A connecting piece for SMT reflow soldering of components without soldering

Abstract

This utility model discloses a connector for SMT reflow soldering of components without soldering. It includes a connector body with a central insertion hole. Multiple radial cuts are uniformly punched along the insertion hole, forming multiple cut sidewalls. The roots of these sidewalls are bent at an angle towards the bottom surface of the connector body, causing them to tilt downwards. An elastic deformation gap is formed between adjacent cut sidewalls. The leads of DIP components are inserted into the insertion hole, with the leads opening the hole. The cut sidewalls grip the leads and sit within the DIP insertion holes on the PCB board. The bottom surface of the cut sidewalls of the connector body is in close contact with the periphery of the insertion holes on the PCB board, thus acting as SMT reflow soldering feet. This allows for simultaneous SMT reflow soldering with other SMD components on the PCB board, eliminating the need for separate wave soldering or manual soldering of DIP components and saving production costs.

Description

Technical Field

[0001] This disclosure relates to the field of electronic component and PCB board soldering technology, and more particularly to a connector for SMT reflow soldering of components without soldering. Background Technology

[0002] Electronic components on PCBs are mainly divided into two major types based on their packaging and mounting methods: SMD components (Surface Mount Devices) and DIP components (Dual In-line Packages). SMD components use surface mount packaging and are soldered onto the PCB surface using reflow soldering, requiring no through-holes. They are commonly found in integrated circuits, resistors, capacitors, and other components. DIP (Dual In-line Package) components are fixed by inserting leads into PCB holes and are soldered using wave soldering. Traditionally, DIP components require individual wave soldering or manual soldering. Setting up a wave soldering production line for a small number of DIP components on a PCB results in relatively high investment and maintenance costs. Therefore, designing an adapter plate connecting the DIP components' leads as a soldering point for SMT reflow soldering allows DIP components to be reflow soldered in one step with other SMD components, eliminating other soldering steps and saving costs. Utility Model Content

[0003] To overcome the shortcomings of the prior art, this disclosure proposes a connector for SMT reflow soldering of components that eliminates the need for soldering, enabling components that are not designed for SMT reflow soldering to be soldered via SMT reflow soldering.

[0004] According to one aspect of this disclosure, a connector for SMT reflow soldering of components without soldering is provided, comprising a connector body, wherein a insertion hole penetrating the top and bottom surfaces of the connector body is provided at the center of the connector body, and multiple radial cuts are uniformly punched along the hole edge of the insertion hole, the multiple cuts forming multiple cut sidewalls, the roots of the multiple cut sidewalls being bent at an angle towards the bottom surface of the connector body, such that the multiple cut sidewalls are inclined downwards, and an elastic deformation gap is formed between adjacent cut sidewalls, the pins of DIP components are inserted into the insertion hole, and the pins open the insertion hole, the cut sidewalls are located in the DIP insertion holes on the PCB board, and the bottom surface of the outer periphery of the cut sidewalls of the connector body is in close contact with the outer periphery of the DIP insertion holes on the PCB board.

[0005] Preferably, the multiple incisions are three or four incisions.

[0006] Furthermore, the root of the multiple cut sidewalls is bent toward the bottom surface of the connecting piece body by R0.2mm.

[0007] Furthermore, the diameter of the insertion hole after the root of the multiple cut sidewalls is bent towards the bottom surface of the connecting piece body is φ0.30±0.02mm.

[0008] Furthermore, the width of the elastic deformation gap formed between the adjacent cut sidewalls is 0.2±0.02mm.

[0009] Preferably, the connecting piece body is made of beryllium copper or chromium zirconium copper, and the thickness of the connecting piece body is 0.1 to 0.15 mm.

[0010] Furthermore, the overall height formed by the upper end of the multiple cut sidewalls to the bottom surface of the connecting piece body is 0.34±0.03mm.

[0011] Furthermore, the root of each of the multiple cuts is set as a circular arc with a diameter of φ0.3mm.

