A circuit board assembly, a brake control system and a vehicle

CN224626877UActive Publication Date: 2026-08-11CONTINENTAL BRAKE SYSTEMS (SHANGHAI) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-18
Publication Date
2026-08-11

AI Technical Summary

Technical Problem

[0004]本实用新型的目的在于解决铝电解电容竖直放置导致的其对应的电路板组件的整体高度较高,安装时需要占用大量空间,安装自由度低的问题

Benefits of technology

[0004]本实用新型的目的在于解决铝电解电容竖直放置导致的其对应的电路板组件的整体高度较高,安装时需要占用大量空间,安装自由度低的问题。本实用新型提供了一种电路板组件、刹车控制系统及汽车,将铝电解电容水平安装于基板,从而降低电路板的整体高度,进而与电路板高度适配的壳体高度也可随之降低,以减少整个电路板组件所需的安装空间,提高其安装自由度。

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Abstract

This utility model discloses a circuit board assembly, comprising: a housing including an inner cavity; a circuit board fixed within the inner cavity; the circuit board including: a substrate; an aluminum electrolytic capacitor connected to the substrate; the aluminum electrolytic capacitor extending along a first direction, the first direction being perpendicular to the height direction of the substrate. This utility model horizontally mounts the aluminum electrolytic capacitor to the substrate, thereby reducing the housing height, reducing the installation space required for the entire circuit board assembly, and increasing its installation flexibility. This utility model also discloses a brake control system and an automobile.
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Description

Technical Field

[0001] This utility model relates to the field of power electronics technology, and in particular to a circuit board assembly, a brake control system, and an automobile. Background Technology

[0002] Aluminum electrolytic capacitors are fundamental electronic components widely used in various electronic circuits, undertaking critical tasks such as filtering and energy storage. Their mounting and placement relative to the circuit board substrate significantly impacts the overall thickness of the entire circuit board assembly. When aluminum electrolytic capacitors are placed vertically (i.e., perpendicular to the substrate), a noticeable problem arises: the overall thickness of the circuit board assembly cannot be reduced due to the capacitor's length.

[0003] Aluminum electrolytic capacitors are relatively large, typically exhibiting a cylindrical shape, with their length varying considerably depending on parameters such as capacitance and voltage rating. When placed vertically, the length of the aluminum electrolytic capacitor aligns with the height of the circuit board assembly. Due to its length, it occupies a significant amount of vertical space, making it difficult to further reduce the height of the circuit board assembly and resulting in limited installation flexibility. Utility Model Content

[0004] The purpose of this invention is to solve the problem that vertically placed aluminum electrolytic capacitors result in a high overall height of the corresponding circuit board assembly, requiring a large amount of space and limiting installation flexibility. This invention provides a circuit board assembly, a brake control system, and an automobile, in which the aluminum electrolytic capacitor is horizontally mounted on a substrate, thereby reducing the overall height of the circuit board. Consequently, the height of the housing, which is adapted to the height of the circuit board, can also be reduced, thus decreasing the installation space required for the entire circuit board assembly and increasing its installation flexibility.

[0005] To address the aforementioned technical problems, this utility model discloses a circuit board assembly, comprising: a housing including an inner cavity; a circuit board fixed within the inner cavity; the circuit board comprising: a substrate; an aluminum electrolytic capacitor connected to the substrate; the aluminum electrolytic capacitor extending along a first direction, the first direction being perpendicular to the height direction of the substrate.

[0006] Using the above technical solution, the aluminum electrolytic capacitor extends along a first direction, which is perpendicular to the height direction of the substrate. That is, the aluminum electrolytic capacitor is horizontally mounted on the substrate, and its extension direction is parallel to the substrate. Therefore, the height of the circuit board in the vertical direction depends only on the length of the aluminum electrolytic capacitor perpendicular to its extension direction. For example, for a cylindrical aluminum electrolytic capacitor, the first direction is its axial direction, and the height of the circuit board in the vertical direction depends only on its diameter. Thus, compared to vertical placement, the space occupied by the circuit board in the vertical direction can be significantly reduced. This mounting method significantly reduces the overall height of the circuit board, thereby reducing the height of the corresponding housing, significantly reducing the space requirements for the circuit board assembly, and increasing its installation flexibility.

