim 4, characterized in that, The reinforcing film (150) is bonded to the inner surface of the conductive tape (140).
7. The electronic device according to any one of claims 1-3, characterized in that, The electronic device (100) also includes a shielding layer (160) disposed on the surface of the conductive tape (140).
8. The electronic device according to any one of claims 1-3, characterized in that, The insulating layer (130) is an insulating varnish sprayed on the surface of the electronic component (120).
9. An electric drive system, characterized in that, It includes a motor and an electronic device (100) according to any one of claims 1-8, the electronic device (100) being electrically connected to the motor.
10. A vehicle, characterized in that, Includes the electronic device (100) according to any one of claims 1-8 or the electric drive system according to claim 9.