A PCB board for storage

Abstract

This utility model discloses a PCB board for storage devices, belonging to the field of electronic component packaging technology. It includes a packaging layer that protects the storage device disposed on the storage substrate. In conjunction with an array layer disposed on the surface of the packaging layer, when the packaging layer expands and contracts due to temperature changes, the gaps formed by several raised structures provide expansion and contraction space, reducing the likelihood of the adhesive layer cracking or peeling due to expansion and contraction. This maintains the device's function of fixing components and providing sealing protection, eliminating the risk of video data loss during transfer. Since the array layer is composed of several raised structures and disposed on the surface of the packaging layer, the heat dissipation grid formed by the combination of several gaps effectively increases the contact area between the packaging layer surface and the air. Furthermore, when airflow passes through the gaps forming the heat dissipation grid, it contacts the surface of the raised structures, further improving heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of electronic component packaging technology, and more specifically, it relates to a PCB board for storage devices. Background Technology

[0002] From the high-frequency wiring of DDR5 to the multi-chip integration of SSDs, from the miniaturization of consumer-grade SSDs to the resistance to environmental interference in industrial-grade SSDs, PCB boards are required. Their technical details (materials, wiring, heat dissipation, etc.) directly determine the upper limit of storage capacity, speed performance and reliability level. Currently, commonly used storage PCB board technologies include: computer field, mobile smart devices, industrial control and Internet, and automotive electronics.

[0003] As the carrier of the core components of the memory chip, the PCB board of the memory is prone to problems due to environmental factors during use. These problems directly affect the performance, stability and even lifespan of the memory. Currently, the storage devices used in dashcams are mainly used for temporary storage of video data, playing a crucial role in the data transfer process to SD cards. Existing technology often uses epoxy adhesives for fixation to provide protection. However, since dashcams are mostly used outdoors, they are constantly exposed to sunlight and temperature changes over long periods of time. Under direct sunlight, the thermal oxidation reaction of the epoxy adhesive is accelerated, causing the adhesive layer to crack and peel off, contaminating the seat covers. Furthermore, the constant thermal expansion and contraction accelerates cracking, rendering the adhesive ineffective in fixing components and providing sealing protection. This results in a risk of video data loss during the transfer process. Utility Model Content

[0004] To achieve the above objectives, the present invention provides the following technical solution: A PCB board for a storage device includes a PCB motherboard 1, a storage substrate 2 with a storage device 6, a protective component disposed on the storage substrate 2 for protecting the storage device 6, and an annular positioning component for fixing the protective component. The protective component includes an encapsulation layer 3 and an array layer 4. The encapsulation layer 3 covers the upper surface of the storage substrate 2. The array layer 4 includes a plurality of protrusions formed on the surface of the encapsulation layer 3. A plurality of gaps are formed between the plurality of protrusions to provide expansion and contraction space, and the plurality of protrusions are uniformly disposed at the top of the encapsulation layer 3.

[0005] Furthermore, the annular limiting component includes an annular flange 5 constructed on the encapsulation layer 3 to improve connection stability. The bottom end of the annular flange 5 is provided with a plurality of limiting slots 501 in an annular array, and the bottom ends of the inner and outer edges of the annular flange 5 are both constructed with a plurality of arc-shaped locking teeth in an annular array.

[0006] Furthermore, the top of the storage substrate 2 is provided with a mounting slot 201 adapted to the annular flange 5, centered on the storage 6. The bottom of the mounting slot 201 is provided with a plurality of limiting protrusions 202 adapted to the limiting slot 501 in a circular array. The bottom of the inner and outer edges of the mounting slot 201 are provided with a plurality of locking grooves adapted to the corresponding arc-shaped locking teeth in a circular array.

[0007] Furthermore, the bottom center of the encapsulation layer 3 is formed with a mounting groove 301 due to the shape of the storage device 6, and the mounting groove 301, together with the encapsulation layer 3 and the storage device substrate 2, forms a wrapping structure for protecting the storage device 6.