[0007] According to another specific embodiment of the present invention, the housing includes: an upper shell including a top wall; a lower shell including a receiving cavity, wherein the substrate of the circuit board is fixed to the receiving cavity; the upper shell and the lower shell are connected, and the receiving cavity and the top wall of the upper shell together define the inner cavity.

[0008] With the above technical solution, the circuit board is located inside the cavity, thereby providing physical support and protection for the circuit board through the shell, effectively resisting external threats such as collisions, dust and moisture.

[0009] According to another specific embodiment of the present invention, the receiving cavity is provided with a limiting groove extending along the first direction; the substrate is provided with a through hole extending along its height direction; the top wall of the upper shell is provided with a mounting groove extending along the first direction; wherein, the limiting groove, the through hole and the mounting groove correspond to and are connected along the height direction of the substrate; a part of the aluminum electrolytic capacitor is located in the limiting groove, and the other part passes through the through hole and extends into the mounting groove.

[0010] Using the above technical solution, the limiting groove, the connecting hole, and the mounting groove together form a receiving space to accommodate the aluminum electrolytic capacitor, thereby confining the aluminum electrolytic capacitor within the receiving space, significantly improving its resistance to mechanical vibration and impact, reducing the risk of solder joint cracking, and avoiding resonance damage.

[0011] According to another specific embodiment of the present invention, the wall of the connecting hole and the outer surface of the aluminum electrolytic capacitor are fixedly connected by adhesive.

[0012] According to another specific embodiment of the present invention, any one or both of the groove walls of the limiting groove and the groove walls of the mounting groove are fixedly connected to the outer surface of the aluminum electrolytic capacitor by adhesive.

[0013] By adopting the above technical solution, when the walls of the limiting groove and the mounting groove are both fixedly connected to the outer surface of the aluminum electrolytic capacitor with adhesive, the different areas of the aluminum electrolytic capacitor are respectively bonded to the limiting groove, the connecting hole and the mounting groove by adhesive, thereby significantly improving mechanical stability, enhancing the shock resistance of the aluminum electrolytic capacitor, reducing the risk of solder joint cracking and avoiding resonance damage.

[0014] According to another specific embodiment of the present invention, the aluminum electrolytic capacitor is cylindrical, and the first direction is the axial direction of the cylindrical aluminum electrolytic capacitor.

[0015] According to another specific embodiment of the present invention, the substrate is connected to the lower shell screw.

[0016] By adopting the above technical solution, the circuit board substrate is connected to the lower shell screw, which can significantly improve the overall structural stability and reliability and prevent the circuit board from shifting or deforming under vibration or impact.

[0017] According to another specific embodiment of the present invention, the upper shell and the lower shell are connected by screws.

[0018] The above technical solution uses screws to connect the upper and lower shells, ensuring the reliability of the connection between the upper and lower shells, while also ensuring that the shell provides stable support for the circuit board and effectively suppresses vibration transmission.

[0019] An embodiment of this utility model also discloses a brake control system based on the above-described circuit board assembly, comprising: a sensor system; and the above-described circuit board assembly, wherein the circuit board is electrically connected to the sensor system.

[0020] An embodiment of this utility model also discloses an automobile based on the above-described braking control system, comprising: a chassis; and the above-described braking control system, wherein the circuit board assembly is mounted on the chassis. Attached Figure Description

[0021] Figure 1 A schematic diagram of a circuit board assembly according to one embodiment is shown;

[0022] Figure 2 An exploded view of the circuit board assembly according to an embodiment of the present invention is shown;

[0023] Figure 3 This is a perspective view showing the connection between the lower shell and the circuit board in an embodiment of the present invention. Detailed Implementation

[0024] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Although the description of this utility model will be presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to this embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived based on the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description. It should be noted that, without conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0025] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0026] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0027] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0028] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0030] Figure 1A schematic diagram of a circuit board assembly 10 in one embodiment is shown. In this embodiment, the circuit board assembly 10 includes a housing 20 and a circuit board 30. The housing 20 includes an upper housing (not shown) and a lower housing 21, which are connected to form an inner cavity. The circuit board 30 is located inside the inner cavity, thereby providing physical support and protection for the circuit board 30 through the housing 20, effectively resisting external threats such as impacts, dust, and moisture.