[0012] The beneficial effects of this utility model are as follows: The welding piece designed in this scheme has a plug hole on the connecting piece body for inserting pins. Multiple radial cuts are uniformly punched along the edge of the plug hole, forming multiple cut sidewalls. The roots of the multiple cut sidewalls bend towards the bottom surface of the connecting piece body to form downward sloping cut sidewalls. An elastic deformation gap is formed between adjacent cut sidewalls. It can be understood that when the pin of the DIP element is inserted into the plug hole on the connecting piece body, the cut sidewalls form a clamping piece for the pin. When the pin is inserted into the plug hole, it opens the plug hole, that is, the diameter of the pin is larger than the diameter of the plug hole formed after the roots of the multiple cut sidewalls bend towards the bottom surface of the connecting piece body. While opening the plug hole, the cut sidewalls deform and bite the pin, realizing a tight connection of the pin. The cut sidewall sits down inside the DIP socket on the PCB board. The bottom surface of the cut sidewall of the connector body is in close contact with the outer perimeter of the socket on the PCB board, thus serving as an SMT reflow soldering foot. It can be reflow soldered with other SMD components on the PCB board in one go, thereby eliminating the need for separate wave soldering or manual soldering of DIP components, which helps to save production costs. Attached Figure Description

[0013] The accompanying drawings, which are included in and form part of this specification, illustrate exemplary embodiments, features, and aspects of this disclosure together with the specification and serve to explain the principles of this disclosure.

[0014] Figure 1 This is a front view of the overall structure of the connecting piece body provided in an embodiment of the present utility model.

[0015] Figure 2 for Figure 1 AA section view.

[0016] Figure 3A bottom view of the overall structure of the connecting piece body provided in an embodiment of this utility model.

[0017] Figure 4 This diagram illustrates the connection between the connector body of this utility model and the pins of the DIP component, as well as its SMT reflow soldering with the PCB board.

[0018] Figure 5 The main view of the overall structure of the connecting piece body with three cuts provided in the embodiment of this utility model.

[0019] The following are explanations of the reference numerals in the attached figures: 1. Connecting piece body; 11. Insertion hole; 12. Cutout; 13. Cutout sidewall; 121. Arc opening; 2. DIP component; 21. Pin; 3. PCB board; 301. DIP socket. Detailed Implementation

[0020] The technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are also within the scope of protection of this disclosure.

[0021] Please refer to Figures 1 to 4 This is a specific embodiment of a connector for SMT reflow soldering of components without soldering, as disclosed in this technology. In this embodiment, the connector for SMT reflow soldering of components without soldering includes a connector body 1. A insertion hole 11 penetrating the top and bottom surfaces of the connector body 1 is provided at the center of the connector body 1. Four radial cuts 12 are uniformly punched along the edge of the insertion hole 11, forming four cut sidewalls 13. The roots of the four cut sidewalls 13 are bent at an angle towards the bottom surface of the connector body 1, causing the four cut sidewalls 13 to tilt downwards. An elastic deformation gap is formed between adjacent cut sidewalls 13. The pin 21 of component 2 is inserted into the insertion hole 11, and the pin 21 opens the insertion hole 11. The cut sidewall 13 clamps the pin 21 to achieve a tight connection between the pin 21 of DIP component 2 and the insertion hole 11. The cut sidewall 13 is located in the DIP insertion hole on the PCB board 3. The bottom surface of the cut sidewall 13 of the connecting piece body 1 is in close contact with the outer periphery of the DIP insertion hole on the PCB board 3. The connecting piece body 1 serves as the SMT reflow soldering foot, and can be reflow soldered with other SMD components on the PCB board 3 in one go, thereby eliminating the need for separate wave soldering or manual soldering of DIP component 2, which helps to save production costs.

[0022] Please refer to Figure 1 , Figure 2In this embodiment, the roots of the four cut sidewalls 13 are bent toward the bottom surface of the connecting piece body 1 by R0.2mm, providing deformation elasticity for the four cut sidewalls 13 and guiding the insertion of the pins 21. Specifically, after the roots of the four cut sidewalls 13 are bent toward the bottom surface of the connecting piece body 1 by R0.2mm, the diameter of the insertion hole 11 is φ0.30±0.02mm, and the width of the elastic deformation gap formed between the adjacent cut sidewalls 13 is 0.2±0.02mm.

[0023] Preferably, the connecting piece body 1 is made of beryllium copper or chromium zirconium copper, and the thickness of the connecting piece body 1 is 0.1 to 0.15 mm.

[0024] In this embodiment, the overall height formed by the upper ends of the four cut sidewalls 13 to the bottom surface of the connecting piece body 1 is 0.34±0.03mm. With this height design, the solder paste that can be reflowed can be firmly soldered to the connecting piece body 1 during the subsequent reflow soldering process.