[0008] Furthermore, the protruding structure is one or more combinations of a semi-circular body, a semi-elliptical body, a frustum, a triangular pyramid, a square pyramid, and a cone, and several of the gaps are combined to form a heat dissipation grid to assist in heat dissipation.

[0009] Furthermore, the encapsulation layer 3 forms a meniscus during curing due to the influence of fluid surface tension, which helps prevent cracks caused by thermal expansion and contraction.

[0010] In summary, this utility model has the following beneficial effects: 1. This utility model protects the memory disposed on the memory substrate through an encapsulation layer. In conjunction with the array layer disposed on the surface of the encapsulation layer, when the encapsulation layer expands and contracts with temperature changes, the gaps formed by several protrusions can provide expansion and contraction space during the thermal expansion and contraction of the encapsulation layer. This reduces the possibility of the encapsulation layer cracking and falling off due to expansion and contraction, thereby reducing pollution inside the vehicle and maintaining its function of fixing components and sealing protection, eliminating the risk of loss of video data during the transfer process. 2. This utility model also achieves heat dissipation through the array layer disposed on the surface of the encapsulation layer. Since the array layer is composed of several protruding structures and is disposed on the surface of the encapsulation layer, the heat dissipation grid formed by the combination of several gaps can effectively increase the contact area between the surface of the encapsulation layer and the air, thereby improving the heat dissipation efficiency. When the airflow passes through the gaps that make up the heat dissipation grid, it will contact the surface of the protruding structure, further improving the heat dissipation efficiency. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the protective component and the annular flange structure of this utility model; Figure 3 This is a schematic diagram of the storage device, storage substrate, and internal mounting slot structure of the present invention. Figure 4 This is a schematic cross-sectional view of the storage substrate, protective assembly, and annular positioning assembly in this utility model. Figure 5 This is a schematic diagram of the cross-sectional structure of the protective component and the annular flange in this utility model; Figure 6 This is a schematic diagram of the cross-sectional structure of the storage substrate in this utility model.

[0013] In the picture: 1. PCB motherboard; 2. Memory substrate; 201. Mounting slot; 202. Limiting key; 3. Encapsulation layer; 301. Mounting groove; 4. Array layer; 5. Annular flange; 501. Limiting slot; 6. Memory. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0015] Example: The following is in conjunction with the appendix Figure 1-6 The present invention will be described in further detail below.

[0016] Please see Figure 1-6 This utility model provides a technical solution: a PCB board for a storage device, such as... Figure 1-6 As shown, it includes a PCB motherboard 1, a storage substrate 2 with a storage 6, and a protective component disposed on the storage substrate 2 for protecting the storage 6. In this embodiment: PCB motherboard 1 adopts FR-4 epoxy glass cloth substrate and is designed with solder pads adapted to memory substrate 2 to ensure stable electrical connection with the pins of memory substrate 2. Memory 6 adopts NAND flash memory chip with several pins and is soldered to the preset solder pad in the center of memory substrate 2. The solder pad is connected to the internal wiring of memory substrate 2 to realize signal transmission with PCB motherboard. Memory substrate 2 with memory 6 is selected as ceramic substrate (such as "96% alumina ceramic substrate"). Protective components and annular positioning components for fixing the protective components are set on memory substrate 2 to protect memory 6. The protective components include an encapsulation layer 3 and an array layer 4. The encapsulation layer 3 is made of toughened modified epoxy resin and covers the upper surface of the memory substrate 2. The array layer 4 includes several protrusions constructed on the surface of the encapsulation layer 3. The protrusions are formed by compression molding and are pressed by a special mold before the encapsulation layer 3 is cured (in the gel state) to ensure dimensional consistency. Several gaps are formed between the protrusions to provide space for expansion and contraction, and the protrusions are evenly arranged on the top of the encapsulation layer 3.