[0031] In this embodiment, the circuit board 30 includes a substrate 31 and an aluminum electrolytic capacitor 32. The aluminum electrolytic capacitor 32 is connected to the substrate 31 via a lead frame. The aluminum electrolytic capacitor 32 is cylindrical and is perpendicularly connected to the substrate 31. That is, the axial direction Z of the cylindrical aluminum electrolytic capacitor 32 is perpendicular to the plane of the substrate 31; in other words, the aluminum electrolytic capacitor 32 is placed vertically.

[0032] However, this method of vertically placing the aluminum electrolytic capacitor 32 has obvious drawbacks. Since the aluminum electrolytic capacitor 32 itself has a certain height, when it is vertically fixed to the substrate 31, it directly increases the vertical height of the entire circuit board 30. Since the circuit board 30 needs to be installed inside the housing 20, the increased height of the circuit board 30 necessitates a corresponding increase in the height of the housing 20 to avoid interference between the aluminum electrolytic capacitor 32 and the housing 20, and to accommodate the vertically placed aluminum electrolytic capacitor 32. This undoubtedly makes the entire circuit board assembly 10 occupy more installation space, and its installation flexibility is also lower.

[0033] Based on this, embodiments of this application provide another type of circuit board assembly 100, such as... Figure 2 As shown, in this embodiment, the aluminum electrolytic capacitor 320 is horizontally mounted on the substrate 310. That is, the extension direction of the aluminum electrolytic capacitor 320 is parallel to the substrate 310, thereby reducing the overall height of the circuit board 300 and the height of the housing 200 adapted to the circuit board 300, reducing the installation space required for the entire circuit board assembly 100 and increasing its installation freedom.

[0034] Specifically, in this embodiment, as Figure 2 As shown, the circuit board assembly 100 includes a housing 200 and a circuit board 300. The housing 200 includes an upper housing 210 and a lower housing 220, with the lower housing 220 including a receiving cavity 221. The upper housing 210 and the lower housing 220 are connected, and the receiving cavity 221 and the top wall of the upper housing 210 together define the inner cavity 201. Exemplarily, the upper housing 210 is generally plate-shaped, with a plurality of screw holes 202 spaced apart on its outer periphery. Correspondingly, the outer periphery of the lower housing 220 also has a plurality of screw holes 203 spaced apart. The screw holes 203 and screw holes 202 correspond one-to-one and are connected by screws 204, thereby achieving a fixed connection between the upper housing 210 and the lower housing 220.

[0035] Those skilled in the art will understand that in other embodiments, the upper shell 210 and the lower shell 220 may be connected in other ways, such as by snap-fit.

[0036] In this embodiment, the circuit board 300 is an irregular heptagon, and the upper shell 210 and lower shell 220 are adapted to the shape of the circuit board 300, that is, the upper shell 210 and lower shell 220 are also irregular heptagons. However, those skilled in the art will understand that in other embodiments, the circuit board 300, the upper shell 210 and the lower shell 220 can also be designed as other shapes as needed, such as rectangles, other polygons, etc.

[0037] like Figure 2 and Figure 3 As shown, the circuit board 300 is fixed within the inner cavity 201. Specifically, the circuit board 300 includes a substrate 310 and an aluminum electrolytic capacitor 320. The substrate 310 is fixed within the receiving cavity 221 and is screwed to the lower shell 220. Specifically, the substrate 310 has multiple screw holes 311, and the receiving cavity 221 of the lower shell 220 has multiple screw holes 222. The multiple screw holes 222 correspond one-to-one with the multiple screw holes 311 and are connected by screws 301. This application does not limit the connection method between the substrate 310 and the lower shell 220; for example, the substrate 310 and the lower shell 220 can also be connected by snap-fit ​​or other methods.

[0038] The aforementioned aluminum electrolytic capacitor 320 is connected to the substrate 310; the aluminum electrolytic capacitor 320 extends along a first direction X, which is perpendicular to the height direction Y of the substrate 310. That is, the aluminum electrolytic capacitor 320 is horizontally mounted on the substrate 310, and the extending direction of the aluminum electrolytic capacitor 320 is parallel to the plane of the substrate 310.

[0039] It is understood that the height direction Y of the substrate 310 corresponds to the height direction of the housing 200 and the entire circuit board assembly 100.

[0040] For example, the aluminum electrolytic capacitor 320 is cylindrical, and the first direction X is the axial direction of the cylindrical aluminum electrolytic capacitor 320. Its axial length is greater than its diameter.