[0025] Please refer to Figures 1 to 4 Each of the four cuts 12 has a φ0.3mm arc-shaped opening 121 at its root. By setting the arc-shaped opening 121, the stress concentration between the cut sidewall 13 at the root of the cut 12 and the connecting piece body 1 can be dispersed, thus avoiding cracking of the right-angle structure due to stress accumulation during the insertion of the pin 21.

[0026] Please refer to Figure 4 The connector body 1 designed in this scheme serves as a DIP component 2 for non-SMT reflow soldering. The pins 21 of the DIP component 2 are inserted into the insertion hole 11. Four radial cuts 12 are uniformly punched along the edge of the insertion hole 11, forming four cut sidewalls 13. The roots of the four cut sidewalls 13 bend towards the bottom surface of the connector body 1, forming downwardly sloping cut sidewalls 13. An elastic deformation gap is formed between adjacent cut sidewalls 13. This can be understood as follows: when the pin 21 of DIP component 2 is inserted into the insertion hole 11 on the connector body 1, the cut sidewall 13 forms a clamping claw for the pin 21. When the pin 21 is inserted into the insertion hole 11, it expands the insertion hole 11, that is, the diameter of the pin 21 is larger than the diameter of the insertion hole 11 formed by bending the roots of multiple cut sidewalls 13 towards the bottom surface of the connector body 1. While expanding the insertion hole 11, the cut sidewall 13 deforms and clamps the pin 21, achieving a tight connection of the pin 21. After the pin 21 of DIP component 2 is connected to the connector body 1, the bottom of the connector body 1 is then subjected to SMT process and reflow soldering with the PCB board 3, and is soldered to other SMD components on the PCB board 3 in one SMT reflow soldering process.

[0027] Please refer to Figure 5In another embodiment, three radial cuts 12 are uniformly punched along the edge of the insertion hole 11 on the connecting piece body 1. In this technical solution, setting three or four cuts 12 is the preferred solution, which can make the cut sidewall 13 have sufficient hardness to achieve the engagement of the pin 21. If more cuts 12 are set, more cut sidewalls 13 will be formed. At this time, the cut sidewall 13 is too thin, and when the pin 21 is inserted into the insertion hole 11, the cut sidewall 13 will be directly rolled open and easily fall off after insertion.

[0028] The parts not described in detail in this technical solution specification are obvious to those skilled in the art and can be supplemented and improved based on existing technical knowledge. At the same time, those skilled in the art should understand that the above embodiments are merely preferred embodiments of this utility model. For those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. A connector for SMT reflow soldering of components without soldering, characterized in that, The device includes a connecting piece body. A insertion hole penetrating the top and bottom surfaces of the connecting piece body is located at its center. Multiple radial cuts are uniformly punched along the edge of the insertion hole, forming multiple cut sidewalls. The roots of these sidewalls are bent at an angle towards the bottom surface of the connecting piece body, causing them to tilt downwards. An elastic deformation gap is formed between adjacent cut sidewalls. The pins of a DIP component are inserted into the insertion hole, and the pins extend beyond the insertion hole. The cut sidewalls are located within DIP sockets on the PCB board, and the bottom surface of the outer periphery of the cut sidewalls of the connecting piece body is in close contact with the outer periphery of the DIP sockets on the PCB board.

2. The SMT reflow soldering connector for solderless components according to claim 1, characterized in that, The multiple incisions are three or four incisions.

3. The SMT reflow soldering connector for solderless components according to claim 1, characterized in that, The root of the multiple cut sidewalls is bent toward the bottom surface of the connecting piece body by R0.2mm.

4. The SMT reflow soldering connector for solderless components according to claim 3, characterized in that, The diameter of the insertion hole after the root of the multiple cut sidewalls is bent towards the bottom surface of the connecting piece body is φ0.30±0.02mm.

5. The SMT reflow soldering connector for solderless components according to claim 1, characterized in that, The width of the elastic deformation gap formed between the adjacent cut sidewalls is 0.2 ± 0.02 mm.

6. The SMT reflow soldering connector for solderless components according to claim 1, characterized in that, The connecting piece body is made of beryllium copper or chromium zirconium copper, and the thickness of the connecting piece body is 0.1 to 0.15 mm.

7. The SMT reflow soldering connector for solderless components according to claim 1, characterized in that, The overall height formed by the upper end of the multiple cut sidewalls to the bottom surface of the connecting piece body is 0.34±0.03mm.

8. The SMT reflow soldering connector for solderless components according to claim 1, characterized in that, The root of each of the multiple cuts is set as a circular arc with a diameter of φ0.3mm.

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