[0017] like Figure 1-6 As shown, a ring-shaped positioning component is used to fix the protective component; In this embodiment: the annular limiting component includes an annular flange 5 integrally formed with the encapsulation layer 3 to improve connection stability (using the same material). The bottom end of the annular flange 5 has several limiting slots 501 arranged in a ring array, and the bottom ends of both the inner and outer edges of the annular flange 5 have several arc-shaped locking teeth arranged in a ring array. The top of the memory substrate 2 has a mounting slot 201 centered on the memory 6, adapted to the annular flange 5. The bottom end of the mounting slot 201 has several limiting protrusions 202 arranged in a ring array to correspond to the limiting slots 501. The bottom ends of both the inner and outer edges of the mounting slot 201 have several locking grooves arranged in a ring array to correspond to the arc-shaped locking teeth.

[0018] like Figure 1-6 As shown, a mounting groove 301 is formed at the bottom center of the encapsulation layer 3, and a meniscus is formed along the upper edge of the encapsulation layer 3; In this embodiment, the bottom center of the encapsulation layer 3 is formed with a mounting groove 301 due to the shape of the storage device 6, and the mounting groove 301, together with the encapsulation layer 3 and the storage device substrate 2, forms a wrapping structure for protecting the storage device 6. When the upper edge of the encapsulation layer 3 is cured, it is affected by the surface tension of the fluid and forms a meniscus based on the stress dispersion effect, which helps to prevent cracks caused by thermal expansion and contraction.

[0019] like Figure 1-6 As shown, a protruding structure is constructed on the surface of the encapsulation layer 3; In this embodiment, the protrusion structure is one or more combinations of a semi-circular body, a semi-elliptical body, a frustum, a triangular pyramid, a square pyramid, and a cone. When the power consumption of the memory is high, the array layer can use a frustum-shaped protrusion to further increase the heat dissipation area, or a semi-circular protrusion can be used. The arc-shaped surface design of the semi-circular body can disperse the stress generated by thermal expansion and contraction through curvature, and several gaps can be combined to form an array-type heat dissipation grid that assists in heat dissipation.

[0020] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example that is included in at least one embodiment or example of the present invention.

[0021] In this specification, the illustrative expressions of the terms used above do not necessarily refer to the same embodiments or examples.

[0022] Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0023] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A PCB board for a storage device, characterized in that, include: PCB motherboard (1), storage substrate (2) with storage (6), protective component provided on storage substrate (2) for protecting storage (6) and annular positioning component for fixing protective component; The protective component includes an encapsulation layer (3) and an array layer (4). The encapsulation layer (3) covers the upper surface of the storage substrate (2). The array layer (4) includes a plurality of protrusions constructed on the surface of the encapsulation layer (3). A plurality of gaps providing expansion and contraction space are formed between the plurality of protrusions. The plurality of protrusions are uniformly disposed on the top of the encapsulation layer (3).

2. The PCB board for a storage device according to claim 1, characterized in that, The annular limiting component includes an annular flange (5) constructed on the encapsulation layer (3) to improve connection stability. The bottom end of the annular flange (5) is provided with a number of limiting slots (501) in an annular array. The bottom ends of the inner and outer edges of the annular flange (5) are both constructed with a number of arc-shaped locking teeth in an annular array.

3. A PCB board for a storage device according to claim 2, characterized in that, The top of the storage substrate (2) is provided with a mounting slot (201) adapted to the annular flange (5) centered on the storage (6), and the bottom of the mounting slot (201) is provided with a number of limiting protrusions (202) adapted to the limiting slot (501) in an annular array. The bottom of the inner and outer edges of the mounting slot (201) are provided with a number of locking grooves adapted to the corresponding arc-shaped locking teeth in an annular array.

4. A PCB board for a storage device according to claim 1, characterized in that, The bottom center of the encapsulation layer (3) is formed with a mounting groove (301) due to the shape of the storage device (6), and the mounting groove (301) together with the encapsulation layer (3) and the storage device substrate (2) form a wrapping structure for protecting the storage device (6).

5. A PCB board for a storage device according to claim 1, characterized in that, The protruding structure is one or a combination of two of the following: hemisphere and frustum. Several of the gaps are combined to form a heat dissipation grid that assists in heat dissipation.

6. A PCB board for a storage device according to claim 1, characterized in that, When the encapsulation layer (3) is cured, it forms a meniscus under the influence of fluid surface tension to prevent cracks caused by thermal expansion and contraction.

Images