[0041] It is understandable that since the circuit board 300 is fixed inside the cavity 201 of the housing 200, which is used to provide physical support and protection for the circuit board 300, the height of the housing 200 is limited by the maximum height of the circuit board 300 located in its cavity 201. When the tallest electronic component on the circuit board 300 is the aluminum electrolytic capacitor 320, the height of the aluminum electrolytic capacitor 320 in the vertical direction determines the height of the housing 200, which can also be said to be the height of the entire circuit board assembly 100.

[0042] Therefore, in this embodiment, the aluminum electrolytic capacitor 320 is horizontally mounted on the substrate 310, with its extension direction parallel to the substrate 310. Thus, the height (or thickness) of the circuit board 300 in the vertical direction depends only on the diameter of the aluminum electrolytic capacitor 320. Compared to vertical placement, the circuit board 300 occupies significantly less space in the vertical direction. This mounting method drastically reduces the overall height of the circuit board 300, thereby correspondingly reducing the height of the adapting housing 200, significantly reducing the space requirements of the circuit board assembly 100, and increasing its installation flexibility.

[0043] In this embodiment, a cylindrical aluminum electrolytic capacitor 320 is used as an example for illustration. However, those skilled in the art will understand that the aluminum electrolytic capacitor 320 can also be other shapes, such as a cuboid, and in the case of a cuboid aluminum electrolytic capacitor 320, the first direction X mentioned above is its length direction.

[0044] refer to Figure 2 The lower shell 220 has a limiting groove 223 extending along the first direction X in the receiving cavity 221. The limiting groove 223 is used to receive the bottom part of the aluminum electrolytic capacitor 320.

[0045] In this embodiment, the lower shell 220 includes a U-shaped portion 224, which protrudes from the bottom wall of the receiving cavity 221, thereby forming a limiting groove 223 together with the U-shaped portion 224 and the bottom wall of the receiving cavity 221. The bottom portion of the horizontally placed aluminum electrolytic capacitor 320 is located within the limiting groove 223.

[0046] For example, this embodiment includes two cylindrical aluminum electrolytic capacitors 320, which are electrically connected. Correspondingly, the lower shell 220 has two U-shaped portions 224, forming two limiting grooves 223, which correspond one-to-one with the two aluminum electrolytic capacitors 320. However, those skilled in the art will understand that the number of aluminum electrolytic capacitors 320 can also be set to other numbers according to actual needs, such as one, three, etc. The number of U-shaped portions 224 in the lower shell 220 can also correspond one-to-one with the number of aluminum electrolytic capacitors 320.

[0047] Corresponding to the limiting groove 223 on the lower shell 220, the substrate 310 is provided with a through hole 312 extending along its height direction Y. For example, the through hole 312 is generally rectangular, and its cross-sectional area is larger than the cross-sectional area of ​​the two aluminum electrolytic capacitors 320 in the height direction Y. Thus, the substrate 310 of the circuit board 300 is fixedly connected to the lower shell 220, and the top part of the aluminum electrolytic capacitor 320 located in the limiting groove 223 of the lower shell 220 is exposed through the through hole 312. At the same time, the pins of the aluminum electrolytic capacitor 320 are also electrically connected to the substrate 310.

[0048] Furthermore, corresponding to the through hole 312 on the substrate 310, the top wall of the upper shell 210 is provided with a mounting groove 211 extending along the first direction X. Exemplarily, the mounting groove 211 is recessed within the top wall of the upper shell 210. In this embodiment, a mounting groove 211 is provided, which can simultaneously accommodate two aluminum electrolytic capacitors 320. However, it is understood that in other embodiments, two separate mounting grooves 211 can also be provided separately, so that they correspond one-to-one with the two limiting grooves 223 described above.

[0049] like Figure 2 As shown, the aforementioned limiting groove 223, connecting hole 312 and mounting groove 211 correspond to and are connected along the height direction Y of the substrate 310; the bottom part of the aluminum electrolytic capacitor 320 is located in the limiting groove 223, and the top part passes through the connecting hole 312 and extends into the mounting groove 211.

[0050] That is, the bottom portion of the aluminum electrolytic capacitor 320 is located within the limiting groove 223, the top portion is located within the mounting groove 211, and the middle portion between the bottom and top portions is located within the connecting hole 312. Thus, the limiting groove 223, the connecting hole 312, and the mounting groove 211 together form a receiving space to accommodate the aluminum electrolytic capacitor 320, thereby confining the aluminum electrolytic capacitor 320 within this space. This significantly improves its resistance to mechanical vibration and impact, reduces the risk of solder joint cracking, and avoids resonance damage.

[0051] Furthermore, in this embodiment, the wall of the connecting hole 312 and the outer surface of the aluminum electrolytic capacitor 320 are fixedly connected by adhesive. Simultaneously, the walls of the limiting groove 223 and the mounting groove 211 are also fixedly connected to the outer surface of the aluminum electrolytic capacitor 320 by adhesive.

[0052] Therefore, while mechanically limiting the aluminum electrolytic capacitor 320 through the limiting groove 223, the connecting hole 312, and the mounting groove 211, different areas of the aluminum electrolytic capacitor 320 are also bonded to the limiting groove 223, the connecting hole 312, and the mounting groove 211 respectively using adhesive. Specifically, the bottom part of the aluminum electrolytic capacitor 320 is bonded to the limiting groove 223 with adhesive, the middle part is bonded to the connecting hole 312 with adhesive, and the top part is bonded to the mounting groove 211 with adhesive. This significantly improves mechanical stability, enhances the shock resistance of the aluminum electrolytic capacitor 320, reduces the risk of solder joint cracking, and avoids resonance damage.

[0053] Those skilled in the art will understand that, in other embodiments, in addition to the connection of the hole wall of the connecting hole 312 and the outer surface of the aluminum electrolytic capacitor 320 by adhesive fixation, either the limiting groove 223 or the mounting groove 211 can be selected to be connected to the aluminum electrolytic capacitor 320 by adhesive fixation.

[0054] This application also provides a brake control system and a vehicle based on the aforementioned circuit board assembly 100. The brake control system includes the circuit board assembly 100 and a sensor system, with the circuit board and sensor system electrically connected. The circuit board assembly 100 is mounted on the chassis of the vehicle to perform brake control during vehicle operation.

[0055] Although the present invention has been illustrated and described with reference to certain preferred embodiments, those skilled in the art should understand that the above description is a further detailed explanation of the present invention in conjunction with specific embodiments, and should not be construed as limiting the specific implementation of the present invention to these descriptions. Those skilled in the art can make various changes in form and detail, including some simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. A circuit board assembly, characterized in that, include: The housing, including the internal cavity; A circuit board is fixed within the inner cavity; the circuit board includes: substrate; An aluminum electrolytic capacitor is connected to the substrate; the aluminum electrolytic capacitor extends along a first direction, which is perpendicular to the height direction of the substrate.

2. The circuit board assembly as claimed in claim 1, characterized in that, The housing includes: The upper shell, including the top wall; The lower shell includes a receiving cavity, and the substrate of the circuit board is fixed to the receiving cavity; the upper shell is connected to the lower shell, and the receiving cavity and the top wall of the upper shell together define the inner cavity.

3. The circuit board assembly as described in claim 2, characterized in that, The cavity is provided with a limiting groove extending along the first direction; The substrate is provided with a through hole extending through its height direction; The top wall of the upper shell is provided with a mounting groove extending along the first direction; The limiting groove, the connecting hole, and the mounting groove are corresponding and connected along the height direction of the substrate; a part of the aluminum electrolytic capacitor is located in the limiting groove, and the other part passes through the connecting hole and extends into the mounting groove.

4. The circuit board assembly as claimed in claim 3, characterized in that, The wall of the connecting hole and the outer surface of the aluminum electrolytic capacitor are fixedly connected by adhesive.

5. The circuit board assembly as claimed in claim 4, characterized in that, One or both of the walls of the limiting groove and the mounting groove are fixedly connected to the outer surface of the aluminum electrolytic capacitor by adhesive.

6. The circuit board assembly as described in any one of claims 1 to 5, characterized in that, The aluminum electrolytic capacitor is cylindrical, and the first direction is the axial direction of the cylindrical aluminum electrolytic capacitor.

7. The circuit board assembly as claimed in claim 2, characterized in that, The substrate is connected to the lower shell screw.

8. The circuit board assembly as claimed in claim 7, characterized in that, The upper shell and the lower shell are connected by screws.

9. A brake control system, characterized in that, include: Sensor systems; as well as The circuit board assembly according to any one of claims 1 to 8, wherein the circuit board is electrically connected to the sensor system.

10. A car, characterized in that, include: Chassis; as well as The brake control system of claim 9, wherein the circuit board assembly is mounted on the chassis.